Wafer spin coating cover structure and spin coating device

Abstract

This utility model relates to a wafer spin coating cap structure and spin coating device. The spin coating cap structure includes: a cap assembly, including a connector, a floating joint, and a cap body. The floating joint is adapted to connect the cap body and the connector. The floating joint is configured to drive the cap body to rotate relative to the connector when the cap body is subjected to pressure from the spin coating cavity, thereby adjusting the level of the cap body; a connecting arm, having a mounting part, on which the cap assembly is adapted to be mounted; and a drive assembly, including a mounting frame, a drive component disposed on the mounting frame, and a transmission component connecting the drive component and the connecting arm. The transmission component can convert the rotational motion of the drive component into the linear motion of the connecting arm, thereby driving the cap assembly to move up and down. By providing a floating joint, the cap body can be driven to rotate relative to the connector when the cap body is subjected to pressure from the spin coating cavity, thereby automatically adjusting the level of the cap body to ensure a tight fit between the cap body and the sealing surface of the spin coating cavity, improving the quality of wafer spin coating.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, specifically to a wafer spin coating structure and spin coating device. Background Technology

[0002] In semiconductor manufacturing processes, spin coating is a common thin-film deposition technique used to uniformly coat photoresist or other liquid materials onto the wafer surface. Spin coating is typically performed in a specialized spin coating chamber, and the chamber's lid plays a crucial role in the process. It must not only reliably seal the chamber to prevent external contamination and internal material leakage, but also ensure stable pressure and environment within the chamber during spin coating.

[0003] However, in existing spin coating chambers, the cover is typically connected to the chamber via a rigid connection structure. This connection method cannot effectively adjust the cover's levelness. During actual use, the spin coating chamber may be affected by various factors, such as uneven equipment installation, mechanical vibration, and thermal expansion. This can cause the sealing surfaces between the cover and the chamber to not always maintain an ideal parallel state. Consequently, the cover cannot fit tightly against the spin coating chamber when closed, leading to a decrease in the chamber's sealing performance and affecting the quality and stability of the spin coating process.

[0004] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Utility Model Content

[0005] In view of this, this application provides a wafer spin-coating capping structure to solve at least one problem existing in the prior art, suitable for capping with a spin-coating cavity, the spin-coating capping structure comprising:

[0006] A cover assembly includes a connector, a floating joint, and a cover body. The floating joint is adapted to connect the cover body and the connector. The cover body is used to open or close a spin coating chamber. The floating joint is configured to rotate the cover body relative to the connector when the cover body is subjected to pressure from the spin coating chamber, thereby adjusting the levelness of the cover body.

[0007] A connecting arm having a mounting portion, the cover assembly being adapted to be mounted on the mounting portion;

[0008] The drive assembly includes a mounting bracket, a drive component disposed on the mounting bracket, and a transmission component connecting the drive component and the connecting arm. The transmission component is capable of converting the rotational motion of the drive component into the linear motion of the connecting arm, thereby driving the cover assembly to move up and down.

[0009] Optionally, in the above-described wafer spin-coating cap structure, the cap assembly is detachably connected to the mounting portion.

[0010] Optionally, in the above-mentioned wafer spin coating structure, the mounting part is provided with a retaining space with an opening facing one side, and the bottom wall of the retaining space is provided with an installation notch;

[0011] The connector includes a support portion with a width greater than the diameter of the mounting notch. The connector is configured such that the connector passes through the mounting notch such that the support portion is located within the retaining space and abuts against the bottom wall of the retaining space, and an upward force is applied to the bottom surface of the retaining space by a first fastener.

[0012] Optionally, in the above-described wafer spin-coating structure, the mounting portion further includes a limiting portion that extends upward from the bottom wall of the holding space and is located on both sides of the mounting notch, wherein the projection of the limiting portion in the first direction at least partially overlaps with the abutting portion.

[0013] Optionally, in the above-described wafer spin-coating structure, a first distance is formed between the limiting portion and the top arm of the holding space, and the first distance is greater than the thickness of the abutting portion.

[0014] Optionally, in the above-described wafer spin-coating capping structure, the floating connector includes a first connecting section and a second connecting section. The upper end of the first connecting section is threadedly connected to the connector, and the lower end of the second connecting section is threadedly connected to the cap body. The upper end of the second connecting section is rotatably connected to the lower end of the first connecting section through a spherical floating head.

