A wafer cleaning device

Abstract

The utility model discloses a kind of oscillation cleaning devices for wafer cleaning, including mounting plate and oscillation assembly, oscillation assembly includes the slide of being installed in the outer wall of mounting plate, the inner wall sliding connection of slide has displacement seat, the lower bottom end movable sleeve of displacement seat has vertical rod, the lower bottom end fixed connection of vertical rod has rotary table, the utility model in the cleaning process of wafer, the vibration efficiency of wafer is improved by multidirectional vibration, and then the efficiency of cleaning is improved, when driving assembly drives rotary table to rotate, rotary table will be driven displacement seat to rotate in the inside of slide by connecting rod, and then make vertical rod constantly longitudinal motion, when vertical rod moves, mounting plate will be through strong magnetic block abutment holding frame outer surface strong magnetic seat, by abutment with magnetic force repulsion, and then make swing seat rotate in the inside of rotary table, and then drive wafer body in placing seat to oscillate, improve the efficiency of oscillation cleaning.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, specifically to an oscillating cleaning device for wafer cleaning. Background Technology

[0002] Wafer cleaning is a core cleanroom process that runs through the entire semiconductor manufacturing process. It removes various contaminants (such as particles, metal ions, organic residues, etc.) generated or attached to the wafer surface during the production process through physical, chemical, or a combination of both methods. This provides an "ultra-clean" substrate surface for subsequent critical processes such as photolithography, etching, and thin film deposition, directly determining the yield, performance, and reliability of the chip.

[0003] In the prior art, a utility model patent discloses a wafer cleaning oscillation mechanism (publication number: CN221361579U), which uses a motor to drive a turntable to rotate in one direction, thereby raising and lowering the main rod and the basket assembly to achieve oscillation cleaning. It eliminates the screw structure and does not require replacement of the turntable. Through the setting of the basket assembly and the cooperation of various components, it can improve the oscillation efficiency and thus improve the cleaning quality during the wafer cleaning process. The motor, in conjunction with the first connecting rod, continuously rotates to improve the wafer cleaning quality. However, in the above-mentioned prior art, the cleaning time is often long due to unidirectional longitudinal vibration, which is not conducive to improving the wafer cleaning efficiency. Utility Model Content

[0004] This invention provides an oscillating cleaning device for wafer cleaning, which aims to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A wafer cleaning oscillation cleaning device includes a mounting plate and an oscillation assembly, wherein the oscillation assembly includes a slide mounted on the outer wall of the mounting plate;

[0007] The inner wall of the slide is slidably connected to a displacement seat. A longitudinal rod is movably sleeved at the lower bottom end of the displacement seat. A turntable is fixedly connected at the lower bottom end of the longitudinal rod. A swing seat is rotatably sleeved on the inner wall of the turntable. A connecting plate is installed at the lower bottom end of the swing seat. A strong magnetic block is installed at the upper top end of the connecting plate. A retainer is fixedly connected at the lower bottom end of the mounting plate. A strong magnetic seat is installed on the outer surface of the retainer, and the magnetic poles of the two strong magnetic seats are opposite. A drive assembly is provided on the outer wall of the mounting plate.

[0008] As a further optimization, the drive assembly includes a drive motor mounted on the outer surface of the mounting plate, with a turntable fixedly sleeved at the output end of the drive motor, and a rotating shaft fixedly connected to the outer surface of the turntable.

[0009] As a further optimization, a connecting rod is rotatably sleeved on the outer wall of the displacement seat, and the connecting rod is rotatably sleeved on the outer wall of the rotating shaft. Limiting rings are sleeved on both the rotating shaft and the displacement seat on the outer wall of the connecting rod.

[0010] As a further optimization, a placement box is fixedly connected to the end of the connecting plate, and a placement rack is fixedly connected to the bottom of the placement box. There are several placement racks, and wafers are snapped into the inner wall of the placement rack.

[0011] As a further optimization, the outer surface of the placement box is fixedly connected to the bottom end of the connecting plate by diagonal supports, and the number of diagonal supports is several.

[0012] As a further optimization, the outer surface of the mounting plate is provided with through slots, which are located on one side of the turntable, and the number of through slots is several.

[0013] As a further optimization, a damping spring is fixedly connected to the inner wall of the slide, and the end of the damping spring is fixedly connected to the top of the displacement seat.

