Ultrasonic endoscope

Abstract

The utility model provides a kind of ultrasonic endoscope capable of realizing miniaturization.Ultrasonic endoscope (12) has front end (40) including ultrasonic transducer unit (46) and camera section, ultrasonic transducer unit (46) includes ultrasonic transducer (48) and backing material layer (54), the glass transition temperature of backing material layer (54) is 5 degrees or more and 45 degrees or less, preferably 20 degrees or more and 40 degrees or less, more preferably 25 degrees or more and 35 degrees or less.

Description

Technical Field

[0001] This utility model relates to an ultrasonic endoscope. Background Technology

[0002] Examples of the physical properties of a backing material layer disposed in an ultrasonic transducer unit are described in Patent Documents 1 to 3.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2021-062170

[0004] Patent Document 2: Japanese Patent Application Publication No. 2011-176420

[0005] Patent document 3: Japanese Patent Application Publication No. 2005-177479. Utility Model Content

[0006] The purpose of this invention is to provide an ultrasonic endoscope that can be miniaturized.

[0007] One embodiment of the present invention relates to an ultrasonic endoscope having a front end portion including an ultrasonic transceiver and a camera portion. The ultrasonic transceiver includes an ultrasonic transducer and a backing material layer, wherein the glass transition temperature of the backing material layer is below 45 degrees Celsius.

[0008] -Utility Model Effect-

[0009] According to the technology of this utility model, miniaturization can be achieved. Attached Figure Description

[0010] Figure 1 This is a schematic structural diagram of an example of an ultrasonic examination system 10 using an ultrasonic endoscope 12 as an embodiment of the technology of this utility model.

[0011] Figure 2 It means Figure 1 An enlarged top view of the front end 40 and its surrounding area shown.

[0012] Figure 3 It is along Figure 2 The sectional view shown by line III-III is a longitudinal sectional view of the front end 40 cut along the centerline of its longitudinal axis.

[0013] Figure 4 It is along Figure 3 The sectional view shown along line IV-IV is a cross-sectional view taken along the center line of the arc structure of the ultrasonic transducer array 50 of the ultrasonic observation section 36 at the front end 40.

[0014] Figure 5This is a schematic diagram showing a cross-section perpendicular to the axis of the signal cable 110.

[0015] Figure 6 This is a schematic diagram showing a cross-section perpendicular to the axis of cable 100.

[0016] Figure 7 This is an enlarged view of the portion including the substrate 60 and the cable 100.

[0017] Figure 8 It is an omission Figure 3 The diagram shows a portion of the cross-section and the location of filler 80.

[0018] Figure 9 yes Figure 7 A schematic diagram of the cross section viewed from direction AA.

[0019] Symbol Explanation

[0020] 10-Ultrasonic inspection system, 12-Ultrasonic endoscope, 14-Ultrasonic processor, 16-Endoscope processor, 18-Light source device, 20-Display, 21a-Water supply tank, 21b-Suction pump, 22-Insertion part, 24-Operating part, 26-Universal plug rope, 28a-Air and water supply buttons, 28b-Suction button, 29-Angle button, 30-Insertion port for treatment instruments, 32a, 32b, 32c-Connecting Connector, 34a-Gas and water supply hose, 34b-Suction hose, 36-Ultrasonic observation section, 38-Endoscope observation section, 40-Front end, 41-External component, 42-Bend, 43-Flexible part, 44-Device outlet, 45-Device channel, 46-Ultrasonic transducer unit, 47-Layer, 48-Ultrasonic transducer, 49-Piezoelectric element, 50-Ultrasonic transducer array, 52-Electrode, 52a-Single Single electrode, 52b-oscillator ground, 54-backing material layer, 60-substrate, 60a, 60b, 60c-edge, 62-electrode pad, 64-ground electrode pad, 76-acoustic matching layer, 78-acoustic lens, 80-filler, 82-observation window, 84-objective lens, 86-imaging element, 88-illumination window, 90-cleaning nozzle, 100-cable, 101-covering part, 102-outer sheath, 102A-protrusion, 10 6-Resin layer, 108-Second shielding layer, 110-Signal cable, 112-Signal line, 112a-Conductor, 112b-Insulation layer, 114-Grounding wire, 116-First signal harness, 116a-Front end, 118-First shielding layer, 130-Fixing part, 410-Accommodation space, 410A-First space, 410B-Second space, AR1-First area, AR2-Second area, AR3-Third area. Detailed Implementation

[0021] Figure 1 This is a schematic structural diagram illustrating an example of an ultrasonic examination system 10 using an ultrasonic endoscope 12 as an embodiment of the technology of this utility model. The ultrasonic examination system 10 includes: an ultrasonic endoscope 12; an ultrasonic processor device 14 for generating ultrasonic images; an endoscope processor device 16 for generating endoscopic images; a light source device 18 for supplying illumination light to the ultrasonic endoscope 12 to illuminate the body cavity; a display 20 for displaying ultrasonic images and endoscopic images; a water supply tank 21a for storing cleaning water, etc.; and a suction pump 21b for suctioning material from the body cavity.

[0022] The ultrasonic endoscope 12 has: an insertion part 22, which is inserted into the body cavity of the subject; an operation part 24, which is connected to the base of the insertion part 22 and is used for operation by the surgeon; and a universal lanyard 26, one end of which is connected to the operation part 24.

[0023] The following mechanisms are arranged side-by-side on the operating unit 24: an air / water supply button 28a, which opens and closes the air / water supply lines from the water supply tank 21a (not shown); and a suction button 28b, which opens and closes the suction line from the suction pump 21b (not shown). A pair of angle knobs 29 and a device insertion port 30 are also provided on the operating unit 24.

[0024] The following mechanisms are provided on the other end of the universal plug rope 26: an ultrasonic connector 32a, connected to the ultrasonic processor device 14; an endoscope connector 32b, connected to the endoscope processor device 16; and a light source connector 32c, connected to the light source device 18. The ultrasonic endoscope 12 is detachably connected to the ultrasonic processor device 14, the endoscope processor device 16, and the light source device 18 via these connectors 32a, 32b, and 32c, respectively. Connector 32c includes: an air / water supply hose 34a, connected to the water tank 21a; and a suction hose 34b, connected to the suction pump 21b.

[0025] The insertion part 22 has, in sequence from the front end side: a front end part 40 having an ultrasonic observation part 36 and an endoscope observation part 38; a curved part 42 connected to the base end side of the front end part 40; and a flexible part 43 connecting the base end side of the curved part 42 and the front end side of the operation part 24.

[0026] The bending section 42 is bent remotely by rotating a pair of bend knobs 29 provided on the operating section 24. This allows the front end 40 to be oriented in the desired direction.

[0027] The ultrasonic processor device 14 generates and supplies ultrasonic transducer unit 46 (reference) for use in ultrasonic observation unit 36. Figure 2The ultrasonic transducer array 50 in the ultrasonic endoscope 12 generates ultrasonic signals. The center frequency of the ultrasonic transducer 48 used in the ultrasonic endoscope 12 is preferably 5MHz or higher and 12MHz or lower. Furthermore, the ultrasonic processor device 14 receives and acquires the echo signals reflected from the observation object that emitted ultrasonic waves through the ultrasonic transducer array 50, and performs various signal processing on the acquired echo signals to generate an ultrasonic image displayed on the display 20.

