An etching device for electrode processing
Patent Information
- Application Number
- CN202521750583.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-18
- Publication Date
- 2026-09-29
- Estimated Expiration
- 2035-08-18
AI Technical Summary
但这两种情况都需要对基材进行刻蚀工作,当基材受到外界环境影响而发生偏移时,会影响到刻蚀的结果,因此,对于激光刻蚀的基材,需要对其进行限位使其固定,本实用新型针对这一技术问题进行解决
[0012](1)本方案通过驱动机构带动传动机构一运转,与传动机构一连接的传动机构二会在传动机构一的带动下运转,使得限位机构一和限位机构二会同时运转,从而可以从多个方向同时对电极材料的基材进行限位,在实现限位的同时节约了限位所需要的时间,提高了工作效率,在对基材限位后,可以通过激光刻蚀模块对基材进行刻蚀工作;
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Figure CN224808685U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of electrode production and processing technology, and specifically relates to an etching device for electrode processing. Background Technology
[0002] During electrode processing, the electrode material typically requires etching. For example, a substrate can be coated with silver nanowires, and then a laser can be used to remove the silver nanowires in the desired areas. However, this process can leave ablation marks on the edges of the etched areas, potentially affecting conductivity and the final product's appearance. Alternatively, a protective layer can be coated onto the substrate surface, and then a groove can be formed by laser etching. A conductive material is then filled into the groove using printing technology. Both of these methods require etching the substrate. If the substrate shifts due to environmental factors, the etching results will be affected. Therefore, laser-etched substrates need to be positioned and fixed. This invention addresses this technical problem. Utility Model Content
[0003] This invention provides an etching apparatus for electrode processing, which can limit the position of the substrate, fix the substrate, and perform laser etching work thereafter, thereby preventing the substrate from shifting and improving the quality of the etching work.
[0004] An etching apparatus for electrode processing includes a base, a support frame connected to the base, a laser etching module connected to the support frame, a first limiting mechanism and a second limiting mechanism connected to the base, a first transmission mechanism connected to the base, and a second transmission mechanism connected to the first transmission mechanism. The first transmission mechanism is connected to the first limiting mechanism, and the second transmission mechanism is connected to the second limiting mechanism. The first transmission mechanism is connected to a drive mechanism. The first limiting mechanism and the second limiting mechanism are used to limit the substrate from different directions.
[0005] Furthermore, the limiting mechanism one includes a slide groove one formed on the base, a slide rod one slidably connected in the slide groove one, and a baffle connected to the top end of the slide rod one. The bottom end of the slide rod one is connected to the transmission mechanism one, and the baffle is connected to the limiting mechanism two.
[0006] Furthermore, the limiting mechanism two includes a slide groove two formed on the base, a slide rod two slidably connected in the slide groove two, and a limiting component connected to the top end of the slide rod two. The bottom end of the slide rod two is connected to the transmission mechanism two, and the limiting component is connected to the baffle.
[0007] Furthermore, the limiting component includes a stop cylinder connected to the slide rod II and a connecting plate slidably connected inside the stop cylinder, the connecting plate being connected to the stop cylinder.
[0008] Furthermore, the transmission mechanism one includes a movable block one connected to the slide rod one, a threaded groove one formed inside the movable block one, a bidirectional lead screw connected to the threaded groove one, and a bevel gear one connected to the middle of the bidirectional lead screw. The bevel gear one is connected to the transmission mechanism two, and the bidirectional lead screw is connected to the drive mechanism.
[0009] Furthermore, the transmission mechanism two includes a movable block two connected to the slide rod two, a threaded groove two opened inside the movable block two, a screw connected to the threaded groove two, and a bevel gear two connected to the end of the screw, wherein the bevel gear two meshes with the bevel gear one.
[0010] Furthermore, a guide rail is connected to the side of the baffle, and a connecting groove is provided on the side of the connecting plate, the connecting groove being connected to the guide rail.
[0011] The technical effects of this utility model are as follows:
[0012] (1) This solution drives the transmission mechanism 1 to operate through the drive mechanism. The transmission mechanism 2 connected to the transmission mechanism 1 will operate under the drive of the transmission mechanism 1, so that the limiting mechanism 1 and the limiting mechanism 2 will operate simultaneously. Thus, the electrode material substrate can be limited from multiple directions at the same time. While achieving the limiting, the time required for limiting is saved and the work efficiency is improved. After the substrate is limited, the substrate can be etched by the laser etching module.