[0015] Optionally, in the above-described wafer spin-coating cap structure, the cap structure further includes a connecting seat located between the floating connector and the cap body. The connecting seat is provided with a through hole, and the lower end of the second connecting segment passes through the through hole and connects to the cap body. The diameter of the through hole is larger than the diameter of the lower end of the second connecting segment, so that the second connecting segment can drive the cap body to swing in the horizontal direction.

[0016] Optionally, the wafer spin-coating cap structure described above further includes a protective sleeve fitted over the outside of the floating connector.

[0017] Optionally, in the above-described wafer spin coating cap structure, the cap body includes an upper cap connected to the floating connector and a lower cap connected to the upper cap. The upper cap is made of metal, and the lower cap and the spin coating cavity are both made of plastic.

[0018] This application also provides a wafer spin coating apparatus, comprising:

[0019] A spin coating chamber includes a housing and a chuck disposed within the housing, the chuck being used to carry a wafer;

[0020] A rotary structure, at least partially disposed within the spin coating cavity, and a rotary motor connected to the chuck, is used to drive the chuck to rotate.

[0021] A coating structure, located on one side of the spin coating cavity, is used to provide material to the wafer surface;

[0022] A cover structure, located on one side of the spin coating cavity, is used to open or close the spin coating cavity. The cover structure is the wafer spin coating cover structure described in any one of the above descriptions.

[0023] Compared with the prior art, this application has the following advantages: by setting a floating joint, the cover body can be driven to rotate relative to the connector when it is subjected to the pressure of the spin coating cavity, thereby automatically adjusting the level of the cover body to ensure a tight fit between the cover body and the sealing surface of the spin coating cavity, effectively preventing external impurities and gases from entering the cavity, and also avoiding leakage of internal materials, so that the spin coating process can be carried out in a stable environment, thereby improving the quality of wafer spin coating. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the wafer spin-coating structure shown in this application;

[0025] Figure 2 yes Figure 1 A schematic diagram of another direction of the wafer spin-coating structure shown;

[0026] Figure 3 yes Figure 2 The diagram shows a cross-sectional view of the wafer spin-coating structure.

[0027] Figure label:

[0028] 1-Cover assembly, 11-Connector, 111-Supporting part, 12-Floating joint, 121-First connecting section, 122-Second connecting section, 123-Spherical floating head, 13-Cover body, 131-Upper cover, 132-Lower cover;

[0029] 2-Connecting arm, 21-Mounting part, 211-Limiting part, 212-First distance, 22-Holding space, 221-Opening, 23-Mounting notch;

[0030] 3-Drive assembly, 31-Mounting bracket, 32-Drive component, 33-Transmission component;

[0031] 4-First fastener;

[0032] 5-Connector, 51-Through hole;

[0033] 6-Protective cover. Detailed Implementation

[0034] The exemplary embodiments disclosed in this application will now be described in more detail. Numerous specific details are set forth in the following description to provide a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without one or more of these details. In other instances, to avoid confusion with this application, some technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0035] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this application.

[0036] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used here for convenience to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of devices in use and operation.

[0037] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “ / the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “compose” and / or “comprising,” when used in this specification, identify the presence of features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0038] To fully understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solution of this application. Preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0039] Please refer to Figures 1-3 As shown in the preferred embodiment of this application, a wafer spin coating apparatus is used to spin coat a wafer so that the coating material can be uniformly covered on the wafer surface. The apparatus includes a spin coating chamber, a rotating structure, a coating structure, and a cover structure. The spin coating chamber includes a housing and a chuck disposed within the housing, the chuck being used to hold the wafer; the rotating structure is at least partially disposed within the spin coating chamber and is connected to a rotary motor connected to the chuck, used to drive the chuck to rotate; the coating structure is located on one side of the spin coating chamber and is used to provide material to the wafer surface; the cover structure is located on one side of the spin coating chamber and is used to open or close the spin coating chamber.

[0040] Furthermore, the cover structure includes a cover body assembly 1, a connecting arm 2, and a drive assembly 3. The cover body assembly 1 includes a connector 11, a floating joint 12, and a cover body 13. The floating joint 12 is adapted to connect the cover body 13 and the connector 11. The cover body 13 is used to open or close the spin coating chamber. The floating joint 12 is configured to rotate the cover body 13 relative to the connector 11 when the cover body 13 is subjected to pressure from the spin coating chamber, thereby adjusting the levelness of the cover body 13. The connecting arm 2 has a mounting portion 21, and the cover body assembly 1 is adapted to be mounted on the mounting portion 21. The drive assembly 3 includes a mounting frame 31, a drive member 32 disposed on the mounting frame 31, and a transmission member 33 connecting the drive member 32 and the connecting arm 2. The transmission member 33 can convert the rotational motion of the drive member 32 into linear motion of the connecting arm 2, thereby driving the cover body assembly 1 to move up and down.

