Laser processing apparatus

Abstract

The application discloses a laser processing equipment, comprising a rack, a laser head connected to the rack, a bottom plate assembly connected to the rack and arranged opposite to the laser head, and a processing area formed on the bottom plate assembly corresponding to a processing range of the laser head, wherein the bottom plate assembly comprises a first bottom plate and a second bottom plate, the first bottom plate is formed with a through hole, the through hole is located in the processing area or the processing area is located in the through hole, and the second bottom plate is detachably installed in the through hole. The use expansion and processing efficiency of the laser processing equipment are effectively improved.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and more particularly to a laser processing device. Background Technology

[0002] Currently, when using laser processing equipment, the object to be processed is usually placed on the base plate of the laser processing equipment for processing. This means that the laser processing equipment can only be placed on a table for engraving, which limits the processing operation and cannot better adapt to diverse processing needs. Utility Model Content

[0003] The purpose of this application is to provide a laser processing device to solve the technical problem of the scalability of laser processing devices in the related art.

[0004] On one hand, embodiments of this application provide a laser processing apparatus, including: frame; A laser head is connected to the frame. The laser head includes a laser and a galvanometer assembly. The laser is used to emit a laser beam, and the galvanometer assembly is used to deflect the laser beam. A base plate assembly is connected to the frame and is disposed opposite to the laser head. The processing area of ​​the laser head corresponds to a processing area formed on the base plate assembly. The base plate assembly includes a first base plate and a second base plate. The first base plate has a through hole, which is located in the processing area or the processing area is located in the through hole. The second base plate is detachably installed in the through hole.

[0005] This application provides a laser processing device in which the base plate assembly is designed as a detachable combination of a first base plate and a second base plate. When the second base plate is installed in the through hole, the workpiece to be processed can be placed directly on the base plate assembly for processing. When the second base plate is removed from the first base plate, the laser can pass through the through hole in the first base plate for processing. At this time, the laser processing device can perform lateral and inverted engraving, and is not limited to engraving on a table. The laser processing device has greater scalability and can be processed in a wider range of scenarios. Attached Figure Description

[0006] Figure 1 This is a schematic diagram of a laser processing device provided in an embodiment of this application; Figure 2 This is an exploded view of a base plate assembly provided in an embodiment of this application; Figure 3 This is provided by the embodiments of this application. Figure 2 A magnified view of region III in the image; Figure 4 This is a schematic diagram of a laser processing device provided in an embodiment of this application; Figure 5 This is a schematic diagram of a laser head provided in an embodiment of this application; The components include: base plate assembly 10, first base plate 1, second base plate 2, elastic element 3, first gasket 4, second gasket 5, buffer chamber 6, magnetic suction element 7, protective cover 8, laser head 20, laser 21, galvanometer assembly 22, outer shell 23, main shell 231, base 232, heat sink 24, mounting base 25, main board assembly 26, frame 30, and protective cover 40. Detailed Implementation

[0007] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0008] It should be understood that the steps described in the method embodiments of this disclosure may be performed in different orders and / or in parallel. Furthermore, the method embodiments may include additional steps and / or omit the steps shown. The scope of this disclosure is not limited in this respect.

[0009] The term "comprising" and its variations as used herein are open-ended inclusions, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Definitions of other terms will be given in the description below.

[0010] In existing technologies, laser processing equipment for laser engraving can usually only engrave objects that can be placed on a tabletop. This means that the object to be engraved needs to be placed in a specific location, which limits the laser engraving process and makes it less scalable.

[0011] To address the technical problems existing in related technologies, this application provides a laser processing device, combined with... Figures 1 to 3 The laser processing equipment provided in this application is described.

[0012] Specifically, refer to Figure 1 and Figure 3The laser processing equipment includes a frame 30, a laser head 20, and a base plate assembly 10. The laser head 20 is connected to the frame 30 and includes a laser 21 and a galvanometer assembly 22. The laser 21 is used to emit a laser beam, and the galvanometer assembly 22 is used to deflect the laser beam. The base plate assembly 10 is connected to the frame 30 and is disposed opposite to the laser head 20. The processing area of ​​the laser head 20 corresponds to the processing area formed on the base plate assembly 10. The base plate assembly 10 includes a first base plate 1 and a second base plate 2. The first base plate 1 has a through hole, which is located in the processing area or the processing area is located in the through hole. The second base plate 2 is detachably installed in the through hole.