[0013] (2) When the drive mechanism in this solution drives the bidirectional screw to rotate, it will cause the limiting component one to move. Moreover, the bevel gear one connected to the bidirectional screw will drive the bevel gear two to rotate, thereby driving the screw to rotate, and then driving the limiting component two to move, so that the substrate can be limited from multiple directions at the same time.
[0014] (3) Since the baffle and the limiting component will gradually move from the outside to the inside during the limiting process to limit the substrate, the limiting component in this solution is a telescopic structure. When the limiting component moves inward, the connecting plate will gradually move into the baffle cylinder to shorten its own length, so that it can cooperate with the baffle to realize the limiting function. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the structure of this utility model.
[0016] Figure 2 This is a schematic diagram of the transmission mechanism one and transmission mechanism two in this utility model.
[0017] Figure 3 This is a schematic diagram of the limiting component in this utility model.
[0018] The attached diagram is labeled as follows: 1. Base; 2. Baffle; 3. Connecting plate; 4. Baffle cylinder; 5. Guide rail; 6. Slide groove two; 7. Slide groove one; 8. Laser etching module; 9. Support frame; 10. Connecting groove; 11. Drive motor; 12. Screw; 13. Moving block two; 14. Slide rod two; 15. Bevel gear two; 16. Bevel gear one; 17. Moving block one; 18. Slide rod one; 19. Bidirectional lead screw. Detailed Implementation
[0019] The technical solution of this utility model will now be clearly and completely described in conjunction with specific embodiments and accompanying drawings.
[0020] See Figures 1-3 An etching apparatus for electrode processing includes a base 1, a support frame 9 connected to the base 1, a laser etching module 8 connected to the support frame 9, a limiting mechanism one and a limiting mechanism two connected to the base 1, a transmission mechanism one connected within the base 1, and a transmission mechanism two connected to the transmission mechanism one. The transmission mechanism one is connected to the limiting mechanism one, and the transmission mechanism two is connected to the limiting mechanism two. The transmission mechanism one is connected to a drive mechanism. The limiting mechanism one and the limiting mechanism two are used to limit the substrate from different directions. The laser etching module 8 is used to perform laser etching, which is common knowledge in the art, and its structure and principle will not be described in detail here.
[0021] Furthermore, the limiting mechanism includes a groove 7 formed on the base 1, a slide rod 18 slidably connected in the groove 7, and a baffle 2 connected to the top end of the slide rod 18. The bottom end of the slide rod 18 is connected to the transmission mechanism 1, and the baffle 2 is connected to the limiting mechanism 2.
[0022] Furthermore, the second limiting mechanism includes a second sliding groove 6 formed on the base 1, a second sliding rod 14 slidably connected in the second sliding groove 6, and a limiting component connected to the top end of the second sliding rod 14. The bottom end of the second sliding rod 14 is connected to the second transmission mechanism, and the limiting component is connected to the baffle 2. In this embodiment, two sets of limiting mechanisms are respectively provided for the first limiting mechanism and the second limiting mechanism.
[0023] Furthermore, the limiting component includes a stop cylinder 4 connected to the slide rod 14 and a connecting plate 3 slidably connected inside the stop cylinder 4, the connecting plate 3 being connected to the stop plate 2. In this embodiment, the stop cylinder 4 is a square cylinder.
[0024] Furthermore, the transmission mechanism one includes a movable block one 17 connected to the slide rod one 18, a threaded groove one formed inside the movable block one 17, a bidirectional lead screw one 19 connected to the threaded groove one, and a bevel gear one 16 connected to the middle of the bidirectional lead screw one 19. The bevel gear one 16 is connected to the transmission mechanism two, and the bidirectional lead screw one 19 is connected to the drive mechanism. In this embodiment, the drive mechanism is a drive motor 11. The bidirectional lead screw one 19 passes through the middle of the bevel gear one 16.
[0025] Furthermore, the transmission mechanism two includes a movable block two 13 connected to the slide rod two 14, a threaded groove two opened inside the movable block two 13, a screw 12 connected to the threaded groove two, and a bevel gear two 15 connected to the end of the screw 12, the bevel gear two 15 meshing with the bevel gear one 16. In this embodiment, the ends of the bidirectional lead screw 19 and the screw 12 can be rotatably connected to the inner wall of the base 1. In this embodiment, the transmission mechanism two is provided in two sets.
