Probe cleaning device and wafer inspection system

Abstract

The application relates to a probe cleaning device and a wafer detection system. The probe cleaning device comprises a cleaning plate, an adsorption plate and a negative pressure mechanism. The adsorption plate comprises a plate body and a connecting pipe. The plate body is arranged on one side of the cleaning plate. One side of the plate body facing the cleaning plate is provided with a groove. The connecting pipe is connected to the plate body and protrudes from the side of the plate body away from the cleaning plate. The connecting pipe is communicated with the groove. The negative pressure mechanism is connected to the connecting pipe. When the negative pressure mechanism is turned on, the groove forms a negative pressure, so that the cleaning plate is adsorbed on one side of the adsorption plate. The probe cleaning device can clean the tips of the probe card efficiently.

Description

Technical Field

[0001] This application relates to the field of wafer inspection technology, specifically to a probe cleaning device and a wafer inspection system. Background Technology

[0002] In wafer inspection equipment, probes are used to contact and inspect wafers. Over time, the probe tips inevitably accumulate the vapor-deposited metal layer from the wafer, necessitating cleaning. A common method is to use cleaning paper on a cleaning plate, allowing it to contact and clean the probe tips. However, this cleaning paper needs to be replaced after a period of use. Therefore, enabling rapid replacement of the cleaning paper significantly improves the efficiency of probe tip cleaning. Utility Model Content

[0003] In view of this, this application provides a probe cleaning device and a wafer inspection system, wherein the probe cleaning device has high efficiency in cleaning the tips of probe cards.

[0004] This application provides a probe cleaning device, which includes a cleaning plate, an adsorption plate, and a negative pressure mechanism. The adsorption plate includes a plate body and a connecting tube. The plate body is disposed on one side of the cleaning plate, and the side of the plate body facing the cleaning plate has a groove. The connecting tube is connected to the plate body and protrudes from the side of the plate body away from the cleaning plate, and the connecting tube communicates with the groove. The negative pressure mechanism is connected to the connecting tube. When the negative pressure mechanism is activated, a negative pressure is formed in the groove, so that the cleaning plate is adsorbed onto one side of the adsorption plate.

[0005] Furthermore, the probe cleaning device also includes a base, a bottom plate, a connecting assembly, and a horizontal adjustment assembly. The bottom plate is supported on the base and can move relative to the base in a first direction. The adsorption plate is disposed on the side of the bottom plate away from the base. The connecting assembly is used to connect the bottom plate and the adsorption plate. There are multiple horizontal adjustment assemblies, and the multiple horizontal adjustment assemblies and the connecting assembly are arranged at intervals around the outer periphery of the adsorption plate. The horizontal adjustment assemblies are respectively connected to the bottom plate and the adsorption plate and are used to adjust the relative position of the adsorption plate and the bottom plate.

[0006] Furthermore, the base plate has a first through hole extending in a first direction, and the adsorption plate has a second through hole extending in the first direction; the horizontal adjustment assembly includes an adjustment member and a first through member, the adjustment member being at least partially located between the base plate and the adsorption plate, the adjustment member being partially inserted through the first through hole and threadedly connected to the first through hole, the adjustment member being movable relative to the base plate in the first direction to adjust the relative position between the base plate and the adsorption plate; the adjustment member has a third through hole extending in the first direction, and the first through member being sequentially inserted through the first through hole, the third through hole, and the second through hole to define the relative position between the base plate and the adsorption plate.

[0007] Further, the connecting assembly includes a second through-feed member, a raising member, a first pad, and a second pad. Along a first direction, the raising member, the first pad, and the second pad are arranged sequentially, and all three are located between the adsorption plate and the base plate. The end of the raising member facing away from the first pad abuts against the adsorption plate, and the end of the second pad facing away from the raising member abuts against the base plate. The first pad has a first guide slope facing the second pad, and the second pad has a second guide slope facing the first pad. The first guide slope and the second guide slope abut against each other. The second through-feed member is sequentially inserted through the base plate, the second pad, the first pad, the raising member, and the adsorption plate to connect the base plate and the adsorption plate.

[0008] Furthermore, the probe cleaning device also includes a column, a base, a lifting plate, a bottom plate, and a drive assembly. The column is disposed on the base, and the lifting plate can slide relative to the column along a first direction. The lifting plate is used to support the bottom plate, and the side of the bottom plate opposite to the lifting plate is used to mount the adsorption plate. The drive assembly includes a drive component, a first rotating wheel, a second rotating wheel, a timing belt, and a rotating rod. The drive component is mounted on the base and connected to the first rotating wheel. The second rotating wheel is spaced apart from the first rotating wheel. The timing belt is sleeved on a portion of the outer periphery of the first rotating wheel and a portion of the outer periphery of the second rotating wheel. The rotating rod extends along the first direction, is connected to the second rotating wheel, and is threadedly connected to the lifting plate. The diameter of the first rotating wheel is smaller than the diameter of the second rotating wheel. When the drive component is activated, it drives the first rotating wheel to rotate, which in turn drives the timing belt and the second rotating wheel to rotate, thereby driving the rotating rod to rotate. This allows the lifting plate to move relative to the rotating rod along the first direction, thereby driving the bottom plate, the adsorption plate, and the cleaning plate to move along the first direction.

[0009] Further, the first rotating wheel and the second rotating wheel are arranged at intervals along a second direction. The driving component includes a driving body and an output shaft. The driving body is used to drive the output shaft to rotate. The output shaft is sleeved on the first rotating wheel. The probe cleaning device also includes a tensioning assembly, which includes a mounting component, a tensioning block, and a tensioning screw. The mounting component is disposed on the base and is located between the driving body and the base. The output shaft passes through the mounting component and part of the base in sequence. The first rotating wheel and the second rotating wheel are both disposed in the base. The tensioning block is disposed on the side of the mounting component away from the second rotating wheel and is connected to the base. The tensioning screw passes through the tensioning block and the mounting component in sequence. When the tensioning screw rotates relative to the mounting component, causing the mounting component to move in a direction away from the second rotating wheel, it causes the first rotating wheel to move in a direction away from the second rotating wheel, so that the timing belt is in a taut state.