[0041] Understandably, by using the floating joint 12 to connect the cover body 13, the floating joint 12 can drive the cover body 13 to rotate relative to the connector 11 when it is under pressure after contacting the spin coating cavity. This automatically adjusts the levelness of the cover body 13, ensuring a tight fit between the cover body 13 and the sealing surface of the spin coating cavity. This reduces the problem of incomplete sealing caused by uneven installation of the spin coating cavity, mechanical vibration, or thermal expansion, thereby improving the stability and repeatability of the spin coating process. It should be noted that in this embodiment, the adjustable angle of the cover body 13 is 3-8 degrees.

[0042] It is worth noting that in this embodiment, the cover includes an upper cover 131 connected to the floating connector 12 and a lower cover 132 connected to the upper cover 131. The upper cover 131 is made of metal, while the lower cover 132 and the spin coating cavity are both made of plastic. The reason for this arrangement is that the upper cover 131 being made of metal ensures the strength of the cover, while the lower cover 132 being made of the same plastic material as the spin coating cavity, whose good chemical stability can prevent corrosion of the spin coating material.

[0043] Furthermore, the cover assembly 1 is detachably connected to the mounting part 21, which facilitates the maintenance and replacement of the cover assembly 1 and reduces the maintenance cost of the equipment. For example, if the cover assembly 1 is damaged or needs to be cleaned, it can be easily removed from the mounting part 21 and a new cover assembly 1 can be installed on the mounting part 21. The operation is simple and will not delay the spin coating process.

[0044] In this embodiment, the mounting part 21 is provided with a holding space 22 with an opening 221 facing one side, and the bottom wall of the holding space 22 is provided with an installation notch 23; the connector 11 includes a supporting part 111 with a width greater than the diameter of the installation notch 23. The connector 11 is configured such that the connector 11 passes through the installation notch 23 so that the supporting part 111 is located in the holding space 22 and abuts against the bottom wall of the holding space 22, and an upward force is applied to the bottom surface of the holding space 22 by the first fastener 4.

[0045] Understandably, by providing a retaining space 22 and an installation notch 23, the connector 11 can enter the retaining space 22 from the installation notch 23, and the connector 11 is fixed by the abutment part 111 of the connector 11 and the first fastener 4 at the same time, thereby realizing the quick disassembly or installation of the cover assembly 1 and ensuring the stability of the cover assembly 1 after installation.

[0046] Furthermore, the mounting portion 21 also includes limiting portions 211 that extend upward from the bottom wall of the holding space 22 and are located on both sides of the mounting notch 23. The projection of the limiting portions 211 in the first direction at least partially overlaps with the abutting portion 111. The purpose of this arrangement is to further limit the connector 11 and prevent the abutting portion 111 of the connector 11 from coming out of the opening 221.

[0047] Furthermore, a first distance 212 is formed between the limiting part 211 and the top arm of the holding space 22. The first distance 212 is greater than the thickness of the supporting part 111, providing sufficient clearance for the installation and disassembly of the connector 11. This arrangement can simultaneously achieve the limiting and installation / disassembly of the supporting part 111 without the need for additional separate limiting structures. In this embodiment, the thickness of the supporting part 111 is 3.5 mm, and the first distance 212 is 5 mm. In other embodiments, the thickness of the supporting part 111 and the first distance 212 are not specifically limited, but are determined according to the actual situation.

[0048] When it is necessary to install the connector 11 to the mounting part 21, loosen the first fastener 4 so that the connector 11 is aligned with the mounting notch 23 and the abutting part 111 is positioned above the limiting part 211 so that it can enter the holding space 22 from the opening 221. Then, the abutting part 111 abuts against the bottom wall of the holding space 22 and the first fastener 4 is tightened to achieve the installation and fixation of the connector 11. When it is necessary to remove the connector 11 from the mounting part 21, loosen the first fastener 4, raise the connector 11 so that the abutting part 111 is higher than the limiting part 211, and then remove the connector 11 from the holding space 22 through the mounting notch 23.

[0049] Furthermore, the floating joint 12 includes a first connecting section 121 and a second connecting section 122. The upper end of the first connecting section 121 is threadedly connected to the connector 11, and the lower end of the second connecting section 122 is threadedly connected to the cover body 13. The upper end of the second connecting section 122 is rotatably connected to the lower end of the first connecting section 121 through a spherical floating head 123.

