Wafer cutting observation window and wafer cutting machine

Abstract

The embodiment of the utility model provides a kind of wafer cutting observation window and wafer cutting machine, it is related to the technical field of semiconductor wafer processing to improve the technical problem that special isolation oil film is difficult to replace on the observation window of wafer cutting machine in prior art, high cost.Through the wafer cutting observation window, the wafer cutting work state inside wafer cutting machine can be observed and monitored;Wherein the wafer cutting observation window includes substrate and observation assembly arranged on substrate, and the observation assembly includes mounting frame body and baffle unit detachably arranged in mounting frame body, connection window is opened on substrate, and mounting frame body is arranged around connection window, so that baffle unit can completely cover connection window.In the utility model, baffle unit is detachably arranged in mounting frame body, convenient to replace, and baffle unit can be repeatedly used, easy to clean, so the cost is lower.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer processing technology, and more specifically, to a wafer dicing observation window and a wafer dicing machine. Background Technology

[0002] A wafer dicing machine is used to precisely divide a whole wafer that has completed front-end processes such as photolithography, etching, and doping into bare chip dies with independent circuit functions, laying the foundation for subsequent chip packaging.

[0003] During the wafer dicing process, operators can observe and monitor the wafer dicing process inside the wafer dicing machine through the observation window set on the wafer dicing machine.

[0004] In the prior art, in order to avoid the slurry splashed during wafer dicing remaining on the observation window and affecting the field of view, a special isolation oil film is usually set on the surface of the observation window. However, this special isolation oil film is easily scratched during use, affecting the isolation effect, and the oil film is difficult to replace and has a high cost. Utility Model Content

[0005] The purpose of this invention is to provide a wafer dicing observation window and a wafer dicing machine to improve the technical problem of high difficulty and cost in replacing the special isolation oil film on the observation window of the wafer dicing machine in the prior art.

[0006] The embodiments of this utility model can be implemented as follows: In a first aspect, this utility model provides a wafer dicing observation window, suitable for observing the interior of a wafer dicing machine, including: A substrate having a connection window; An observation assembly, the observation assembly including a mounting frame and a baffle unit detachably disposed within the mounting frame; The mounting frame is arranged around the outer edge of the connection window so that the baffle unit covers the connection window.

[0007] In an optional embodiment, the baffle unit includes a first observation baffle and a second observation baffle; The first observation baffle and the second observation baffle are detachably disposed within the mounting frame.

[0008] In an optional embodiment, the mounting frame includes a support portion, and the support portion has an insertion slot. The first observation baffle and the second observation baffle are inserted into the insertion slot.

[0009] In an optional embodiment, a partition plate is provided in the insertion slot along the length direction, and the partition plate divides the insertion slot into a first sub-slot and a second sub-slot. The first observation baffle and the second observation baffle are respectively inserted into the first sub-slot and the second sub-slot.

[0010] In an optional embodiment, the mounting frame further includes a limiting part, which is disposed on the side of the bearing part away from the connecting window, and is used to prevent the first observation baffle and the second observation baffle from tipping over.

[0011] In an optional embodiment, the connection between the support portion and the substrate can be any one of bolt connection, screw connection, rivet connection, welding connection, or adhesive connection.

[0012] In an optional embodiment, the baffle unit has opposing plug-in connection ends and gripping connection ends; The baffle unit is connected to the mounting frame via the plug-in connection end; a gripping hole is provided on the side of the baffle unit near the gripping connection end.

[0013] In an optional embodiment, both the first observation baffle and the second observation baffle are flat, transparent flat plates.

[0014] In an optional embodiment, the substrate has a plurality of positioning connection holes, and the substrate is positioned and connected to the wafer dicing machine through the plurality of positioning connection holes.

[0015] Secondly, this utility model provides a wafer dicing machine, including an observation window formed on the wafer dicing machine. The wafer dicing observation window described in any of the foregoing embodiments is connected to the wafer dicing machine through the observation window and is used to observe the interior of the wafer dicing machine.

