A lightweight composite structural panel resistant to die marking

CN224810255UActive Publication Date: 2026-09-29HANPIN (KUNSHAN) ELECTRONIC CO LTD
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Patent Information

Application Number
CN202522298697.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-30
Publication Date
2026-09-29
Estimated Expiration
2035-10-30

AI Technical Summary

Technical Problem

[0004]本实用新型提供的一种抗模印的轻量复合结构板,有效的解决了复合结构板容易产生模印、不能兼具减重与强度、缓冲性能不足的问题

Benefits of technology

[0013]1、当缓冲层与产品贴合后,产品不平整的表面与缓冲胶层贴合对复合结构板产生的应力首先被柔软的缓冲胶层吸收和分散,剩余的应力被第一铝合金层和第二铝合金层均化,使得经过第一铝合金层后的应力难以形成集中的、可传递至表面的点状形变,剩余应力被PET层利用自身柔性的特点吸收,杜绝了模印的产生。

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Abstract

The utility model discloses a kind of lightweight composite structure board of anti-mold, including first aluminum alloy layer, the first epoxy curing adhesive layer of first aluminum alloy layer upper end face, the second epoxy curing adhesive layer of first aluminum alloy layer lower end, the PET layer of first epoxy curing adhesive layer upper end face, the second aluminum alloy layer of second epoxy curing adhesive layer lower end face, the buffer adhesive layer of second aluminum alloy layer lower end face and the appearance coating of PET layer upper end face.Advantage: when buffer layer and product are attached, the uneven surface of product and the stress generated by the attachment of buffer adhesive layer to composite structure board are first absorbed and dispersed by soft buffer adhesive layer, and the remaining stress is homogenized by first aluminum alloy layer and second aluminum alloy layer, so that the stress after first aluminum alloy layer is difficult to form concentrated, point-like deformation that can be transmitted to the surface, and the remaining stress is absorbed by the flexible characteristics of PET layer, eliminating the generation of mold.
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Description

Technical Field

[0001] This utility model relates to the field of composite materials, specifically a lightweight composite structural plate resistant to mold printing. Background Technology

[0002] With the development of consumer electronics, home appliances, and automobiles, the requirements for product appearance, weight, and structural strength are increasing. Aluminum alloys are widely used as structural or aesthetic components due to their high strength and good texture. However, pure aluminum alloy sheets have a high specific gravity, are prone to scratches, and are susceptible to "molding" (i.e., the outline or indentation of the internal structure is visible on the surface through the material) when in contact with internal components or under pressure, affecting the product's aesthetics. Current technologies often use plastic or fiberglass layers laminated onto aluminum alloy substrates to reduce weight and improve appearance. However, these structures often have the following shortcomings: 1. Poor anti-molding effect: In simple double or triple-layer structures, under localized pressure, the outline of the internal rigid structures (such as screw pillars, battery edges, etc.) can still be transmitted to the surface, forming visible molding. 2. The contradiction between weight reduction and strength: Excessively reducing the thickness of the aluminum alloy to reduce weight sacrifices overall structural strength; while increasing the thickness leads to increased weight. 3. Insufficient interlayer bonding strength and buffering performance: If the layers are only connected by ordinary adhesives, their bonding strength, impact resistance and buffering performance are limited, and they cannot effectively disperse and absorb local stress.

[0003] Therefore, it is necessary to provide a lightweight composite structural panel that is resistant to mold printing. Utility Model Content

[0004] This utility model provides a lightweight composite structural board that is resistant to mold marks, which effectively solves the problems of composite structural boards being prone to mold marks, not being able to achieve both weight reduction and strength, and having insufficient cushioning performance.

[0005] The technical solution adopted by this utility model is: a lightweight composite structural board with anti-molding properties, including a first aluminum alloy layer, a first epoxy curing adhesive layer disposed on the upper end surface of the first aluminum alloy layer, a second epoxy curing adhesive layer disposed on the lower end surface of the first aluminum alloy layer, a PET layer disposed on the upper end surface of the first epoxy curing adhesive layer, a second aluminum alloy layer disposed on the lower end surface of the second epoxy curing adhesive layer, a buffer adhesive layer disposed on the lower end surface of the second aluminum alloy layer, and an appearance coating disposed on the upper end surface of the PET layer.