[0028] The endoscope processor device 16 receives and acquires the camera image signal acquired in the endoscope observation section 38 from the observation object part illuminated by the illumination light from the light source device 18, and performs various processing on the acquired camera image signal to generate an endoscope image displayed on the display 20.

[0029] exist Figure 1 In the example, the ultrasonic processor device 14 and the endoscope processor device 16 are composed of two separate devices (computers). However, it is not limited to this, and both the ultrasonic processor device 14 and the endoscope processor device 16 can be composed of a single device.

[0030] In order to acquire image signals by using the endoscope observation section 38 to photograph the observation area inside the body cavity, the light source device 18 generates illumination light, including white light or light of a specific wavelength, which are the three primary colors of light such as red light, green light and blue light. The light propagates in the light guide (not shown) inside the ultrasonic endoscope 12 and is emitted from the endoscope observation section 38, thereby illuminating the observation area inside the body cavity.

[0031] The display 20 receives video signals generated by the ultrasound processor 14 and the endoscope processor 16, and displays ultrasound images and endoscope images. Regarding the display of these ultrasound and endoscope images, it is also possible to appropriately switch to displaying only one image on the display 20, or to display both images simultaneously.

[0032] In this embodiment, ultrasound images and endoscopic images are displayed on a single display 20, but separate displays for displaying ultrasound images and endoscopic images may also be provided. Furthermore, display methods other than display 20 may include displaying ultrasound images and endoscopic images on a display of a terminal carried by the surgeon.

[0033] Next, refer to Figures 2 to 4 The structure of the front end 40 will be explained. Figure 2 It means Figure 1 An enlarged top view of the front end 40 and its surrounding area shown. Figure 3 It is along Figure 2The sectional view shown by line III-III is a longitudinal sectional view of the front end 40 cut along the centerline of its longitudinal axis. Figure 4 It is along Figure 3 The sectional view shown along line IV-IV is a cross-sectional view taken along the center line of the arc structure of the ultrasonic transducer array 50 of the ultrasonic observation section 36 at the front end 40.

[0034] like Figure 2 and Figure 3 As shown, in the front end portion 40, an ultrasonic observation unit 36 ​​for acquiring ultrasonic images is mounted on the front end side, and an endoscopic observation unit 38 for acquiring endoscopic images is mounted on the base end side. Furthermore, in the front end portion 40, a treatment device outlet 44 is provided between the ultrasonic observation unit 36 ​​and the endoscopic observation unit 38.

[0035] The endoscopic observation section 38 includes an observation window 82, an objective lens 84, an imaging element 86, an illumination window 88, a cleaning nozzle 90, and a wiring cable 92. The observation window 82, objective lens 84, imaging element 86, and illumination window 88 constitute the imaging section.

[0036] The treatment device outlet 44 is connected to the treatment device channel 45 that extends into the insertion part 22. From Figure 1 The treatment device (not shown) inserted into the treatment device insertion port 30 is discharged into the body cavity through the treatment device channel 45 from the treatment device outlet 44.

[0037] like Figures 2 to 4 As shown, the ultrasonic observation unit 36 ​​includes: an ultrasonic transducer unit 46, which constitutes an ultrasonic transceiver unit; an external component 41, which holds the ultrasonic transducer unit 46; and a cable 100, which is electrically connected to the ultrasonic transducer unit 46 via a substrate 60. The cable 100 is formed into an elongated strip extending along the longitudinal axis of the insertion portion 22 and is provided to a connector 32a.

[0038] The outer component 41 comprises a rigid component such as rigid resin and forms part of the front end portion 40. A receiving space 410 is provided in the outer component 41, extending through the longitudinal axis of the insertion portion 22. The receiving space 410 includes a first space 410A on the base side and a second space 410B on the front end side, which is wider than the first space 410A. A portion of the ultrasonic transducer unit 46, the substrate 60, and the front end of the cable 100 are accommodated in the receiving space 410. The receiving space 410 constitutes a receiving portion for accommodating the ultrasonic transducer unit 46 and the cable 100.

[0039] The ultrasonic transducer unit 46 includes: an ultrasonic transducer array 50 including a plurality of ultrasonic transducers 48; an electrode 52 disposed at the end side of the ultrasonic transducer array 50 in the width direction (orthogonal to the longitudinal axis direction of the insertion portion 22); a backing material layer 54 supporting each ultrasonic transducer 48 from the lower surface side; and a substrate 60 disposed along the side side of the backing material layer 54 in the width direction and connected to the electrode 52.

[0040] The structure of the substrate 60 is not particularly limited as long as it can electrically connect multiple ultrasonic transducers 48 to the cable 100.

[0041] The substrate 60 is preferably made of a flexible substrate (also known as a flexible printed circuit board (FPC)) that has flexibility, a printed wiring circuit substrate (also known as a printed circuit board (PCB)) that includes a rigid substrate with high rigidity that does not have flexibility, or a printed wiring substrate (also known as a printed wire board (PWB)).

[0042] The ultrasonic transducer unit 46 includes: an acoustic matching layer 76 stacked on the ultrasonic transducer array 50; and an acoustic lens 78 stacked on the acoustic matching layer 76. The ultrasonic transducer unit 46 is configured as a laminate 47 having an acoustic lens 78, an acoustic matching layer 76, an ultrasonic transducer array 50, and a backing material layer 54.

[0043] The ultrasonic transducer array 50 is composed of a plurality of cuboid-shaped ultrasonic transducers 48 arranged outward in a convex arc shape. The ultrasonic transducer array 50 is, for example, an array of 48 to 192 channels including 48 to 192 ultrasonic transducers 48. Each ultrasonic transducer 48 has a piezoelectric element 49.

[0044] The ultrasonic transducer array 50 has electrodes 52. Electrodes 52 have: individual electrodes 52a, independent for each ultrasonic transducer 48; and a transducer ground 52b, which serves as a common electrode for all ultrasonic transducers 48. Figure 4 In this configuration, multiple individual electrodes 52a are disposed on the lower surface of the ends of multiple ultrasonic transducers 48, and transducer grounding 52b is disposed on the upper surface of the ends of the ultrasonic transducers 48.

[0045] The substrate 60 has 48 to 192 wirings (not shown) that are electrically connected to individual electrodes 52a of 48 to 192 ultrasonic transducers 48 respectively, and a plurality of electrode pads 62 that are connected to the ultrasonic transducers 48 respectively via the wirings.

[0046] The ultrasonic transducer array 50 has a structure in which multiple ultrasonic transducers 48 are arranged in a one-dimensional array at predetermined intervals, for example. Each ultrasonic transducer 48 constituting the ultrasonic transducer array 50 is arranged in a convex-bending shape at equal intervals along the longitudinal axis of the insertion portion 22, and is configured according to the ultrasonic processor device 14 (reference 14). Figure 1 The input drive signals are driven sequentially. Thus, the sequence of signals is driven... Figure 2 The range of the ultrasonic transducer 48 shown is used as the scanning range for convex electronic scanning.

