A spraying structure and a linear cutting machine

Abstract

The utility model relates to processing device technical field, especially a kind of spraying structure and linear cutting machine. In spraying structure, spray pipe is equipped with liquid inlet and liquid outlet;Sealing plate is located above flow guide plate, sealing plate and flow guide plate are connected with spray pipe respectively, sealing plate, flow guide plate and spray pipe form liquid storage area between, liquid storage area is communicated with liquid outlet, the volume of liquid storage area is greater than 0.7L;The end of sealing plate far from spray pipe and the end of flow guide plate far from spray pipe form liquid discharge port between;Flow guide plate includes flow guide part facing sealing plate and forming liquid discharge port with sealing plate, the included angle between flow guide part and sealing plate is α, 10°≤α≤45°. Precise liquid spraying to different size photovoltaic silicon rods can be realized, and liquid spraying is uniform, effectively avoiding the situation of liquid flow broken line.

Description

Technical Field

[0001] This utility model relates to the technical field of photovoltaic silicon rod processing equipment, and in particular to a spray structure and a wire cutting machine. Background Technology

[0002] Wire EDM is a processing method that uses a high-speed reciprocating cutting wire that moves relative to a photovoltaic silicon rod to cut the rod. In wire EDM, a spray system delivers a spray solution to the contact area between the cutting wire and the photovoltaic silicon rod to achieve cooling, lubrication, and chip removal, making it a key piece of equipment for ensuring the cutting quality of the photovoltaic silicon rod. However, existing spray systems generally suffer from uneven spraying and interrupted flow, making it difficult to meet actual production needs. Utility Model Content

[0003] In view of this, the present invention proposes a spray structure and a wire cutting machine, aiming to partially or completely solve the technical problems of uneven spraying and broken liquid flow in existing spray devices.

[0004] To achieve the above objectives, the technical solution of this utility model is implemented as follows: In a first aspect, embodiments of the present invention provide a spray structure, the spray structure comprising: The spray pipe is equipped with a liquid inlet and a liquid outlet; A sealing plate and a guide plate are provided, with the sealing plate located above the guide plate. The sealing plate and the guide plate are respectively connected to the spray pipe. A liquid storage area is formed between the sealing plate, the guide plate, and the spray pipe. The liquid storage area is connected to the liquid outlet, and the volume of the liquid storage area is greater than 0.7L. A drain outlet is formed between the end of the sealing plate away from the spray pipe and the end of the guide plate away from the spray pipe; The guide plate includes a guide portion facing the sealing plate and forming the drain port with the sealing plate, the included angle between the guide portion and the sealing plate is α, and 10°≤α≤45°.

[0005] In some embodiments, when the volume of the storage area is in the range of 0.7L-1.5L, 25°≤α≤45°; or, when the volume of the storage area is in the range of 1.2L-2L, 10°≤α≤25°.

[0006] In some embodiments, the guide plate further includes a connecting portion, one end of which is connected to the spray pipe, and the other end of which is connected to the guide portion. The included angle between the connecting portion and the guide portion is β, where 85°≤β≤100° is present when 25°≤α≤45°; or, When 10°≤α≤25°, 92°≤β≤100°.

[0007] In some embodiments, when 25°≤α≤45°, the guide portion is inclined downwards; or, when 10°≤α≤25°, the guide portion is inclined downwards, and the angle between the guide portion and the horizontal plane is γ, wherein 5°≤γ≤20°.

[0008] In some embodiments, the length of the guide plate along the radial direction of the spray pipe is L1, where 50mm≤L1≤125mm is the case where 25°≤α≤45°; or, where 80mm≤L1≤125mm is the case where 10°≤α≤25°.

[0009] In some embodiments, the spray structure further includes a baffle plate disposed inside the spray pipe, which divides the spray pipe into a first chamber and a second chamber. The first chamber is connected to the liquid inlet, and the second chamber is connected to the liquid outlet. The baffle plate has a diversion hole that connects the first chamber and the second chamber. When the volume of the liquid storage area is in the range of 1.2L-2L, a gap is formed between the circumferential edge of the baffle plate and the pipe wall of the spray pipe along the length direction of the spray pipe.

