An electronic component gluing device

CN224807694UActive Publication Date: 2026-09-29JIANGSU FUKUN PHOTOELECTRIC TECH CO LTD
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Patent Information

Application Number
CN202521717563.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-13
Publication Date
2026-09-29
Estimated Expiration
2035-08-13

AI Technical Summary

Technical Problem

[0004]涂胶过程中有时需要根据涂胶对象调整涂胶头的出胶速度,但目前的涂胶设备调整涂胶头的触角速度不够方便和及时,同时由于出胶速度的调整,同等环境下若出胶速度较大时,有可能会出现胶水不能及时凝固,影响涂胶效果

Benefits of technology

本实用新型改变了涂胶头的结构并增加调节壳,通过旋转调节壳,可以改变涂胶头的开口大小,从而实现随时调整涂胶头的出胶速度;该设备还通过加热组件为涂胶平台加热,使涂胶平台温度升高提高胶水凝固速度,同时可以在调整涂胶头的触角速度时适当提升温度,使涂胶平台温度适应更快的涂胶速度,防止出胶速度较快时有部分胶水不能及时凝固。

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Abstract

The utility model belongs to the production gluing technical field, specifically disclose a kind of electronic component gluing equipment, including portal frame and gluing head, it is characterized in that, the gluing head is connected by linear module and the portal frame, the gluing head outside is equipped with adjusting shell, the adjusting shell is oval shell, annular guide rail is fixed along the adjusting shell inner wall, the glue discharging speed of the gluing head is changed by rotating the adjusting shell, the gluing platform bottom is equipped with heating assembly, the gluing platform is heated after the heating assembly energization;The gluing head includes two circular arc inner limit blocks, the inner limit block inner arc surface is towards another the inner limit block, two the inner limit blocks are symmetrically arranged, and the connecting rubber is respectively fixed with connecting rubber at two ends of the inner limit block by glue, the equipment solves the problem that the glue discharging speed of current gluing equipment adjusting gluing head is not enough convenient and glue can not be solidified in time possibly when glue discharging speed is relatively large, influence gluing effect.
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Description

Technical Field

[0001] This utility model belongs to the field of adhesive coating technology, specifically relating to an adhesive coating equipment for electronic components. Background Technology

[0002] Electronic components are the building blocks of electronic parts and small machines and instruments. They are usually composed of several parts and can be used interchangeably in similar products. They often refer to certain parts in the electrical, radio, and instrument industries, and are a general term for electronic devices such as capacitors, transistors, hairsprings, and mainsprings. Common examples include diodes.

[0003] In the production of certain electronic components, it is necessary to apply adhesive to their surfaces to meet the corresponding production process requirements. For example, radio frequency filters generally require the application of conductive and sealing metal adhesive to the silver plating layer of their aluminum bodies.

[0004] During the glue application process, it is sometimes necessary to adjust the glue dispensing speed of the glue head according to the object being glued. However, the current glue application equipment is not convenient or timely enough to adjust the dispensing speed of the glue head. At the same time, due to the adjustment of the dispensing speed, if the dispensing speed is higher under the same conditions, the glue may not solidify in time, affecting the glue application effect.

[0005] Therefore, an electronic component coating device is proposed to solve the problems of the current coating device, which is not convenient to adjust the dispensing speed of the dispensing head and may cause the glue to not solidify in time when the dispensing speed is too high, thus affecting the coating effect. Summary of the Invention