[0010] Furthermore, the base also has a first maintenance window and a second maintenance window, which are disposed through the side of the base. The first maintenance window is disposed corresponding to the first rotating wheel, and the second maintenance window is disposed corresponding to the second rotating wheel.

[0011] Furthermore, the probe cleaning device also includes a sensing assembly, which includes a first sensing element, a second sensing element, a third sensing element, and a sensed element. The first sensing element, the second sensing element, and the third sensing element are spaced apart on the column along a first direction, and the sensed element is disposed on the lifting plate. The first sensing element and the sensed element cooperate with each other to sense a first position of the lifting plate; the second sensing element and the sensed element cooperate with each other to sense a second position of the lifting plate; and the third sensing element and the sensed element cooperate with each other to sense a third position of the lifting plate. The first position, the second position, and the third position are arranged sequentially along the first direction.

[0012] Furthermore, the probe cleaning device also includes a limiting component, which includes a first limiting member and a second limiting member. The first limiting member is disposed on the side of the column away from the base; the second limiting member is disposed on the base. The first limiting member and the second limiting member cooperate to limit the lifting plate.

[0013] This application also provides a wafer inspection system, which includes: a chuck, a probe card, and a probe cleaning device provided in this application. The chuck is used to hold a sample to be inspected; the probe card is disposed on one side of the chuck, and the tip of the probe card is used to contact the sample to be inspected and to inspect the sample; the probe cleaning device is disposed on the same side of the probe card as the chuck, and the cleaning plate is used to clean the tip of the probe card.

[0014] In this application, when the probe card is positioned relative to the chuck and the chuck carries the sample to be tested, the probe card contacts the sample and performs testing on it, thereby enabling the wafer inspection system to test the sample. When the probe card is positioned relative to the cleaning plate of the probe cleaning device, the probe card contacts the cleaning paper attached to the cleaning plate to clean the tip of the probe card. The probe cleaning device of this application enables rapid adsorption and separation of the adsorption plate from the cleaning plate, thereby improving the efficiency of the user in changing the cleaning paper and enhancing the efficiency of the wafer inspection system in cleaning the tip of the probe card. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the implementation will be briefly introduced below. Obviously, the drawings described below are some implementations of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the wafer inspection system according to the first embodiment of this application; Figure 2 This is a schematic diagram of the probe cleaning device according to an embodiment of this application; Figure 3 This is an exploded structural diagram of the probe cleaning device according to the first embodiment of this application; Figure 4 This is a partial exploded structural diagram of a probe cleaning device according to an embodiment of this application; Figure 5 This is a top view of a probe cleaning device according to an embodiment of this application; Figure 6 for Figure 5 Schematic diagram of the cross-sectional structure along the AA direction; Figure 7 for Figure 6 Enlarged structural diagram of the dashed box in section B; Figure 8 for Figure 6 Enlarged structural diagram of the dashed box in the middle C; Figure 9 This is a partially exploded structural diagram of a connection component according to an embodiment of this application.

[0017] Figure 10 This is an exploded structural diagram of the probe cleaning device according to the second embodiment of this application; Figure 11 This is a schematic diagram of the wafer inspection system according to the second embodiment of this application; Figure 12 This is an exploded structural diagram of the probe cleaning device according to the third embodiment of this application; Figure 13 This is a side view of a probe cleaning device according to an embodiment of this application.

[0018] Explanation of reference numerals in the attached figures: 100-Probe cleaning device, 110-Cleaning plate, 120-Adsorption plate, 121-Plate body, 1211-Groove, 122-Connecting pipe, 123-Second through hole, 130-Negative pressure mechanism, 140-Base, 141-First maintenance window, 142-Second maintenance window, 150-Base plate, 151-First through hole, 1511-First through sub-hole, 1512-Second through sub-hole, 160-Connecting assembly, 161-Second through component, 162-Elevating component, 163-First pad, 1631-First guide ramp, 164-Second pad, 1641-Second guide ramp, 170-Level adjustment assembly, 171-Adjusting component, 1711-Third through hole, 1712-Insertion hole, 172-First through Components: 180-Column, 190-Lifting plate, 210-Drive assembly, 211-Drive component, 2111-Drive body, 2112-Output shaft, 212-First rotating wheel, 213-Second rotating wheel, 214-Synchronous belt, 215-Rotating rod, 220-Tensioning assembly, 221-Mounting component, 222-Tensioning block, 223-Tensioning screw, 230-Sensing assembly, 231-First sensing element, 232-Second sensing element, 233-Third sensing element, 234-Sensed element, 240-Limiting assembly, 241-First limiting component, 242-Second limiting component, 250-Guide component, 260-Cleaning paper, 300-Wafer inspection system, 310-Chuck, 320-Probe card, 330-Moving mechanism. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0020] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0021] In this document, references to "embodiment" or "implementation" mean that a particular feature, structure, or characteristic described in connection with an embodiment or implementation may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0022] In wafer inspection equipment, probes are used to contact and inspect wafers. Over time, the probe tips inevitably accumulate the vapor-deposited metal layer from the wafer, necessitating cleaning. A common method is to use cleaning paper on a cleaning plate, allowing it to contact and clean the probe tips. However, this cleaning paper needs to be replaced after a period of use. Therefore, enabling rapid replacement of the cleaning paper significantly improves the efficiency of probe tip cleaning.