[0010] In some embodiments, the width of the middle part of the partition is smaller than the width of the end part of the partition along the length of the spray pipe; or, the middle part of the partition to one end of the partition is a trapezoidal structure, and the angle between the upper base and the waist of the trapezoidal structure is θ, 90.1°≤θ≤92°.

[0011] In some embodiments, the spray structure further includes an overflow plate disposed on the guide portion and extending toward the sealing plate.

[0012] In some embodiments, the distance from the overflow plate to the end of the guide section near the spray pipe is L2, and the distance from the overflow plate to the end of the guide section away from the spray pipe is L3, where 1.1≤L2 / L3≤1.9.

[0013] Secondly, this utility model embodiment also provides a wire cutting machine, which includes the spray structure as described above.

[0014] This utility model discloses a spray structure that can achieve precise spraying of liquid onto photovoltaic silicon rods of different sizes by controlling the volume of the liquid storage area and the angle α between the guide part and the sealing plate, and the spraying is uniform, effectively avoiding the situation of liquid flow interruption.

[0015] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more obvious and understandable, specific embodiments of this utility model are given below. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0017] Figure 1 This is a partial structural schematic diagram of the spray structure described in an embodiment of the present utility model; Figure 2 This is a schematic diagram of the cross-sectional structure of the spray structure described in this embodiment of the present invention, perpendicular to the axial direction of the spray pipe; Figure 3 This is a schematic diagram of the spray structure described in an embodiment of the present invention; Figure 4 for Figure 2 Dimensions of the middle section Figure 1 ; Figure 5 for Figure 2 Dimensions of the middle section Figure 2 ; Figure 6 This is a schematic diagram of the partition structure described in an embodiment of the present utility model; Figure 7 This is a schematic diagram of the structure of the first silicon rod; Figure 8 This is a schematic diagram of the structure of the second silicon rod.

[0018] Explanation of reference numerals in the attached figures: 10. Spray pipe; 11. Liquid inlet; 12. Liquid outlet; 13. First chamber; 14. Second chamber; 20. Sealing plate; 30. Deflector plate; 31. Deflector section; 32. Connecting section; 40. Baffle plate; 41. Diversion hole; 50. Overflow plate; 60. Liquid storage area; 61. Drain outlet; 70. Liquid inlet pipe; 80. Flow regulating plate; 81. Long strip hole; 91. First silicon rod; 92. Second silicon rod. Detailed Implementation

[0019] Exemplary embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0020] Reference Figures 1 to 6 As shown in the embodiment of this application, a spray structure is provided. This spray structure is mainly suitable for cutting photovoltaic silicon rods. It can achieve precise spraying of liquid onto photovoltaic silicon rods of different shapes and sizes, and the liquid spraying is uniform, effectively avoiding the situation of liquid flow interruption.

[0021] Photovoltaic silicon rods include a first silicon rod 91 and a second silicon rod 92, as shown in the reference. Figure 7 and Figure 8 The diagram illustrates the structures of two photovoltaic silicon rods. The first silicon rod 91 has a length-to-width ratio in the direction of arrow B ranging from 1:0.3 to 1:0.6, a length ranging from 170mm to 250mm, and a width ranging from 80mm to 130mm. The second silicon rod 92 has a length-to-width ratio in the direction of arrow B ranging from 1:0.8 to 1:1, a length ranging from 170mm to 250mm, and a width ranging from 170mm to 250mm. Furthermore, in the actual cutting process, due to the significant difference in length and width between the first silicon rod 91, a transverse cut is performed when the adhesive surface is on the side of the first silicon rod 91 along its length; a vertical cut is performed when the adhesive surface is on the side of the first silicon rod 91 along its width.