[0047] The acoustic matching layer 76 is used to obtain acoustic impedance matching between the test subject and the ultrasonic transducer 48.

[0048] An acoustic lens 78 is used to converge the ultrasonic waves emitted from the ultrasonic transducer array 50 toward the object being observed. This acoustic lens 78 is formed, for example, of a silicone-based resin (millable silicone rubber or liquid silicone rubber, etc.), a butadiene-based resin, or a polyurethane-based resin. If necessary, powders such as titanium oxide, aluminum oxide, or silica are mixed into the acoustic lens 78. Thus, the acoustic lens 78 can achieve acoustic impedance matching between the object being examined and the ultrasonic transducer 48 in the acoustic matching layer 76, and improve the transmittance of the ultrasonic waves.

[0049] like Figure 3 and Figure 4 As shown, the backing material layer 54 is disposed on the back side (lower surface) of the ultrasonic transducer array 50, which is inward relative to the arrangement surface of the plurality of ultrasonic transducers 48. The backing material layer 54 is composed of a layer of components containing backing material. The backing material layer 54 mechanically and flexibly supports the ultrasonic transducer array 50 and has the function of attenuating ultrasonic waves propagating towards the backing material layer 54 from the ultrasonic signals oscillating from the plurality of ultrasonic transducers 48 or reflected from the object being observed. Considering the reduction in diameter of the ultrasonic endoscope 12 and the attenuation performance of ultrasonic waves, the thickness of the backing material layer 54 is preferably set to be 0.5 mm or more and 1.5 mm or less.

[0050] Figure 4 The substrate 60 shown has multiple electrode pads 62 electrically connected at one end to multiple individual electrodes 52a and a ground electrode pad 64 electrically connected to the oscillator ground 52b. Additionally, in Figure 4 The cable 100 is omitted in the text.

[0051] Electrical bonding between the substrate 60 and the individual electrode 52a can be established, for example, by using a conductive resin material. Examples of resin materials include forming a film-like ACF (Anisotropic Conductive Film) or ACP (Anisotropic Conductive Paste) by molding a material in which fine conductive particles are mixed in a thermosetting resin.

[0052] Other resin materials include, for example, resin materials in which conductive fillers such as metal particles are dispersed in adhesive resins such as epoxy or urethane, and after bonding, the fillers form conductive pathways. Examples of such resin materials include conductive pastes such as silver paste.

[0053] like Figure 3 As shown, the cable 100 includes a plurality of signal cables 110 and a cylindrical covering portion 101 that bundles and covers the plurality of signal cables 110.

[0054] Figure 5 This is a schematic diagram showing a cross-section perpendicular to the axis of the signal cable 110. Figure 5 In this example, the signal cable 110 is a non-coaxial cable. The signal cable 110 has multiple signal lines 112 and multiple ground lines 114. The signal lines 112 are, for example, composed of a conductor 112a and an insulating layer 112b covering the outer peripheral surface of the conductor 112a.

[0055] Conductor 112a is, for example, made of bare wire of copper or copper alloy. The bare wire is subjected to plating treatments such as tin plating or silver plating. Conductor 112a has, for example, a diameter of 0.03 mm to 0.04 mm. Insulation layer 112b can be made of resin materials such as fluorinated ethylene propylene (FEP) or perfluoroalkoxy (PFA). Insulation layer 112b has, for example, a thickness of 0.015 mm to 0.025 mm.

[0056] The grounding wire 114 is, for example, made of a conductor having the same diameter as the signal wire 112. The grounding wire 114 is made of bare copper or copper alloy wire, or a stranded wire formed by twisting together multiple bare copper or copper alloy wires.

[0057] The first signal harness 116 is formed by twisting together multiple signal lines 112 and multiple ground lines 114.

[0058] The signal cable 110 includes a first shielding layer 118 that bundles and covers the first signal wire harness 116. The first shielding layer 118 may be composed of an insulating film or the like, to which a metal foil is laminated with an adhesive. The insulating film may be composed of polyethylene terephthalate (PET) film or the like. The metal foil may be composed of aluminum foil or copper foil or the like.

[0059] Regarding signal cable 110, multiple signal lines 112 are grouped together and shielded by the first shielding layer 118.

[0060] Regarding the first signal harness 116, it is constructed by twisting together seven wires: four signal wires 112 and three ground wires. One of the four signal wires 112 is positioned in the center. The remaining three signal wires 112 and three ground wires 114 are arranged adjacent to each other around the center signal wire 112. However, the number of signal wires 112, the number of ground wires 114, and their arrangement in the first signal harness 116 are not limited to a specific number. Figure 5 The structure of the signal cable 110 is such that each conductor 112a is electrically connected to any one of the electrode pads 62 of the substrate 60.

[0061] Figure 6 This is a schematic diagram showing a cross-section perpendicular to the axis of cable 100. Figure 6 In this example, the cable 100 includes: a plurality of signal cables 110; a cylindrical resin layer 106 that bundles and covers the plurality of signal cables 110; a cylindrical second shielding layer 108 that is disposed along and covers the outer peripheral surface of the resin layer 106; and a cylindrical outer sheath 102 that is disposed along and covers the outer peripheral surface of the second shielding layer 108. The covering portion 101 is constituted by the resin layer 106, the second shielding layer 108, and the outer sheath 102.

[0062] The outer sheath 102 can be made of fluoropolymer materials such as extruded PFA, FEP, ethylene-tetrafluoroethylene copolymer (ETFE), or polyvinyl chloride (PVC). The outer sheath 102 forms the outermost circumferential surface of the cable 100. Regarding the outer sheath 102, in order to improve durability by reducing friction with other contents inside the ultrasonic endoscope 12 (such as air / water supply hoses, suction hoses, or traction wires), its outer surface smoothness is preferably high.

[0063] The resin layer 106 can be made of, for example, the aforementioned fluorine-based resin material or resin tape.

[0064] The smoothness of the outer surface of the second shielding layer 108 is preferably lower than that of the outer surface of the outer sheath 102. Smoothness can be defined, for example, by average surface roughness. The second shielding layer 108 is, for example, a metal mesh shielding member constructed by braiding multiple bare wires. The bare wires are made of copper wire or copper alloy wire that has undergone plating treatment (tin plating or silver plating). A first covering member, consisting of a resin layer 106 and the second shielding layer 108, bundles and wraps the multiple signal cables 110. However, the resin layer 106 is not essential in the cable 100 and can be omitted. A second covering member, consisting of the outer sheath 102, covers this first covering member.

[0065] The second shielding layer 108 is disposed concentrically with the resin layer 106 on the outer periphery of the resin layer 106, surrounding and covering the outer peripheral surface of the resin layer 106 within a 360-degree circumferential range. The outer skin 102 is disposed concentrically with the second shielding layer 108 on the outer periphery of the second shielding layer 108, surrounding and covering the outer peripheral surface of the second shielding layer 108 within a 360-degree circumferential range.

[0066] exist Figure 6 In this example, cable 100 includes 16 signal cables 110 and 64 signal lines 112. The number of signal cables 110 and signal lines 112 is not limited to this value.

