Laser device and laser processing apparatus

Abstract

The application provides a laser device and a laser processing equipment. A laser of the laser device is used for emitting a laser beam. A heat dissipation assembly is arranged on one side of the laser along a first direction and connected with the laser. The heat dissipation assembly is used for forming a heat dissipation channel extending along a second direction. The second direction is perpendicular to the first direction. A galvanometer assembly is arranged on the other side of the laser along the first direction. The galvanometer assembly is used for adjusting the emission direction of the laser beam. Therefore, the laser device has better heat dissipation performance.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, specifically to a laser device and laser processing equipment. Background Technology

[0002] Laser processing equipment is a device that uses a laser beam to carve, cut, or weld on the surface of materials, and is characterized by high precision and high speed.

[0003] When the laser power of a laser processing equipment is high, a heat dissipation module is required. However, the airflow resistance of the heat dissipation module in current laser processing equipment is relatively high, and its heat dissipation capacity is insufficient to meet the requirements of high-power lasers. Therefore, the heat dissipation performance of such laser processing equipment needs improvement. Utility Model Content

[0004] The purpose of this application is to provide a laser device and laser processing equipment with better heat dissipation performance.

[0005] To address the aforementioned problems, in a first aspect, this application provides a laser device, comprising: A laser, used to emit a laser beam; A heat dissipation assembly is disposed on one side of the laser along a first direction and connected to the laser; the heat dissipation assembly is used to form a heat dissipation channel extending along a second direction, the second direction being perpendicular to the first direction; and A galvanometer assembly is disposed on the other side of the laser along the first direction, and the galvanometer assembly is used to adjust the emission direction of the laser beam.

[0006] Optionally, the laser device further includes: The housing assembly has an air inlet and an air outlet; The laser, the heat dissipation assembly, and the galvanometer assembly are disposed inside the housing assembly. Along the second direction, the air inlet and the air outlet are located at opposite ends of the heat dissipation assembly, and the air inlet and the air outlet are correspondingly disposed to the ends of the heat dissipation assembly.

[0007] Optionally, the heat dissipation component includes: A cooling fan is provided corresponding to the air inlet; and A heat dissipation structure is disposed along the second direction on the side of the cooling fan away from the air inlet, with one end of the heat dissipation structure corresponding to the cooling fan and the other end of the heat dissipation structure corresponding to the air outlet; The cooling fan is used to guide the cooling airflow into the interior of the housing assembly, and at least a portion of the cooling airflow flows through the cooling structure and is discharged from the air outlet.

[0008] Optionally, along the second direction, a first opening and a second opening are respectively provided at opposite ends of the heat dissipation structure, and a plurality of airflow channels communicating with the first opening and the second opening are opened inside the heat dissipation structure. The first opening is corresponding to the cooling fan, and the second opening is corresponding to the air outlet. And / or, the heat dissipation structure includes at least one of a metal plate heat dissipation structure, a heat pipe heat dissipation structure, and a vapor chamber heat dissipation structure.

[0009] Optionally, the laser device further includes: A motherboard assembly, arranged along the first direction with the cooling fan, wherein the motherboard assembly is electrically connected to at least one of the laser, the galvanometer assembly, and the cooling fan; and A first connector is disposed along the second direction on the side of the motherboard assembly away from the air inlet. The first connector is connected to the motherboard assembly and the cooling fan respectively. The first connector is provided with a ventilation hole, which is located between the cooling fan and the heat dissipation structure.

[0010] Optionally, the laser device further includes: An installation component is disposed on one side of the housing component along the second direction, and the installation component is provided with an air guide groove; The housing assembly includes a base plate, on which the air outlet is provided. The air outlet is disposed opposite to and connected to the air guide groove.

[0011] Optionally, the laser device includes: At least two lasers, the at least two lasers being arranged along the second direction, each laser being bonded to the heat dissipation assembly; and A beam combining assembly is used to guide the laser beam emitted by each of the lasers to the same optical path and couple it to the galvanometer assembly.

[0012] Optionally, along a third direction, the light-combining component is disposed on one side of the galvanometer component, and the third direction, the first direction, and the second direction are perpendicular to each other.

[0013] Optionally, the laser device further includes: The second connector includes a first connecting portion and a second connecting portion that are bent together. The first connecting portion is fixedly connected to the heat dissipation assembly, and the second connecting portion is fixedly connected to the light combining assembly. The first connecting portion and the second connecting portion form a clearance area, and at least a portion of the galvanometer assembly is located within the clearance area.

[0014] Secondly, this application also provides a laser processing device, including a frame, a worktable, an outer casing assembly, and a laser device as described above; The laser device is slidably connected to the frame and is provided with an exhaust vent. The worktable is fixedly connected to the frame and is arranged opposite to the laser device. When the laser device slides along the frame, the distance between the laser device and the worktable changes. The worktable is used to place the workpiece to be processed, and the laser beam emitted by the laser device is used to transmit to the workpiece to be processed on the worktable. The outer cover assembly is slidably connected to the frame. When the outer cover assembly abuts against the worktable, the frame, the worktable, the outer cover assembly, and the laser device enclose a working space. The cooling airflow introduced by the laser device passes through the workspace and is discharged from the exhaust port.

