Water-cooled plate tin soldering spring welding tooling
Patent Information
- Application Number
- CN202522285885.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-29
- Publication Date
- 2026-09-29
- Estimated Expiration
- 2035-10-29
AI Technical Summary
[0005]针对现有技术的不足,本实用新型提供了一种水冷板锡焊弹片焊接工装,解决了传统工装体积较大且笨重,搬运、装夹不便,且其本身吸热量大,不仅需延长过炉时间补偿热量,还会导致铜块与水冷板贴合处局部温度不足,出现锡膏熔化不完全,引发虚焊、假焊,难以保障合格率的技术问题,达到了采用弹片工装实现轻便小巧吸热少,缩短过炉时间,锡膏容易吸热熔化,使焊接性能得以保证,且组装方便,成本低下的目的
1、本实用新型通过安装于铜块上方的M型弹片工装,对铜块施加向下的压力,将铜块固定在安装槽内,随后将水冷板箱体送入炉中烘烤,使铜块底部的锡膏熔化并填充在安装槽内,完成铜块和水冷板箱体的连接,再将弹片工装取下即可,相较于传统工装,弹片工装小巧轻便吸热少,缩短了整体过炉时间,锡膏更容易吸热熔化,避免锡膏熔化不完全甚至不熔化,进而引发虚焊、假焊等焊接不良问题,提高了产品合格率。
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Figure CN224808627U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of water-cooled plate technology, and in particular to a welding fixture for soldering springs on water-cooled plates. Background Technology
[0002] As electronic devices rapidly develop towards higher power and miniaturization, water-cooled plates, with their excellent heat dissipation performance, are increasingly widely used in new energy vehicles, industrial control, data centers and other fields. The quality of the solder connection between the water-cooled plate and the copper block directly determines the operating efficiency of the heat dissipation system, and the corresponding demand for soldering fixtures has also increased significantly.
[0003] Currently, the industry generally uses traditional rigid structure fixtures for copper block soldering operations. The fixtures are used to press the side of the copper block coated with solder paste into the mounting groove of the water-cooled plate to ensure that the two are in close contact. Then, the water-cooled plate and the fixture are placed into a heating furnace. The high temperature in the furnace melts the solder paste, thereby achieving the adhesion and fixation of the copper block and the water-cooled plate.
[0004] However, these traditional tooling fixtures have many significant drawbacks: First, they are large and heavy, which not only occupy more production space but also make tooling handling and clamping inconvenient, affecting production flow efficiency. Second, the tooling itself absorbs a lot of heat, which on the one hand forces the soldering reflow time to be extended to compensate for heat loss, directly reducing production efficiency. On the other hand, the large amount of heat absorption will lead to insufficient local temperature in the area where the copper block and the water-cooled plate are in contact. Even if the reflow time is extended, the solder paste is still prone to incomplete melting or even no melting, which in turn leads to poor soldering problems such as cold solder joints and false solder joints, making it difficult to guarantee the product qualification rate. Utility Model Content
[0005] To address the shortcomings of existing technologies, this utility model provides a water-cooled plate soldering spring welding fixture, which solves the technical problems of traditional fixtures being large and heavy, inconvenient to handle and clamp, and having high heat absorption. This not only requires extending the reflow time to compensate for the heat, but also leads to insufficient local temperature at the contact point between the copper block and the water-cooled plate, resulting in incomplete melting of solder paste, causing cold solder joints and false solder joints, making it difficult to guarantee the pass rate. The spring fixture achieves the goals of being lightweight, compact, and having low heat absorption, shortening the reflow time, allowing the solder paste to easily absorb heat and melt, ensuring welding performance, and being easy to assemble and low in cost.
[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a water-cooled plate soldering spring welding fixture, including a water-cooled plate box, the top of the water-cooled plate box is provided with an installation groove, a heat-conducting copper block is embedded in the installation groove, two sets of fixing blocks are symmetrically fixed to the top of the water-cooled plate box and on both sides of the installation groove, and the inner sides of the two sets of fixing blocks are symmetrically provided with insertion grooves, and a spring fixture for pressing and fixing the copper block is inserted into the insertion groove.
[0007] A further improvement is that the copper block is perfectly adapted to the mounting groove, and its bottom is coated with solder paste.
[0008] A further improvement is that the spring fixture has an overall M-shaped structure, and it is interference-fitted with the copper block. The spring fixture has protrusions on both sides that are adapted to the insertion slot.
[0009] A further improvement is that the inner walls of the ∧-shaped structures on both sides of the M-shaped spring fixture are fixedly connected to springs that maintain the elasticity of the spring fixture.