[0067] Figure 7 This is an enlarged view of the portion including the substrate 60 and the cable 100. (See image below.) Figure 7 As shown, the substrate 60 has a plurality of electrode pads 62 arranged along an edge 60a on the base end side and a ground electrode pad 64 arranged between the plurality of electrode pads 62 and the edge 60a. The ground electrode pad 64 is arranged parallel to the edge 60a.

[0068] Cable 100 is positioned opposite edge 60a of substrate 60. Electrode pad 62 is electrically connected to signal line 112 of signal cable 110. Signal cable 110 is arranged parallel to edges 60b and 60c, which are orthogonal to edge 60a. However, the positional relationship between substrate 60 and signal cable 110 is not particularly limited.

[0069] like Figure 3 and Figure 7 As shown, on the front end side of cable 100, the sheath 101 is stripped, forming a first region AR1 where the signal cable 110 is partially exposed. Further to the base end of cable 100 than the first region AR1, the outer sheath 102 is stripped, forming a second region AR2 where the second shielding layer 108 is partially exposed. Further to the base end of cable 100 than the second region AR2, a third region AR3 where the outer sheath 102 is exposed. Thus, within the receiving space 410, cable 100 has a structure that sequentially includes the first region AR1 exposed by the signal cable 110, the second region AR2 exposed by the second shielding layer 108, and the third region AR3 exposed by the outer sheath 102, starting from the ultrasonic transducer unit 46 side.

[0070] exist Figure 3 In the accommodating space 410 shown, a filler 80 is provided to fill the gap between the outer component 41 and the front end of the ultrasonic transducer unit 46, the substrate 60 and the cable 100 (the part of the first space 410A excluding the cable 100 and the part of the second space 410B excluding the ultrasonic transducer unit 46, the substrate 60 and the cable 100). Figure 8 It is an omission Figure 3The diagram shows a portion of the cross-section and the location of filler 80.

[0071] The filler 80 primarily serves to fix the substrate 60, signal cable 110, and various wiring components. The filler 80 is preferably matched to the acoustic impedance of the backing material layer 54 with a specified precision or higher, so that ultrasonic signals propagating from the ultrasonic transducer array 50 to the backing material layer 54 are not reflected at the boundary with the backing material layer 54. To improve the efficiency of heat dissipation generated in the multiple ultrasonic transducers 48, the filler 80 is preferably composed of a heat-dissipating component. When the filler 80 is heat-dissipating, heat dissipation efficiency can be improved because heat is received from the backing material layer 54, substrate 60, and signal cable 110. The material of the filler 80 is not particularly limited; for example, silicone resin or rubber can be used.

[0072] like Figure 7 As shown, filler 80 fills the gap between the first region AR1, the second region AR2 and the third region AR3 and the inner surface of the outer component 41, and contacts the first region AR1, the second region AR2 and the third region AR3.

[0073] According to this structure, the filler 80 can be embedded in the step difference at the boundary between the first region AR1 and the second region AR2, or the step difference at the boundary between the second region AR2 and the third region AR3, thereby achieving an anchoring effect. As a result, the fixation force of various components based on the filler 80 can be improved, and the durability of the ultrasonic endoscope 12 can be enhanced.

[0074] Furthermore, even when the smoothness of the outer surface of the second region AR2 is lower than that of the outer surface of the third region AR3, the filler 80 is also embedded in the unevenness of the outer surface of the second region AR2 to achieve an anchoring effect. As a result, the durability of the ultrasonic endoscope 12 can be further improved. In this configuration, the second region AR2 and the third region AR3 are disposed in a relatively narrow first space 410A within the receiving space 410. Therefore, the volume of the gap between the second region AR2 and the third region AR3 and the outer component 41 is small, and the space for the filler 80 to enter is small. Even in this structure, with the reduced smoothness of the second shielding layer 108, sufficient fixing force can be ensured even with a small amount of filler 80.

[0075] like Figure 7 and Figure 8 As shown, a protrusion 102A protruding radially along the cable 100 is provided on the outer surface (surface of the outer sheath 102) of the portion disposed in the first space 410A in the third region AR3 of the cable 100.

[0076] Figure 9 yes Figure 7A schematic diagram of the cross-section viewed from direction AA. Figure 9 The cross-section of cable 100 is simplified and shown in the image. Figure 9 As shown, the protrusion 102A is composed of an annular component that is disposed around the entire circumference of the outer periphery of the outer sheath 102 of the cable 100. The shape of this annular component is not particularly limited and can be a perfect circle, ellipse, or polygon. The protrusion 102A can be integrally formed with the outer sheath 102 of the cable 100, but it is preferable to be separate from the cable 100. For example, by forming the protrusion 102A with a metal ring or the like, the cable 100 can be secured from its outer periphery using the protrusion 102A. This prevents the outer sheath 102 from moving relative to the second shielding layer 108 along the axial direction in the first space 410A. Furthermore, by embedding the filler 80 into the protrusion 102A, an anchoring effect can be obtained, further improving the durability of the ultrasonic endoscope 12.

[0077] The protrusion 102A may not be provided along the entire circumference of the outer sheath 102 of the cable 100. For example, the protrusion 102A may be C-shaped. By making the protrusion 102A C-shaped, it is easier to install the protrusion 102A onto the cable 100 when the cable 100 and the protrusion 102A are separate components. Furthermore, by embedding the filler 80 between the two circumferential ends of the C-shaped protrusion 102A, the anchoring effect can be improved. The C-shaped protrusion 102A is an example of a ring-shaped component.

[0078] Furthermore, as long as the purpose is to achieve the anchoring effect, the protrusion 102A does not need to be composed of a ring-shaped component and can be of any shape. By constructing the protrusion 102A as a ring-shaped component, as described above, an anchoring effect can be achieved while securing the cable 100. Multiple protrusions 102A can be provided along the axial direction of the cable 100. This further enhances the anchoring effect.

[0079] like Figure 7 As shown, the substrate 60 and the first signal harness 116 are fixed by the fixing part 130, and the relative positions of the substrate 60 and each of the first signal harnesses 116 are fixed. The fixing part 130 fixes the substrate 60 and the first signal harnesses 116 while overlapping with the substrate 60. The first signal harnesses 116, which are composed of stranded wires of multiple signal lines 112 and multiple ground lines 114, are untied into individual signal lines 112 at the front end 116a. Each untied signal line 112 is electrically connected to the electrode pads 62 disposed on the substrate 60. The front end 116a is the starting position for untiing into individual signal lines 112. In addition, the fixing part 130 is omitted in some of the first signal harnesses 116 for ease of understanding. The connection area between the substrate 60 and the signal cable 110 as described above is also covered and fixed by the filler 80 described above.

[0080] Next, the preferred structure of the backing material layer 54 and the filler 80 will be described.

[0081] (Optimal properties of the backing material layer)

[0082] The glass transition temperature of the backing material layer 54 is preferably below 45 degrees Celsius.