[0015] Based on the above technical solution, the heat dissipation component of the laser device of this application is disposed on one side of the laser along the first direction and connected to the laser, and the heat dissipation component forms a heat dissipation channel along the second direction; the galvanometer assembly is disposed on the other side of the laser along the first direction, and the galvanometer assembly, the laser and the heat dissipation component are arranged along the first direction. The galvanometer assembly and the laser do not block the heat dissipation component and the heat dissipation channel in the second direction. Therefore, the heat conducted from the laser to the heat dissipation component can be smoothly discharged to the outside of the laser device along the heat dissipation channel extending in the second direction. The heat encounters less resistance when it is discharged to the outside of the laser device along the heat dissipation channel, the heat dissipation is smoother and the heat dissipation efficiency is higher. The heat dissipation performance of the heat dissipation component of this application is better. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. Those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0017] Figure 1 A schematic diagram of the structure of a laser device provided in an embodiment of this application; Figure 2 for Figure 1 The diagram shows the exploded structure of the laser device. Figure 3 for Figure 1 A schematic cross-sectional view of the laser device shown. Figure 4 This is a connection diagram of a portion of the structure of the laser device according to an embodiment of this application; Figure 5This is a schematic diagram of the structure of a laser processing device provided in an embodiment of this application; Figure 6 for Figure 5 The diagram shows the structure of the laser processing equipment in another state.

[0018] The reference numerals in the attached figures are as follows: 10. Laser processing equipment; 100. Laser device; 200. Frame; 300. Outer casing assembly; 400. Worktable; 110. Laser; 120. Heat dissipation assembly; 130. Galvanometer assembly; 140. Beam combining assembly; 150. Housing assembly; 160. Mainboard assembly; 170. Mounting assembly; 180. First connector; 190. Second connector; 111. First laser; 112. Second laser; 121. Cooling fan; 122. Heat dissipation structure; 123. Heat dissipation channel; 151. Outer casing; 152. Base plate; 153. Air inlet; 154. Air outlet; 171. Air guide duct; S1. Air cooling path; H1. First direction; H2. Second direction; H3. Third direction. Detailed Implementation

[0019] The following will refer to the appendices in this application. Figure 1 To be continued Figure 6 The technical solutions in this application are clearly and completely described in conjunction with the embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0020] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0021] Please refer to Figures 1 to 3 , Figure 1 This is a schematic diagram of a laser device 100 provided in an embodiment of this application. Figure 2 for Figure 1 The diagram shows the exploded structure of the laser device 100. Figure 3 for Figure 1The diagram shows a cross-sectional view of a laser device 100. The laser device 100 includes a laser 110, a heat dissipation assembly 120, and a galvanometer assembly 130. The laser 110 emits a laser beam. The heat dissipation assembly 120 is disposed on one side of the laser 110 along a first direction H1 and is connected to the laser 110. The heat dissipation assembly 120 forms a heat dissipation channel 123 extending along a second direction H2, which is perpendicular to the first direction H1. The galvanometer assembly 130 is disposed on the other side of the laser 110 along the first direction H1 and is used to adjust the emission direction of the laser beam.

[0022] It is understood that laser 110 can emit a laser beam of a preset wavelength. Laser 110 may include, but is not limited to, structures such as a pump source, a gain medium, and an optical resonant cavity. The pump source is the energy source of laser 110, providing energy to the gain medium, causing particles in the medium to transition from low energy levels to high energy levels, achieving population inversion. The gain medium is fundamental to laser generation, determining the laser's wavelength, power, and other characteristics. The optical resonant cavity mainly consists of two or more mirrors, used to provide optical feedback, causing light to reflect back and forth within the cavity, continuously amplifying the number of photons generated by stimulated emission, thereby forming a strong laser output. Laser 110 may include, but is not limited to, solid-state lasers, gas lasers, semiconductor lasers, fiber lasers, etc.

[0023] It is understood that the galvanometer assembly 130 is disposed along the first direction H1 on the side of the laser 110 opposite to the heat dissipation assembly 120. The galvanometer assembly 130 is optically coupled to the laser 110 and can receive the laser beam emitted by the laser 110. The galvanometer assembly 130 is an optical device for precisely controlling the direction of the laser beam. The galvanometer assembly 130 includes a reflecting mirror, a rotating shaft structure, a motor, and other structures. The rotating shaft structure is connected to the reflecting mirror and can drive the reflecting mirror to rotate, thereby controlling the reflection direction of the laser beam. The motor is connected to the rotating shaft structure and drives the rotating shaft structure to rotate. Of course, the galvanometer assembly 130 may also include an aperture that defines the spot size of the laser beam, an attenuator that adjusts the power density of the laser beam, a feedback device for detecting the actual deflection angle of the reflecting mirror, and a drive controller that enables the galvanometer assembly 130 to interact with a host computer system. The specific structure of the galvanometer assembly 130 is not limited in the embodiments of this application.

[0024] It is understood that the heat dissipation component 120 can be thermally connected to the laser 110 and used to transfer the heat generated by the laser 110 during operation to the outside of the laser device 100, thereby achieving heat dissipation of the laser 110. The heat dissipation component 120 can be in close contact with the laser 110; for example, the side of the heat dissipation component 120 near the laser 110 is in close contact with the side of the laser 110 near the heat dissipation component 120. The heat dissipation component 120 can include, but is not limited to, one or more of the following: air-cooled heat dissipation structure, water-cooled heat dissipation structure, semiconductor cooling heat dissipation structure, microchannel heat dissipation structure, phase change heat dissipation structure, and heat pipe heat dissipation structure.

[0025] It is understandable that, such as Figure 3 As shown, the heat dissipation component 120 forms a heat dissipation channel 123 extending along the second direction H2, through which the heat generated by the laser 110 can be discharged to the outside of the laser device 100. Specifically, in the first direction H1, the galvanometer assembly 130, the laser 110, and the heat dissipation component 120 are arranged sequentially, with the heat dissipation component 120 positioned on the side of the laser 110 away from the galvanometer assembly 130. Along the second direction H2, the laser 110 and the galvanometer assembly 130 do not obstruct the heat dissipation channel 123, resulting in less resistance when heat is discharged to the outside of the laser device 100 along the heat dissipation channel 123, leading to smoother heat dissipation and higher heat dissipation efficiency.