[0006] The purpose of this invention is to provide a positioning device for drilling holes in the body of a drying cylinder, so as to solve the problems mentioned in the background art.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution: an electronic component coating equipment, including a gantry frame and a coating head, characterized in that the coating head is connected to the gantry frame through a linear module, an adjustment shell is provided on the outer side of the coating head, the adjustment shell is an elliptical shell, an annular guide rail is fixed along the inner wall of the adjustment shell, the dispensing speed of the coating head is changed by rotating the adjustment shell, and a heating component is provided at the bottom of the coating platform, the heating component heats the coating platform after being powered on; The adhesive applicator includes two arc-shaped inner limiting blocks, with the inner arc-shaped surface of one inner limiting block facing the other. The two inner limiting blocks are symmetrically arranged, and connecting rubber is fixed to both ends of each inner limiting block with adhesive. The other ends of the two connecting rubbers are fixed to the ends of the opposite inner limiting blocks with adhesive. The two inner limiting blocks and the two connecting rubbers form a sealing limiting opening. A connecting rod is fixed in the middle of the outer arc surface of the inner limiting block, and an outer limiting block is fixed at the other end of the connecting rod. The curvature of the outer limiting block is the same as that of the inner limiting block, and the outer limiting block is rotatably connected to the annular guide rail of the adjusting shell. The two outer limiting blocks are fixedly connected to the sub-guide rod and the mother guide rod at both ends, respectively. The mother guide rod is hollow inside and has a clearance fit with the sub-guide rod, allowing the sub-guide rod to slide inside the mother guide rod. A spring is sleeved on the outside of the mother guide rod, and the two ends of the spring are fixed to the two outer limiting blocks at both ends, respectively.

[0008] This utility model further illustrates that the gantry frame is connected to the gantry frame base via a linear module, which is used to achieve precise positioning and smooth movement of the gantry frame on the base.

[0009] The present invention further describes that the glue-applying platform is fixed on the gantry base, the glue-applying platform includes a heating component, the heating component is located at the bottom of the glue-applying platform, the heating component includes a mounting plate and an electric heating film, the mounting plate is fixed to the glue-applying platform by bolts, and the electric heating film is provided above the mounting plate.

[0010] This invention further explains that the heating film and the controller are electrically connected, and the voltage of the heating film is controlled by the controller so as to adjust the heating intensity as needed.

[0011] This invention further explains that the spring is always in a compressed state to ensure that tension is maintained during adjustment and to prevent the glue outlet from becoming loose.

[0012] This invention further explains that the adhesive used in this device is a chemically reactive adhesive.

[0013] Compared with the prior art, the beneficial effects achieved by this utility model are: This invention modifies the structure of the dispensing head and adds an adjustment shell. By rotating the adjustment shell, the opening size of the dispensing head can be changed, thereby allowing for adjustment of the dispensing speed at any time. The device also heats the dispensing platform through a heating component, increasing the platform temperature and accelerating the glue solidification speed. Simultaneously, the temperature can be appropriately increased when adjusting the dispensing head's contact angle speed, allowing the dispensing platform temperature to adapt to a faster dispensing speed and preventing some glue from failing to solidify in time when the dispensing speed is too fast.

[0014] This equipment solves the problems of current glue coating equipment, such as the inconvenience of adjusting the glue dispensing speed of the glue head and the possibility that the glue may not solidify in time when the dispensing speed is too high, thus affecting the glue coating effect. Attached Figure Description

[0015] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the heating component inside the adhesive coating platform of this utility model; Figure 3 This is a partial structural diagram of the glue applicator when the opening of the glue applicator is at its minimum. Figure 4 This is a partial structural diagram of the glue applicator when the opening of the glue applicator is at its maximum. Figure 5 This is a schematic diagram of the connection structure of the outer limiting block of this utility model via the sub-guide rod and the mother guide rod. In the diagram: 1. Gantry frame; 2. Gantry frame base; 3. Glue application platform; 31. Heating component; 311. Mounting plate; 312. Heating film; 4. Glue application head; 41. Inner limit block; 42. Connecting rubber; 43. Connecting rod; 44. Outer limit block; 45. Sub-guide rod; 46. Female guide rod; 47. Spring; 5. Adjusting shell. Detailed Implementation

[0016] The following detailed, non-limiting description of the present invention, in conjunction with preferred embodiments and accompanying drawings, is provided. Obviously, the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0017] Please see Figure 1-5 The present invention provides the following technical solution: An electronic component coating device is characterized in that it includes a gantry frame 1, a gantry frame base 2, a coating platform 3, and a coating head 4. The coating head 4 is provided with an adjustment shell 5 on its outer side. The adjustment shell 5 is an elliptical shell. An annular guide rail is fixed along the inner wall of the adjustment shell 5. The dispensing speed of the coating head 4 is changed by rotating the adjustment shell 5. The bottom of the coating platform 3 is provided with a heating component 31. The heating component 31 heats the coating platform 3 after being energized.