[0016] The beneficial effects of the wafer dicing observation window and wafer dicing machine provided in this embodiment of the invention include: This invention provides a wafer dicing observation window and a wafer dicing machine having the observation window. The observation window allows for observation and monitoring of the wafer dicing process within the dicing machine. The observation window includes a substrate and an observation assembly mounted on the substrate. The observation assembly includes a mounting frame and a baffle unit detachably mounted within the mounting frame. A connection window is provided on the substrate, and the mounting frame surrounds the connection window so that the baffle unit completely covers it. Operators can observe and monitor the wafer dicing process inside the dicing machine through the baffle unit and the connection window. Because the baffle unit and the mounting frame are detachably connected, when slurry residue remains on the baffle unit during the dicing process, the baffle unit can be easily removed and replaced with a clean one, minimizing replacement difficulty. Furthermore, since the baffle unit is reusable and easy to clean, the cost is low. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the wafer dicing observation window provided in this embodiment from a first-view perspective; Figure 2 This is a schematic diagram of the wafer dicing observation window provided in this embodiment from a second perspective. Figure 3 This is a schematic diagram of the wafer dicing observation window provided in this embodiment from a third-view perspective; Figure 4 This is a schematic diagram of the structure of the first observation baffle and the second observation baffle in the wafer dicing observation window provided in this embodiment 1; Figure 5 This is a schematic diagram of the wafer dicing observation window provided in this embodiment 2 from a second perspective.

[0019] Icons: 100 - substrate; 110 - connection window; 120 - positioning connection hole; 200 - Observation component; 210 - Mounting frame; 211 - Supporting part; 2111 - Insertion slot; 2112 - Partition plate; 2113 - First sub-slot; 2114 - Second sub-slot; 212 - Limiting part; 220-Baffle unit; 220a-Plug-in connection end; 220b-Grabbing connection end; 221-First observation baffle; 222-Second observation baffle; 223-Grabbing hole. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0024] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0025] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.

[0026] In the field of semiconductor wafer processing technology, wafer dicing machines are the core process equipment before back-end packaging. Their core function is to precisely divide the entire wafer, which has completed front-end processes such as photolithography, etching, and doping, into bare chip dies with independent circuit functions, laying the foundation for subsequent chip packaging (such as bonding and molding).

[0027] During the wafer dicing process, in order to ensure dicing quality and optimize dicing parameters, operators need to observe and monitor the wafer dicing process. The main method is to observe and monitor through the observation window set on the wafer dicing machine. However, the slurry splashed during the wafer dicing process may remain on the observation window, thus affecting the field of view. In the existing technology, a special isolation oil film is usually set on the surface of the observation window. However, this special isolation oil film is easily scratched during use, affecting the isolation effect. Moreover, the oil film is difficult to replace and has a high cost.

[0028] This invention provides a wafer dicing observation window and a wafer dicing machine having the wafer dicing observation window, which enables observation of the wafer dicing process inside the wafer dicing machine.

[0029] The wafer dicing observation window provided by this utility model includes a substrate 100 and an observation component 200 disposed on the substrate 100; wherein, a connection window 110 is provided on the substrate 100 and is used to connect to the wafer dicing machine, and the observation component 200 enables observation of the inside of the wafer dicing machine.

[0030] Furthermore, the observation component 200 includes a mounting frame 210 and a baffle unit 220 detachably disposed within the mounting frame 210; the mounting frame 210 is disposed around the outer edge of the connection window 110 so that the baffle unit 220 can completely cover the connection window 110.

[0031] In this invention, since the baffle unit 220 and the mounting frame 210 are detachably connected, when mortar remains on the baffle unit 220 during the cutting process, the operator can easily remove the baffle unit 220 and replace it with a clean baffle unit 220 (or directly replace it with a new baffle unit 220). The replacement is easy, the baffle unit 220 is easy to clean and can be reused, thus reducing the cost of use.

[0032] The following describes in detail the overall structure, working principle, and technical effects of the wafer dicing observation window and wafer dicing machine provided by this utility model through embodiments and in conjunction with the accompanying drawings.

[0033] Example 1: Please see Figure 1 This embodiment provides a wafer dicing observation window and a wafer dicing machine having the wafer dicing observation window, wherein the wafer dicing observation window includes a substrate 100 and an observation component 200 disposed on the substrate 100, the observation component 200 includes a mounting frame 210 and a baffle unit 220 detachably disposed in the mounting frame 210.

[0034] In this embodiment, the observation component 200 can be connected to the wafer dicing machine via the substrate 100.

[0035] Specifically, the wafer dicing machine has an observation window, and the substrate 100 has a corresponding connection window 110, which connects the substrate 100 to the wafer dicing machine and connects the connection window 110 to the observation window.

[0036] It should be noted that the correspondence here means that when the connection window 110 is opened, it must correspond to the size and shape of the observation window; ideally, the connection window 110 should be set to completely overlap with the observation window.

[0037] Furthermore, a plurality of positioning connection holes 120 are provided on the substrate 100 around the connection window 110, and correspondingly, a plurality of positioning connection structures are provided on the wafer dicing machine around the observation window, so that the substrate 100 can be accurately positioned and connected to the wafer dicing machine through the plurality of positioning connection holes 120.