[0026] In this embodiment of the laser device 100, a heat dissipation assembly 120 is disposed along a first direction H1 on one side of the laser 110 and is thermally connected to the laser 110. The heat dissipation assembly 120 forms a heat dissipation channel 123 along a second direction H2. A galvanometer assembly 130 is disposed along the first direction H1 on the side of the laser 110 away from the heat dissipation assembly 120. The galvanometer assembly 130, the laser 110, and the heat dissipation assembly 120 are arranged along the first direction H1. The galvanometer assembly 130 and the laser 110 do not obstruct the heat dissipation assembly 120 and the heat dissipation channel 123 in the second direction H2. Therefore, the heat conducted from the laser 110 to the heat dissipation assembly 120 can be smoothly discharged to the outside of the laser device 100 along the heat dissipation channel 123 extending in the second direction H2. The resistance encountered by the heat when dissipating to the outside of the laser device 100 along the heat dissipation channel 123 is small, resulting in smoother heat dissipation and higher heat dissipation efficiency. Therefore, the laser device 100 of this embodiment has good heat dissipation performance.

[0027] Please refer to this again. Figures 1 to 3In one possible embodiment of this application, the laser device 100 further includes a housing assembly 150. The housing assembly 150 is used to house the laser 110, the heat dissipation assembly 120, and the galvanometer assembly 130, which are disposed inside the housing assembly 150. The housing assembly 150 has an air inlet 153 and an air outlet 154. Along the second direction H2, the air inlet 153 and the air outlet 154 are located at opposite ends of the heat dissipation assembly 120, and are correspondingly disposed to the ends of the heat dissipation assembly 120. At least a portion of the projections of the air inlet 153, the air outlet 154, and the heat dissipation assembly 120 along the second direction H2 overlaps. The air inlet 153 and the air outlet 154 are respectively connected to the heat dissipation channel 123 of the heat dissipation assembly 120, thereby further reducing wind resistance and improving heat dissipation efficiency.

[0028] Please combine Figure 2 Please refer to Figure 4 , Figure 4 This is a schematic diagram showing the connection of a portion of the structure of the laser device 100 according to an embodiment of this application. The housing assembly 150 includes a housing 151 and a base plate 152. The housing 151 forms the housing structure of the laser device 100, and the base plate 152 supports structures such as the laser 110, the heat dissipation assembly 120, and the galvanometer assembly 130. The laser 110, the heat dissipation assembly 120, and the galvanometer assembly 130 can be fixed to the base plate 152 by means of, but not limited to, threaded connection, snap-fit, bonding, welding, etc. The housing 151 can be connected to the base plate 152 by means of, but not limited to, threaded connection, snap-fit, bonding, welding, etc. The base plate 152 and the housing 151 form an accommodating space for accommodating structures such as the laser 110, the heat dissipation assembly 120, and the galvanometer assembly 130. A through hole or a hollow structure can be provided on one surface (e.g., the top surface) of the housing 151 corresponding to the area of ​​the heat dissipation assembly 120 to form an air inlet 153. Correspondingly, the area of ​​the base plate 152 corresponding to the heat dissipation component 120 may also be provided with through holes or hollow structures to form an air outlet 154.

[0029] Understandably, the cooling airflow can enter the housing assembly 150 from the air inlet 153, flow along the cooling channel 123, and exit from the air outlet 154. During the flow, the cooling airflow can carry the heat generated by the laser 110 out of the air outlet 154 to achieve heat dissipation of the laser 110.

[0030] In this embodiment of the laser device 100, the laser 110, the heat dissipation assembly 120, and the galvanometer assembly 130 are all disposed inside the housing assembly 150. The housing assembly 150 can protect the laser 110 and other structures, thereby improving the service life of the laser device 100. Meanwhile, the air inlet 153 and the air outlet 154 are disposed at opposite ends of the heat dissipation assembly 120. The air inlet 153, the heat dissipation assembly 120, and the air outlet 154 can form a heat dissipation path S1 that is sequentially connected along the second direction H2. The heat dissipation path S1 extends basically along the second direction H2. The heat dissipation path S1 has low wind resistance, smoother heat dissipation, and higher heat dissipation efficiency.

[0031] It should be noted that the air inlet 153 and air outlet 154 in this application embodiment can also be formed in other ways, such as, but not limited to, the air outlet 154 can be disposed on the mounting component 170 connecting the laser device 100 and the external structure. This application embodiment does not limit this.

[0032] Please continue to refer to the following: Figures 1 to 4 In some examples, the heat dissipation assembly 120 includes a cooling fan 121 and a heat dissipation structure 122. The cooling fan 121 is correspondingly disposed and connected to the air inlet 153. The heat dissipation structure 122 is disposed along the second direction H2 on the side of the cooling fan 121 opposite to the air inlet 153. One end of the heat dissipation structure 122 is correspondingly disposed and connected to the cooling fan 121, and the other end of the heat dissipation structure 122 is correspondingly disposed and connected to the air outlet 154. The cooling fan 121 is used to guide the cooling airflow into the interior of the housing assembly 150, and at least a portion of the cooling airflow flows through the heat dissipation structure 122 and is discharged from the air outlet 154.