[0022] In some embodiments, reference is made to Figure 1 and Figure 2 As shown, the spray structure includes a spray pipe 10, a sealing plate 20, and a guide plate 30. The spray pipe 10 is provided with an inlet 11 and an outlet 12. The sealing plate 20 is located above the guide plate 30. The sealing plate 20 and the guide plate 30 are respectively connected to the spray pipe 10. A liquid storage area 60 is formed between the sealing plate 20, the guide plate 30, and the spray pipe 10. The liquid storage area 60 is connected to the outlet 12, and the volume of the liquid storage area 60 is greater than 0.7L. A drain outlet 61 is formed between the end of the sealing plate 20 away from the spray pipe 10 and the end of the guide plate 30 away from the spray pipe 10. The guide plate 30 includes a guide portion 31 facing the sealing plate 20 and forming the drain outlet 61 with the sealing plate 20. The included angle between the guide portion 31 and the sealing plate 20 is α, wherein 10°≤α≤45°.

[0023] It is understandable that the included angle α between the guide section 31 and the sealing plate 20, and the volume of the liquid storage area 60, can be specifically set according to the usage requirements to obtain the required spraying distance of the spray liquid. For example, the included angle α between the guide section 31 and the sealing plate 20 can be one of 10°, 11°, 12°, 13°, 14°, 15°, 16°, 17°, 18°, 19°, 20°, 21°, 22°, 23°, 24°, 25°, 26°, 27°, 28°, 29°, 30°, 31°, 32°, 33°, 34°, 35°, 36°, 37°, 38°, 39°, 40°, 41°, 42°, 43°, 44°, or 45°. For example, the volume of the storage area 60 is one of 0.7L, 0.8L, 0.9L, 1L, 1.1L, 1.2L, 1.3L, 1.325L, 1.35L, 1.375L, 1.4L, 1.425L, 1.45L, 1.475L, or 1.5L.

[0024] like Figure 2 As shown in the embodiment of this application, the cross-section of the liquid storage area 60 gradually decreases toward the side away from the spray pipe 10 in the radial direction perpendicular to the spray pipe 10, and is the smallest near the drain outlet 61.

[0025] In this embodiment, along the axial direction of the spray pipe 10, the lengths of the sealing plate 20 and the guide plate 30 match the length of the spray pipe 10, so that all the spray liquid flowing out from the outlet 12 flows into the storage area 60. The axial direction of the spray pipe 10 is referenced to... Figure 1 As indicated by the middle arrow X.

[0026] Reference Figure 1 and Figure 3 As shown, the spray pipe 10 is provided with a liquid inlet 11, and the liquid inlet pipe 70 is connected to the spray pipe 10. The spray liquid enters the spray pipe 10 through the liquid inlet pipe 70 and the liquid inlet 11. It can be understood that the number of liquid inlets 11 and the number of liquid inlet pipes 70 can be set according to usage requirements; there can be 2, 3, 4, etc., liquid inlets 11 and liquid inlet pipes 70. The number of liquid outlets 12 can also be set according to usage requirements. Multiple liquid outlets 12 can have the same or different diameters, and the multiple liquid outlets 12 can be evenly distributed along the axial direction of the spray pipe 10 or unevenly distributed.

[0027] The spray structure is suitable for spraying spray liquid during the cutting process of photovoltaic silicon rods. In use, the spray liquid enters the spray pipe 10 through the inlet 11, then enters the storage area 60 through the outlet 12, and is finally discharged from the outlet 61. Slurry and other spray liquids are used to evenly spray onto the cutting line during the cutting process. These liquids cool the cutting line, lubricate it, remove powder and other impurities generated during cutting, and enhance cutting force and the quality of the surface texture of the workpiece.

[0028] The spray structure of this embodiment uses a liquid storage area 60 to buffer pressure fluctuations in the spray liquid and stabilize the flow rate. By limiting the volume of the liquid storage area 60 and the angle formed between the guide section 31 and the sealing plate 20, it can accurately spray liquid onto photovoltaic silicon rods of different sizes, and has the advantages of uniform and continuous liquid flow during the cutting of photovoltaic silicon rods of different sizes. In addition, the volume range of the liquid storage area 60 can also solve the problem of backflow of spray liquid caused by the high-speed reciprocating cutting wind field of the cutting line, and meet the higher requirements for spray distance and spray uniformity of spray liquid during the cutting of, for example, the first silicon rod 91 and the second silicon rod 92.

