High-efficiency electronic component leg shearing production equipment

Abstract

The utility model discloses an electronic component high -efficient production equipment of cutting foot, include: cutting foot sliding table, cutting foot sliding table both ends are equipped with the cutting knife sliding block that can be relative to cutting foot sliding table elasticity telescopic, cutting knife sliding block is equipped with alignment recess and guide inclined plane, cutting foot mechanism, cutting foot mechanism quantity is two groups, is located cutting foot sliding table both sides respectively, cutting foot mechanism includes drive arrangement, installs the knife rest of drive arrangement power output end, press line piece, the cutting knife of two guide inclined planes is equipped with to the knife rest, press line piece installs drive arrangement power output end or the knife rest, sets up corresponding two alignment recess, the drive arrangement of two cutting foot mechanism is used for driving the relative of knife rest the closing or relative of cutting knife away, the feeding plate, the feeding plate quantity is two groups, is located cutting foot sliding table both sides respectively, the feeding plate is equipped with two corresponding the pin conveying groove of cutting knife sliding block two sides.

Description

Technical Field

[0001] This application relates to the field of automated processing equipment technology, specifically a high-efficiency lead-cutting production equipment for electronic components. Background Technology

[0002] Electronic components, such as two-pin common-mode coils, two-pin capacitors, diodes, and resistors, have two pins for soldering to the circuit board. To allow for manufacturing allowances, excess pin length needs to be trimmed during production to obtain pins of the required length for the actual application.

[0003] Existing production equipment, such as the coil testing and lead-cutting integrated machine disclosed in patent application CN202421644289.6, can only cut the leads of one electronic component at a time, resulting in low production efficiency. Utility Model Content

[0004] This utility model addresses the above-mentioned problems by proposing a high-efficiency lead-cutting production equipment for electronic components, aiming to solve the technical problems in the background art.

[0005] To achieve the above objectives, this utility model provides a high-efficiency lead-cutting production equipment for electronic components, comprising: A cutting slide table, wherein both ends of the cutting slide table are provided with cutting blade sliders that can elastically extend and retract relative to the cutting slide table; the cutting blade sliders are provided with alignment grooves and guide slopes; The cutting mechanism comprises two sets, located on opposite sides of the cutting slide. Each cutting mechanism includes a drive unit, a blade holder mounted on the power output end of the drive unit, and a pressure block. The blade holder is equipped with cutters corresponding to the two guide inclined surfaces. The pressure block is mounted on the power output end of the drive unit or the blade holder and is positioned corresponding to the two alignment grooves. The drive units of the two cutting mechanisms are used to drive the relative cutters of the blade holder to engage or disengage. The feeding plates are in two sets, located on both sides of the cutting slide; each feeding plate has two lead conveying grooves corresponding to the two sides of the cutting slide.

[0006] Furthermore, the cutting slide includes a side plate and a baffle; the side plate is provided with a sliding groove; one end of the cutting slider away from the guide slope is slidably connected to the sliding groove; the sliding groove is also provided with an elastic element for keeping the cutting slider extending outward relative to the cutting slide; the baffle is connected to the side plate and surrounds the sliding groove.

[0007] Furthermore, the pressure block is connected to the tool holder, and an elastic buffer is provided between the pressure block and the tool holder.

[0008] Furthermore, it includes a protective buffer block disposed at the end of the blade holder away from the cutter.

[0009] Furthermore, it includes a protective cover plate, which is connected to the feeding plate and surrounds the cutting slide and the knife holder.

[0010] Furthermore, the product placement rack is located adjacent to the cutting slide, and the product placement rack has two placement slots corresponding to the two pins of the electronic components; a magnetic element is provided between the two placement slots; and the width of at least one of the placement slots is adjustable.

[0011] Furthermore, it includes a moving component, a flux box, and a solder furnace; the moving component is used to pick up the electronic components with their leads cut off from the product display rack, and sequentially pass the leads through the flux box and the solder furnace to apply flux and solder.

[0012] Furthermore, it includes a scraper mechanism for scraping off the oxidized solder from the surface of the solder furnace; the scraper mechanism and the flux box are respectively located on both sides of the solder furnace.

[0013] Furthermore, this includes the material feeding conveyor belt.

[0014] Furthermore, the driving device is a cylinder.

[0015] Compared with the prior art, the present invention provides an efficient lead-cutting production equipment for electronic components. This new equipment, compared with the traditional lead-cutting device, can cut the leads of two electronic components at the same time, which greatly improves the production efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of an efficient lead-cutting production equipment for electronic components according to this application.

[0017] Figure 2 This is a schematic diagram of some components of an efficient lead-cutting production equipment for electronic components according to this application.

[0018] Figure 3 This is an exploded view of some components of a high-efficiency lead-cutting production equipment for electronic components according to this application.

