An automated chip detection apparatus

Abstract

The utility model discloses an automatic chip detection device belongs to chip detection technical field, and its technical key points include base and the conveyer belt of setting on the base, the top of base is equipped with the mechanical arm for automatic feeding, one end of base is equipped with the storage rack for storing the chip of waiting for detecting, the top of base is equipped with the probe station for detecting the chip, be equipped with a plurality of equidistance distribution's placing frame on the conveyer belt, the upper surface of a plurality of placing frames all are equipped with the recess for placing the chip, one end of base is fixedly connected with two equidistance distribution's pillar, and the top of pillar is rotatably installed with the guide frame through the bearing seat. The utility model discloses through being equipped with electric push rod and guide frame, has realized to the automatic classification of chip superiority and inferiority, has improved the classification efficiency and accuracy, still through being equipped with the inclined plate, the guide plate and the buffer pad, has realized the buffer protection and steady guiding transmission to the chip.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and more specifically to an automated chip testing device. Background Technology

[0002] A chip generally refers to the carrier of an integrated circuit, and is also the result of the integrated circuit after design, manufacturing, packaging and testing. It is usually an independent whole that can be used immediately. The core purpose of chip testing is to ensure that its quality, performance and reliability meet the design requirements, avoid the risk of use due to manufacturing defects or design problems, and ensure that the chip works stably within the design specifications.

[0003] A search revealed Chinese patent CN210294464U, which discloses an electronic chip testing device, including a testing host for testing electronic chips and displaying testing results. The device also includes a mounting frame, a placement tray, and a lifting device. The mounting frame includes a base, columns, and springs. The base has a mounting groove at its center, and at least two columns are symmetrically arranged on both sides of the mounting groove. However, the device still has the following drawbacks: it fails to effectively classify chips, which means that a lot of manual screening and processing is still required in the chip production process. This manual method is not only inefficient, but also significantly increases the cost of production and the time cost of operators when producing large-scale chips. Utility Model Content

[0004] The purpose of this invention is to provide an automated chip testing device to solve the problems existing in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automated chip testing device, comprising a base and a conveyor belt disposed on the base, wherein the top of the base is provided with a robotic arm for automatic feeding, one end of the base is provided with a storage rack for storing chips to be tested, the top of the base is provided with a probe station for testing chips, and the conveyor belt is provided with multiple equally spaced placement racks, the upper surface of the multiple placement racks being provided with grooves for placing chips. Two equally spaced pillars are fixedly connected to one end of the base. A guide frame is rotatably mounted on the top of the pillars through a bearing seat. The guide frame has a double-sided opening structure. A power component is provided at the bottom of the guide frame to push the guide frame to change its angle. Two collection boxes are symmetrically distributed at one end of the base.

[0006] As a further embodiment of this utility model, an inclined plate is fixedly connected to one side of the guide frame, and the inclined plate is located directly below one end of the conveyor belt.

[0007] As a further embodiment of this utility model, guide plates are fixedly connected to both ends of the guide frame at the opening.

[0008] As a further embodiment of this utility model, buffer pads are provided inside the guide frame, on the upper surface of the guide plate, and on the conveying surface of the inclined plate.

[0009] As a further embodiment of this utility model, the power assembly includes an electric push rod disposed at the bottom of the guide frame, and the electric push rod and the two support columns are symmetrically distributed at the bottom of the guide frame.

[0010] As a further embodiment of this utility model, the bottom of the electric push rod is rotatably mounted on one end of the base via a bearing seat, and the actuating end of the electric push rod is rotatably connected to the bottom of the guide frame via the bearing seat.

[0011] As a further embodiment of this invention, the bottom of the guide rack contacts the top of one of the collection boxes.

[0012] As a further embodiment of this utility model, two equally spaced slide rails are fixedly connected to the inner walls of both sides of the collection box, and a collection box that cooperates with the slide rails is provided on one side of the collection box.

[0013] As a further embodiment of this utility model, the outside of the collection box is provided with multiple limiting blocks that are fixed to the base, and the multiple limiting blocks form a limiting space.

[0014] As a further embodiment of this invention, when the conveyor belt is in operation, none of the multiple placement racks are in contact with the inclined plate.