[0029] In some embodiments, when the second silicon rod 92 is cut and the first silicon rod 91 is cut transversely, the volume range of the liquid storage area 60 is set to 0.7L-1.5L, and 25°≤α≤45°. At this time, the spraying distance of the spray liquid on the photovoltaic silicon rod can cover the contact area between the photovoltaic silicon rod and the cutting line on a large area, and the spray liquid flow rate is uniform. It will not cause the spray liquid impact force to be too large and affect the surface of the silicon wafer (such as causing edge chipping or cracks). When the first silicon rod 91 is vertically cut, the volume range of the liquid storage area 60 is set to 1.2L-2L, and 10°≤α≤25. Since the spray liquid needs to reach a farther spray position to cover the contact area between the photovoltaic silicon rod and the cutting line in a large area when the first silicon rod 91 is vertically cut, the angle α can be further reduced. However, if only the angle α is reduced, the spray liquid will not be powerful enough, and the liquid flow will be interrupted. Therefore, the volume of the liquid storage area 60 is increased to achieve uniform spraying and continuous liquid flow when the spraying distance is increased.

[0030] According to the spray structure of the present application embodiment, by adjusting the included angle α between the flow guide 31 and the sealing plate 20 within a specific range (10°≤α≤25° or 25°≤α≤45°) and matching the volume of the corresponding liquid storage area 60 (0.7L-1.5L or 1.2L-2L), the spray distance of the spray liquid can be precisely controlled, thereby adapting to the cutting requirements of photovoltaic silicon rods of different sizes, and the uniform flow of the spray liquid can still be guaranteed after the included angle α is improved.

[0031] In some embodiments, reference is made to Figure 2 and Figure 4 As shown, the guide plate 30 also includes a connecting part 32. One end of the connecting part 32 is connected to the spray pipe 10, and the other end of the connecting part 32 is connected to the guide part 31. The included angle between the connecting part 32 and the guide part 31 is β, 85°≤β≤100°. In this embodiment, when the included angle β between the connecting part 32 and the guide part 31 is within the above range, the included angle is close to a right angle and leaves an appropriate buffer space, which can make the spray liquid flow from the connecting part 32 to the guide part 31 form a smooth transition, avoid liquid flow impact and rebound caused by too small an angle, or liquid flow dispersion caused by too large an angle, reduce internal turbulence of the liquid flow, and ensure stable liquid flow pattern.

[0032] It is understandable that the included angle β between the connecting part 32 and the guide part 31 can be specifically set according to the usage requirements. For example, the included angle β between the connecting part 32 and the guide part 31 is one of 85°, 86°, 87°, 88°, 89°, 90°, 91°, 92°, 93°, 94°, 95°, 96°, 97°, 98°, 99°, and 100°.

[0033] like Figure 2 As shown in the embodiment of this application, the connecting portion 32 and the guide portion 31 form an L-shape, and the connection between the connecting portion 32 and the guide portion 31 is smoothly transitioned. The connecting portion 32 can extend vertically or obliquely, and the top end of the connecting portion 32 extends to connect with the spray pipe 10 and is located on the side of the liquid outlet 12 away from the drain outlet 61.

[0034] Preferably, when the first silicon rod 91 is vertically cut, since the vertical cutting of the first silicon rod 91 requires a longer spraying distance, 92°≤β≤100° can be set. An angle greater than 90 degrees can make the guide part 31 form a moderately outward guide angle in the direction of the flow, which can counteract the tendency of the liquid flow to naturally diffuse in the long-distance spraying, and ensure that the liquid flow still maintains a concentrated and continuous form when it reaches the vertical cutting surface, avoiding the dispersion of the liquid flow and incomplete coverage due to excessive distance.