[0013] The laser head 20 is mounted on the frame 30. The laser head 20 is controlled to process the object to be processed, such as engraving and cutting. Therefore, when the laser head 20 is mounted on the frame 30, the laser head 20 can be mounted by a sliding table mechanism set on the frame 30, so that the laser head 20 can be raised and lowered. At the same time, the processing area of ​​the laser head 30 is directly opposite the processing area formed on the base plate assembly 10.

[0014] There may be one or more lasers 21. In some embodiments, there may be multiple lasers 21 with different wavelengths, and the multiple lasers 21 may be combined by optical devices and reach the galvanometer assembly 22.

[0015] In some embodiments, the galvanometer assembly 22 may include an X-axis galvanometer and a Y-axis galvanometer, which cooperate to move the light spot projected onto the base plate assembly 10 along the X and Y directions.

[0016] In some embodiments, the laser head 20 further includes a housing 23, within which the laser 21 and the galvanometer assembly 22 can be mounted. The housing 23 may include a main housing 231 and a base 232, with the base 232 mounted on the bottom of the main housing 231. The main housing 231 and the base 232 can enclose an installation space, within which the laser 21 and the galvanometer assembly 22 are housed. The galvanometer assembly 22 can be mounted on the base 232. In other embodiments, the housing 23 is not limited to the structure of the main housing 232 and the base 232; it may also be a structure combining the main housing with a top cover, or a structure combining the main housing with a side cover, etc., which are not listed here nor are specific limitations imposed.

[0017] In some embodiments, the laser head 20 further includes a heat sink 24, which can be installed inside the housing 23. The laser 21 can be installed on the heat sink 24. The heat sink 24 can be used to dissipate heat from the laser 21 so that the laser 21 can operate relatively stably.

[0018] In some embodiments, the laser head 20 further includes optical devices such as reflectors that change the optical path and / or beam combiners that merge the optical path, and these optical devices are disposed between the laser 21 and the galvanometer assembly 22. In some embodiments, the laser head 20 further includes a mounting base 25, on which reflectors, beam combiners, etc., may be disposed, and the mounting base 25 may be mounted on the housing 23 or the heat sink 24.

[0019] In some embodiments, such as Figure 5 As shown, the laser head 20 may also include a motherboard assembly 26, which is connected to the laser 21. The motherboard assembly 26 may include a motherboard and electronic components and corresponding drive circuits, control circuits, etc., mounted on the motherboard. The motherboard assembly 26 may be mounted on the housing 23 or the heat sink 24.

[0020] like Figure 2 As shown, the base plate assembly 10 on the laser processing equipment includes a first base plate 1 and a second base plate 2. A through hole is formed on the first base plate 1. At the same time, there is a processing area on the base plate assembly 1. The through hole and the processing area can be located within the processing area or the processing area can be located within the through hole.

[0021] Furthermore, the second base plate 2 can be detachably installed within the through hole of the first base plate 1. That is, the second base plate 2 and the through hole are complementary in shape, allowing the second base plate 2 to be completely embedded within the through hole of the first base plate 1. In actual operation, when the second base plate 2 is installed within the through hole of the first base plate 1, the upper surfaces of the first base plate 1 and the second base plate 2 are flush with each other, forming a continuous and flat workpiece bearing surface. When the second base plate 2 is removed from the first base plate 1, the through hole on the first base plate 1 becomes an open space, allowing the laser beam to penetrate. This enables processing in lateral or inverted directions, without limiting processing to a tabletop.

[0022] In some embodiments, the wall of the through hole includes a stepped structure, and the second base plate 2 is mounted on the stepped structure.

[0023] Specifically, refer to Figure 3 , Figure 3 for Figure 2 The cross-sectional diagram at point A shows a through hole formed on the first base plate 1 for the detachable installation of the second base plate 2. To support the second base plate 2, the wall of the through hole on the first base plate 1 includes a stepped structure, which supports the second base plate 2 when it is installed on the first base plate 1. It should be noted that the steps on the wall of the through hole formed on the first base plate 1 can be, in addition to... Figure 3 The structure shown can be customized according to actual needs, and the inner wall of the hole can also be a sloping structure.