[0015] Compared with the prior art, the technical effects and advantages of this utility model are as follows: 1. This utility model, by incorporating an electric push rod and a guide rack, achieves automatic classification of chips based on their quality, improving classification efficiency and accuracy, and greatly reducing labor costs.

[0016] 2. This utility model achieves buffer protection and stable guiding transmission of the chip through the cooperation of inclined plate, guide plate and buffer pad, thus ensuring the integrity and quality of the chip during the testing process.

[0017] 3. This utility model uses a sliding rail and a collection box inside the collection box to facilitate the centralized collection and processing of sorted chips, which greatly improves the sorting efficiency after chip detection. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the front three-dimensional structure of this utility model.

[0019] Figure 2This is a schematic diagram of the working structure of the probe station of this utility model.

[0020] Figure 3 This is a schematic diagram of the material guide frame of this utility model.

[0021] Figure 4 This is a schematic diagram of the operation of the electric actuator of this utility model.

[0022] Figure 5 This utility model Figure 4 A schematic diagram of the bottom structure viewed from below.

[0023] Figure 6 This is a schematic diagram of the collection box of this utility model.

[0024] In the diagram: 1. Storage rack; 2. Robotic arm; 3. Conveyor belt; 4. Base; 5. Probe station; 6. Placement rack; 7. Groove; 9. Inclined plate; 10. Guide rack; 11. Buffer pad; 12. Guide plate; 13. Electric push rod; 14. Support column; 15. Collection box; 16. Limit block; 17. Collection box; 18. Slide rail. Detailed Implementation

[0025] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. In addition, the forms of the various structures described in the following embodiments are merely illustrative. This utility model is not limited to the structures described in the following embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0026] Please see Figures 1-6 This utility model provides an automated chip testing device, including a base 4 and a conveyor belt 3 set on the base 4. The top of the base 4 is provided with a robotic arm 2 for automatic feeding, and the robotic arm 2 is provided with a vacuum suction cup. One end of the base 4 is provided with a storage rack 1 for storing chips to be tested. The top of the base 4 is provided with a probe station 5 for detecting whether the chips have problems. The conveyor belt 3 is provided with multiple placement racks 6 evenly distributed. The upper surface of each placement rack 6 is provided with a groove 7 for placing chips. By activating the robotic arm 2 and the vacuum suction cup, the chips placed on the storage rack 1 are grasped and then placed into the groove 7 in the placement rack 6. The placement rack 6 containing the chips is transported to the bottom of the probe station 5 for testing by the conveyor belt 3. It should be noted that: the probe station 5 (specifically model HTP-400) includes mechanical load-bearing components, precision positioning components, probes, probe holders, etc., which can detect the electrical performance and functional integrity of the chip; the robotic arm 2 includes mechanical structure, drive components, sensing components, and end effector, etc., which work together to achieve precise movement of the chip; the vacuum suction cup includes suction cup body, vacuum interface and pipeline, sealing structure and auxiliary components, etc., which generates adsorption force through vacuum negative pressure to achieve non-destructive grasping of the chip; the conveyor belt 3 includes drive motor, reduction component, frame and plate chain, etc. All of the above equipment are existing technologies, and those skilled in the art can set them up according to actual needs, which will not be described in detail here.

[0027] Two equally spaced support columns 14 are bolted to one end of the base 4. A guide frame 10 is rotatably mounted on the top of the support column 14 via a bearing seat. An inclined plate 9 is bolted to one side of the guide frame 10. When the conveyor belt 3 is in operation, the multiple placement racks 6 do not contact the inclined plate 9, ensuring that the placement racks 6 do not collide with the guide frame 10 during operation, thus preventing the chips from falling accurately into the guide frame 10. Furthermore, the inclined plate 9 is located directly below one end of the conveyor belt 3. When the chips fall from the placement racks 6 on the conveyor belt 3, they first land on the inclined plate 9, preventing the chips from directly impacting the guide frame. The inclined plate 9 can guide the chip to slide smoothly into the guide rack 10, ensuring that the chip enters the collection box 15 accurately. The guide rack 10 has a double-sided opening structure, and the bottom of the guide rack 10 can contact the top of the two collection boxes 15. On the one hand, it limits the guide rack 10. When the two are in contact, the collection box 15 will support the guide rack 10. On the other hand, it also facilitates the chip to slide smoothly from the guide rack 10 into the collection box 15. The two form a relatively closed and stable slide, ensuring that the chip will not be scattered or damaged by external factors during the transfer process.