[0038] In other embodiments, the substrate 100 and the wafer dicing machine can be connected by any one of the following methods: bolt connection, screw connection, rivet connection, welding connection, or adhesive connection.

[0039] In some embodiments, the number of baffle units 220 can be multiple in order to meet specific operational needs (e.g., replacing the baffle unit 220 during wafer dicing).

[0040] In this embodiment, there are two baffle units 220, namely a first observation baffle 221 and a second observation baffle 222, and both the first observation baffle 221 and the second observation baffle 222 can be detachably disposed in the mounting frame 210.

[0041] Please see Figure 2 and Figure 3 Furthermore, the mounting frame 210 includes a supporting part 211 and a limiting part 212. The supporting part 211 has a insertion groove 2111 for fixing the first observation baffle 221 and the second observation baffle 222. At this time, the first observation baffle 221 and the second observation baffle 222 are both disposed in the insertion groove 2111, and the limiting part 212 is disposed on the side of the supporting part 211 away from the connection window 110, thereby preventing the first observation baffle 221 and the second observation baffle 222 from tilting to the side away from the connection window 110.

[0042] The connection between the aforementioned support portion 211 and the substrate 100 can be any one of bolt connection, screw connection, rivet connection, welding connection, or adhesive connection.

[0043] In this embodiment, both the first observation baffle 221 and the second observation baffle 222 can be flat, transparent flat plates.

[0044] It should be noted that the first observation baffle 221 and the second observation baffle 222 are roughly the same in shape, size and material. The positions of the first observation baffle 221 and the second observation baffle 222 in the insertion slot 2111 can be interchanged. For example, the first observation baffle 221 can be set on the side closer to the substrate 100 and the second observation baffle 222 can be set on the side farther away from the substrate 100; or the second observation baffle 222 can be set on the side closer to the substrate 100 and the first observation baffle 221 can be set on the side farther away from the substrate 100. No limitation is made here.

[0045] For example, the first observation baffle 221 is disposed on the side close to the substrate 100, and the second observation baffle 222 is disposed on the side away from the substrate 100. At this time, the first observation baffle 221 serves as an observation plate, allowing the operator to observe the wafer dicing process inside the wafer dicing machine through the first observation baffle 221. The second observation baffle 222 serves as a blocking plate, used to block materials sputtered during the wafer dicing process when the first observation baffle 221 is being replaced.

[0046] In the specific operation process, when slurry remains on the first observation baffle 221 during wafer dicing, the operator can remove the first observation baffle 221 from the mounting frame 210 to clean or replace it. In particular, when the wafer dicing machine is in operation, in order to prevent slurry or other materials from splashing out of the wafer dicing machine due to the replacement of the first observation baffle 221, a second observation baffle 222 is set on the side away from the substrate 100 to block the materials splashed out during wafer dicing. After the first observation baffle 221 has been cleaned and replaced, when it is placed back into the mounting frame 210, the operator can choose to clean or replace the second observation baffle 222, which may have slurry residue. This allows the baffle unit 220 to be replaced without stopping the wafer dicing machine, so as to maintain a clear field of view.

[0047] Please see Figure 4 To facilitate the operator in removing the first observation baffle 221 and the second observation baffle 222 from the mounting frame 210, in this embodiment, both the first observation baffle 221 and the second observation baffle 222 have opposing plug-in connection ends 220a and gripping connection ends 220b; wherein, the plug-in connection ends 220a of the first observation baffle 221 and the second observation baffle 222 are plugged into the plug-in slot 2111; gripping holes 223 are provided on the side of the first observation baffle 221 and the second observation baffle 222 near the plug-in connection ends 220a.

[0048] Understandably, the gripping hole 223 is designed to provide gripping space for the operator's hands, so that the operator can easily clean and replace the first observation baffle 221 and the second observation baffle 222.

[0049] The wafer dicing observation window provided in this embodiment operates as follows when sputtered material remains on the baffle unit 220, affecting the field of view: When the wafer dicing machine is stopped, the operator only needs to replace the first observation baffle 221 located on the side closest to the substrate 100 and place the cleaned or replaced first observation baffle 221 back in its original position. Specifically, the operator can hold the gripping hole 223 of the first observation baffle 221 and pull the first observation baffle 221 out of the mounting frame 210, and then place the cleaned or replaced first observation baffle 221 back into the insertion slot 2111 of the mounting frame 210.