[0023] Please see Figure 1 and Figure 2 This application also provides a wafer inspection system 300, which includes a chuck 310, a probe card 320, and a probe cleaning device 100 provided in this application. The chuck 310 is used to hold the sample to be inspected. The probe card 320 is disposed on one side of the chuck 310, and the tip of the probe card 320 is used to contact the sample to be inspected and to inspect the sample. The probe cleaning device 100 and the chuck 310 are disposed on the same side of the probe card 320, and the cleaning plate 110 is used to clean the tip of the probe card 320.

[0024] Understandably, the probe cleaning device 100 and the chuck 310 are disposed on the same side of the probe card 320 and the probe cleaning device 100 and the chuck 310 are spaced apart.

[0025] Understandably, the chuck 310 can move relative to the probe card 320 along a horizontal plane perpendicular to the first direction to adjust the relative position of the chuck 310 and the probe card 320 so that the probe card 320 is positioned relative to the chuck 310.

[0026] Understandably, the probe cleaning device 100 can move relative to the probe card 320 along a horizontal plane perpendicular to the first direction to adjust the relative position of the probe cleaning device 100 and the probe card 320 so that the probe card 320 is positioned relative to the probe cleaning device 100.

[0027] In this embodiment, when the probe card 320 is positioned relative to the chuck 310 and the chuck 310 carries the sample to be tested, the probe card 320 contacts the sample to be tested and performs testing on the sample, thereby enabling the wafer inspection system 300 to detect the sample. When the probe card 320 is positioned relative to the cleaning plate 110 of the probe cleaning device 100, the probe card 320 contacts the cleaning paper 260 attached to the cleaning plate 110 to clean the tip of the probe card 320. The probe cleaning device 100 of this embodiment enables the adsorption plate 120 to quickly adsorb and separate from the cleaning plate 110, thereby improving the efficiency of the user in replacing the cleaning paper 260 and enhancing the efficiency of the wafer inspection system 300 in cleaning the tip of the probe card 320.

[0028] Optionally, the wafer inspection system 300 further includes a moving mechanism 330, which is disposed on the side of the chuck 310 and the probe cleaning device 100 away from the probe card 320. The moving mechanism 330 is used to set the chuck 310 and the probe cleaning device 100 so as to drive the chuck 310 and the probe cleaning device 100 to move along a horizontal plane perpendicular to the first direction, so that the probe card 320 is set relative to the chuck 310 or the probe cleaning device 100.

[0029] Please see also Figure 3This application provides a probe cleaning device 100, which includes a cleaning plate 110, an adsorption plate 120, and a negative pressure mechanism 130. The adsorption plate 120 includes a plate body 121 and a connecting tube 122. The plate body 121 is disposed on one side of the cleaning plate 110, and the side of the plate body 121 facing the cleaning plate 110 has a groove 1211. The connecting tube 122 is connected to the plate body 121 and protrudes from the side of the plate body 121 away from the cleaning plate 110. The connecting tube 122 communicates with the groove 1211. The negative pressure mechanism 130 is connected to the connecting tube 122. When the negative pressure mechanism 130 is turned on, the groove 1211 forms a negative pressure, so that the cleaning plate 110 is adsorbed onto one side of the adsorption plate 120.

[0030] Optionally, the probe cleaning device 100 further includes cleaning paper 260, which is attached to the surface of the cleaning plate 110 opposite to the adsorption plate 120. When the probe cleaning device 100 is applied to the wafer inspection system 300, the cleaning paper 260 contacts the tip of the probe card 320 and cleans the tip of the probe card 320. Understandably, the cleaning paper 260 is a probe cleaning paper.

[0031] Understandably, the side of the plate 121 facing the cleaning plate 110 has a groove 1211, which can be a sink.

[0032] Understandably, the connecting pipe 122 connects to the plate body 121 and protrudes from the side of the plate body 121 away from the cleaning plate 110. This can be achieved by partially inserting the connecting pipe 122 into the plate body 121 and communicating with the groove 1211, with the connecting pipe 122 partially protruding from the side of the plate body 121 away from the cleaning plate 110, so as to facilitate communication with the negative pressure mechanism 130.

[0033] Understandably, in Figure 3 In this embodiment, the negative pressure mechanism 130 is not yet connected to the connecting pipe 122, but the negative pressure mechanism 130 and the connecting pipe 122 can be connected by a pipe or the like.

[0034] In this embodiment, when the negative pressure mechanism 130 is connected to the connecting pipe 122, the opposite ends of the connecting pipe 122 are respectively connected to the groove 1211 and the negative pressure mechanism 130. When the negative pressure mechanism 130 is activated, air can be drawn out of the groove 1211 or injected into the groove 1211 through the connecting pipe 122, so that the groove 1211 forms a negative pressure or a positive pressure. Specifically, after the cleaning paper 260 is attached to the cleaning plate 110, the cleaning plate 110 is placed on one side of the adsorption plate 120, the plate body 121 covers the groove 1211, and the negative pressure mechanism 130 is activated to form a negative pressure in the groove 1211, and the cleaning plate 110 is adsorbed onto one side of the adsorption plate 120. When the cleaning plate 110 becomes worn or needs replacement after a period of use, the negative pressure mechanism 130 is activated to inject air into the groove 1211, creating positive pressure in the groove 1211. This separates the cleaning plate 110 from the adsorption plate 120, allowing workers to easily remove the cleaning plate 110 and replace the cleaning paper 260 on it. The probe cleaning device 100 of this embodiment facilitates rapid adsorption and separation of the cleaning plate 110, enabling quick replacement of the cleaning paper and highly efficient cleaning of the probe tip.