[0035] In some embodiments, to further mitigate the issues of increased spray flow rate variation, higher probability of flow interruption, and increased probability of uneven spray thickness caused by the long spray distance during vertical cutting of the first silicon rod 91, the guide portion 31 is inclined downwards in this embodiment. This configuration has also been experimentally verified to be suitable for the horizontal cutting of the second silicon rod 92 and the first silicon rod 91.

[0036] When the spray structure is used for vertical cutting of the first silicon rod 91, the spray liquid needs to have a large spray distance. The angle between the guide section 31 and the horizontal plane is set to γ, 5°≤γ≤20°, more preferably 10°≤γ≤15°. For example, the angle γ between the guide section 31 and the horizontal plane is one of 5°, 6°, 7°, 8°, 9°, 10°, 11°, 12°, 13°, 14°, 15°, 16°, 17°, 18°, 19°, and 20°. In the embodiments of this application, when the angle γ between the guide section 31 and the horizontal plane is within the above range, the spray can have a certain initial velocity and be directed towards the cutting line of the first silicon rod 91 with a parabolic trajectory, and the flow rate and thickness are uniform to ensure cooling and rinsing effects; and the initial velocity will not cause excessive impact on the silicon wafer surface.

[0037] In some embodiments, the length of the guide plate 30 along the radial direction of the spray pipe 10 is L1, where 50mm ≤ L1 ≤ 125mm. When the length L1 of the guide plate 30 is within the above range, the length of the guide plate 30 is relatively long, which can avoid problems such as variable flow rate, flow interruption, and uneven thickness of the spray liquid. In addition, when cutting the second silicon rod 92 or the first silicon rod 91 laterally, if the volume range of the liquid storage area 60 is set to 0.7L-1.5L, where 50mm ≤ L1 ≤ 125mm, the spray distance of the spray liquid can better reach the second silicon rod 92, and the spray liquid flow rate is uniform. When cutting the first silicon rod 91 vertically, if the volume range of the liquid storage area 60 is set to 1.2L-2L, where 80mm ≤ L1 ≤ 125mm, the spray distance of the spray liquid can better reach the first silicon rod 91, and the spray liquid flow rate is uniform.

[0038] Understandably, the length L1 of the deflector 30 is set according to the specific usage requirements. For example, the length L1 of the deflector 30 is one of 50mm, 60mm, 70mm, 80mm, 90mm, 100mm, 110mm, 112mm, 114mm, 115mm, 117mm, 119mm, 120mm, 122mm, 124mm, and 125mm.

[0039] In some embodiments, the spray structure further includes a baffle 40, which is disposed inside the spray pipe 10 and arranged along the axial direction of the spray pipe 10. The baffle 40 divides the spray pipe 10 into a first chamber 13 and a second chamber 14. The first chamber 13 is connected to the liquid inlet 11, and the second chamber 14 is connected to the liquid outlet 12. The baffle 40 is provided with a diversion hole 41, which connects the first chamber 13 and the second chamber 14.

[0040] In use, the spray structure allows the spray liquid to enter the first chamber 13 within the spray pipe 10 through the inlet 11. The spray liquid is blocked by the baffle 40 and flows axially to both sides of the spray pipe 10, thus achieving a diversion effect. This reduces the pressure and velocity of the spray liquid, improving the uniformity of the output. The spray liquid in the first chamber 13 flows into the second chamber 14 through the diversion hole 41, which slows down the flow of the spray liquid within the spray pipe 10. Even under fluctuating supply pressure, the spray liquid can still be evenly distributed within the spray pipe 10, thus flowing uniformly out of the outlet 12, offering advantages such as uniform and continuous liquid flow.

[0041] When the first silicon rod 91 is vertically cut, a gap is formed between the circumferential edge of the partition plate 40 and the wall of the spray pipe 10 along the length of the spray pipe 10. The impact force of the spray liquid entering the first chamber 13 through the liquid inlet 11 acts on the partition plate 40, which achieves a certain buffer and avoids vibration of the spray pipe 10. In this way, the spray distance of the spray liquid can better reach the first silicon rod 91 during vertical cutting, and the spray liquid flow is uniform, ensuring the cooling effect and washing away silicon powder on the cutting line.