[0033] It is understood that the cooling fan 121 is positioned above the heat dissipation structure 122 along the second direction H2, and the cooling fan 121 may be, but is not limited to, an axial fan. The heat dissipation structure 122 is positioned below the cooling fan 121 along the second direction H2. The laser 110 can be attached to the side of the heat dissipation structure 122 to conduct heat to the heat dissipation structure 122. The cooling fan 121 allows the cooling airflow outside the housing assembly 150 to enter the housing assembly 150 through the air inlet 153. Since the galvanometer assembly 130, the motherboard assembly 160 (and the beam combining assembly 140 described later) are all located inside the housing assembly 150, at least part of the cooling airflow will also pass through the galvanometer assembly 130, the motherboard assembly 160, and the beam combining assembly 140 for heat dissipation. Furthermore, the cooling fan 121 is correspondingly arranged with the heat dissipation structure 122, thus guiding most of the cooling airflow to the heat dissipation structure 122. Since the laser 110 is closely connected to the heat dissipation structure 122, the heat dissipation structure 122 can conduct the heat generated by the laser 110 to the heat dissipation channel 123 and be discharged from the laser device 100 from the air outlet 154 along with the cooling airflow generated by the cooling fan 121. The cooling airflow flows along the air inlet 153, the cooling fan 121, the heat dissipation structure 122 and the air outlet 154, forming a cooling path S1. The laser device 100 of this embodiment can achieve heat dissipation through this cooling path S1.

[0034] In the laser device 100 of this application embodiment, the heat dissipation airflow flows along the air-cooling path S1 to achieve heat dissipation. Since the laser 110 and the galvanometer assembly 130 are not arranged above or below the cooling fan 121 and the heat dissipation structure 122 along the second direction H2, the air-cooling path S1 is not easily disturbed, the heat dissipation airflow is smooth, the wind resistance is small, and the heat dissipation efficiency is higher. Thus, the laser device 100 can meet the heat dissipation requirements of the high-power laser 110 in a limited space.

[0035] It should be noted that the heat dissipation component 120 in this application embodiment is not limited to including a cooling fan 121 and a heat dissipation structure 122. For example, but not limited to, the heat dissipation component 120 may include a cooling fan 121 or a heat dissipation structure 122, or the heat dissipation component 120 may include a liquid cooling structure, a heat pipe cooling structure, a phase change cooling structure, etc. The specific structure of the heat dissipation component 120 is not limited in this application embodiment.

[0036] In some possible examples of this application, the heat dissipation structure 122 has a first opening and a second opening at opposite ends. The heat dissipation structure 122 has multiple airflow channels communicating with the first and second openings. The first opening corresponds to the cooling fan 121, and the second opening corresponds to the air outlet 154. The cooling fan 121, the first opening, the multiple airflow channels, and the second opening together form a heat dissipation channel 123. In this embodiment, the first and second openings are respectively connected to multiple airflow channels, resulting in a larger contact area between the multiple airflow channels and heat, thus improving the heat dissipation efficiency of the heat dissipation channel 123.

[0037] In some possible examples of this application, the heat dissipation structure 122 may include multiple heat sinks, which are spaced apart and an airflow channel communicating with the first opening and the second opening can be formed between adjacent heat sinks. The multiple heat sinks can form multiple airflow channels extending along the second direction H2. The multiple heat sinks of the heat dissipation structure 122 in this embodiment can increase the contact area between the heat dissipation structure 122 and the airflow, thereby improving heat dissipation efficiency. The structure of the heat sinks may be, but is not limited to, a vertical structure, a finned structure, a pin structure, etc.

[0038] In some possible examples of this application, the heat dissipation structure 122 includes at least one of a metal plate heat dissipation structure, a heat pipe heat dissipation structure, and a vapor chamber heat dissipation structure. The metal plate heat dissipation structure transfers the heat generated by the laser 110 to the outside of the laser device 100 through the heat dissipation channel 123 via heat conduction. The heat pipe heat dissipation structure includes a sealed heat pipe structure with a liquid wick and a working fluid (such as water, alcohol, etc.) inside. One end of the heat pipe is in contact with the heat source, such as the laser 110, and the other end is in contact with the heat dissipation medium, such as airflow. When the heat source generates heat, the working fluid inside the heat pipe absorbs heat and evaporates at the heat source end. The vapor condenses into liquid at the other end, releasing heat. The liquid flows back to the heat source end through capillary action or gravity, forming a closed loop and achieving heat dissipation. The heat dissipation structure of the vapor chamber includes a sealed shell, a liquid wick, and a working fluid. The sealed shell can transfer heat from the laser 110 to the internal working fluid. The working fluid circulates inside the vapor chamber and achieves heat transfer through phase change (evaporation and condensation). The liquid wick can promote the return flow of the working fluid through capillary action.

[0039] It should be noted that the metal plate heat dissipation structure, heat pipe heat dissipation structure, or vapor chamber heat dissipation structure may include multiple heat sinks to increase the heat dissipation area. The heat dissipation structure 122 may include one, two, or three of the metal plate heat dissipation structure, heat pipe heat dissipation structure, and vapor chamber heat dissipation structure. The embodiments of this application do not limit the heat dissipation structure 122.

[0040] Please refer to this again. Figures 1 to 4In some possible examples of this application, the laser device 100 may further include a motherboard assembly 160. The motherboard assembly 160 and the base plate 152 may be respectively disposed on both sides of the galvanometer assembly 130, the laser 110, and the heat dissipation structure 122 along a second direction H2. The base plate 152 is disposed along the second direction H2 on the side of the galvanometer assembly 130, the laser 110, and the heat dissipation structure 122 opposite to the motherboard assembly 160. For example, the motherboard assembly 160 is disposed on the upper side of the galvanometer assembly 130, the laser 110, and the heat dissipation structure 122, and the base plate 152 is disposed on the lower side of the galvanometer assembly 130, the laser 110, and the heat dissipation structure 122. The motherboard assembly 160 and the cooling fan 121 are arranged along a first direction H1, and in the first direction H1, the motherboard assembly 160 is disposed on the side of the cooling fan 121 closer to the galvanometer assembly 130. The motherboard assembly 160 is electrically connected to at least one of the laser 110, the galvanometer assembly 130, the cooling fan 121 (and the light combining assembly 140 described below), and the motherboard assembly 160 can control at least one of the laser 110, the galvanometer assembly 130, the cooling fan 121 (and the light combining assembly 140).