[0083] The temperature of the environment in which the ultrasonic endoscope 12 is placed can vary from the storage temperature to the temperature inside the patient's body (around 45 degrees Celsius). The ultrasonic endoscope 12 also depends on the storage environment, but it can be placed in a temperature range between 5 degrees Celsius and 45 degrees Celsius. If the glass transition temperature of the backing material layer 54 is below 45 degrees Celsius, which is the temperature inside the patient's body, the physical properties of the backing material layer 54 change when the ultrasonic endoscope 12 is inserted into the patient's body. For example, the molecular motion in the backing material layer 54 becomes more intense, making it easier to dissipate external energy (ultrasound waves) as the kinetic energy (heat) of the molecules. Therefore, even when the thickness of the backing material layer 54 is reduced to make the ultrasonic endoscope 12 smaller (miniaturized), the attenuation performance of the ultrasound waves based on the backing material layer 54 can be improved during insertion into the patient's body. Furthermore, by softening the backing material layer 54, the stress when applying thermal load to the ultrasonic endoscope 12 is reduced, preventing cracks and improving durability.

[0084] On the other hand, with the ultrasonic endoscope 12 outside the patient's body, it is placed in a temperature environment lower than the glass transition temperature of the backing material layer 54. At this temperature, the backing material layer 54 becomes sufficiently hard. Therefore, the impact resistance and durability when storing the ultrasonic endoscope 12 can be improved. Furthermore, when the ultrasonic endoscope 12 is inserted into the patient's body, the backing material layer 54 becomes slightly softer, but the inner wall of the organ being examined is also soft, so the impact on durability is minimal.

[0085] If the storage facility for the ultrasonic endoscope 12 is indoors, the lower limit of the glass transition temperature of the backing material layer 54 is approximately 5 degrees Celsius. However, considering a more realistic storage environment, it is preferable to set it to approximately 10 degrees Celsius. Furthermore, regarding this lower limit, if the storage is in an air-conditioned room, it is preferable to set it to approximately 20 degrees Celsius. Moreover, if considering the possibility of temperature deviations within the patient's body, the upper limit of the glass transition temperature of the backing material layer 54 can be set to 40 degrees Celsius. Considering the practical use environment of the ultrasonic endoscope 12 and the ease of manufacturing the backing material layer 54, the glass transition temperature of the backing material layer 54 is more preferably set to 25 degrees Celsius or higher and 35 degrees Celsius or lower.

[0086] Regarding the backing material layer 54, the material constituting it is not particularly limited, but it is preferably composed of at least one of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure. By including these resins, the stress under thermal load can be sufficiently reduced. From the viewpoint of further improving processability, the resin included in the backing material layer 54 is preferably polyurea resin.

[0087] The resin contained in the backing material layer 54 is preferably a resin with a loss tangent of 0.06 or more in the range of 0 to 50°C and a loss tangent of less than 1.50 in the range of -20 to 110°C. When the content of the above-mentioned resin in the backing material layer 54 is set to 25 to 50% by volume, the storage modulus of the backing material layer 54 in the range of 0 to 50°C is preferably 1000 MPa or more.

[0088] The following describes in detail the preferred resin contained in the backing material layer 54.

[0089] Polyurea resin

[0090] Polyurea resins can be obtained by reacting polyisocyanate compounds with polyamine compounds.

[0091] As a polyisocyanate compound, any polyisocyanate compound having two or more isocyanate groups can be used without particular restrictions. The polyisocyanate compound can be any one of an aliphatic isocyanate compound (a compound in which isocyanate groups are bonded to an aliphatic chain or aliphatic ring) and an aromatic isocyanate compound (a compound in which isocyanate groups are bonded to an aromatic ring), or a mixture thereof. The polyisocyanate compound can have a ring structure. From the viewpoint of low reactivity and long shelf life when producing cured products, aliphatic polyisocyanate compounds are preferred; from the viewpoint of further improving ultrasonic attenuation, aliphatic polyisocyanate compounds containing aromatic rings and aromatic polyisocyanate compounds are preferred.

[0092] As a polyamine compound, any polyamine compound having two or more amino groups can be used without particular restriction; polyamine compounds commonly used as curing agents for epoxy resins are preferred. The polyamine compound can be any one of aliphatic polyamine compounds (chain-like aliphatic polyamine compounds with amino groups bonded to aliphatic chains or cyclic aliphatic polyamine compounds with amino groups bonded to aliphatic rings) and aromatic polyamine compounds (compounds with amino groups bonded to aromatic rings), or a mixture thereof. Aliphatic polyamine compounds exhibit excellent reactivity and are therefore preferred. The polyamine compound can have a cyclic structure. Furthermore, in addition to nitrogen atoms, it can also contain heteroatoms such as oxygen atoms. From the viewpoint of further improving ultrasonic attenuation and processability, the polyamine compound preferably includes aliphatic polyamine compounds with aromatic rings and chain-like aliphatic polyamine compounds without aromatic rings.

[0093] [Epoxy resin with polyurethane structure]

[0094] Epoxy resins with a polyurethane structure can be used without particular restrictions, as long as they have a polyurethane structure and epoxy groups. Commercially available epoxy resins with a polyurethane structure typically have a number average molecular weight of 200 to 20,000. The viscosity of epoxy resins with a polyurethane structure at 25°C is not particularly limited; for example, 200 to 200,000 mPa·s is preferred, and 600 to 30,000 mPa·s is more preferred. Furthermore, the viscosity is a value measured under conditions of 25°C and a shear rate of 0.01 / s.

[0095] Polyamines or acid anhydrides can be used as curing agents for reacting with epoxy resins having a polyurethane structure, but polyamines are preferred. As for the polyamine compound that reacts with epoxy resins having a polyurethane structure, any polyamine compound having two or more amino groups can be used without particular restriction; polyamine compounds commonly used as curing agents for epoxy resins are preferred.

[0096] [Epoxy resin with polyetheramine structure]

[0097] As an epoxy resin with a polyetheramine structure, it is a reaction cured product of epoxy resin and polyamine compound having two or more amino groups. As long as it has a polyether structure, it can be used without particular restrictions.

[0098] Epoxy resins with a polyetheramine structure can be obtained by any one of the following: reaction of an epoxy resin with a polyether structure with a polyamine compound without a polyether structure, reaction of an epoxy resin without a polyether structure with a polyamine compound with a polyether structure, or reaction of an epoxy resin with a polyether structure with a polyamine compound with a polyether structure. Typically, the polyether structure of the reaction-cured product obtained in this way is a polyether structure with a number average molecular weight of 200 to 6000.

[0099] Among these, the preferred are either a reaction-cured product of an epoxy resin having a polyether structure and a polyamine compound not having a polyether structure, or a reaction-cured product of an epoxy resin not having a polyether structure and a polyamine compound having a polyether structure. From the viewpoint that the curable resin composition exhibits a more preferred viscosity, the preferred choice is a reaction-cured product of an epoxy resin not having a polyether structure and a polyamine compound having a polyether structure.

[0100] Commercially available epoxy resins with a polyether structure typically have a polyether structure and a number average molecular weight of 200 to 6000. Specifically, epoxy resins with a bisphenol structure are preferred from the viewpoint of excellent mechanical strength. Examples of epoxy resins with a polyether structure include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, and phenolic varnish type epoxy resin. From the viewpoint of excellent mechanical strength of the cured product, bisphenol A type epoxy resin is preferred.