[0042] There are multiple diversion holes 41, which are spaced apart along the axial direction of the spray pipe 10, or they can be evenly arranged. The diversion holes 41 and the liquid outlet 12 can be aligned vertically or staggered vertically. In this case, the spray liquid can reach the first silicon rod 91 better, and the spray liquid flow rate is uniform.

[0043] In some implementations, refer to Figure 6 As shown, along the length of the spray pipe 10, the width W2 of the middle section of the baffle 40 is smaller than the width W1 of the end section of the baffle 40. This results in a larger gap between the circumferential edge of the baffle 40 in the middle section and the wall of the spray pipe 10 compared to the gap between the baffle 40 in the end section and the wall of the spray pipe 10. Since the inlet pipe 70 is connected to the middle section of the spray pipe 10 and flows towards both ends, increasing the gap in the middle section reduces resistance and prevents insufficient flow to both ends; thus, a uniform flow distribution is achieved within the spray pipe 10, ensuring the uniformity of subsequent spraying.

[0044] Preferably, the baffle 40 has a trapezoidal structure from its middle section to one end. That is, the width of the baffle 40 gradually increases from the middle to the end, resulting in the largest gap between the circumferential edge of the baffle 40 and the wall of the spray pipe 10 in the middle region, and the smallest gap between the baffle 40 and the wall of the spray pipe 10 in the end region. By setting a gradually decreasing gap trend from the middle region to the end region, the resistance in each region can be controlled, achieving a uniform flow distribution in the spray pipe 10.

[0045] More preferably, such as Figure 6As shown, the middle part to one end of the partition 40 has a trapezoidal structure, with the angle between the upper base and the waist of the trapezoid being θ, where 90.1°≤θ≤92°. For example, it can be 90.1°, 90.2°, 90.3°, 90.4°, 90.5°, 90.6°, 90.7°, 90.8°, 90.9°, 91°, 91.1°, 91.2°, 91.3°, 91.4°, 91.5°, 91.6°, 91.7°, 91.8°, 91.9°, or 92°. This avoids excessively large gaps between the partition 40 and the spray pipe 10, which would result in insufficient resistance, splashing, and broken flow lines. Conversely, excessively small gaps would lead to excessive resistance, low flow rates at the ends, and uneven spray thickness. The middle part of the partition 40 is... Figure 6 The position indicated by the dashed line.

[0046] The structure of the baffle 40 inside the spray pipe 10 can be configured according to usage requirements. For example, a blocking plate can be provided at both ends of the spray pipe 10. The blocking plate can be detachably connected to the spray pipe 10, thereby sealing the end of the spray pipe 10. The blocking plate has a groove on the side wall facing the inside of the spray pipe 10, and the baffle 40 is locked in the groove. Of course, bolts or other locking devices can also be used to fix the baffle 40 to the blocking plate.

[0047] In some embodiments, the spray structure further includes an overflow plate 50, which is disposed on the guide portion 31 and extends toward the sealing plate 20. An overflow plate 50 and a sealing plate 20 form a channel. When the spray liquid flows along the guide section 31 to the overflow plate 50, it is blocked by the overflow plate 50, reducing both the pressure and velocity of the spray liquid. Then, the spray liquid moves upward and, at the channel position between the overflow plate 50 and the sealing plate 20, is subjected to the combined action of the overflow plate 50 and the sealing plate 20, further reducing the velocity and pressure of the spray liquid. The spray liquid moves to both sides along the axial direction of the spray pipe 10 and then passes through the channel between the overflow plate 50 and the sealing plate 20, exiting through the drain port 61. This improves the uniformity of the spray liquid along the length of the spray pipe 10 at the drain port 61, solving the problems of spray liquid flow interruption and inconsistent spray liquid thickness, thereby ensuring cutting quality. This results in a large spray distance range for the spray liquid discharged from the spray structure, and the spray liquid can flow smoothly to the desired distance, meeting, for example, the higher requirements for spray distance and spray uniformity of the first silicon rod 91 and the second silicon rod 92 during cutting.