[0041] In this embodiment, the motherboard assembly 160 and the base plate 152 are respectively disposed on both sides of the galvanometer assembly 130, the laser 110, and the heat dissipation structure 122 along the second direction H2. The motherboard assembly 160 and the base plate 152 make reasonable use of the space of the laser device 100 in the second direction H2. At the same time, the motherboard assembly 160 is disposed on the side of the cooling fan 121 near the galvanometer assembly 130 along the first direction H1. The motherboard assembly 160 makes reasonable use of the space of the laser device 100 in the first direction H1. Thus, the layout of multiple components of the laser device 100 in this application is more reasonable and more conducive to the miniaturization design of the laser device 100.

[0042] In some possible examples of this application, the laser device 100 is further provided with a first connecting seat 180. The first connecting seat 180 is disposed along the second direction H2 on the side of the motherboard assembly 160 away from the air inlet 153. The first connecting seat 180 is connected to the motherboard assembly 160 and the cooling fan 121 respectively. Specifically, the first connecting seat 180 includes a carrier plate and a side plate connected together. The side plate can be fixedly connected to the cooling fan 121 by means of threaded connection, snap-fit, bonding, welding, etc. The carrier plate carries the motherboard assembly 160. The carrier plate can be fixedly connected to the motherboard assembly 160 by means of threaded connection, snap-fit, bonding, welding, etc. Thus, the first connecting seat 180 can connect the motherboard assembly 160 and the cooling fan 121 into a whole. The connection between the motherboard assembly 160 and the cooling fan 121 is more stable. Furthermore, since the cooling fan 121 is disposed near the motherboard assembly 160, when the cooling fan 121 introduces external cooling airflow, at least a portion of the airflow will pass through the motherboard assembly 160, thereby achieving heat dissipation for the motherboard assembly 160.

[0043] In some possible examples of this application, the first connecting seat 180 is provided with a ventilation hole, which can be provided on the side plate. The ventilation hole is located between the cooling fan 121 and the heat dissipation structure 122. The ventilation hole is connected to the cooling fan 121 and the heat dissipation structure 122 respectively, so that the cooling fan 121 can bring the introduced cooling airflow into the heat dissipation structure 122 through the ventilation hole.

[0044] Please refer to this again. Figures 1 to 4 The laser device 100 may further include a mounting assembly 170, which is disposed along the second direction H2 on the side of the base plate 152 opposite to the laser 110. The housing 151 is connected to the base plate 152. The galvanometer assembly 130, the laser 110, the heat dissipation assembly 120, and other devices are all disposed in the internal space formed by the housing 151 and the base plate 152. Therefore, the mounting assembly 170 is connected to the laser device 100 by connecting to the base plate 152. The mounting assembly 170 may also be slidably connected to the frame 200 of the laser processing equipment 10 described later. Since the mounting assembly 170 can slide on the frame 200, the laser device 100 can slide on the frame 200.

[0045] It is understood that the area of ​​the mounting component 170 corresponding to the heat dissipation channel 123 may be provided with an air guide 171. The air guide 171 is arranged opposite to and connected to the air outlet 154, and the heat dissipation airflow can be discharged to the outside of the laser device 100 along the air inlet 153, the cooling fan 121, the heat dissipation structure 122, the air outlet 154, and the air guide 171. Among them, the air guide 171 may be an inclined groove structure inclined towards the outside of the laser device 100, and the air guide 171 can better lead the heat dissipation airflow to the outside of the laser device 100.

[0046] Please refer to this again. Figures 1 to 4 In some possible examples of this application, the laser device 100 further includes at least two lasers 110. In some possible examples of this application, the laser device 100 also includes a beam combining assembly 140. The beam combining assembly 140 is optically coupled to the galvanometer assembly 130 and each laser 110, respectively, and is used to guide the laser beam emitted by each laser 110 to the same optical path and couple it to the galvanometer assembly 130.

[0047] It is understandable that the wavelength of the laser beam emitted by laser 110 is closely related to the material being processed; different wavelengths are suitable for processing different materials. For example, a 10.6-micron wavelength laser 110 (a carbon dioxide laser) can process non-metallic materials (such as wood, acrylic, leather, paper, cloth, plastic, rubber, etc.) and some metallic materials (such as coated metals, anodized aluminum, etc.). A 1.06-micron wavelength laser 110 (a fiber laser) can process metallic materials (such as stainless steel, aluminum, brass, titanium, gold, silver, etc.) and some non-metallic materials (such as plastics, ceramics, stone, etc.). A 355-nanometer (nm) wavelength laser 110 (an ultraviolet laser) can process thermosensitive materials (such as glass, ceramics, etc.), semiconductor materials, crystals, etc. A 450-nm wavelength laser 110 (a blue laser) is suitable for processing a variety of materials (such as wood, leather, plastics, stone, metals, etc.). The 1064nm wavelength laser 110 (outer infrared laser) can perform laser processing on materials such as metals (e.g., aluminum and its alloys, copper and its alloys, stainless steel, etc.), plastics, wood, leather, and ceramics.