[0101] As a polyamine compound with a polyether structure, any polyamine compound having two or more amino groups can be used without particular restrictions. Polyamine compounds commonly used as curing agents for epoxy resins are preferred. Commercially available polyamine compounds with a polyether structure typically have a polyether structure with a number average molecular weight of 200 to 6000.

[0102] [Resin content in the backing material layer]

[0103] The resin content in the backing material layer 54 is 25-50% by volume, preferably 30-50% by volume. The content of at least one of the following reactive cured resins in the backing material layer 54—polyurea resin, epoxy resin with a polyurethane structure, and epoxy resin with a polyetheramine structure—is not particularly limited, as long as the technical effect of this invention is achieved. For example, it can be set to 15% by volume or more, preferably 20% by volume or more, more preferably 30% by volume or more, further preferably 50% by volume or more, and especially preferably 70% by volume or more. It is also preferable that the resin contained in the backing material layer 54 is entirely composed of at least one of polyurea resin, epoxy resin with a polyurethane structure, and epoxy resin with a polyetheramine structure.

[0104] The backing material layer 54 is preferably composed of at least one of polyurea resin, epoxy resin with a polyurethane structure, and epoxy resin with a polyetheramine structure, and includes heat-dissipating fillers. The backing material layer 54 improves thermal conductivity by including thermally conductive particles as heat-dissipating fillers. By improving the thermal conductivity of the backing material layer 54, the heat generated in the ultrasonic transducer unit 46 can be transferred to the heat dissipation structure (not shown), preventing heat accumulation at the front end 40. This reduces the thermal load on the backing material layer 54, further reducing the stress caused by the thermal load.

[0105] Regarding the thermally conductive particles, any type of inorganic or organic particle can be used as long as it is thermally conductive. To improve the thermal conductivity of the backing material layer 54, its thermal conductivity per unit weight is preferably 30 W / m•K or higher, more preferably 60 W / m•K or higher. Since the ultrasonic endoscope 12 is inserted into the body, the thermally conductive particles are preferably safe materials that are non-toxic and stable in environments with low moisture absorption. Furthermore, to improve attenuation, high density is preferred. Since it is disposed near the circuit, materials with low or no electrical conductivity that will not cause short-circuit faults are preferred.

[0106] The shape of the thermally conductive particles is not particularly limited; various shapes such as irregular shapes, spheres, fibers, branched fibers, and plates can be used. Spherical shapes are preferred as they increase the fill rate. Anisotropic shapes, such as fibers or plates, increase particle contact and improve heat dissipation, which is also preferred. Irregularly shaped particles can randomly reflect ultrasonic waves, which is preferable from the viewpoint of improving the ultrasonic attenuation of the backing material layer 54.

[0107] Examples of thermally conductive particles include alumina, tungsten oxide, silicon carbide, tungsten carbide, silicon nitride, boron nitride, or aluminum nitride. Nitrides are particularly preferred from the viewpoint of high thermal conductivity and high insulation. The thermally conductive particles may contain one or more of these thermally conductive materials. To facilitate dispersion in the resin, the surface of the thermally conductive particles may be surface-treated.

[0108] There is no particular limitation on the particle size of the thermally conductive particles. From the viewpoint of suppressing the viscosity of the curable resin composition contained in the backing material layer 54 to a low level while maintaining a high mechanical strength of the backing material layer 54, the particle size of the thermally conductive particles is preferably 1 to 300 μm, more preferably 5 to 100 μm, and even more preferably 8 to 30 μm. The "particle size" of the thermally conductive particles refers to the number average particle size.

[0109] The proportion of thermally conductive particles in the total amount of components other than the resin in the backing material layer 54 is preferably 50% by volume or more, more preferably 60% by volume or more, and even more preferably 65% ​​by volume or more. It is also preferable that all components in the backing material layer 54, excluding the resin, are thermally conductive particles. The content of thermally conductive particles in the backing material layer 54 is preferably, for example, 30 to 60% by volume, more preferably 30 to 55% by volume, and even more preferably 30 to 50% by volume.

[0110] In addition to the aforementioned resin and thermally conductive particles, the backing material layer 54 may also contain other components. These other components may include hollow particles. Including hollow particles can further improve ultrasonic attenuation. As hollow particles, there are no particular limitations on the use of hollow particles commonly used to exhibit improved sound wave attenuation or ultrasonic attenuation; either hollow glass particles or hollow resin particles can be used, with hollow resin particles being preferred.

[0111] Examples of hollow particles include, for instance, glass capsules, hollow silica, cenolite, phenolic resin microcapsules, urea-formaldehyde resin microcapsules, polymethyl methacrylate capsules, and thermally expandable microcapsules. Furthermore, a single type of hollow particle may be used, or two or more may be used in combination. In this specification, when two or more types of hollow particles are contained, the content of hollow particles refers to their total amount.

[0112] There is no particular limitation on the particle size of the hollow particles. From the viewpoint of suppressing the viscosity of the curable resin composition to a low level while maintaining a high mechanical strength of the backing material layer 54, the particle size of the hollow particles is preferably 1 to 300 μm, more preferably 5 to 100 μm, and even more preferably 20 to 80 μm. Furthermore, the term "particle size" for hollow particles has the same meaning as the term "particle size" for thermally conductive particles described above. That is, the "particle size" of hollow particles is the number-average particle size.

[0113] Other components mentioned above may include dispersants, diluents, colorants, viscosity modifiers, plasticizers, curing accelerators, etc. The content of other components in the backing material layer 54 can, for example, be set to 10-20% by volume.

[0114] A preferred embodiment of the backing material layer 54 may include, for example, a resin comprising at least one of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure, and thermally conductive particles. This resin has the aforementioned specific loss tangent, the aforementioned specific storage modulus, and contains the aforementioned hollow particles. In this embodiment, the content of the resin in the backing material layer 54 is 25-50% by volume, preferably 30-50% by volume. The content of the thermally conductive particles is preferably 30-60% by volume, more preferably 30-55% by volume, and even more preferably 30-50% by volume. The content of the hollow particles is preferably 10-20% by volume.

[0115] The backing material layer 54 is preferably formed using a curable resin composition. The curable resin composition preferably comprises any one of the following: the thermally conductive particles described above; a combination of a polyisocyanate compound and a polyamine compound as resin components; a combination of an epoxy resin having a polyurethane structure and a polyamine compound; or a combination of an epoxy resin and a polyamine compound, wherein at least one of the epoxy resin and the polyamine compound has a polyether structure.

[0116] <Manufacturing Method of Backing Material Layer>

[0117] The curable resin composition constituting the backing material layer 54 can be prepared by conventional methods. For example, as components constituting the curable resin composition, a resin component comprising the aforementioned thermally conductive particles, and at least one of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure, along with suitable other components, can be obtained by mixing using a mixing apparatus such as a rotary kneader, a pressure kneader, a Banbury mixer (continuous kneader), or a two-roll mixer. The mixing order of the components is not particularly limited. The mixing conditions are not particularly limited, as long as the thermally conductive particles are dispersed in the resin component.