[0028] The bottom of the guide frame 10 is equipped with a power component (such as...) to drive the guide frame 10 to change its angle. Figure 5As shown), the power assembly includes an electric push rod 13 located at the bottom of the guide frame 10. The electric push rod 13 and two support columns 14 are symmetrically distributed at the bottom of the guide frame 10. When the electric push rod 13 extends and retracts, it can push or pull the guide frame 10 to rotate around the support columns 14. When the electric push rod 13 is locked, it forms a support mechanism. The bottom of the electric push rod 13 is rotatably mounted on one end of the base 4 through a bearing seat. The execution end of the electric push rod 13 is rotatably connected to the bottom of the guide frame 10 through the bearing seat. Two collection boxes 15 are symmetrically distributed at one end of the base 4. The outside of the collection box 15 is provided with multiple limiting blocks 16 fixed to the base 4. A limiting space is formed between the multiple limiting blocks 16. The limiting space is adapted to the size of the guide frame 10. When the collection box 15 is placed in the limiting space, the limiting blocks 16 can accurately limit the collection box 15 from multiple directions to prevent the collection box 15 from shaking or shifting during chip transfer. Specifically, when probe station 5 detects that the chip is of superior quality, in this embodiment (e.g.) Figure 3 As shown), start the electric push rod 13. The actuator of the electric push rod 13 extends and retracts downward, driving the guide frame 10 to rotate around the two pillars 14, causing the guide frame 10 to tilt into one of the collection boxes 15 and contact the top of the collection box 15. The conveyor belt 3 will drive the placement frame 6 to move. When the placement frame 6 moves to the tilted state, the chip will be detached from the groove 7 and fall onto the inclined plate 9 due to the tilt of the placement frame 6. Then, it will continue to fall into the guide frame 10 along the conveying surface of the inclined plate 9. Finally, the guide frame 10 guides the high-quality chip into one of the collection boxes 15. When probe station 5 detects that the chip is defective, in this embodiment (e.g.) Figure 4 As shown), the actuator of the electric push rod 13 will extend upward until the guide rack 10 rotates to the bottom and contacts the top of another collection box 15. At this time, the defective chips will be transported to another collection box 15 via the conveyor belt 3 and the placement rack 6, so as to sort the chips into good and bad categories. It should be specifically noted that the electric push rod 13 is a self-locking electric push rod, and the electric push rod 13 is existing technology. The electric push rod 13 can be used in conjunction with a magnetic switch, a proximity switch or a photoelectric switch to achieve precise control of the rotation angle of the guide frame 10, so that the guide frame 10 can be in a stopped state at a specific angle. Those skilled in the art can set it according to actual needs, which will not be elaborated here.

[0029] To further reduce the possibility of chip damage due to impact during drop, this embodiment (e.g.) Figure 4As shown), guide plates 12 are bolted to both ends of the guide frame 10 at the opening. The guide plates 12 shorten the distance for the chip to enter the collection box 15, further ensuring that the chip can enter the collection box 15 accurately and quickly. At the same time, the inclined setting of the guide plates 12 can also play a buffering role, avoiding damage to the chip due to a large impact force caused by direct drop. Buffer pads 11 are provided inside the guide frame 10, on the upper surface of the guide plates 12, and on the conveying surface of the inclined plate 9. The buffer pads 11 are PE pads. PE pads can absorb slight impacts with their flexibility. The surface of the PE pad is smooth and has a low coefficient of friction. When the chip slides on its surface, it will not be scratched by friction. At the same time, the modified PE pads can effectively avoid the accumulation of static electricity and protect the chip circuit from being broken down.

[0030] To more effectively collect the chips after testing, this embodiment (e.g.) Figure 6 As shown, the inner walls of both sides of the collection box 15 are fixed with two equally spaced slide rails 18 by bolts. One side of the collection box 15 is provided with a collection box 17 that cooperates with the slide rail 18. The collection box 17 can slide smoothly into or out of the collection box 15 along the slide rail 18. When one collection box 17 is full of chips, it can be easily removed without affecting the detection. At the same time, the other collection box 17 can continue to receive chips, ensuring the continuity of the chip detection process. The inside of the collection box 17 is lined with soft anti-static material to further prevent the chips from being affected by static electricity or physical damage during storage. The outside of the collection box 15 also has a reserved label area to facilitate the staff to quickly identify and distinguish chips of different batches or types.