[0050] When the wafer dicing machine is not stopped, the operator needs to replace the first observation baffle 221 located near the substrate 100. At this time, the second observation baffle 222 is used to block the material sputtered during the wafer dicing process. After cleaning or replacing the first observation baffle 221, the operator can then choose whether to clean or replace the second observation baffle 222. The replacement process of the first observation baffle 221 and the second observation baffle 222 is roughly the same as the replacement process of the first observation baffle 221 when the wafer dicing machine is stopped, and will not be described in detail here. On the one hand, since the first observation baffle 221 and the second observation baffle 222 are inserted into the mounting frame 210, and both the first observation baffle 221 and the second observation baffle 222 are provided with gripping holes 223, it is convenient for operators to replace the first observation baffle 221 and / or the second observation baffle 222. On the other hand, compared with the prior art of setting a special isolation oil film on the observation window, the first observation baffle 221 and the second observation baffle 222 can be reused and are easy to clean, thus reducing costs.

[0051] Example 2: This embodiment is largely the same as Embodiment 1 in terms of working principle and technical effect. The difference is that in this embodiment, the first observation baffle 221 and the second observation baffle 222 are independently separated in the insertion slot 2111, so that when any one of the first observation baffle 221 or the second observation baffle 222 is removed, the other baffle can remain stable.

[0052] Please see Figure 5In this embodiment, a partition plate 2112 is provided in the insertion slot 2111 along the length direction to divide the insertion slot 2111 into an independent first sub-slot 2113 and a second sub-slot 2114 in the length direction; the first observation baffle 221 and the second observation baffle 222 can be respectively disposed in the first sub-slot 2113 and the second sub-slot 2114, so that when any baffle is removed, it will not affect the other baffle (for example, when the first observation baffle 221 is removed, the second observation baffle 222 will be lifted at the same time), and after any baffle is removed, the other baffle can remain stable and will not shake due to the increased space occupied.

[0053] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer dicing observation window, characterized in that, Suitable for observing the interior of a wafer dicing machine, including: A substrate (100) having a connection window (110) on it. The observation assembly (200) includes a mounting frame (210) and a baffle unit (220) detachably disposed within the mounting frame (210). The mounting frame (210) is arranged around the outer edge of the connection window (110) so that the baffle unit (220) covers the connection window (110).

2. The wafer dicing observation window according to claim 1, characterized in that, The baffle unit (220) includes a first observation baffle (221) and a second observation baffle (222); The first observation baffle (221) and the second observation baffle (222) are respectively detachably disposed within the mounting frame (210).

3. The wafer dicing observation window according to claim 2, characterized in that, The mounting frame (210) includes a support part (211), and the support part (211) has a plug-in groove (2111). The first observation baffle (221) and the second observation baffle (222) are inserted into the insertion slot (2111).

4. The wafer dicing observation window according to claim 3, characterized in that, A partition plate (2112) is provided in the insertion slot (2111) along the length direction, and the partition plate (2112) divides the insertion slot (2111) into a first sub-slot (2113) and a second sub-slot (2114). The first observation baffle (221) and the second observation baffle (222) are respectively inserted into the first sub-slot (2113) and the second sub-slot (2114).

5. The wafer dicing observation window according to claim 3, characterized in that, The mounting frame (210) also includes a limiting part (212), which is located on the side of the bearing part (211) away from the connecting window (110) and is used to prevent the first observation baffle (221) and the second observation baffle (222) from tipping over.

6. The wafer dicing observation window according to claim 3, characterized in that, The connection between the support part (211) and the substrate (100) can be any one of bolt connection, screw connection, rivet connection, welding connection, or adhesive connection.

7. The wafer dicing observation window according to claim 1, characterized in that, The baffle unit (220) has opposing plug-in connection end (220a) and gripping connection end (220b). The baffle unit (220) is connected to the mounting frame (210) by the plug-in connection end (220a); a gripping hole (223) is provided on the side of the baffle unit (220) near the gripping connection end (220b).

8. The wafer dicing observation window according to claim 2, characterized in that, Both the first observation baffle (221) and the second observation baffle (222) are flat, transparent flat plates.

9. The wafer dicing observation window according to claim 1, characterized in that, The substrate (100) has a plurality of positioning connection holes (120), and the substrate (100) is positioned and connected to the wafer dicing machine through the plurality of positioning connection holes (120).

10. A wafer dicing machine, characterized in that, The wafer dicing observation window, as described in any one of claims 1-9, is connected to the wafer dicing machine and is used to observe the interior of the wafer dicing machine.

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