[0018] The adhesives used in this device are chemically reactive adhesives, such as epoxy resin adhesives, polyurethane adhesives, and acrylic AB adhesives. Heating accelerates molecular movement and promotes cross-linking reactions, thereby shortening the curing time. For example, the curing speed of epoxy resin adhesives is significantly increased at 50-80℃.

[0019] The gantry frame 1 is connected to the gantry frame base 2 via a linear module. The linear module is used to achieve precise positioning and smooth movement of the gantry frame 1 on the base 2. The glue applicator 4 is connected to the gantry frame 1 via a linear module, ensuring that the glue applicator 4 can be flexibly adjusted on the gantry frame 1.

[0020] The glue application platform 3 is fixedly installed on the gantry base 2, providing a stable working surface. The glue application platform 3 includes a heating component 31, which is located at the bottom of the glue application platform 3. The heating component 31 includes a mounting plate 311 and an electric heating film 312. The mounting plate 311 is fixed to the glue application platform 3 by bolts. The electric heating film 312 is provided above the mounting plate 311, and the electric heating film 312 ensures that heat is evenly conducted to the surface of the glue application platform 3.

[0021] The heating film 312 is electrically connected to the controller, and the voltage of the heating film 312 is controlled by the controller so as to adjust the heating intensity as needed.

[0022] The glue applicator 4 includes two arc-shaped inner limiting blocks 41, with the inner arc surface of the inner limiting block 41 facing the other inner limiting block 41. The two inner limiting blocks 41 are symmetrically arranged, and connecting rubbers 42 are fixed to both ends of the inner limiting blocks 41 by glue. The other ends of the two connecting rubbers 42 are fixed to the two ends of the inner limiting blocks 41 on the opposite side by glue. The two inner limiting blocks 41 and the two connecting rubbers 42 form a limiting opening, which is used to control the glue flow rate. The connecting rubbers 42 provide elastic support to adapt to adjustment. A connecting rod 43 is fixed in the middle of the outer arc surface of the inner limiting block 41, and an outer limiting block 44 is fixed at the other end of the connecting rod 43. The curvature of the outer limiting block 44 is the same as that of the inner limiting block 41, and the outer limiting block 44 is rotatably connected to the annular guide rail of the adjusting shell 5.

[0023] The two outer limiting blocks 44 are fixedly connected at both ends to the sub-guide rod 45 and the mother guide rod 46, respectively. The mother guide rod 46 is hollow inside and has a clearance fit with the sub-guide rod 45, allowing the sub-guide rod 45 to slide within the mother guide rod 46, thereby changing the spacing of the inner limiting blocks 41. A spring 47 is sleeved on the outside of the mother guide rod 46, and the two ends of the spring 47 are fixed to the two ends of the two outer limiting blocks 44, respectively. The spring 47 provides a restoring force and a buffering effect for the sub-guide rod 45 and the mother guide rod 46.

[0024] The spring 47 is always in a compressed state to ensure that tension is maintained during adjustment and to prevent the glue outlet from loosening.

[0025] Working principle: When applying glue, the heating component 31 can be energized to heat the glue application platform 3, accelerating the glue solidification process and improving the glue application efficiency; the voltage of the heating component 31 can also be adjusted by the controller to precisely control the required heating temperature according to the type of glue used or the different requirements of the glue application components.

[0026] When it is necessary to adjust the dispensing speed of the glue applicator 4, the adjusting shell 5 on the outside of the glue applicator 4 is rotated. By rotating the adjusting shell 5, the distance between the two outer limiting blocks 44 is changed based on the current position of the contact point with the adjusting shell 5, thereby changing the size of the glue outlet. like Figure 3 As shown, at this time, the positional relationship between the adjusting shell 5 and the glue applicator 4 minimizes the distance between the inner limiting blocks 41. At this time, the cross-sectional area of ​​the inner limiting blocks 41 is minimized, and the glue dispensing speed of the glue applicator 4 is slowed down, which is suitable for high-precision glue application requirements. like Figure 4 As shown, at this time, the positional relationship between the adjusting shell 5 and the glue applicator 4 maximizes the distance between the inner limiting blocks 41. At this time, the cross-sectional area of ​​the inner limiting blocks 41 is maximized, so that the glue dispensing speed of the glue applicator 4 is the fastest, which meets the needs of large-area rapid glue application scenarios.