[0048] It is understood that in some possible examples of this application, the laser beams emitted by the multiple lasers 110 have different wavelengths. For example, the laser device 100 includes a first laser 111 and a second laser 112. The first laser 111 is a blue laser, and the second laser 112 is an infrared laser. The blue laser can emit a laser beam with a wavelength range between 400nm and 490nm. For example, the blue laser emits a laser beam with a wavelength of 450nm to perform laser processing on materials of various materials. The infrared laser can emit a laser beam with a wavelength range between 780nm and 1100nm. For example, the infrared laser emits a laser beam with a wavelength of 1064nm to perform laser processing on materials such as metal, plastic, wood, leather, and ceramics. It should be noted that this application may also include multiple lasers 110 that emit laser beams of other different wavelengths.

[0049] It is understood that, in some possible examples of this application, at least two of the multiple lasers 110 may also emit laser beams of the same wavelength. One of the two lasers 110 may operate as the main laser, while the other laser 110 may serve as a backup laser to take over operation when the main laser is damaged or malfunctions. Alternatively, the two lasers 110 may operate alternately to avoid the high temperature and wear problems caused by prolonged operation of a single laser 110, and to improve the lifespan of both lasers 110. It should be noted that the embodiments of this application do not limit the specific operating wavelength of the laser beams emitted by the multiple lasers 110.

[0050] Understandably, the beam combining component 140 can combine laser beams of different wavelengths or directions emitted by multiple lasers 110 into the same optical path and transmit them to the galvanometer component 130, so as to ensure that the laser beam emitted by each laser 110 can be coupled to the galvanometer component 130. For example, when the first laser 111 is working, the beam combining component 140 is optically coupled to both the first laser 111 and the galvanometer component 130, and couples the laser beam emitted by the first laser 111 to the galvanometer component 130; when the second laser 112 is working, the beam combining component 140 is optically coupled to both the second laser 112 and the galvanometer component 130, and couples the laser beam emitted by the second laser 112 to the galvanometer component 130. The light combining component 140 may include structures such as a dichroic mirror, a prism assembly, a light inlet, and a light outlet. The laser beam emitted by the laser 110 can enter the light combining component 140 through the light inlet. The dichroic mirror can reflect or transmit laser beams of different wavelengths. The prism assembly can converge light from different directions onto a common optical axis through multiple reflections and exit through the light outlet into the galvanometer assembly 130. It should be noted that the light combining component 140 may also include other structures, and the specific structure of the light combining component 140 is not limited in this embodiment.

[0051] It is understood that in some possible examples of this application, the laser device 100 further includes a second connecting seat 190, which includes a first connecting portion and a second connecting portion. The first connecting portion is fixedly connected to the heat dissipation assembly 120, and the first connecting portion can be fixedly connected to the heat dissipation assembly 120 by means of, but not limited to, threaded connection, snap-fit, adhesive bonding, welding, etc. The second connecting portion is fixedly connected to the light combining assembly 140, and the second connecting portion can be fixedly connected to the light combining assembly 140 by means of, but not limited to, threaded connection, snap-fit, adhesive bonding, welding, etc. In the embodiments of this application, the light combining assembly 140 achieves a close and fixed connection with the heat dissipation assembly 120 through the second connecting seat 190, resulting in a more robust connection between the light combining assembly 140 and the heat dissipation assembly 120, and better structural stability of the laser device 100.

[0052] In some possible embodiments of this application, the first connecting portion and the second connecting portion enclose a clearance area, and at least a portion of the galvanometer assembly 130 is located within the clearance area. Through the clearance area in the embodiments of this application, since a portion of the galvanometer assembly 130 is located within the clearance area, the space utilization rate within the housing assembly 150 is further increased, making the arrangement of various components within the housing assembly 150 more compact.

[0053] The laser device 100 of this application embodiment can guide the laser beams emitted by multiple lasers 110 when they are working to the same optical path and couple them to the galvanometer assembly 130 under the action of the beam combining component 140. Multiple lasers 110 can process materials of different materials, which greatly improves the applicability of the laser device 100 and makes the materials processed by the laser device 100 more abundant and extensive.

[0054] In some possible examples of this application, each laser 110 of the laser device 100 can be thermally connected to the heat dissipation assembly 120, so that the heat dissipation assembly 120 can conduct the heat generated by each laser 110 to the outside of the laser device 100. For example, each laser 110 can be bonded to the heat dissipation assembly 120 (e.g., the heat dissipation structure 122 of the heat dissipation assembly 120), with one side of each laser 110 bonded to the same heat dissipation surface of the heat dissipation assembly 120, such as the heat dissipation structure 122. The heat dissipation assembly 120 can conduct the heat generated by each laser 110 to the outside of the laser device 100, thus achieving heat dissipation for multiple lasers 110.

[0055] In some possible examples of this application, multiple lasers 110 may be arranged along the second direction H2. For example, multiple lasers 110 may be arranged at intervals or stacked along the second direction H2. In some possible examples of this application, the laser device 100 includes an infrared laser and a blue laser arranged along the second direction H2, with the blue laser disposed above the infrared laser, so that the infrared laser carries the blue laser. Since the heat dissipation channel 123 of the heat dissipation component 120 extends along the second direction H2, the heat dissipation component 120 has a large size in the second direction H2. In this embodiment, multiple lasers 110 are stacked along the height direction of the laser device 100 - the second direction H2, which makes reasonable use of the space of the laser device 100 in the second direction H2 and reduces the size of multiple lasers 110 in other directions, thus realizing the miniaturization design of the laser device 100. Furthermore, the stacking direction of multiple lasers 110 is the same as the extension direction of the heat dissipation channel 123, so the heat dissipation component 120 can more smoothly conduct the heat of multiple lasers 110 to the outside of the laser device 100, and the heat dissipation resistance of the heat dissipation component 120 is smaller.