[0035] In some embodiments, the probe cleaning device 100 further includes a base 140, a base plate 150, a connecting assembly 160, and a horizontal adjustment assembly 170. The base plate 150 is supported on the base 140 and is movable relative to the base 140 in a first direction. The adsorption plate 120 is disposed on the side of the base plate 150 away from the base 140. The connecting assembly 160 is used to connect the base plate 150 and the adsorption plate 120. There are multiple horizontal adjustment assemblies 170, and the multiple horizontal adjustment assemblies 170 and the connecting assembly 160 are arranged at intervals around the outer periphery of the adsorption plate 120. The horizontal adjustment assemblies 170 are respectively connected to the base plate 150 and the adsorption plate 120 and are used to adjust the relative position of the adsorption plate 120 and the base plate 150.

[0036] Understandably, along the first direction, the cleaning paper 260, the cleaning plate 110, the adsorption plate 120, the base plate 150 and the base 140 are arranged in sequence.

[0037] In the terminology of this application, "multiple" means two or more.

[0038] In this embodiment, the base plate 150 is supported on the base 140 and can move relative to the base 140 along a first direction. The adsorption plate 120 is disposed on the side of the base plate 150 away from the base 140. When the base plate 150 moves relative to the base 140 in the first direction away from the base 140, it drives the adsorption plate 120 and the cleaning plate 110 to move relative to the base 140 in the first direction away from the base 140, so that the cleaning plate 110 is disposed close to the tip of the probe card 320. When the base plate 150 moves relative to the base 140 in the first direction towards the base 140, it drives the adsorption plate 120 and the cleaning plate 110 to move relative to the base 140 in the first direction towards the base 140, so that the cleaning plate 110 is disposed away from the tip of the probe card 320. The connecting assembly 160 and the plurality of leveling components 170 are at least partially located between the adsorption plate 120 and the base plate 150. The connecting assembly 160 is used to connect the base plate 150 and the adsorption plate 120. The leveling components 170 can adjust the relative position of the adsorption plate 120 and the base plate 150 so that the adsorption plate 120 is in a horizontal state, thereby making the cleaning plate 110 in a horizontal state. When the cleaning plate 110 is provided with cleaning paper 260 and is used to contact the tip of the probe card 320 and clean the tip of the probe card 320, it can prevent the cleaning plate 110 from deviating from a horizontal state and damaging the tip of the probe card 320, and ensure the cleaning effect of the cleaning plate 110 on the tip of the probe card 320, thus improving the performance of the probe cleaning device 100.

[0039] Please see also Figures 4 to 7 In some embodiments, the base plate 150 has a first direction (e.g., Figure 4 The first through hole 151 extends in the X direction (as shown in the middle), and the adsorption plate 120 has a second through hole 123 extending in the first direction; the horizontal adjustment assembly 170 includes an adjustment member 171 and a first through member 172. The adjustment member 171 is at least partially located between the base plate 150 and the adsorption plate 120. The adjustment member 171 is partially inserted through the first through hole 151 and threadedly connected to the first through hole 151. The adjustment member 171 can move relative to the base plate 150 in the first direction to adjust the relative position between the base plate 150 and the adsorption plate 120; the adjustment member 171 has a third through hole 1711 extending in the first direction. The first through member 172 is sequentially inserted through the first through hole 151, the third through hole 1711 and the second through hole 123 to define the relative position between the base plate 150 and the adsorption plate 120.

[0040] Understandably, the adjusting member 171 has an external thread, the first through hole 151 has an internal thread, and the external thread and the internal thread are threadedly connected.

[0041] In this embodiment, the adjusting member 171 is at least partially located between the base plate 150 and the adsorption plate 120, and the adjusting member 171 is partially inserted through the first through hole 151. The end of the adjusting member 171 facing away from the base plate 150 abuts against the adsorption plate 120. When the adjusting member 171 is threadedly connected to the first through hole 151 and the adjusting member 171 moves relative to the base plate 150 in a first direction, it will drive the adsorption plate 120 to move relative to the base plate 150 in a first direction. Specifically, if the adsorption plate 120 is tilted towards the side closer to the base plate 150, the adjusting member 171 moves relative to the base plate 150 in a first direction towards the side closer to the base plate 150, so that the adsorption plate 120 returns to a horizontal position. Similarly, if the adsorption plate 120 is tilted away from the base plate 150, the adjusting member 171 moves relative to the base plate 150 in a first direction towards the side closer to the base plate 150, so that the adsorption plate 120 returns to a horizontal position. The adjusting member 171 is threadedly connected to the first through hole 151 to adjust the relative position between the base plate 150 and the adsorption plate 120, so that the cleaning plate 110 is in a horizontal state. Furthermore, the first penetrating member 172 is sequentially inserted through the first penetrating hole 151, the third penetrating hole 1711, and the second penetrating hole 123, so that the first penetrating member 172 is sequentially inserted through the base plate 150, the adjusting member 171, and the adsorption plate 120, thereby limiting the relative positions between the base plate 150, the adjusting member 171, and the adsorption plate 120, so as to prevent the cleaning plate 110 from shifting and damaging the probe card 320 during the cleaning process of the tip of the probe card 320, thus improving the cleaning performance of the probe cleaning device 100.

[0042] Optionally, in some embodiments, the first through-hole 172 is threadedly connected to the second through-hole 123.

[0043] Optionally, in some embodiments, the first through hole 151 includes a first through sub-hole 1511 and a second through sub-hole 1512 that are interconnected. The first through sub-hole 1511 is closer to the adsorption plate 120 than the second through sub-hole 1512. The adjusting member 171 is threadedly connected to the first through sub-hole 1511, and the first through member 172 is threadedly connected to the second through sub-hole 1512. When the first through member 172 passes through the first through hole 151, the third through hole 1711, and the second through hole 123, the threaded connection between the first through member 172 and the second through sub-hole 1512 helps to improve the stability of the first through member 172 passing through the first through hole 151 and improves the stability of the first through member 172 in defining the relative position between the base plate 150 and the adsorption plate 120.