[0048] In some implementations, refer to Figure 5As shown, the distance from the overflow plate 50 to the end of the guide section 31 near the spray pipe 10 is L2, and the distance from the overflow plate 50 to the end of the guide section 31 away from the spray pipe 10 is L3, with the relationship 1.1≤L2 / L3≤1.9, preferably 1.3≤L2 / L3≤1.7. For example, L2 / L3 can be one of 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, or any ratio between the above ratios; this allows the spraying distance to be suitable for photovoltaic silicon rods of different sizes, and the spraying to be uniform.

[0049] In some implementations, refer to Figure 1 As shown, the spray structure also includes a flow regulating plate 80, which is located at the end of the sealing plate 20 away from the spray pipe 10. In actual operation, by changing the distance between the lower end of the flow regulating plate 80 and the guide plate 30, the size of the drain port 61 can be further optimized to adjust the size of the outlet of the storage area 60, thereby changing the outlet flow rate and pressure of the spray liquid.

[0050] In one specific embodiment, the distance between the lower end of the flow regulating plate 80 and the guide plate 30 is 10mm-40mm. For example, 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, 16mm, 17mm, 18mm, 19mm, 20mm, 21mm, 22mm, 23mm, 24mm, 25mm, 26mm, 27mm, 28mm, 29mm, 30mm, 31mm, 32mm, 33mm, 34mm, 35mm, 36mm, 37mm, 38mm, 39mm, or 40mm.

[0051] The flow regulating plate 80 can be installed in a manner compatible with the sealing plate, depending on the application requirements. For example, the flow regulating plate 80 may have a slotted hole or an elongated hole 81, through which bolts or other locking devices can pass to connect with the threaded holes on the sealing plate 20. Alternatively, the flow regulating plate 80 can also be implemented using a lead screw and nut, and this application does not limit its specific configuration.

[0052] The spray structure of this application embodiment, by setting a flow regulating plate 80, can optimize and adjust the flow regulating plate 80 according to actual operation requirements, change the size of the drain port 61, thereby making the flow regulation more precise.

[0053] The spray structure of this embodiment, by setting a liquid storage area 60 and adjusting its volume, as well as the included angle α between the guide portion 31 and the sealing plate 20, can change the spray distance of the spray liquid discharged from the spray structure. This makes the spray structure suitable for cutting photovoltaic silicon rods of different sizes, and it has the advantages of uniform and continuous liquid flow when cutting photovoltaic silicon rods of different sizes, thus improving its versatility. Furthermore, by setting the partition plate 40 and the overflow plate 50, and by adjusting the dimensions of the partition plate 40 and the overflow plate 50 as described above, good spray uniformity is maintained while achieving the required spray distance, and problems such as interrupted liquid flow and inconsistent spray liquid thickness do not occur. Therefore, the spray structure can effectively ensure the cutting quality of the workpiece.

[0054] This application also provides a wire cutting machine, which includes the spray structure described above.

[0055] In use, the wire cutting machine of this application embodiment cuts photovoltaic silicon rods with a cutting wire. A spray structure sprays liquid onto the cutting wire to cool it, lubricate it, remove powder and other impurities generated during the cutting process, and enhance the cutting force and the surface finish of the photovoltaic silicon rod. Furthermore, because the spray structure is suitable for producing photovoltaic silicon rods of various sizes and offers advantages such as uniform and continuous liquid flow during cutting of different sizes, the wire cutting machine can also be used for producing photovoltaic silicon rods of various sizes, resulting in better versatility and cutting performance. In the embodiments of this application, the spray structure and the wire cutting machine can be referenced to each other and have the same or similar beneficial effects as any of the aforementioned spray structures. To avoid repetition, they will not be described again here.