[0027] Furthermore, a knob can be connected to the adjusting shell 5 to simplify the adjustment process. The voltage applied to the heating component 31 by the controller can be adjusted so that when the dispensing speed increases, the voltage applied to the heating component 31 also increases, and when the dispensing speed decreases, the voltage applied to the heating component 31 also decreases. This achieves linkage control, where increasing the dispensing speed also appropriately increases the heating temperature of the heating component on the coating platform 3 to adapt to the faster dispensing speed and prevent delayed glue solidification; conversely, decreasing the dispensing speed also appropriately decreases the heating temperature of the heating component on the coating platform 3 to adapt to the slower dispensing speed and avoid overheating and wasting energy, thereby improving overall coating efficiency and the intelligence level of the equipment.

[0028] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0029] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. An electronic component coating equipment, comprising a gantry (1), a gantry base (2), a coating platform (3), and a coating head (4), characterized in that, The glue applicator (4) is connected to the gantry frame (1) via a linear module. An adjustment shell (5) is provided on the outside of the glue applicator (4). The adjustment shell (5) is an elliptical shell. An annular guide rail is fixed along the inner wall of the adjustment shell (5). The glue dispensing speed of the glue applicator (4) is changed by rotating the adjustment shell (5). The gantry frame (1) is connected to the gantry frame base (2) via a linear module. The glue applicator platform (3) is fixed on the gantry frame base (2). A heating component (31) is provided at the bottom of the glue applicator platform (3). The heating component (31) heats the glue applicator platform (3) after being powered on. The adhesive applicator (4) includes two arc-shaped inner limiting blocks (41), with the inner arc-shaped surface of the inner limiting block (41) facing the other inner limiting block (41). The two inner limiting blocks (41) are arranged symmetrically. Connecting rubbers (42) are fixed to both ends of the inner limiting blocks (41) with adhesive. The other ends of the two connecting rubbers (42) are fixed to the two ends of the opposite inner limiting blocks (41) with adhesive. The two inner limiting blocks (41) and the two connecting rubbers (42) form a closed limiting opening. A connecting rod (43) is fixed in the middle of the outer arc surface of the inner limiting block (41), and an outer limiting block (44) is fixed at the other end of the connecting rod (43). The curvature of the outer limiting block (44) is consistent with that of the inner limiting block (41), and the outer limiting block (44) is rotatably connected to the annular guide rail of the adjusting shell (5). The two outer limiting blocks (44) are fixedly connected to the sub-guide rod (45) and the mother guide rod (46) at both ends respectively. The mother guide rod (46) is hollow inside and has a clearance fit with the sub-guide rod (45) so that the sub-guide rod (45) can slide inside the mother guide rod (46). A spring (47) is sleeved on the outside of the mother guide rod (46), and the two ends of the spring (47) are fixed to the two outer limiting blocks (44) at both ends respectively.

2. The electronic component coating equipment according to claim 1, characterized in that: The linear module is used to achieve precise positioning and smooth movement of the gantry (1) on the base (2).

3. The electronic component coating equipment according to claim 2, characterized in that: The adhesive application platform (3) includes a heating component (31), which is located at the bottom of the adhesive application platform (3). The heating component (31) includes a mounting plate (311) and an electric heating film (312). The mounting plate (311) is fixed to the adhesive application platform (3) by bolts, and the electric heating film (312) is provided above the mounting plate (311).

4. The electronic component coating equipment according to claim 3, characterized in that: The heating film (312) is electrically connected to the controller, and the voltage of the heating film (312) is controlled by the controller so as to adjust the heating intensity as needed.

5. The electronic component coating equipment according to claim 4, characterized in that: The spring (47) is always in a compressed state to ensure that tension is maintained during adjustment and to prevent the outlet from loosening.

6. The electronic component coating equipment according to claim 1, characterized in that: The adhesive used in this equipment is a chemically reactive adhesive.