[0044] Understandably, the radial dimension of the first through hole 1511 is greater than the radial dimension of the second through hole 123.

[0045] Optionally, the side of the adjusting member 171 has a plurality of spaced holes 1712, which facilitates the insertion of a wrench and rotation of the adjusting member 171, and facilitates the rotation of the adjusting member 171 relative to the base plate 150 and its threaded connection with the first through hole 151, thereby improving the ease of adjusting the relative position of the adjusting member 171 and the base plate 150.

[0046] Please see also Figure 8 and Figure 9 In some embodiments, the connecting assembly 160 includes a second through member 161, a raising member 162, a first pad 163, and a second pad 164. Along a first direction, the raising member 162, the first pad 163, and the second pad 164 are arranged sequentially, and all three are located between the adsorption plate 120 and the base plate 150. The end of the raising member 162 facing away from the first pad 163 abuts against the adsorption plate 120, and the second pad 164 faces away from the raising member. One end of 162 abuts against the base plate 150. The first pad 163 has a first guide slope 1631 facing the second pad 164, and the second pad 164 has a second guide slope 1641 facing the first pad 163. The first guide slope 1631 and the second guide slope 1641 abut against each other. The second through member 161 is sequentially inserted through the base plate 150, the second pad 164, the first pad 163, the shim 162, and the adsorption plate 120 to connect the base plate 150 and the adsorption plate 120.

[0047] Understandably, the first guide ramp 1631 and the second guide ramp 1641 are arranged opposite to each other.

[0048] Understandably, the first pad 163 and the second pad 164 are selected from spherical pads.

[0049] In this embodiment, the shim 162, the first pad 163, and the second pad 164 are arranged sequentially along a first direction. When the second through-feed member 161 is sequentially inserted through the base plate 150, the second pad 164, the first pad 163, the shim 162, and the adsorption plate 120, the second through-feed member 161 connects the base plate 150 and the adsorption plate 120. The shim 162, the first pad 163, and the second pad 164 provide support for the adsorption plate 120, so that the base plate 150 and the adsorption plate 120 are spaced apart, which facilitates the installation of the horizontal adjustment component 170 and improves the stability of the adsorption plate 120 on the base plate 150. Furthermore, the first pad 163 has a first guide slope 1631 facing the second pad 164, and the second pad 164 has a second guide slope 1641 facing the first pad 163. The first guide slope 1631 and the second guide slope 1641 abut against each other, so there is a large contact area between the first pad 163 and the second pad 164. When the adsorption plate 120 deviates from the horizontal position, the first guide slope 1631 and the second guide slope 1641 slide relative to each other and fit tightly together. This helps to reduce point contact between the first pad 163 and the second pad 164, avoid stress concentration that could damage the second pad 164 or the base plate 150, improve the reliability of the connecting assembly 160 for connecting the base plate 150 and the adsorption plate 120, and help to extend the service life of the probe cleaning device 100.

[0050] Optionally, the first guide slope 1631 is an arc surface, and the second guide slope 1641 is an arc surface.

[0051] Please refer to the above as well. Figures 10 to 12In some embodiments, the probe cleaning device 100 further includes a column 180, a base 140, a lifting plate 190, a bottom plate 150, and a drive assembly 210. The column 180 is disposed on the base 140, and the lifting plate 190 is slidable relative to the column 180 along a first direction. The lifting plate 190 is used to support the bottom plate 150, and the side of the bottom plate 150 opposite to the lifting plate 190 is used to house the adsorption plate 120. The drive assembly 210 includes a drive member 211, a first rotating wheel 212, a second rotating wheel 213, a synchronous belt 214, and a rotating rod 215. The drive member 211 is mounted on the base 140 and connected to the first rotating wheel 212, and the second rotating wheel 213 is spaced apart from the first rotating wheel 212. The timing belt 214 is sleeved on a portion of the outer periphery of the first rotating wheel 212 and a portion of the outer periphery of the second rotating wheel 213. The rotating rod 215 extends along a first direction and is connected to the second rotating wheel 213 and threadedly connected to the lifting plate 190. The diameter of the first rotating wheel 212 is smaller than the diameter of the second rotating wheel 213. When the driving component 211 is activated, it drives the first rotating wheel 212 to rotate, thereby driving the timing belt 214 and the second rotating wheel 213 to rotate, which in turn drives the rotating rod 215 to rotate, so that the lifting plate 190 moves relative to the rotating rod 215 along the first direction, thereby driving the base plate 150, the adsorption plate 120 and the cleaning plate 110 to move along the first direction.

[0052] Understandably, along the first direction, the cleaning paper 260, the cleaning plate 110, the adsorption plate 120, the base plate 150, the lifting plate 190, and the base 140 are arranged in sequence.

[0053] Understandably, the lifting plate 190 can slide relative to the column 180 in the first direction. Specifically, the lifting plate 190 can move relative to the column 180 in the first direction toward the base 140, and the lifting plate 190 can also move relative to the column 180 in the first direction away from the base 140.

[0054] Understandably, the drive assembly 210 is mounted on the base 140.