[0019] Figure 4 This is a schematic diagram of the lead-cutting mechanism and elastic buffer structure of an efficient lead-cutting production equipment for electronic components according to this application.

[0020] Figure 5 This is an exploded view of the cutting slide and cutting blade slider structure of an efficient lead-cutting production equipment for electronic components according to this application.

[0021] Figure 6 This is a schematic diagram of the product placement rack structure of an efficient lead-cutting production equipment for electronic components according to this application.

[0022] The reference numerals in the figure are as follows: 1. Cutting slide; 110. Side plate; 111. Slide groove; 120. Baffle; 2. Cutting slider; 210. Alignment groove; 220. Guide slope; 230. Stop block; 3. Cutting mechanism; 310. Drive device; 320. Knife holder; 321. Cutting knife; 330. Wire pressing block; 4. Feeding plate; 410. Lead conveying groove; 5. Elastic buffer; 6. Protective buffer block; 7. Protective cover plate; 8. Product placement rack; 810. Placement groove; 820. Magnetic component; 830. Strip adjustment hole; 840. Stop bar; 9. Moving component; 910. Linear module; 920. Lifting device; 930. Clamping mechanism; 10. Flux box; 11. Solder furnace; 12. Scraper mechanism; 13. Unloading conveyor belt. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model. It is understood that the accompanying drawings are provided for reference and illustration only and are not intended to limit the present utility model. The connection relationships shown in the drawings are only for clear description and do not limit the connection method.

[0024] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component, or there may be an intervening component. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be noted that, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection; as a mechanical connection or an electrical connection; or as a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention.

[0025] It should also be noted that in the description of this utility model, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] Please refer to Figure 1 - Figure 6 This embodiment provides a high-efficiency lead-cutting production equipment for electronic components, including: A cutting slide 1 is provided at both ends of a cutting slide 1, which is elastically retractable relative to the cutting slide 1; the cutting slide 2 is provided with an alignment groove 210 and a guide slope 220; Two sets of cutting mechanisms 3 are respectively located on both sides of the cutting slide 1. Each cutting mechanism 3 includes a drive device 310, a blade holder 320 mounted on the power output end of the drive device 310, and a wire pressing block 330. The blade holder 320 is provided with cutters 321 corresponding to the two guide inclined surfaces 220. The wire pressing block 330 is mounted on the power output end of the drive device 310 or the blade holder 320 and is provided with two alignment grooves 210. The drive devices 310 of the two cutting mechanisms 3 are used to drive the blade holder 320 to engage or disengage from the relative cutters 321. The feeding plate 4 is provided in two sets, located on both sides of the cutting slide table 1. The feeding plate 4 is provided with two lead conveying grooves 410 corresponding to the two sides of the cutting slide table 2.

[0027] Working principle: Using automated equipment or manually, two electronic components with two leads to be cut are held on the outer side of the feeding plate 4, and the two leads of the electronic components are respectively fed into the two lead conveying grooves 410. In this way, the two leads of each electronic component to be cut are located on both sides of the same cutter slider 2. By controlling the two drive devices 310 to work synchronously, the drive devices 310 output linear moving force, driving the cutter holder 320 to move, so that the two pairs of opposite cutters 321 in the two sets of four cutters 321 are aligned and close together. Preferably, the four wire pressing blocks 330 cut before the pairs of opposite cutters 321, pressing the redundant leads into the alignment grooves 210 for fixation, so as to prevent the leads from twisting and deviating when the cutter 321 cuts.

[0028] Before the two opposing cutters 321 cut, the sides of the cutters 321 are still in contact with the guide slope 220 of the cutter slider 2. The closer the two opposing cutters 321 are, the more elastically the cutter slider 2 can extend relative to the cutting slide 1. The cutter slider 2 moves back and retracts relative to the cutting slide 1 to avoid the cutting slide 1. At this time, the pins held by the wire pressing block 330 and the alignment groove 210 are tightened and straightened, which can remove the redundant parts more effectively and ensure that the required pin length meets the requirements. The two opposing cutters 321 complete the cutting under the drive of the drive device 310, and the two cut electronic components can be collected.

[0029] Under control, the drive unit 310 drives the cutter holder 320 to return, and the two opposing cutters 321 move away from each other. The cutter slider 2 is no longer held by the cutters 321 and also elastically extends back relative to the cutting foot slide 1.

[0030] This new type of high-efficiency lead-cutting production equipment for electronic components can cut the leads of two electronic components simultaneously at one time, compared with traditional lead-cutting devices, thus greatly improving production efficiency.