[0006] Furthermore, the exterior coating is either a PU paint layer or a UV paint layer.

[0007] Furthermore, the buffer adhesive layer is one of epoxy resin modified adhesive, polyurethane adhesive, or silicone.

[0008] Furthermore, the thickness of the PET layer ranges from 0.025mm to 0.06mm.

[0009] Furthermore, the thickness of both the first aluminum alloy layer and the second aluminum alloy layer ranges from 0.05 mm to 0.2 mm.

[0010] Furthermore, the thickness of both the first epoxy curing adhesive layer and the second epoxy curing adhesive layer ranges from 0.01 mm to 0.1 mm.

[0011] Furthermore, the thickness of the buffer adhesive layer is 0.05mm to 0.15mm.

[0012] Beneficial effects of the utility model:

[0013] 1. When the buffer layer is bonded to the product, the stress generated by the uneven surface of the product and the bonding of the buffer layer to the composite structure board is first absorbed and dispersed by the soft buffer layer. The remaining stress is homogenized by the first aluminum alloy layer and the second aluminum alloy layer, making it difficult for the stress after passing through the first aluminum alloy layer to form concentrated point deformation that can be transmitted to the surface. The remaining stress is absorbed by the PET layer using its own flexible characteristics, thus preventing the generation of mold marks.

[0014] 2. By replacing a single-layer thick aluminum alloy with a first and second aluminum alloy layer, the equivalent bending stiffness of the "sandwich structure" formed by the first aluminum alloy layer, the second epoxy curing adhesive layer, and the second aluminum alloy layer is higher, even with the total thickness remaining the same or even reduced. Therefore, thinner and lighter aluminum alloys can be used to achieve the same or higher structural strength, thus achieving weight reduction. At the same time, the sandwich structure forms a highly integral composite core material, greatly improving the bending stiffness and dimensional stability of the board, making it less prone to warping and deformation.

[0015] 3. At the same time, all layers are made of mature industrial materials, which can be formed in one step through mature processes such as hot pressing and curing, resulting in high production efficiency and controllable costs. Attached Figure Description

[0016] Figure 1 This is an overall schematic diagram of a mold-resistant lightweight composite structural panel provided for an embodiment of this application.

[0017] The markings in the diagram are as follows: 1. First aluminum alloy layer; 2. First epoxy curing adhesive layer; 3. Second epoxy curing adhesive layer; 4. PET layer; 5. Second aluminum alloy layer; 6. Buffer adhesive layer; 7. Outer coating. Detailed Implementation

[0018] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0019] like Figure 1As shown, the embodiments of this application provide a lightweight composite structural board resistant to mold printing. Its structure includes a first aluminum alloy layer 1, a first epoxy curing adhesive layer 2 disposed on the upper surface of the first aluminum alloy layer 1, a second epoxy curing adhesive layer 3 disposed on the lower surface of the first aluminum alloy layer 1, a PET layer 4 disposed on the upper surface of the first epoxy curing adhesive layer 2, a second aluminum alloy layer 5 disposed on the lower surface of the second epoxy curing adhesive layer 3, a buffer adhesive layer 6 disposed on the lower surface of the second aluminum alloy layer 5, and an appearance coating 7 disposed on the upper surface of the PET layer 4. The first epoxy curing adhesive layer 2 strongly bonds the first aluminum alloy layer 1 and the PET layer 4, and the second epoxy curing adhesive layer 3 strongly bonds the second aluminum alloy layer 5 and the first aluminum alloy layer 1.

[0020] In the above design, after the buffer layer is bonded to the product, the stress generated by the uneven surface of the product and the bonding of the buffer adhesive layer 6 to the composite structural board is first absorbed and dispersed by the soft buffer adhesive layer 6. The remaining stress is homogenized by the first aluminum alloy layer 1 and the second aluminum alloy layer 5, making it difficult for the stress after passing through the first aluminum alloy layer 1 to form concentrated point deformations that can be transmitted to the surface. The remaining stress is absorbed by the PET layer 4 using its own flexible characteristics. The outer coating 7 provides color, texture, and surface protection. By replacing one layer of aluminum alloy with the first aluminum alloy layer 1 and the second aluminum alloy layer 5, while ensuring the total thickness and strength, the use of the intermediate second epoxy curing adhesive layer 3 significantly improves the structure's resistance to bending and deformation.