[0055] In this embodiment, the driving component 211 is mounted on the base 140 and connected to the first rotating wheel 212. When the driving component 211 is turned on, it drives the first rotating wheel 212 to rotate. Further, the second rotating wheel 213 is spaced apart from the first rotating wheel 212. The timing belt 214 is sleeved on a portion of the outer periphery of the first rotating wheel 212 and a portion of the outer periphery of the second rotating wheel 213. When the first rotating wheel 212 rotates, it drives the timing belt 214 to rotate, thereby driving the second rotating wheel 213 to rotate. Furthermore, the rotating rod 215 extends along the first direction, is connected to the second rotating wheel 213 and threadedly connected to the lifting plate 190. When the second rotating wheel 213 rotates, it drives the rotating rod 215 to rotate, thereby causing the lifting plate 190 to be threadedly connected to the rotating rod 215. This allows the lifting plate 190 to move relative to the rotating rod 215 along the first direction, thereby driving the base plate 150, the adsorption plate 120, and the cleaning plate 110 to move along the first direction, thus adjusting the relative position of the cleaning plate 110 with respect to the base 140 along the first direction. When the probe cleaning device 100 is applied to the wafer inspection system 300, it adjusts the relative position of the cleaning plate 110 and the probe card 320 in the first direction, so that the cleaning paper 260 on the cleaning plate 110 can contact the tip of the probe card 320 and clean the tip of the probe card 320, improving the cleaning performance of the probe cleaning device 100.

[0056] Furthermore, in this embodiment, the first rotating wheel 212 serves as the driving wheel, and the second rotating wheel 213 serves as the driven wheel. The diameter of the first rotating wheel 212 is smaller than the diameter of the second rotating wheel 213, creating a speed difference between them. This facilitates deceleration, slowing the rotation speed of the rotating rod 215 and the movement speed of the lifting plate 190 along the first direction, thereby improving the stability of the lifting plate 190's movement along the first direction. It also improves the accuracy of the drive assembly 210 in driving the lifting plate 190 along the first direction. On the other hand, the second rotating wheel 213 also increases torque, enhancing the torque force and thus improving the stability of driving the lifting plate 190 along the first direction.

[0057] In some embodiments, the first rotating wheel 212 and the second rotating wheel 213 are along a second direction (e.g., Figure 11Arranged at intervals (as shown in the Y direction), the driving component 211 includes a driving body 2111 and an output shaft 2112. The driving body 2111 drives the output shaft 2112 to rotate. The output shaft 2112 is sleeved with the first rotating wheel 212. The probe cleaning device 100 also includes a tensioning assembly 220, which includes a mounting component 221, a tensioning block 222, and a tensioning screw 223. The mounting component 221 is disposed on the base 140 and is located between the driving body 2111 and the base 140. The output shaft 2112 passes through the mounting component 221 and part of the base 140 in sequence. 0. The first rotating wheel 212 and the second rotating wheel 213 are both disposed within the base 140. The tensioning block 222 is disposed on the side of the mounting member 221 away from the second rotating wheel 213 and is connected to the base 140. The tensioning screw 223 passes through the tensioning block 222 and the mounting member 221 in sequence. When the tensioning screw 223 rotates relative to the mounting member 221, causing the mounting member 221 to move in a direction away from the second rotating wheel 213, it causes the first rotating wheel 212 to move in a direction away from the second rotating wheel 213, so that the synchronous belt 214 is in a taut state.

[0058] Understandably, the driving component 211 includes a driving body 2111 and an output shaft 2112. The driving body 2111 is used to drive the output shaft 2112 to rotate. The output shaft 2112 is fitted with the first rotating wheel 212. When the driving body 2111 is turned on, it drives the output shaft 2112 to rotate, thereby driving the first rotating wheel 212 to rotate.

[0059] Understandably, the mounting component 221 is movably disposed on the side of the base 140 facing the base plate 150, the drive body 2111 is fixedly disposed on the mounting component 221, and the tensioning block 222 is fixedly disposed on the base 140.

[0060] Understandably, along the second direction, the tensioning block 222, the mounting component 221, and the second rotating wheel 213 are arranged in sequence.

[0061] Optionally, the tensioning screw 223 is threadedly connected to the mounting component 221.

[0062] In this embodiment, the drive body 2111 is disposed on the mounting member 221, and the output shaft 2112 passes through the mounting member 221 and part of the base 140 in sequence. When the tensioning screw 223 rotates relative to the mounting member 221 to drive the mounting member 221 to move in a direction away from the second rotating wheel 213, the drive body 2111, the output shaft 2112 and the first rotating wheel 212 will move in a direction away from the second rotating wheel 213 to increase the distance between the first rotating wheel 212 and the second rotating wheel 213 along the first direction. When the timing belt 214 is sleeved on the outer periphery of the first rotating wheel 212 and the outer periphery of the second rotating wheel 213, the timing belt 214 will be in a taut state. The tensioning component 220 provided in this embodiment helps reduce the installation difficulty of the drive component 210, facilitating the placement of the synchronous belt 214 on the outer periphery of the first rotating wheel 212 and the second rotating wheel 213, so that the second rotating wheel 213 rotates under the drive of the synchronous belt 214 and the first rotating wheel 212. Furthermore, the tensioning component 220 facilitates the adjustment of the distance between the first rotating wheel 212 and the second rotating wheel 213 along the second direction, ensuring that the synchronous belt 214 is in a taut state. This prevents gaps between the synchronous belt 214 and the first rotating wheel 212 or between the synchronous belt 214 and the second rotating wheel 213, which would reduce the stability of the lifting plate 190 moving along the first direction and prevent the lifting plate 190 from slipping during movement. This results in the probe cleaning device 100 having better performance.

[0063] In some embodiments, the base 140 further has a first maintenance window 141 and a second maintenance window 142, which are disposed through the side of the base 140. The first maintenance window 141 is disposed corresponding to the first rotating wheel 212, and the second maintenance window 142 is disposed corresponding to the second rotating wheel 213.