[0118] By curing the curable resin composition thus obtained, a backing material layer 54 can be obtained. The curing conditions can be adjusted according to the chemical reaction of the resin components contained in the curable resin composition, for example, by heating and curing it at a specific temperature for a constant time, thereby obtaining the backing material layer 54.

[0119] The shape of the backing material layer 54 is not particularly limited. For example, it can be made into the preferred shape of the backing material layer using the mold described above during curing, or it can be made by obtaining a sheet-like backing material and cutting it using cutting or the like to produce the desired backing material layer. In addition, the backing material layer 54 of this invention has excellent processability, so when it is cut into the desired shape at a spacing of μm, the occurrence of deformation, breakage, etc. can be suppressed while producing the desired backing material layer.

[0120] (Preferred properties of fillers)

[0121] Considering that the physical properties of the backing material layer 54 may change due to variations in the temperature environment in which the ultrasonic endoscope 12 is placed, the filler 80 is preferably configured to have a hardness greater than that of the backing material layer 54. Thus, even if the dimensional changes of the backing material layer 54 may occur due to variations in the temperature environment in which the ultrasonic endoscope 12 is placed, these dimensional changes can be suppressed by the hardness of the backing material layer 54. Since the ultrasonic endoscope 12 has a very small diameter, these dimensional changes can be suppressed, thereby ensuring consistent quality. Furthermore, the high hardness of the filler 80 enhances the fixation strength of the substrate 60 and the cable 100.

[0122] Regarding filler 80, its material is not particularly limited, but in order to maintain the desired hardness as described above while possessing heat dissipation properties, it is preferable, for example, to contain a crosslinking density of 500 mol / m³. 3 Above and 12000mol / m 3 The preferred crosslinking density is 3000 mol / m³. 3 Above and 10000mol / m 3 It is composed of the following epoxy resins.

[0123] As such an epoxy resin, an epoxy resin with an epoxy equivalent of 140 or less, as illustrated in International Publication No. 2023 / 054203, can be used. The filler 80 can be a substance that is cured alone by an epoxy resin with an epoxy equivalent of 140 or less, or a substance that is cured by reacting the epoxy resin with a curing agent.

[0124] In the ultrasonic transducer unit 46 configured as described above, if each ultrasonic transducer 48 of the ultrasonic transducer array 50 is driven and a voltage is applied to the electrode 52 of the ultrasonic transducer 48, the piezoelectric element 49 vibrates and sequentially generates ultrasonic waves, which are then irradiated toward the observation area of ​​the subject. Then, by using an electronic switch such as a multiplexer to sequentially drive multiple ultrasonic transducers 48, ultrasonic waves are scanned within a scanning range along the curved surface where the ultrasonic transducer array 50 is arranged, for example, within a range of approximately tens of millimeters from the center of curvature of the surface.

[0125] Furthermore, if an echo signal reflected from the observed object is received, the piezoelectric element 49 vibrates to generate a voltage, which is then output to the ultrasonic processor device 14 as an electrical signal corresponding to the received ultrasonic echo. After various signal processing steps are performed in the ultrasonic processor device 14, the signal is displayed on the display 20 as an ultrasonic image.

[0126] (Example of a modified endoscope)

[0127] The characteristic properties of the backing material layer 54 and the filler 80 described above can be applied to all structures of ultrasonic endoscopes. For example, in ultrasonic endoscope 12, the cable 100 may be a structure without the second region AR2 (the signal cable 110 is exposed by peeling off the sheath 101 at the front end, and the outer sheath 102 is located further from the base end than the exposed portion of the signal cable 110), or it may be a structure without the protrusion 102A.

[0128] Furthermore, the signal cable 110 is not limited to... Figure 5 The non-coaxial cable shown can also be a coaxial cable or a twisted-pair cable. When the signal cable 110 is a coaxial cable, it may have a structure in which a shielding layer is provided around one signal line 112 and this shielding layer is covered by an insulating layer. When the signal cable 110 is a twisted-pair cable, it may have a structure in which two signal lines 112 are twisted together.

[0129] Furthermore, while the ultrasonic endoscope 12 is a convex ultrasonic endoscope, the technology of this invention can also be applied to a radial ultrasonic endoscope. In a radial ultrasonic endoscope, the ultrasonic observation section is located in a structure further forward than the endoscope observation section, and the technology of this invention can also be applied.

[0130] Example

[0131] The following describes an embodiment of the backing material layer 54 of the present invention, but the backing material layer 54 is not to be interpreted in a limiting manner based on these results.

[0132] <1> Preparation of the composition for the backing material layer

[0133] A composition (curable resin composition) for a backing material layer having the following composition was prepared.

[0134] (Polyurea resin)

[0135] A composition for a backing material layer was prepared by mixing 2.5 parts of isophthalic diisocyanate (Tokyo Chemical Industry Co., Ltd.) as polyisocyanate, 45 parts of a resin composition consisting of 2 parts of ELASMER250P (KUMIAI CHEMICAL INDUSTRY CO.,LTD.) and 8 parts of ELASMER650P (KUMIAI CHEMICAL INDUSTRY CO.,LTD.) as polyamine, 25 parts of tungsten carbide particles (WC-100S (manufactured by ALMTCorp.)) and 15 parts of silicon carbide particles (SSC-A15 (manufactured by Shinano Electric Refining Co., Ltd.)) as thermally conductive particles.

[0136] (Epoxy resin with a polyurethane structure)

[0137] A composition for a backing material layer was prepared by mixing 10 parts of ADEKA RESIN EPU-11F (ADEKA CORPORATION) as an epoxy resin having a polyurethane structure, 45 parts of a resin composition consisting of 0.6 parts of 2,2,4-trimethylhexamethylenediamine (Tokyo Chemical Industry Co., Ltd.) and 1.0 parts of GASKAMINE-328 (MITSUBISHI GAS CHEMICAL COMPANY, INC.) as a polyamine, 25 parts of tungsten carbide particles (WC-100S (manufactured by ALMTCorp.)) and 15 parts of silicon carbide particles (SSC-A15 (manufactured by Shinano Electric Refining Co., Ltd.)) as thermally conductive particles.

[0138] (Epoxy resin with a polyetheramine structure)

[0139] A composition for a backing material layer was prepared by mixing 10 parts of jER828 (Mitsubishi Chemical Corporation) as a bisphenol A type epoxy resin, 45 parts of a resin composition consisting of 4.5 parts of JEFFAMINE D400 (Huntsman International LLC) and 6.0 parts of JEFFAMINE D2000 (Huntsman International LLC) as a difunctional polyether polyamine, 25 parts of tungsten carbide particles (WC-100S (manufactured by ALMTCorp.)) and 15 parts of silicon carbide particles (SSC-A15 (manufactured by Shinano Electric Refining Co., Ltd.)) as thermally conductive particles.

[0140] <2> Fabrication, testing, and evaluation of backing material sheets

[0141] The backing material layer composition prepared above was poured into a square mold with one side of 30 mm and the desired depth, heated at 80°C for 18 hours, and then heated at 150°C for 1 hour to cure it, thereby producing a square backing material sheet with one side of 30 mm and the desired thickness. The depth of the mold used and the thickness of the obtained sheet were 2 mm and 0.5 mm, respectively. The backing material sheet was measured and evaluated as follows.