[0031] Please refer to Figure 3 and Figure 5 The cutting slide 1 includes a side plate 110 and a baffle 120; the side plate 110 is provided with a groove 111; one end of the cutter slider 2 away from the guide inclined surface 220 is slidably connected to the groove 111; the groove 111 is also provided with an elastic element (not shown) for keeping the cutter slider 2 extended relative to the cutting slide 1; the baffle 120 is connected to the side plate 110 and surrounds the groove 111.

[0032] Preferably, the cutter slider 2 is provided with a stop 230 for placing the ejection groove 111.

[0033] Please refer to Figure 3 and Figure 4 The pressure block 330 is connected to the tool holder 320, and an elastic buffer 5 is provided between the pressure block 330 and the tool holder 320.

[0034] The elastic buffer 5 can provide elastic cushioning when the pressure block 330 abuts against the alignment groove 210. In some embodiments, the elastic buffer 5 is a cylindrical spring assembly.

[0035] While the pressure block 330 is pressing the wire, the elastic buffer 5 plays a buffering role and can also prevent the cutter slider 2 from being unable to move when the cutter 321 is cutting the foot.

[0036] Please refer to Figure 1 and Figure 3 This includes a protective buffer block 6 disposed at the end of the blade holder 320 away from the cutter 321.

[0037] The protective buffer block 6 is used to provide buffering when the drive unit 310 drives the tool holder 320 back to the limit position under control.

[0038] Please refer to Figure 2 and Figure 3 It includes a protective cover plate 7, which is connected to the feeding plate 4 and surrounds the cutting slide 1 and the knife holder 320.

[0039] In some embodiments, the protective buffer block 6, together with the feeding plate 4 and the protective cover plate 7, completely encloses the cutting slide 1 and the knife holder 320, thereby improving the safety of the equipment.

[0040] Please refer to Figure 2 and Figure 6 The product placement rack 8 is located adjacent to the cutting slide 1. The product placement rack 8 has two placement slots 810 corresponding to the two pins of the electronic components. A magnetic element 820 is provided between the two placement slots 810. The width of at least one of the placement slots 810 is adjustable.

[0041] The two electronic components, with their leads trimmed, can be placed into the corresponding slots 810. Magnetic components 820 provide a degree of fixation to the main body of the electronic components.

[0042] The width of the placement slot 810 is adjustable. In some embodiments, the product placement rack 8 is provided with a strip-shaped adjustment hole 830 on the side of the placement slot 810, and a baffle 840 detachably connected to the product placement rack 8. The baffle 840 is connected to the strip-shaped adjustment hole 830 by a screw assembly. The position of the baffle 840 is set within the length range of the strip-shaped adjustment hole 830, so that the width of the fixed-width placement slot 810 can be adjusted by the baffle 840 to improve the versatility of the equipment and to collect and place electronic components of various specifications.

[0043] Please refer to Figure 1 It includes a moving component 9, a flux box 10, and a solder furnace 11; the moving component 9 is used to pick up the electronic components with their leads cut off from the product display rack 8, and sequentially pass the leads through the flux box 10 and the solder furnace 11 to apply flux and solder.

[0044] The moving component 9 can be composed of a linear module 910 and a lifting device 920. The moving component 9 is also equipped with a clamping mechanism 930, which can remove multiple electronic components from the product display rack 8.

[0045] The linear module 910 can be equipped with four photoelectric sensors on its inner side to identify the product gripping station, flux application station, solder plating station, and product placement station. The photoelectric sensor on the lifting device 920 of the clamping mechanism 930 is connected to the automatic solder plating controller to set commands for the clamping mechanism 930 to grip, stop, lower, and raise.

[0046] According to the program set by the controller, when the linear module 910 reaches above the flux box 10, the sensor will stop and the lifting device 920 will drive the clamping mechanism 930 to descend. The clamping mechanism 930 will automatically descend to the set height and stop time. After the flux is applied, the lifting device 920 will automatically drive the clamping mechanism 930 to rise.

[0047] While the electronic component leads are coated with flux, the scraper mechanism 12 begins to remove the solder slag from the solder furnace 11. As the clamping mechanism 930 moves onto the solder furnace 11, a sensor, according to the controller's settings, initiates the lifting device 920 to drive the clamping mechanism 930 downwards. The descent height is set on the controller based on the product's size and lead length, as well as the temperature and solder plating time of the solder furnace 11, according to the product's lead wire diameter. After the product foot enters the solder furnace 11, the depth of entry into the solder furnace 11 should reach 85% of the foot length. The dwell time in the solder furnace 11 is set on the controller according to the product specifications.

[0048] After the solder plating is completed, the clamping mechanism 930 is driven to rise by the lifting device 920. The height needs to exceed the flux box 10 to prevent the product feet from touching the solder furnace 11. After moving above the unloading conveyor belt 13 and descending to a distance of about 20-40mm above the unloading conveyor belt 13, the clamping mechanism 930 puts the product into the production line and conveys the product into the product box. The height of the clamping mechanism 930 is driven to rise by the lifting device 920, which can be adjusted by adjusting the position of the sensor.