[0024] For example, since the inner wall of the through hole includes a stepped structure, and the second base plate 2 is mounted on the through hole formed on the first base plate 1, the position where the edge of the second base plate 2 contacts the inner wall of the through hole can also be a stepped structure, so as to achieve stable mounting of the second base plate 2 on the first base plate 1.

[0025] In some embodiments, the base plate assembly 10 further includes an elastic element 3 disposed between the hole wall of the through hole and the second base plate, so as to fix the second base plate to the first base plate.

[0026] When the second base plate 2 is installed on the first base plate 1, the outer edge of the second base plate 2 contacts the inner wall of the through hole formed on the first base plate 1. To improve the stability and ease of installation, a suitable elastic element can be placed between the first base plate 1 and the second base plate 2, such as... Figure 2 As shown, when the second base plate 2 is installed on the first base plate 1, the second base plate 2 is fixed in the through hole of the first base plate 1 based on the action of the elastic element 3.

[0027] In some embodiments, the elastic element 3 can be fixed to the first base plate 1 by means of fasteners (such as screws, bolts, etc.), adhesives, etc. For example, in some embodiments, the first base plate 1 has a mounting groove or mounting hole on the inner wall of the through hole, and the elastic element 3 is fixed in the mounting groove or mounting hole by screws and protrudes from the inner wall of the through hole.

[0028] In some embodiments, the elastic element 3 includes an elastic snap.

[0029] In some embodiments, the elastic element 3 is a silicone element.

[0030] In some embodiments, the elastic member 3 includes a body and a protrusion provided on the body. The body abuts against the hole wall, and the protrusion abuts against the second base plate, so that the second base plate and the elastic member are in an interference fit.

[0031] The material and / or structural properties of the elastic element 3 can be diverse. For example, the elastic element 3 may include an elastic buckle, or it may be made of silicone. It may also include a body and a protrusion on the body, or it may be an elastic buckle made of silicone, or a silicone material that includes a body and a protrusion on the body, or an elastic buckle made of silicone that includes a body and a protrusion on the body. Based on the same structural or material properties, the second base plate 2 can be stably installed in the through hole formed on the first base plate 1.

[0032] The elastic element 3 includes a body and a protrusion on the body. The body abuts against the wall of the through hole in the first base plate 1, and the protrusion abuts against the side of the second base plate 2, thereby allowing the second base plate 2 and the elastic element 3 to have an interference fit. In actual installation, simply press the second base plate 2 downwards, and the protrusion on the body of the elastic element 3 will spring back after being deformed by pressure, thus firmly clamping the second base plate 2. When disassembling the second base plate 2, it can be disassembled by pulling it in the opposite direction.

[0033] When the second base plate 2 is installed in the through hole, the elastic element 3 is used to achieve stable installation of the second base plate 2, prevent the second base plate 2 from falling off during the movement of the laser processing equipment, and enable the second base plate 2 to be detachably installed with the first base plate 1.

[0034] In some other embodiments, the elastic element 3 may also be a sheet, spring, etc., and there is no limitation here.

[0035] In some embodiments, the base plate assembly 10 further includes a first pad 4, which is disposed on the side of the second base plate 2 away from the laser head. The first pad 4 can support the second base plate 2, so that the second base plate 2 is not easily detached when the base plate assembly 10 is placed on a table.

[0036] In some embodiments, the number of first gaskets 4 is at least two, and the at least two first gaskets 4 are arranged in parallel and spaced apart. In this way, the support stability of the second base plate 2 is better, ensuring the processing accuracy.

[0037] The number of first gaskets 4 can be multiple, such as two, three, four, five, or more. In such cases... Figure 2 In the base plate assembly, taking two first gaskets 4 as an example, the two first gaskets 4 are arranged parallel and spaced apart. In addition, the number of first gaskets 3 can also be related to their size. When the size is small, fewer gaskets can be set, while when the size is large, more gaskets can be set.

[0038] exist Figure 2 In the illustrated embodiment, the first gasket 4 is strip-shaped. In some embodiments, the first gasket 4 may also be annular or planar.

[0039] In some embodiments, the first gasket 4 may be made of silicone, rubber, foam, etc., to provide cushioning. The first gasket 4 may be installed on the side of the second base plate 2 away from the laser head 20 by means of adhesive bonding or other methods.