[0014] As a further optimization, the outer wall of the mounting plate is provided with bolt grooves, and the number of bolt grooves is several.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] 1. By setting up the oscillation component, the various components can cooperate with each other to improve the vibration efficiency of the wafer during the cleaning process through multi-directional vibration, thereby improving the cleaning efficiency. When the drive component drives the turntable to rotate, the turntable will drive the displacement seat to rotate inside the slide through the linkage rod, thereby causing the longitudinal rod to move continuously longitudinally. When the longitudinal rod moves, the mounting plate will abut against the strong magnetic seat on the outer surface of the holder through the strong magnetic block. Through the abutment and magnetic repulsion, the swing seat will rotate inside the turntable, thereby driving the wafer in the placement seat to oscillate, improving the efficiency of oscillation cleaning. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the turntable in this utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the strong magnetic block in this utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the box in this utility model;

[0021] Figure 5 for Figure 4 A schematic diagram of the structure at point A in the middle.

[0022] In the diagram: 1. Mounting plate; 2. Slide; 3. Displacement seat; 4. Longitudinal rod; 5. Turntable; 6. Swing seat; 7. Connecting plate; 8. Strong magnet; 9. Cage; 10. Strong magnet seat; 11. Drive motor; 12. Turntable; 13. Rotating shaft; 14. Linkage rod; 15. Placement box; 16. Placement rack; 17. Wafer; 18. Diagonal support; 19. Through slot; 20. Damping spring; 21. Bolt slot. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] This utility model provides an oscillating cleaning device for wafer cleaning, such as... Figures 1 to 5 As shown, it includes a mounting plate 1 and an oscillation assembly, the oscillation assembly including a slide 2 mounted on the outer wall of the mounting plate 1;

[0025] The inner wall of the slide 2 is slidably connected to a displacement seat 3. The lower bottom end of the displacement seat 3 is movably sleeved with a longitudinal rod 4. The lower bottom end of the longitudinal rod 4 is fixedly connected to a turntable 5. The inner wall of the turntable 5 is rotatably sleeved with a swing seat 6. The lower bottom end of the swing seat 6 is equipped with a connecting plate 7. The upper top end of the connecting plate 7 is equipped with a strong magnetic block 8. The lower bottom end of the mounting plate 1 is fixedly connected to a retainer 9. The outer surface of the retainer 9 is equipped with a strong magnetic seat 10, and the magnetic poles of the two strong magnetic seats 10 are opposite. The outer wall of the mounting plate 1 is provided with a drive assembly.

[0026] The drive assembly includes a drive motor 11 mounted on the outer surface of the mounting plate 1. The output end of the drive motor 11 is fixedly sleeved with a turntable 12, and the outer surface of the turntable 12 is fixedly connected with a rotating shaft 13.

[0027] A connecting rod 14 is rotatably sleeved on the outer wall of the displacement seat 3. The connecting rod 14 is rotatably sleeved on the outer wall of the rotating shaft 13. Limiting rings are sleeved on both the rotating shaft 13 and the displacement seat 3 on the outer wall of the connecting rod 14.

[0028] Specifically, through the arrangement of the oscillation components, the various parts can work together to oscillate at multiple angles during the wafer cleaning process. This improves the wafer cleaning contact surface and cleaning efficiency. The operation of the drive motor 11 drives the turntable 12 at its output end to rotate, which in turn drives the displacement seat 3 to slide inside the slide block 2 via the rotating shaft 13 and the connecting rod 14. The displacement seat 3 then drives the longitudinal rod 4 at its end to move. Since the end of the longitudinal rod 4 is connected to the swing seat 6 via the turntable 5, the outer wall of the swing seat 6 will be subjected to strong magnetic force during the longitudinal movement. Block 8 abuts against the strong magnetic seat 10 on the outer wall of the retainer 9. Therefore, when the displacement seat 3 moves, it will drive the connecting plate 7 to move longitudinally. During the movement, it will also drive the connecting plate 7 to swing laterally through abutment. During the swing, it will first be pushed away by the mutual repulsion of the first strong magnetic seat 10, and then be attracted by the second strong magnetic seat 10 as it moves upward. As the drive motor 11 continues to run, the cleaning and oscillation efficiency of the wafer can be greatly improved through continuous circulation. Because the end of the connecting plate 7 is equipped with a rubber ball, the oscillation effect can also be improved by impact, while providing a buffering effect for the connecting plate 7.

[0029] A placement box 15 is fixedly connected to the end of the connecting plate 7. A placement rack 16 is fixedly connected to the bottom of the placement box 15. There are several placement racks 16. A wafer 17 is snapped into the inner wall of the placement rack 16.