[0056] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0057] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. For embodiments of devices, electronic devices, computer-readable storage media, and computer program products containing instructions, the descriptions are relatively simple because they are basically similar to the method embodiments; relevant parts can be referred to the descriptions of the method embodiments.

[0058] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model are included within the scope of protection of this utility model.

Claims

1. A spray structure, characterized in that, include, The spray pipe (10) is provided with an inlet (11) and an outlet (12). A sealing plate (20) and a guide plate (30) are provided. The sealing plate (20) is located above the guide plate (30). The sealing plate (20) and the guide plate (30) are respectively connected to the spray pipe (10). A liquid storage area (60) is formed between the sealing plate (20), the guide plate (30) and the spray pipe (10). The liquid storage area (60) is connected to the liquid outlet (12). The volume of the liquid storage area (60) is greater than 0.7L. A drain port (61) is formed between the end of the sealing plate (20) away from the spray pipe (10) and the end of the guide plate (30) away from the spray pipe (10). The guide plate (30) includes a guide portion (31) facing the sealing plate (20) and forming the drain port (61) with the sealing plate (20). The included angle between the guide portion (31) and the sealing plate (20) is α, where 10°≤α≤45°.

2. The spray structure according to claim 1, characterized in that, When the volume range of the storage area (60) is 0.7L-1.5L, 25°≤α≤45°; or, When the volume range of the liquid storage area (60) is 1.2L-2L, 10°≤α≤25°.

3. The spray structure according to claim 1 or 2, characterized in that, The guide plate (30) further includes a connecting part (32), one end of which is connected to the spray pipe (10), and the other end of which is connected to the guide part (31). The included angle between the connecting part (32) and the guide part (31) is β. When 25°≤α≤45°, 85°≤β≤100°; or, When 10°≤α≤25°, 92°≤β≤100°.

4. The spray structure according to claim 1 or 2, characterized in that, When 25°≤α≤45°, the guide section (31) is inclined downward; or, When 10°≤α≤25°, the guide part (31) is inclined downward, and the angle between the guide part (31) and the horizontal plane is γ, 5°≤γ≤20°.

5. The spray structure according to claim 1 or 2, characterized in that, Along the radial direction of the spray pipe (10), the length of the guide plate (30) is L1. When 25°≤α≤45°, 50mm≤L1≤125mm; or, When 10°≤α≤25°, 80mm≤L1≤125mm.

6. The spray structure according to claim 1 or 2, characterized in that, The spray structure also includes a partition (40), which is disposed inside the spray pipe (10). The partition (40) divides the spray pipe (10) into a first chamber (13) and a second chamber (14). The first chamber (13) is connected to the liquid inlet (11), and the second chamber (14) is connected to the liquid outlet (12). The partition (40) has a diversion hole (41) that connects the first chamber (13) and the second chamber (14). When the volume of the storage area (60) is in the range of 1.2L-2L, a gap is formed between the circumferential edge of the partition (40) and the wall of the spray pipe (10) along the length direction of the spray pipe (10).

7. The spray structure according to claim 6, characterized in that, Along the length of the spray pipe (10), the width of the middle part of the partition (40) is smaller than the width of the end part of the partition (40); or, The partition (40) has a trapezoidal structure from the middle to one end of the partition (40), and the angle between the upper base and the waist of the trapezoidal structure is θ, 90.1°≤θ≤92°.

8. The spray structure according to claim 1, characterized in that, The spray structure also includes an overflow plate (50), which is disposed on the guide portion (31) and extends toward the sealing plate (20).

9. The spray structure according to claim 8, characterized in that, The distance from the overflow plate (50) to the end of the guide section (31) near the spray pipe (10) is L2, and the distance from the overflow plate (50) to the end of the guide section (31) away from the spray pipe (10) is L3, 1.1≤L2 / L3≤1.

9.

10. A wire cutting machine, characterized in that, The wire cutting machine includes a spray structure as described in any one of claims 1 to 9.

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