[0026] Furthermore, a guide rail 5 is connected to the side of the baffle 2, and a connecting groove 10 is provided on the side of the connecting plate 3, which is connected to the guide rail 5. In this embodiment, the height of the guide rail 5 is close to the top of the baffle 2, so that the part of the baffle 2 located below the guide rail 5 plays a limiting role on the substrate, thereby preventing the guide rail 5 from directly abutting against the side of the substrate.
[0027] The working process of this utility model is as follows:
[0028] First, the substrate is placed on the base 1. Then, the drive motor 11 is started, which drives the bidirectional lead screw 19 to rotate. The slide rod 18 connected to the bidirectional lead screw 19 moves in the slide groove 7, thereby driving the baffle 2 to move towards the center of the base 1, i.e., inward. At this time, the bevel gear 16 connected to the bidirectional lead screw 19 drives the bevel gear 15 to rotate. The screw 12 connected to the bevel gear 15 also rotates, causing the slide rod 14 to move in the slide groove 6, driving the baffle 4 to move towards the center of the base 1. The connecting plate 3 connected to the baffle 4 gradually moves into the baffle 4 during the movement, achieving a telescopic effect. Finally, the baffle 2 and the baffle 4 abut against the sides of the substrate in different directions, thereby achieving the function of limiting the substrate. Then, the substrate is subjected to laser etching.
[0029] When it is necessary to remove the substrate, the drive motor 11 can be controlled to rotate in the opposite direction, causing the baffle 2 and the baffle cylinder 4 to move outward, so that the baffle 2 and the baffle cylinder 4 are separated from the substrate, thereby allowing the substrate to be removed.
[0030] The technical features not described in detail in this solution are based on the conventional operation and general understanding of those skilled in the art and are derived from existing technologies, and will not be elaborated further here.
[0031] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.
Claims
1. An etching apparatus for electrode processing, characterized in that, It includes a base (1), a support frame (9) connected to the base (1), a laser etching module (8) connected to the support frame (9), a limiting mechanism 1 and a limiting mechanism 2 connected to the base (1), a transmission mechanism 1 connected to the base (1), and a transmission mechanism 2 connected to the transmission mechanism 1. The transmission mechanism 1 is connected to the limiting mechanism 1, and the transmission mechanism 2 is connected to the limiting mechanism 2. The transmission mechanism 1 is connected to a driving mechanism. The limiting mechanism 1 and the limiting mechanism 2 are used to limit the substrate from different directions.
2. The etching apparatus for electrode processing according to claim 1, characterized in that, The limiting mechanism includes a slide groove (7) opened on the base (1), a slide rod (18) slidably connected in the slide groove (7), and a baffle (2) connected to the top end of the slide rod (18). The bottom end of the slide rod (18) is connected to the transmission mechanism, and the baffle (2) is connected to the limiting mechanism.
3. The etching apparatus for electrode processing according to claim 2, characterized in that, The limiting mechanism 2 includes a slide groove 2 (6) opened on the base (1), a slide rod 2 (14) slidably connected in the slide groove 2 (6), and a limiting component connected to the top end of the slide rod 2 (14). The bottom end of the slide rod 2 (14) is connected to the transmission mechanism 2, and the limiting component is connected to the baffle (2).
4. The etching apparatus for electrode processing according to claim 3, characterized in that, The limiting component includes a baffle (4) connected to the slide bar (14) and a connecting plate (3) slidably connected inside the baffle (4), wherein the connecting plate (3) is connected to the baffle (2).
5. The etching apparatus for electrode processing according to claim 3, characterized in that, The first transmission mechanism includes a first movable block (17) connected to the first slide rod (18), a first threaded groove opened inside the first movable block (17), a double-acting lead screw (19) connected to the first threaded groove, and a first bevel gear (16) connected to the middle of the first double-acting lead screw (19). The first bevel gear (16) is connected to the second transmission mechanism, and the second double-acting lead screw (19) is connected to the drive mechanism.
6. The etching apparatus for electrode processing according to claim 5, characterized in that, The transmission mechanism 2 includes a movable block 2 (13) connected to the slide bar 2 (14), a threaded groove 2 opened inside the movable block 2 (13), a screw 2 (12) connected to the threaded groove 2, and a bevel gear 2 (15) connected to the end of the screw 2 (12). The bevel gear 2 (15) meshes with the bevel gear 1 (16).
7. The etching apparatus for electrode processing according to claim 4, characterized in that, The side of the baffle (2) is connected to the guide rail (5), and the side of the connecting plate (3) is provided with a connecting groove (10), which is connected to the guide rail (5).