[0040] In some embodiments, the base plate assembly 10 further includes a second pad 5, which is disposed on the side of the first base plate 1 opposite to the laser head 20 and located outside the through hole. The second pad 5 can prevent the first base plate 1 from damaging the tabletop supporting the laser processing equipment, and also provides a certain cushioning effect.

[0041] The second gasket 5 can be installed on the side of the first base plate 1 away from the laser head 20 by means of adhesive bonding or other methods. In some embodiments, the second gasket 5 can be made of silicone, rubber, foam, etc., to provide a certain degree of cushioning. In some embodiments, there are two second gaskets 5, respectively disposed on both sides of the through hole.

[0042] In some embodiments, such as Figure 4 As shown, the laser processing equipment also includes a protective cover 40, which is movably mounted on the frame 30 to open or close the processing space of the laser processing equipment. The base plate assembly 10 also includes a buffer 6, which is located at the position opposite to the first base plate 1 and the protective cover 40, so that the buffer 6 abuts against the protective cover 40 when the protective cover 40 is in the closed position.

[0043] The protective cover 40 provides a closed processing environment and a safe working environment for external operators, ensuring the safety of the laser processing process. The buffer 6 cushions the impact between the lower edge of the protective cover 40 and the base plate assembly 10, eliminating impact noise. In some embodiments, the protective cover 40 can be raised and lowered relative to the frame 30. In some embodiments, the protective cover 40 can be flipped relative to the frame 30.

[0044] For example, the buffer 6 is disposed opposite to the protective cover 40, such as Figure 2 As shown, when the protective cover 40 descends to contact the base plate assembly 10, the buffer 6 can protect both. The shape of the buffer 6 is consistent with the shape of the surface of the protective cover 40 in contact with the first base plate 1, thus better increasing the airtightness of the processing environment; for example, as... Figure 2 and Figure 4 In the embodiment shown, the protective cover 40 has a U-shaped structure, and the buffer 6 is correspondingly U-shaped.

[0045] In some embodiments, the buffer 6 may be made of materials such as silicone or rubber.

[0046] In some embodiments, the surface of the first base plate 1 opposite to the protective cover 40 is provided with a mounting groove, and the buffer 6 is disposed in the mounting groove. In this way, the mounting groove can limit the buffer 6 to prevent the buffer 6 from shifting.

[0047] In some embodiments, the protective cover 40 has a magnetic suction part, and the base plate assembly 10 further includes a magnetic suction member 7, which is disposed on the first base plate 1 so that the protective cover 40 is magnetically attracted when it is in the closed position, thereby further ensuring the safety of processing.

[0048] like Figure 2As shown, the magnetic suction component 7 can be installed on the first base plate 1 at a position corresponding to the magnetic suction part on the protective cover 40, so that when the protective cover 40 is closed to process the workpiece, the protective cover 40 can be magnetically attracted to avoid gaps caused by the movement of the protective cover 40.

[0049] In some embodiments, the first base plate 1 has mounting holes at at least two apex corners, and at least two magnetic members 7 are provided, with the at least two magnetic members 7 corresponding to the at least two mounting holes. Thus, the structure of the first base plate 1 is relatively compact, while achieving a better magnetic attraction effect on the protective cover.

[0050] Of course, the installation position and number of the magnetic components 7 can be adjusted to ensure the stability of the protective cover 40. In some embodiments, the magnetic component 7 can be a magnet, a magnetite, etc., and the magnetic part can be made of a material that can be attracted by a magnet or a magnetite, such as iron, stainless steel, or a magnet.

[0051] for Figure 2 Regarding the base plate assembly shown, there are two possible relationships between the second base plate 2 and the first base plate 1: one is that the second base plate 2 is installed inside the through hole of the first base plate 1, and the other is that the second base plate 2 is not installed inside the through hole of the first base plate 1. When the second base plate 2 is placed to one side of the first base plate 1, the first plane of the first base plate 1 and the second plane of the second base plate 2 are flush, thereby increasing the placement surface of the base plate assembly. This allows for the placement of larger objects, enriching the application scenarios of laser processing equipment. It also allows accessory products such as expansion accessories and rotating attachments to be placed on this plane for easier use.