[0056] It is understood that, in some possible examples of this application, multiple lasers 110 may also be arranged sequentially along a third direction H3. This third direction H3 is different from the second direction H2 and the first direction H1. For example, the first direction H1, the second direction H2, and the third direction H3 are all perpendicular to each other. When the second direction H2 is the height direction of the laser device 100, the first direction H1 may be the length direction of the laser device 100, and the third direction H3 may be the width direction of the laser device 100. Multiple lasers 110 may be arranged along the width direction of the laser device 100. Of course, in some possible examples of this application, some of the multiple lasers 110 may be arranged along the second direction H2, and other lasers 110 may be arranged along other directions. The embodiments of this application do not limit the specific arrangement position of the multiple lasers 110.

[0057] In this embodiment, multiple lasers 110 are stacked between the heat dissipation assembly 120 and the galvanometer assembly 130 along the second direction H2. The multiple lasers 110 occupy a small size in the first direction H1 and the third direction H3, which enables the miniaturization design of the laser device 100. At the same time, the multiple lasers 110 and the galvanometer assembly 130 will not interfere with the heat dissipation channel 123 of the heat dissipation assembly 120 in the second direction H2. The heat dissipation channel 123 experiences less resistance when dissipating heat, resulting in smoother heat dissipation and higher heat dissipation efficiency.

[0058] Please refer to this again. Figures 1 to 4 In some possible examples of this application, the beam combining component 140 is disposed on one side of the plurality of lasers 110 and the galvanometer assembly 130 along a third direction H3. The plurality of lasers 110 and the galvanometer assembly 130 are disposed on the same side of the beam combining component 140 along the third direction H3. In this case, the galvanometer assembly 130, the lasers 110 and the heat dissipation component 120 are arranged along a first direction H1, and the galvanometer assembly 130 and the lasers 110 are arranged with the beam combining component 140 along the third direction H3. The beam combining component 140 does not easily increase the size of the laser device 100 in the first direction H1, and can make full use of the size of the laser device 100 in the third direction H3. The arrangement between the various components of the laser device 100 is more reasonable and more conducive to the miniaturization design of the laser device 100. Furthermore, when multiple lasers 110 are stacked along the second direction H2, the beam combining component 140 is located on the same side of the multiple lasers 110 and the galvanometer component 130. The beam combining component 140 can more easily guide the laser beam emitted by each laser 110 to the same optical path and couple it to the galvanometer component 130, thus simplifying the beam combining path of the beam combining component 140.

[0059] Based on the above description of the laser device 100, this application also provides a laser processing apparatus 10. Please refer to... Figure 5 and Figure 6 , Figure 5This is a schematic diagram of the structure of the laser processing equipment 10 provided in an embodiment of this application. Figure 6 for Figure 5 The diagram shows a structural schematic of the laser processing equipment 10 in another state. The laser processing equipment 10 includes a frame 200 and a laser device 100, which is connected to the frame 200 and is movable relative to the frame 200. The laser device 100 includes the laser device 100 of any of the above embodiments.

[0060] Understandably, the frame 200 is the main frame structure of the laser processing equipment 10, providing structural support for the laser device 100. The laser processing equipment 10 also includes a worktable 400, on which the workpiece to be processed can be placed. The laser beam emitted from the laser device 100 is used to transmit to the worktable and process the workpiece.

[0061] It is understood that the laser device 100 can be slidably connected to the frame 200. In some possible examples of this application, the frame 200 may also be provided with a moving mechanism connected to the laser device 100. Specifically, the moving mechanism can be connected to the mounting assembly 170 of the laser device 100. The moving mechanism can drive the laser device 100 to slide along the second direction H2, thereby changing the distance between the laser device 100 and the 400 worktable, thus adjusting the focus of the laser 110 to accommodate the processing of workpieces of different thicknesses.

[0062] It is understood that, in some possible examples of this application, the laser processing equipment 10 may also include an outer enclosure assembly 300, which is slidably connected to and movable relative to the frame 200, and which, together with the laser device 100, encloses a workspace. The outer enclosure assembly 300 is used to shield the laser beam and improve the safety of the laser processing equipment 10. Specifically, the outer enclosure assembly 300 may be a transparent housing with light-filtering properties to filter the laser beam and prevent it from harming the user's eyes.

[0063] In some possible embodiments of this application, an exhaust fan for discharging heat dissipation airflow is provided inside the rack 200, and the exhaust fan is correspondingly arranged with the exhaust port. It is understood that when the outer casing assembly 300 abuts against the worktable 400, the laser device 100, rack 200, outer casing assembly 300, and worktable 400 form a closed working space. The heat dissipation airflow passing through the housing assembly 150 flows into the working space from the air guide groove 171 of the mounting assembly 170 and is discharged out of the working space by the exhaust fan, thereby achieving heat dissipation within the working space.

[0064] It should be noted that the laser device 100 and the laser processing equipment 10 in this application are different subjects under the same inventive concept, and features not described in detail in each embodiment can be referred to the descriptions in other embodiments.

[0065] In the laser device 100 and laser processing equipment 10 of this application embodiment, a heat dissipation assembly 120 is disposed along a first direction H1 on one side of the laser 110 and forms a heat dissipation channel 123 along a second direction H2. A galvanometer assembly 130 is disposed along the first direction H1 on the side of the laser 110 away from the heat dissipation assembly 120. Therefore, the galvanometer assembly 130, the laser 110, and the beam combining assembly 140 do not obstruct the heat dissipation assembly 120 and the heat dissipation channel 123 in the second direction H2. The heat conducted from the laser 110 to the heat dissipation assembly 120 can be smoothly discharged to the outside of the laser device 100 along the heat dissipation channel 123 extending in the second direction H2. The resistance encountered when the heat is discharged to the outside of the laser device 100 along the heat dissipation channel 123 is small, resulting in smoother heat dissipation and higher heat dissipation efficiency. Simultaneously, multiple lasers 110 are stacked along the second direction H2, and the main board assembly 160 and the base plate 152 are respectively disposed along the second direction H2. The space on both sides of the galvanometer assembly 130, laser 110, beam combining assembly 140, and heat dissipation structure 122 makes reasonable use of the space of the laser device 100 in the second direction H2; and the beam combining assembly 140 is arranged along the third direction H3 on one side of the multiple lasers 110 and galvanometer assembly 130, making reasonable use of the space of the laser device 100 in the third direction H3. The multiple components of the laser device 100 are arranged in a reasonable manner, which can realize the miniaturization design of the laser device 100. The laser device 100 of this application embodiment can meet the heat dissipation requirements of the high-power laser 110 in a limited space.