[0064] In this embodiment, the first maintenance window 141 and the second maintenance window 142 are spaced apart along the second direction. When the synchronous belt 214 is fitted around a portion of the outer periphery of the first rotating wheel 212 and a portion of the outer periphery of the second rotating wheel 213, and the synchronous belt 214 rotates under the drive of the first rotating wheel 212, the first maintenance window 141 and the second maintenance window 142 facilitate the observation of the working status of the synchronous belt 214 by the staff, so as to promptly observe whether the synchronous belt 214 is worn and needs to be replaced, and facilitate the timely maintenance of the synchronous belt 214. Furthermore, when it is necessary to maintain the first rotating wheel 212 and / or the second rotating wheel 213, the staff can directly maintain the first rotating wheel 212 and / or the second rotating wheel 213 through the first maintenance window 141 and / or the second maintenance window 142, improving the ease of maintenance of the probe cleaning device 100.

[0065] Please see also Figure 13 In some embodiments, the probe cleaning device 100 further includes a sensing component 230, which includes a first sensing element 231, a second sensing element 232, a third sensing element 233, and a sensed element 234. The first sensing element 231, the second sensing element 232, and the third sensing element 233 are spaced apart on the column 180 along a first direction. The sensed element 234 is disposed on the lifting plate 190. The first sensing element 231 and the sensed element 234 cooperate with each other to sense a first position of the lifting plate 190. The second sensing element 232 and the sensed element 234 cooperate with each other to sense a second position of the lifting plate 190. The third sensing element 233 and the sensed element 234 cooperate with each other to sense a third position of the lifting plate 190. The first position, the second position, and the third position are arranged sequentially along the first direction.

[0066] In this embodiment, the sensing element 234 is disposed on the lifting plate 190. When the lifting plate 190 moves relative to the column 180 along a first direction, it drives the sensing element 234 to move relative to the column 180 along the first direction, so that the sensing element 234 corresponds to one of the first sensing element 231, the second sensing element 232, or the third sensing element 233. Specifically, when the lifting plate 190 drives the sensing element 234 to move relative to the column 180 along the first direction, and the sensing element 234 approaches the first sensing element 231, the first sensing element 231 senses the signal of the sensing element 234 to sense that the lifting plate 190 is in a first position, and then senses the position of the cleaning plate 110. When the lifting plate 190 moves the sensed element 234 relative to the column 180 along a first direction, and the sensed element 234 approaches the second sensing element 232, the second sensing element 232 senses the signal of the sensed element 234 to sense that the lifting plate 190 is in a second position, and then senses the position of the cleaning plate 110. When the lifting plate 190 moves the sensed element 234 relative to the column 180 along the first direction, and the sensed element 234 approaches the third sensing element 233, the third sensing element 233 senses the signal of the sensed element 234 to sense that the lifting plate 190 is in a third position, and then senses the position of the cleaning plate 110. The first position, the second position, and the third position are arranged sequentially along the first direction to facilitate the operator in obtaining the relative position of the lifting plate 190 and the column 180, and to facilitate the adjustment of the position of the lifting plate 190.

[0067] Please see Figure 10 In some embodiments, the probe cleaning device 100 further includes a limiting component 240, which includes a first limiting member 241 and a second limiting member 242. The first limiting member 241 is disposed on the side of the column 180 away from the base 140; the second limiting member 242 is disposed on the base 140. The first limiting member 241 and the second limiting member 242 cooperate to limit the lifting plate 190.

[0068] Understandably, when the lifting plate 190 abuts against the first limiting member 241, the sensing element 234 is set corresponding to the first sensing element 231, and the lifting plate 190 is in the first position; when the lifting plate 190 abuts against the second limiting member 242, the sensing element 234 is set corresponding to the third sensing element 233, and the lifting plate 190 is in the third position.

[0069] Understandably, the first limiting member 241 cooperates with the second limiting member 242 to limit the lifting plate 190 to move between the first position and the third position.

[0070] In this embodiment, the first limiting member 241 is disposed on the side of the column 180 away from the base 140, and is used to prevent the lifting plate 190 from continuing to move away from the base 140 relative to the column 180. The second limiting member 242 is disposed on the base 140, and is used to prevent the lifting plate 190 from continuing to move towards the base 140 relative to the column 180. The first limiting member 241 and the second limiting member 242 cooperate to hard limit the movement of the lifting plate 190, thereby stopping the lifting plate 190 and keeping it in the first position and the third position, preventing the lifting plate 190 from dislodging from the rotating rod 215 or abutting against the base 140 and damaging the base 140, thus improving the performance of the probe cleaning device 100.

[0071] Optionally, the probe cleaning device 100 further includes a guide 250, which extends along a first direction and is disposed on the column 180. The lifting plate 190 is slidably connected to the guide 250 along the first direction. The guide 250 is used to guide the lifting plate 190 to move relative to the column 180 along the first direction.

[0072] In this embodiment, the guide member 250 extends along the first direction and is disposed on the column 180. When the lifting plate 190 moves relative to the column 180, the guide member 250 is used to move the moving direction of the lifting plate 190 so that the lifting plate 190 moves relative to the column 180 along the first direction. The guide member 250 improves the accuracy and stability of the lifting plate 190 moving along the first direction, improves the stability of the cleaning plate 110 moving along the first direction, and ultimately improves the performance of the probe cleaning device 100.

[0073] In this application, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of these phrases in various locations throughout the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this application can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this application can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this application, provided there is no contradiction between them.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A probe cleaning device, characterized in that, The probe cleaning device includes: Cleaning board; An adsorption plate, comprising a plate body and a connecting tube, wherein the plate body is disposed on one side of a cleaning plate, and the side of the plate body facing the cleaning plate has a groove; the connecting tube connects to the plate body and protrudes from the side of the plate body opposite to the cleaning plate, and the connecting tube communicates with the groove; and A negative pressure mechanism is connected to the connecting pipe. When the negative pressure mechanism is activated, the groove forms a negative pressure, causing the cleaning plate to adhere to one side of the adsorption plate.