[0052] In some embodiments, the second base plate 2 has a plurality of holes arranged in an array. The array of holes can be used to indicate the space for the user to place the equipment, to perform various calibration tasks for the auxiliary laser processing equipment (such as field lens calibration, camera calibration, etc.), and to install some accessories.

[0053] In some embodiments, the first base plate 1 is provided with marking lines. The marking lines can be used to mark the placement position of the workpiece, and / or the placement position of some accessories, and / or for some calibration, etc.

[0054] In summary, this application discloses a laser processing device. By designing the base plate assembly 10 as a detachable combination of a first base plate 1 and a second base plate 2, the device significantly improves its adaptability to diverse processing needs while maintaining its original processing functions. When processing conventional planar objects, the second base plate 2 is installed within the through hole, maintaining the integrity of the processing area. When encountering objects that are large, have special shapes, or require processing from multiple angles, the second base plate 2 can be detached, utilizing the through hole to form an open processing space. In this case, the laser processing device can perform lateral or inverted engraving, rather than being limited to engraving on a tabletop. This enhances the expandability of the laser processing device and broadens the range of processing scenarios.

[0055] The laser processing equipment provided in the embodiments of this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application. Moreover, those skilled in the art can make several improvements and modifications without departing from the principles of this application, and these improvements and modifications are also considered to be within the protection scope of this application.

Claims

1. A laser processing device, characterized in that, include: frame; A laser head is connected to the frame. The laser head includes a laser and a galvanometer assembly. The laser is used to emit a laser beam, and the galvanometer assembly is used to deflect the laser beam. A base plate assembly is connected to the frame and is disposed opposite to the laser head. The processing area of ​​the laser head corresponds to a processing area formed on the base plate assembly. The base plate assembly includes a first base plate and a second base plate. The first base plate has a through hole, which is located in the processing area or the processing area is located in the through hole. The second base plate is detachably installed in the through hole.

2. The laser processing equipment as described in claim 1, characterized in that, The wall of the through hole includes a stepped structure, and the second base plate is mounted on the stepped structure.

3. The laser processing equipment as described in claim 1, characterized in that, The base plate assembly further includes an elastic element disposed between the hole wall of the through hole and the second base plate, so as to fix the second base plate to the first base plate.

4. The laser processing equipment as described in claim 3, characterized in that, The elastic element includes an elastic buckle; and / or, The elastic element is a silicone element; and / or, The elastic element includes a body and a protrusion provided on the body. The body abuts against the hole wall, and the protrusion abuts against the second base plate, so that the second base plate and the elastic element are in an interference fit.

5. The laser processing equipment as described in any one of claims 1 to 4, characterized in that, The base plate assembly further includes a first gasket, which is disposed on the side of the second base plate opposite to the laser head; The number of the first gaskets is at least two, and the at least two gaskets are arranged in parallel and spaced apart.

6. The laser processing equipment according to any one of claims 1 to 4, characterized in that, The base plate assembly further includes a second gasket, which is disposed on the side of the first base plate away from the laser head and located outside the through hole.

7. The laser processing equipment according to any one of claims 1 to 4, characterized in that, The laser processing equipment also includes a protective cover, which is movably mounted on the frame to open or close the processing space of the laser processing equipment. The base plate assembly also includes a buffer member, which is located at the position opposite to the protective cover on the first base plate, so that the protective cover abuts against the protective cover when it is in the closed position.

8. The laser processing equipment as described in any one of claims 1 to 4, characterized in that, The laser processing equipment also includes a protective cover, which is movably mounted on the frame to open or close the processing space of the laser processing equipment. The protective cover has a magnetic suction part, and the base plate assembly also includes a magnetic suction element, which is disposed on the first base plate so that the protective cover is magnetically attracted when it is in the closed position.

9. The laser processing equipment as described in claim 8, characterized in that, The first base plate has mounting holes at at least two apex corners, and the magnetic component is mounted in the mounting holes.

10. The laser processing equipment according to any one of claims 1 to 4, characterized in that, When the second base plate is placed on one side of the first base plate, the first plane of the first base plate and the second plane of the second base plate are flush; and / or, The second base plate has a plurality of holes arranged in an array; and / or, The first base plate has marking lines.

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