[0066] It should be noted that the term "multiple" in this application generally refers to two or more. Furthermore, the directional terms used in the embodiments of this application, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrating and understanding the embodiments of this application, and not for limiting the embodiments of this application. In the various drawings, structurally similar units are represented by the same reference numerals. For clarity, the various parts in the drawings are not drawn to scale. Additionally, some related parts may not be shown in the drawings.

[0067] It should be understood that in the description of this application, terms such as "first" and "second" are used only to distinguish similar objects and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0068] It is understood that those skilled in the art can combine various implementation methods in the above embodiments under the guidance of the above examples to obtain technical solutions with multiple implementation methods. The above descriptions are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

[0069] The laser device and laser processing equipment provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A laser device, characterized in that, include: A laser, used to emit a laser beam; A heat dissipation component is disposed on one side of the laser along a first direction and connected to the laser. The heat dissipation component is used to form a heat dissipation channel extending along a second direction, which is perpendicular to the first direction. and A galvanometer assembly is disposed on the other side of the laser along the first direction, and the galvanometer assembly is used to adjust the emission direction of the laser beam.

2. The laser device according to claim 1, characterized in that, The laser device also includes: The housing assembly has an air inlet and an air outlet; The laser, the heat dissipation assembly, and the galvanometer assembly are disposed inside the housing assembly. Along the second direction, the air inlet and the air outlet are located at opposite ends of the heat dissipation assembly, and the air inlet and the air outlet are correspondingly disposed to the ends of the heat dissipation assembly.

3. The laser device according to claim 2, characterized in that, The heat dissipation component includes: A cooling fan is provided corresponding to the air inlet; and A heat dissipation structure is disposed along the second direction on the side of the cooling fan away from the air inlet, with one end of the heat dissipation structure corresponding to the cooling fan and the other end of the heat dissipation structure corresponding to the air outlet; The cooling fan is used to guide the cooling airflow into the interior of the housing assembly, and at least a portion of the cooling airflow flows through the cooling structure and is discharged from the air outlet.

4. The laser device according to claim 3, characterized in that, Along the second direction, a first opening and a second opening are respectively provided at opposite ends of the heat dissipation structure. The interior of the heat dissipation structure is provided with a plurality of airflow channels communicating with the first opening and the second opening. The first opening is provided corresponding to the cooling fan, and the second opening is provided corresponding to the air outlet. And / or, the heat dissipation structure includes at least one of a metal plate heat dissipation structure, a heat pipe heat dissipation structure, and a vapor chamber heat dissipation structure.

5. The laser device according to claim 3, characterized in that, The laser device also includes: A motherboard assembly, arranged along the first direction with the cooling fan, wherein the motherboard assembly is electrically connected to at least one of the laser, the galvanometer assembly, and the cooling fan; and A first connector is disposed along the second direction on the side of the motherboard assembly away from the air inlet. The first connector is connected to the motherboard assembly and the cooling fan respectively. The first connector is provided with a ventilation hole, which is located between the cooling fan and the heat dissipation structure.

6. The laser device according to claim 2, characterized in that, The laser device also includes: An installation component is disposed on one side of the housing component along the second direction, and the installation component is provided with an air guide groove; The housing assembly includes a base plate, on which the air outlet is provided. The air outlet is disposed opposite to and connected to the air guide groove.

7. The laser device according to any one of claims 1 to 6, characterized in that, The laser device includes: At least two lasers, the at least two lasers being arranged along the second direction, each laser being bonded to the heat dissipation assembly; and A beam combining assembly is used to guide the laser beam emitted by each of the lasers to the same optical path and couple it to the galvanometer assembly.

8. The laser device according to claim 7, characterized in that, Along a third direction, the light combining component is disposed on one side of the galvanometer component, and the third direction, the first direction, and the second direction are perpendicular to each other.

9. The laser device according to claim 8, characterized in that, The laser device also includes: The second connector includes a first connecting portion and a second connecting portion that are bent together. The first connecting portion is fixedly connected to the heat dissipation assembly, and the second connecting portion is fixedly connected to the light combining assembly. The first connecting portion and the second connecting portion form a clearance area, and at least a portion of the galvanometer assembly is located within the clearance area.

10. A laser processing device, characterized in that, Includes a frame, a worktable, an outer casing assembly, and a laser device as described in any one of claims 1 to 9; The laser device is slidably connected to the frame, and the frame is provided with an exhaust vent; The worktable is fixedly connected to the frame and is arranged opposite to the laser device. When the laser device slides along the frame, the distance between the laser device and the worktable changes. The worktable is used to place the workpiece to be processed, and the laser beam emitted by the laser device is used to transmit to the workpiece to be processed on the worktable. The outer cover assembly is slidably connected to the frame. When the outer cover assembly abuts against the worktable, the frame, the worktable, the outer cover assembly, and the laser device enclose a working space. The cooling airflow introduced by the laser device passes through the workspace and is discharged from the exhaust port.

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