2. The probe cleaning device according to claim 1, characterized in that, The probe cleaning device further includes a base, a bottom plate, a connecting assembly, and a horizontal adjustment assembly. The bottom plate is supported on the base and can move relative to the base in a first direction. The adsorption plate is disposed on the side of the bottom plate away from the base. The connecting assembly is used to connect the bottom plate and the adsorption plate. There are multiple horizontal adjustment assemblies, and the multiple horizontal adjustment assemblies and the connecting assembly are arranged at intervals around the outer periphery of the adsorption plate. The horizontal adjustment assemblies are respectively connected to the bottom plate and the adsorption plate and are used to adjust the relative position of the adsorption plate and the bottom plate.

3. The probe cleaning device according to claim 2, characterized in that, The base plate has a first through hole extending in a first direction, and the adsorption plate has a second through hole extending in a first direction. The horizontal adjustment assembly includes an adjustment member and a first through-hole member. The adjustment member is at least partially located between the base plate and the adsorption plate. The adjustment member is partially inserted through the first through-hole and threadedly connected to the first through-hole. The adjustment member can move relative to the base plate along a first direction to adjust the relative position between the base plate and the adsorption plate. The adjustment member has a third through-hole extending along the first direction. The first through-hole member is sequentially inserted through the first through-hole, the third through-hole, and the second through-hole to define the relative position between the base plate and the adsorption plate.

4. The probe cleaning device according to claim 2, characterized in that, The connecting assembly includes a second through member, a raising member, a first pad, and a second pad. Along a first direction, the raising member, the first pad, and the second pad are arranged sequentially, and all three are located between the adsorption plate and the base plate. The end of the raising member facing away from the first pad abuts against the adsorption plate, and the end of the second pad facing away from the raising member abuts against the base plate. The first pad has a first guide slope facing the second pad, and the second pad has a second guide slope facing the first pad. The first guide slope and the second guide slope abut against each other. The second insert is sequentially inserted through the base plate, the second pad, the first pad, the raising member, and the adsorption plate to connect the base plate and the adsorption plate.

5. The probe cleaning device according to claim 1, characterized in that, The probe cleaning device also includes a column, a base, a lifting plate, a bottom plate, and a drive assembly. The column is disposed on the base. The lifting plate can slide relative to the column in a first direction. The lifting plate is used to support the bottom plate. The side of the bottom plate opposite to the lifting plate is used to house the adsorption plate. The drive assembly includes a drive component, a first rotating wheel, a second rotating wheel, a timing belt, and a rotating rod. The drive component is mounted on the base and connected to the first rotating wheel. The second rotating wheel is spaced apart from the first rotating wheel. The timing belt is sleeved on a portion of the outer circumference of the first rotating wheel and a portion of the outer circumference of the second rotating wheel. The rotating rod extends along a first direction and is connected to the second rotating wheel and threadedly connected to the lifting plate. The diameter of the first rotating wheel is smaller than the diameter of the second rotating wheel. When the drive component is activated, it drives the first rotating wheel to rotate, which in turn drives the timing belt and the second rotating wheel to rotate, thereby driving the rotating rod to rotate. This allows the lifting plate to move relative to the rotating rod along the first direction, which in turn drives the base plate, the adsorption plate, and the cleaning plate to move along the first direction.

6. The probe cleaning device according to claim 5, characterized in that, The first rotating wheel and the second rotating wheel are arranged at intervals along a second direction. The driving component includes a driving body and an output shaft. The driving body is used to drive the output shaft to rotate. The first rotating wheel is sleeved on the output shaft. The probe cleaning device further includes a tensioning assembly, which includes a mounting component, a tensioning block, and a tensioning screw. The mounting component is disposed on the base and is located between the drive body and the base. The output shaft passes through the mounting component and part of the base in sequence. The first rotating wheel and the second rotating wheel are both disposed within the base. The tensioning block is disposed on the side of the mounting component away from the second rotating wheel and is connected to the base. The tensioning screw passes through the tensioning block and the mounting component in sequence. When the tensioning screw rotates relative to the mounting component, causing the mounting component to move in a direction away from the second rotating wheel, it causes the first rotating wheel to move in a direction away from the second rotating wheel, so that the synchronous belt is in a taut state.

7. The probe cleaning device according to claim 5, characterized in that, The base also has a first maintenance window and a second maintenance window, which are disposed through the side of the base. The first maintenance window is disposed corresponding to the first rotating wheel, and the second maintenance window is disposed corresponding to the second rotating wheel.

8. The probe cleaning device according to claim 5, characterized in that, The probe cleaning device further includes a sensing component, which includes a first sensing element, a second sensing element, a third sensing element, and a sensed element. The first sensing element, the second sensing element, and the third sensing element are spaced apart on the column along a first direction. The sensed element is disposed on the lifting plate. The first sensing element and the sensed element cooperate with each other to sense a first position of the lifting plate. The second sensing element and the sensed element cooperate with each other to sense a second position of the lifting plate. The third sensing element and the sensed element cooperate with each other to sense a third position of the lifting plate. The first position, the second position, and the third position are arranged sequentially along the first direction.

9. The probe cleaning device according to claim 5, characterized in that, The probe cleaning device further includes a limiting component, which includes a first limiting member and a second limiting member. The first limiting member is disposed on the side of the column away from the base; the second limiting member is disposed on the base. The first limiting member and the second limiting member cooperate to limit the lifting plate.

10. A wafer inspection system, characterized in that, The wafer inspection system includes: A chuck, used to hold the sample to be tested; A probe card, disposed on one side of the chuck, the tip of the probe card being used to contact the sample to be tested and to perform testing on the sample; and The probe cleaning device according to any one of claims 1 to 9, wherein the probe cleaning device and the chuck are disposed on the same side of the probe card, and the cleaning plate is used to clean the tip of the probe card.

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