[0010] A further improvement is that the spring is a memory spring and is made of nickel-titanium memory alloy material.
[0011] A further improvement is that a grid groove is provided at the bottom of the copper block.
[0012] By means of the above technical solution, this utility model provides a welding fixture for soldering springs on water-cooled plates, which has at least the following beneficial effects: 1. This utility model uses an M-shaped spring clip fixture installed above a copper block to apply downward pressure to the copper block, fixing it in the mounting groove. Then, the water-cooled plate housing is sent into the furnace for baking, causing the solder paste at the bottom of the copper block to melt and fill the mounting groove, completing the connection between the copper block and the water-cooled plate housing. The spring clip fixture can then be removed. Compared with traditional fixtures, the spring clip fixture is small, lightweight, and absorbs less heat, shortening the overall reflow time. The solder paste is more likely to absorb heat and melt, avoiding incomplete or no melting of the solder paste, which can lead to poor soldering problems such as cold solder joints and false solder joints, thus improving the product qualification rate.
[0013] 2. This utility model creates a grid groove at the bottom of the copper block. If the solder paste is not applied evenly, the grid groove can serve as a "solder paste storage cavity". Excess solder paste will be squeezed into the grid groove, and insufficient areas can be replenished from the grid groove, ensuring that the amount of solder paste on the soldering surface is uniform and suitable, improving the consistency of soldering. In addition, the grid groove will form an interlocking structure at the bottom of the copper block, which will form a mechanical interlocking connection structure after solidification, improving its shear strength and peel resistance.
[0014] 3. This utility model uses the elasticity of the spring itself to assist the elastic reset of both sides of the spring plate fixture, thereby avoiding insufficient reset on one side or in a local area, which would result in the inability to provide stable and uniform pressure to the copper block, leading to uneven melting of solder paste and affecting the stability of the solder connection between the copper block and the water-cooled plate housing. Attached Figure Description
[0015] The accompanying drawings, which are provided to further illustrate this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application.
[0016] In the attached diagram: Figure 1 This is a schematic diagram of a traditional tooling clamping structure; Figure 2 This is a schematic diagram of the overall structure of this utility model; Figure 3 This is a schematic diagram of the disassembled structure of this utility model; Figure 4 This is a schematic diagram of the independent structure of the spring clip tooling of this utility model; Figure 5 This is a schematic diagram of the independent copper block structure of this utility model viewed from below.
[0017] In the diagram: 1. Water-cooled plate housing; 2. Mounting slot; 3. Copper block; 31. Grid groove; 4. Fixing block; 5. Insertion slot; 6. Spring clip fixture; 61. Protrusion; 62. Spring. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0019] Example 1 Traditional soldering fixtures are bulky and heavy, inconvenient to handle and clamp, and absorb a lot of heat. This not only requires extended reflow time to compensate for the heat but also leads to insufficient local temperature at the contact point between the copper block and the water-cooled plate, resulting in incomplete solder paste melting, cold solder joints, and difficulty in ensuring a high pass rate. This embodiment provides a water-cooled plate soldering spring-loaded fixture. By using this spring-loaded fixture, it achieves a lightweight, compact design with low heat absorption, shortens reflow time, facilitates solder paste melting, ensures soldering performance, and is easy to assemble at a low cost. Please refer to... Figures 2-5 The water-cooled plate soldering spring welding fixture includes a water-cooled plate housing 1, a mounting groove 2 on the top of the water-cooled plate housing 1, a heat-conducting copper block 3 embedded in the mounting groove 2, two sets of fixing blocks 4 symmetrically fixed to the top of the water-cooled plate housing 1 and on both sides of the mounting groove 2, and insertion grooves 5 symmetrically opened on the inner side of the two sets of fixing blocks 4, and a spring fixture 6 for pressing and fixing the copper block 3 inserted into the insertion groove 5.
[0020] The copper block 3 is perfectly fitted to the mounting slot 2, and its bottom is coated with solder paste. The spring fixture 6 has an M-shaped structure and an interference fit with the copper block 3. Protrusions 61, which match the insertion slots 5, are fixed to both sides of the spring fixture 6. The copper block 3, with solder paste coated on its bottom, is pressed into the mounting slot 2 on the water-cooled plate housing 1. Then, the protrusions 61 on both sides of the spring fixture 6 are sequentially inserted into the insertion slots 5 in the fixing block 4, thus mounting the spring fixture 6 above the copper block 3. Because of the interference fit between the spring fixture 6 and the copper block 3, the bottom of the M-shaped spring fixture 6 abuts against the copper block 3 evenly. Apply downward pressure to the copper block 3 to press and fix it in the mounting groove 2. Then, send the water-cooled plate housing 1 into the furnace for baking, so that the solder paste at the bottom of the copper block 3 melts and fills the mounting groove 2, completing the connection between the copper block 3 and the water-cooled plate housing 1. Then, remove the spring fixture 6. Compared with traditional fixtures, the spring fixture 6 is small, lightweight and absorbs less heat, shortening the overall reflow time. The solder paste is easier to absorb heat and melt, avoiding incomplete melting or even no melting of the solder paste, which can lead to poor soldering problems such as cold solder joints and false solder joints, thus improving the product qualification rate.