[0049] Please refer to Figure 1 It includes a scraper mechanism 12 for scraping off the oxidized solder on the surface of the solder furnace 11; the scraper mechanism 12 and the flux box 10 are respectively located on both sides of the solder furnace 11.

[0050] The scraper mechanism 12 can be connected to a scraper via the piston rod end of a drive cylinder, which drives the scraper to move and scrape the oxidized solder on the surface of the solder furnace 11.

[0051] Please refer to Figure 1 It includes a feeding conveyor belt 13. In some embodiments, the feeding conveyor belt 13 is disposed between the product display rack 8 and the flux box 10.

[0052] Please refer to Figure 2 and Figure 3 In some embodiments, the drive device 310 is a cylinder.

[0053] In summary, the beneficial effects of this high-efficiency lead trimming production equipment for electronic components are as follows: One person can cut the leads of two products at the same time, and can also automatically tin-plate 8-10 products. In terms of labor costs, it can save three people. One person can do 600-800 pieces / hour, which is more than 50% more efficient than the traditional single process. Compared to the floor space required for a single workstation and the factory space used for product stacking, the overall cost of a manufacturing plant is optimized in terms of handling time.

[0054] In the specification and claims of this application, the terms "comprising / including" and "having / including" and variations thereof are used to specify the presence of the stated features, values, steps or components, but do not exclude the presence or addition of one or more other features, values, steps, components or combinations thereof.

[0055] Some features of this invention are described in different embodiments for clarity; however, these features may also be described in combination in a single embodiment. Conversely, some features of this invention are described only in a single embodiment for brevity; however, these features may also be described individually or in any suitable combination in different embodiments.

[0056] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-efficiency lead-cutting production equipment for electronic components, characterized in that, include: A cutting slide table, wherein both ends of the cutting slide table are provided with cutting blade sliders that can elastically extend and retract relative to the cutting slide table; the cutting blade sliders are provided with alignment grooves and guide slopes; The cutting mechanism comprises two sets, located on opposite sides of the cutting slide. Each cutting mechanism includes a drive unit, a blade holder mounted on the power output end of the drive unit, and a pressure block. The blade holder is equipped with cutters corresponding to the two guide inclined surfaces. The pressure block is mounted on the power output end of the drive unit or the blade holder and is positioned corresponding to the two alignment grooves. The drive units of the two cutting mechanisms are used to drive the relative cutters of the blade holder to engage or disengage. The feeding plates are in two sets, located on both sides of the cutting slide; each feeding plate has two lead conveying grooves corresponding to the two sides of the cutting slide.

2. The high-efficiency lead-cutting production equipment for electronic components according to claim 1, characterized in that, The cutting slide includes a side plate and a baffle; the side plate is provided with a groove; the end of the cutting slider away from the guide slope is slidably connected to the groove; the groove is also provided with an elastic element for keeping the cutting slider extended relative to the cutting slide; the baffle is connected to the side plate and surrounds the groove.

3. The high-efficiency lead-cutting production equipment for electronic components according to claim 1, characterized in that, The pressure block is connected to the tool holder, and an elastic buffer is provided between the pressure block and the tool holder.

4. The high-efficiency lead-cutting production equipment for electronic components according to claim 1, characterized in that, This includes a protective buffer block positioned at the end of the blade holder furthest from the cutter.

5. The high-efficiency lead-cutting production equipment for electronic components according to claim 1, characterized in that, It includes a protective cover plate, which is connected to the feeding plate and surrounds the cutting slide and the knife holder.

6. The high-efficiency lead-cutting production equipment for electronic components according to claim 1, characterized in that, The product placement rack is located adjacent to the cutting slide, and the product placement rack has two placement slots corresponding to the two pins of the electronic components; a magnetic element is provided between the two placement slots; and the width of at least one of the placement slots is adjustable.

7. The high-efficiency lead-cutting production equipment for electronic components according to claim 6, characterized in that, It includes a moving component, a flux box, and a solder furnace; the moving component is used to pick up the electronic components with their leads cut off from the product display rack, and sequentially pass the leads through the flux box and the solder furnace to apply flux and solder.

8. The high-efficiency lead-cutting production equipment for electronic components according to claim 7, characterized in that, It includes a scraper mechanism for scraping off the oxidized solder from the surface of the solder furnace; the scraper mechanism and the flux box are located on opposite sides of the solder furnace.

9. The high-efficiency lead-cutting production equipment for electronic components according to claim 7, characterized in that, This includes the material feeding conveyor belt.

10. The high-efficiency lead-cutting production equipment for electronic components according to claim 1, characterized in that, The driving device is a cylinder.

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