[0031] The following steps can be taken when collecting and classifying chips based on their quality: S1: First, the chip is placed in the groove 7 by the vacuum suction cup on the robotic arm 2, and then transferred to the bottom of the probe station 5 by the conveyor belt 3. S2: Then debug the probe station 5, achieve precise alignment between the chip placement rack 6 and the probe through visual positioning, then make the probe stably contact the chip, cooperate with the tester to transmit signals to detect electrical performance, and finally record and classify the chip test results. S3: When the probe station 5 has completed the chip inspection and the chip is of good quality, the power component will make the guide rack 10 contact one of the collection boxes 15, so that the chip will fall smoothly into the collection box 17. S4: When the probe station 5 has completed the chip inspection and found that the chip is defective, the power component will make the guide rack 10 contact with another collection box 15, so that the chip will fall smoothly into the collection box 17. S5: When one of the collection boxes 17 is full of chips, the staff can easily remove the collection box 17 along the slide rail 18 to complete the detection and effective collection of the chips.

[0032] Finally, the following points should be noted: In the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection" and "linkage" should be interpreted broadly, and can be mechanical or electrical connection, or internal connection between two components, or direct connection. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationship. When the absolute position of the described object changes, the relative positional relationship may change. The electronic components and modules used in this utility model can all be parts that are commonly used in the market and can achieve the specific functions in this case. The specific models and sizes can be selected and adjusted according to actual needs. The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

Claims

1. An automated chip testing device, comprising a base (4) and a conveyor belt (3) disposed on the base (4), characterized in that: The base (4) is provided with a robotic arm (2) for automatic feeding at the top. One end of the base (4) is provided with a storage rack (1) for storing chips to be tested. The base (4) is provided with a probe station (5) for testing chips at the top. The conveyor belt (3) is provided with multiple equally spaced placement racks (6). The upper surface of the multiple placement racks (6) is provided with grooves (7) for placing chips. Two equally spaced support columns (14) are fixedly connected to one end of the base (4). A guide frame (10) is rotatably installed on the top of the support column (14) through a bearing seat. The guide frame (10) has a double-sided open structure. A power component is provided at the bottom of the guide frame (10) to push the guide frame (10) to change angle. Two collection boxes (15) are symmetrically distributed at one end of the base (4).

2. The automated chip testing device according to claim 1, characterized in that: A sloping plate (9) is fixedly connected to one side of the guide frame (10), and the sloping plate (9) is located directly below one end of the conveyor belt (3).

3. The automated chip testing device according to claim 2, characterized in that: Both ends of the opening of the guide frame (10) are fixedly connected to guide plates (12).

4. The automated chip testing device according to claim 1, characterized in that: The guide frame (10), the upper surface of the guide plate (12), and the conveying surface of the inclined plate (9) are all provided with buffer pads (11).

5. The automated chip testing device according to claim 1, characterized in that: The power assembly includes an electric push rod (13) located at the bottom of the guide frame (10), and the electric push rod (13) and the two support pillars (14) are symmetrically distributed at the bottom of the guide frame (10).

6. The automated chip testing device according to claim 5, characterized in that: The bottom of the electric push rod (13) is rotatably mounted on one end of the base (4) via a bearing seat, and the actuating end of the electric push rod (13) is rotatably connected to the bottom of the guide frame (10) via a bearing seat.

7. The automated chip testing device according to claim 6, characterized in that: The bottom of the guide rack (10) contacts the top of one of the collection boxes (15).

8. The automated chip testing device according to claim 1, characterized in that: The inner walls of both sides of the collection box (15) are fixedly connected with two equally spaced slide rails (18), and a collection box (17) that cooperates with the slide rails (18) is provided on one side of the collection box (15).

9. The automated chip testing device according to claim 1, characterized in that: The outside of the collection box (15) is provided with multiple limiting blocks (16) fixed to the 4 phases, and the multiple limiting blocks (16) form a limiting space.

10. The automated chip testing device according to claim 1, characterized in that: When the conveyor belt (3) is in operation, none of the multiple placement racks (6) are in contact with the inclined plate (9).

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