[0021] To further improve the strength of soldering and prevent excessive solder paste from overflowing, a grid groove 31 is provided at the bottom of the copper block 3. If the thickness of the solder paste is uneven when it is applied to the bottom of the copper block 3, pressing directly will cause some areas to overflow with too much solder paste and contaminate the surrounding area, or too little solder paste to cause cold solder joints or empty solder joints. In this case, the grid groove 31 can act as a "solder paste storage cavity". Excess solder paste will be squeezed into the grid groove 31, and insufficient areas can be replenished with solder paste from the grid groove 31 to ensure that the amount of solder paste on the soldering surface is uniform and appropriate, improve the consistency of soldering, and the grid groove 31 will form a concave-convex structure at the bottom of the copper block 3. After solidification, it will form a connection structure similar to mechanical interlocking, which will improve its shear strength and peel resistance.
[0022] Example 2 To prevent the spring fixture 6 from failing to fully reset on one side or in a localized area after repeated insertion into the slot 5 of the fixing block 4, thus causing a shift in the center of gravity and affecting the stable and uniform pressure provided by the spring fixture 6 to the copper block 3, therefore, based on Embodiment 1, as follows... Figures 2-5 As shown, springs 62 are fixed to the inner walls of the ∧-shaped structures on both sides of the M-shaped spring fixture 6 to maintain the elasticity of the spring fixture 6. When the spring fixture 6 is removed from the insertion slot 5 each time, the elasticity of the spring 62 itself assists the elastic reset of both sides of the spring fixture 6, thereby avoiding insufficient reset on one side or in a local area, which would result in the inability to provide stable and uniform pressure to the copper block 3, and thus cause uneven melting of solder paste, affecting the stability of the solder connection between the copper block 3 and the water-cooled plate housing 1.
[0023] Furthermore, the spring 62 is a memory spring and is made of nickel-titanium memory alloy material. The spring 62 made of nickel-titanium memory alloy material is more resistant to high temperature, and when the nickel-titanium memory alloy spring 62 is heated in the furnace, it will extend to both sides, thereby applying elastic force to the inside of the M-shaped spring fixture 6, so that the spring fixture 6 applies pressure to the copper block 3, making the copper block 3 fit tightly in the mounting groove 2, thus improving its soldering effect.
[0024] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A welding fixture for soldering springs on a water-cooled plate, comprising a water-cooled plate housing (1), characterized in that: The top of the water-cooled plate box (1) is provided with an installation groove (2), and a heat-conducting copper block (3) is embedded in the installation groove (2). Two sets of fixing blocks (4) are symmetrically fixed to the top of the water-cooled plate box (1) and on both sides of the installation groove (2). Insertion grooves (5) are symmetrically provided on the inner side of the two sets of fixing blocks (4). A spring clip fixture (6) for pressing and fixing the copper block (3) is inserted into the insertion groove (5).
2. The welding fixture for water-cooled plate soldering springs according to claim 1, characterized in that: The copper block (3) is perfectly fitted to the mounting groove (2), and its bottom is coated with solder paste.
3. The welding fixture for water-cooled plate soldering springs according to claim 1, characterized in that: The spring tooling (6) is an M-shaped structure, and it is interference-fitted with the copper block (3). The spring tooling (6) has protrusions (61) on both sides that are compatible with the insertion slot (5).
4. The welding fixture for water-cooled plate soldering springs according to claim 2, characterized in that: The inner walls of the ∧-shaped structures on both sides of the M-shaped spring fixture (6) are fixed with springs (62) to maintain the elasticity of the spring fixture (6).
5. The welding fixture for water-cooled plate soldering springs according to claim 4, characterized in that: The spring (62) is a memory spring and is made of nickel-titanium memory alloy material.
6. The welding fixture for water-cooled plate soldering springs according to claim 1, characterized in that: The bottom of the copper block (3) is provided with a grid groove (31).