[0050] Furthermore, the cover structure also includes a connecting seat 5 located between the floating joint 12 and the cover body 13. The connecting seat 5 is provided with a through hole 51. The lower end of the second connecting segment 122 passes through the through hole 51 and connects to the cover body 13. The diameter of the through hole 51 is larger than the diameter of the lower end of the second connecting segment 122, so that the second connecting segment 122 can drive the cover body 13 to swing in the horizontal direction.

[0051] Furthermore, the cover structure also includes a protective sleeve 6 fitted over the outside of the floating joint 12, which can effectively protect the floating joint 12 from external impurities entering the floating joint 12 and mechanical damage, and extend the service life of the floating joint 12.

[0052] The above is only one specific implementation of this application, and any other improvements made based on the concept of this application shall be considered within the scope of protection of this application.

Claims

1. A wafer spin-coating cap structure, suitable for fitting with a spin-coating cavity, characterized in that, The spin-coating capping structure includes: A cover assembly includes a connector, a floating joint, and a cover body. The floating joint is adapted to connect the cover body and the connector. The cover body is used to open or close a spin coating chamber. The floating joint is configured to rotate the cover body relative to the connector when the cover body is subjected to pressure from the spin coating chamber, thereby adjusting the levelness of the cover body. A connecting arm having a mounting portion, the cover assembly being adapted to be mounted on the mounting portion; The drive assembly includes a mounting bracket, a drive component disposed on the mounting bracket, and a transmission component connecting the drive component and the connecting arm. The transmission component is capable of converting the rotational motion of the drive component into the linear motion of the connecting arm, thereby driving the cover assembly to move up and down.

2. The wafer spin-coating structure according to claim 1, characterized in that, The cover assembly is detachably connected to the mounting portion.

3. The wafer spin-coating structure according to claim 2, characterized in that, The mounting part is provided with a holding space with an opening facing one side, and the bottom wall of the holding space is provided with an installation notch; The connector includes a support portion with a width greater than the diameter of the mounting notch. The connector is configured such that the connector passes through the mounting notch such that the support portion is located within the retaining space and abuts against the bottom wall of the retaining space, and an upward force is applied to the bottom surface of the retaining space by a first fastener.

4. The wafer spin-coating structure according to claim 3, characterized in that, The mounting portion further includes limiting portions that extend upward from the bottom wall of the holding space and are located on both sides of the mounting notch, wherein the projection of the limiting portions in the first direction at least partially overlaps with the abutting portion.

5. The wafer spin-coating structure according to claim 4, characterized in that, A first distance is formed between the limiting part and the top arm of the holding space, and the first distance is greater than the thickness of the abutting part.

6. The wafer spin-coating structure according to claim 1, characterized in that, The floating joint includes a first connecting section and a second connecting section. The upper end of the first connecting section is threadedly connected to the connector, and the lower end of the second connecting section is threadedly connected to the cover body. The upper end of the second connecting section is rotatably connected to the lower end of the first connecting section through a spherical floating head.

7. The wafer spin-coating structure according to claim 6, characterized in that, The cover structure also includes a connecting seat located between the floating joint and the cover body. The connecting seat is provided with a through hole. The lower end of the second connecting segment passes through the through hole and connects to the cover body. The diameter of the through hole is larger than the diameter of the lower end of the second connecting segment, so that the second connecting segment can drive the cover body to sway in the horizontal direction.

8. The wafer spin-coating structure according to claim 7, characterized in that, The cover structure also includes a protective sleeve fitted over the outside of the floating joint.

9. The wafer spin-coating structure according to any one of claims 1-8, characterized in that, The cover includes an upper cover connected to the floating joint and a lower cover connected to the upper cover. The upper cover is made of metal, while the lower cover and the spin coating cavity are both made of plastic.

10. A wafer spin coating apparatus, characterized in that, include: A spin coating chamber includes a housing and a chuck disposed within the housing, the chuck being used to carry a wafer; A rotary structure, at least partially disposed within the spin coating cavity, and a rotary motor connected to the chuck, is used to drive the chuck to rotate. A coating structure, located on one side of the spin coating cavity, is used to provide material to the wafer surface; A cover structure, located on one side of the spin coating cavity, is used to open or close the spin coating cavity, wherein the cover structure is the wafer spin coating cover structure according to any one of claims 1-8.

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