[0030] The outer surface of the placement box 15 is fixedly connected to the bottom end of the connecting plate 7 by diagonal supports 18, and there are several diagonal supports 18.

[0031] Specifically, the connecting plate 7 can provide sufficient connection stability for the placement box 15, ensuring that it and the wafer 17 placed inside maintain sufficient stability during the cleaning process, avoiding the phenomenon of the wafer 17 shaking and becoming unstable due to vibration. The placement rack 16 can stably clamp the wafer 17, improving its cleaning stability.

[0032] The outer surface of the mounting plate 1 is provided with a through groove 19, which is located on one side of the turntable 12, and there are several through grooves 19.

[0033] A damping spring 20 is fixedly connected to the inner wall of the slide 2, and the end of the damping spring 20 is fixedly connected to the top of the displacement seat 3.

[0034] The outer wall of the mounting plate 1 is provided with bolt grooves 21, and the number of bolt grooves 21 is several.

[0035] Specifically, the through groove 19 on the outer surface of the mounting plate 1 can ensure that the operation of the turntable 12 is not affected, and can also provide airflow for the drive motor 11 to avoid heat accumulation that would affect the operation of the drive motor 11. The damping spring 20 on the inner wall of the slide 2 can provide a connection for the displacement seat 3 through the material properties of the spring, improving the smoothness of its displacement. During installation, the bolt groove 21 on the outer wall of the mounting plate 1 can be used to improve the installation efficiency and stability with the cleaning machine, thereby improving the cleaning quality of the wafer 17.

[0036] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A wafer cleaning oscillation cleaning device, comprising a mounting plate (1) and an oscillation assembly, characterized in that: The oscillation assembly includes a slide (2) mounted on the outer wall of the mounting plate (1); The inner wall of the slide (2) is slidably connected to a displacement seat (3), the lower bottom end of the displacement seat (3) is movably sleeved with a longitudinal rod (4), the lower bottom end of the longitudinal rod (4) is fixedly connected to a turntable (5), the inner wall of the turntable (5) is rotatably sleeved with a swing seat (6), the lower bottom end of the swing seat (6) is installed with a connecting plate (7), the upper top end of the connecting plate (7) is installed with a strong magnetic block (8), the lower bottom end of the mounting plate (1) is fixedly connected with a retainer (9), the outer surface of the retainer (9) is installed with a strong magnetic seat (10), and the magnetic poles of the two strong magnetic seats (10) are opposite. The outer wall of the mounting plate (1) is provided with a drive assembly.

2. The oscillating cleaning apparatus for wafer cleaning according to claim 1, characterized in that: The drive assembly includes a drive motor (11) mounted on the outer surface of the mounting plate (1), and a turntable (12) is fixedly sleeved on the output end of the drive motor (11). A rotating shaft (13) is fixedly connected to the outer surface of the turntable (12).

3. The oscillating cleaning apparatus for wafer cleaning according to claim 2, characterized in that: The outer wall of the displacement seat (3) is rotatably sleeved with a connecting rod (14), the connecting rod (14) is rotatably sleeved on the outer wall of the rotating shaft (13), and the rotating shaft (13) and the displacement seat (3) are both sleeved with limit rings on the outer wall of the connecting rod (14).

4. The oscillating cleaning apparatus for wafer cleaning according to claim 1, characterized in that: The end of the connecting plate (7) is fixedly connected to a placement box (15), and the bottom of the placement box (15) is fixedly connected to a placement rack (16). There are several placement racks (16), and a wafer (17) is snapped into the inner wall of the placement rack (16).

5. The oscillating cleaning apparatus for wafer cleaning according to claim 4, characterized in that: The outer surface of the placement box (15) is fixedly connected to the bottom end of the connecting plate (7) by diagonal supports (18), and there are several diagonal supports (18).

6. The oscillating cleaning apparatus for wafer cleaning according to claim 2, characterized in that: The outer surface of the mounting plate (1) is provided with a through groove (19), which is located on one side of the turntable (12), and there are several through grooves (19).

7. The oscillating cleaning apparatus for wafer cleaning according to claim 6, characterized in that: A damping spring (20) is fixedly connected to the inner wall of the slide (2), and the end of the damping spring (20) is fixedly connected to the top of the displacement seat (3).

8. The oscillating cleaning apparatus for wafer cleaning according to claim 7, characterized in that: The outer wall of the mounting plate (1) is provided with bolt grooves (21), and the number of bolt grooves (21) is several.

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