[0142] (1) Determination of glass transition temperature

[0143] For the 0.5mm backing material sheet produced, the loss tangent was measured using a dynamic viscoelasticity measuring device (Vibron: DVA-225 (trade name), manufactured by IT Keisoku Seigyo Co., Ltd.) under the conditions of a fixture distance of 20mm, a heating rate of 2℃ / min, a measurement temperature range of -150℃ to 250℃, and a frequency of 5Hz. The maximum value of the loss tangent was then calculated, thereby determining the glass transition temperature.

[0144] The glass transition temperatures of the backing material sheets containing the backing material layer composition are all in the range of 25 to 35 degrees Celsius.

[0145] (2) Determination of thermal conductivity

[0146] Test pieces were prepared by cutting square backing material sheets with a thickness of 0.5 mm into strips with a width of 5 mm. The test pieces were then tested using the laser flash method according to JIS (Japanese Industrial Standard) R 1611. Test pieces containing compositions with any backing material layer all showed a good value of 1.0 W / m•K.

[0147] (3) Determination of attenuation rate

[0148] According to the method described in JIS (Japanese Industrial Standard) Z 2354 (2012) Method for Determination of Ultrasonic Attenuation Coefficient of Solids, the intensity of the reflected echo was measured using a sing-around sound velocity measuring device (manufactured by ULTRASONIC ENGINEERING CO.,LTD., trade name "UVM-2 type"). In the measurement, a 2MHz measuring probe was used in water at 23°C, and the attenuation rate was determined based on the intensity difference of the reflected echo caused by the presence or absence of a measuring test piece used for the aforementioned sound velocity measurement and the thickness of the measuring test piece. Test pieces containing any backing material layer composition showed a good attenuation rate exceeding 4.0 dB / mm•MHz.

[0149] The results above show that, by using a backing material comprising at least one of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure, it is possible to achieve a glass transition temperature lower than that within the test subject while simultaneously achieving high heat dissipation and a high attenuation rate within the test subject.

[0150] As explained above, at least the following items are described in this instruction manual. (1)

[0152] An ultrasonic endoscope includes a front end portion comprising an ultrasonic transceiver unit and a camera unit.

[0153] The aforementioned ultrasonic transceiver unit includes an ultrasonic transducer and a backing material layer.

[0154] The glass transition temperature of the aforementioned backing material layer is below 45 degrees Celsius. (2)

[0156] According to the ultrasonic endoscope described in (1), wherein,

[0157] The glass transition temperature mentioned above is above 10 degrees Celsius. (3)

[0159] According to the ultrasonic endoscope described in (2), wherein,

[0160] The glass transition temperature mentioned above is below 40 degrees Celsius. (4)

[0162] According to the ultrasonic endoscope described in (3), wherein,

[0163] The glass transition temperature mentioned above is above 20 degrees Celsius. (5)

[0165] According to the ultrasonic endoscope described in (4), wherein,

[0166] The glass transition temperature mentioned above is above 25 degrees and below 35 degrees. (6)

[0168] According to any one of (1) to (5) of the ultrasonic endoscope, wherein,

[0169] The aforementioned front end is provided with a receiving portion for accommodating the aforementioned ultrasonic transceiver and the cable connected to the aforementioned ultrasonic transducer, and a filler for filling the gaps within the receiving portion.

[0170] The hardness of the filler is greater than the hardness of the backing material layer. (7)

[0172] According to the ultrasonic endoscope described in (6), wherein,

[0173] The above-mentioned filler has a crosslinking density of 500 mol / m³. 3 Above and 12000mol / m 3 The following epoxy resins. (8)

[0175] According to any one of (1) to (5) of the ultrasonic endoscope, wherein,

[0176] The aforementioned backing material layer comprises at least one of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure. (9)

[0178] According to the ultrasonic endoscope described in (8), wherein,

[0179] The aforementioned backing material layer is composed of heat-dissipating filler. (10)

[0181] According to the ultrasonic endoscope described in (9), wherein,

[0182] The thermal conductivity of the aforementioned heat dissipation filler is above 30 W / m•K. (11)

[0184] According to the ultrasonic endoscope described in (10), wherein,

[0185] The aforementioned heat dissipation filler includes at least one of aluminum oxide, tungsten oxide, silicon carbide, tungsten carbide, silicon nitride, boron nitride, and aluminum nitride. (12)

[0187] According to any one of (1) to (5) of the ultrasonic endoscope, wherein,

[0188] The thickness of the aforementioned backing material layer is 0.5 mm or more and 1.5 mm or less. (13)

[0190] According to the ultrasonic endoscope described in (12), wherein,

[0191] Regarding the vibration frequency of the aforementioned ultrasonic transducer, the center frequency is above 5MHz and below 12MHz. (14)

[0193] According to any one of (1) to (5) of the ultrasonic endoscope, wherein,

[0194] The ultrasonic transceiver unit is located further forward than the camera unit.

Claims

1. An ultrasonic endoscope, characterized in that, It has a front end that includes an ultrasonic transceiver unit and a camera unit. The ultrasonic transceiver unit includes an ultrasonic transducer and a backing material layer. The glass transition temperature of the backing material layer is below 45 degrees Celsius.

2. The ultrasonic endoscope according to claim 1, wherein, The glass transition temperature is above 10 degrees Celsius.

3. The ultrasonic endoscope according to claim 2, wherein, The glass transition temperature is below 40 degrees Celsius.

4. The ultrasonic endoscope according to claim 3, wherein, The glass transition temperature is above 20 degrees Celsius.

5. The ultrasonic endoscope according to claim 4, wherein, The glass transition temperature is above 25 degrees and below 35 degrees.

6. The ultrasonic endoscope according to any one of claims 1 to 5, wherein, The front end is provided with a housing for accommodating the ultrasonic transceiver and the cable connected to the ultrasonic transducer, and a filler for filling the gaps within the housing. The hardness of the filler is greater than the hardness of the backing material layer.

7. The ultrasonic endoscope according to claim 6, wherein, The filler has a crosslinking density of 500 mol / m³. 3 Above and 12000mol / m 3 The following epoxy resins.

8. The ultrasonic endoscope according to any one of claims 1 to 5, wherein, The backing material layer comprises any one of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure.

9. The ultrasonic endoscope according to claim 8, wherein, The backing material layer is composed of heat-dissipating filler.

10. The ultrasonic endoscope according to claim 9, wherein, The thermal conductivity of the heat dissipation filler is above 30 W / m•K.

11. The ultrasonic endoscope according to claim 10, wherein, The heat dissipation filler includes any one of alumina, tungsten oxide, silicon carbide, tungsten carbide, silicon nitride, boron nitride, and aluminum nitride.

12. The ultrasonic endoscope according to any one of claims 1 to 5, wherein, The thickness of the backing material layer is more than 0.5 mm and less than 1.5 mm.

13. The ultrasonic endoscope according to claim 12, wherein, Regarding the vibration frequency of the ultrasonic transducer, the center frequency is above 5MHz and below 12MHz.

14. The ultrasonic endoscope according to any one of claims 1 to 5, wherein, The ultrasonic transceiver is located at a more forward position than the camera unit.

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