[0021] Specifically, the outer coating 7 is either a PU paint layer or a UV paint layer. The outer coating 7 is applied to the PET layer 4 by spraying.

[0022] In the above design, the appearance coating 7 can meet the visual requirements of actual application scenarios.

[0023] Specifically, the buffer layer 6 is one of epoxy resin modified adhesive, polyurethane adhesive, or silicone.

[0024] In the above design, epoxy resin modified adhesive, polyurethane adhesive or silicone all have good adhesion and flexibility, which can not only meet the requirements of product surface bonding, but also play a buffering role, effectively absorbing and dispersing point pressure from the inside.

[0025] Specifically, the thickness of the PET layer 4 ranges from 0.025 mm to 0.06 mm.

[0026] In the above design, the PET layer 4 serves as both a decorative layer and a cushioning layer, with a thickness ranging from 0.025mm to 0.06mm. The PET layer 4 can absorb minor deformations using its own flexibility, while also meeting the requirements for thinner products.

[0027] Specifically, the thickness of the first aluminum alloy layer 1 and the second aluminum alloy layer 5 both range from 0.05 mm to 0.2 mm.

[0028] In the above design, the first aluminum alloy layer 1 serves as the main structural support layer, and the second aluminum alloy layer 5 also plays a supporting role, enhancing the overall rigidity through the first aluminum alloy layer 1 and the second aluminum alloy layer 5. The first aluminum alloy layer 1 and the second aluminum alloy layer 5, both with a thickness range of 0.05mm to 0.2mm, can meet the requirements for bending resistance and deformation resistance, while also satisfying the requirements for product thinness.

[0029] Specifically, the thickness of the first epoxy curing adhesive layer 2 and the second epoxy curing adhesive layer 3 both range from 0.01 mm to 0.1 mm.

[0030] In the above design, the first epoxy curing adhesive layer 2 and the second epoxy curing adhesive layer 3, both with a thickness range of 0.01mm to 0.1mm, have sufficient bonding strength to achieve bonding between the first aluminum alloy layer 1 and the PET layer 4, and between the second aluminum alloy layer 5 and the first aluminum alloy layer 1, while also meeting the requirements for product thinness.

[0031] Specifically, the thickness of the buffer adhesive layer 6 is 0.05mm to 0.15mm.

[0032] In the above design, the buffer layer 6 can absorb the pressure caused by the unevenness of the product surface. The buffer layer 6 with a thickness of 0.05mm to 0.15mm meets the requirements for spacing deformation and product thinning.

[0033] In further detail, it should be understood that the above description is only a specific embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A lightweight composite structural panel resistant to mold printing, characterized in that: It includes a first aluminum alloy layer (1), a first epoxy curing adhesive layer (2) disposed on the upper end of the first aluminum alloy layer (1), a second epoxy curing adhesive layer (3) disposed on the lower end of the first aluminum alloy layer (1), a PET layer (4) disposed on the upper end of the first epoxy curing adhesive layer (2), a second aluminum alloy layer (5) disposed on the lower end of the second epoxy curing adhesive layer (3), a buffer adhesive layer (6) disposed on the lower end of the second aluminum alloy layer (5), and an appearance coating (7) disposed on the upper end of the PET layer (4).

2. The anti-molding lightweight composite structural panel according to claim 1, characterized in that: The exterior coating (7) is either a PU coating or a UV coating.

3. The anti-molding lightweight composite structural panel according to claim 1, characterized in that: The buffer adhesive layer (6) is one of epoxy resin modified adhesive, polyurethane adhesive or silicone.

4. The anti-molding lightweight composite structural panel according to claim 1, characterized in that: The thickness of the PET layer (4) ranges from 0.025 mm to 0.06 mm.

5. The anti-molding lightweight composite structural panel according to claim 1, characterized in that: The thickness of the first aluminum alloy layer (1) and the second aluminum alloy layer (5) is both in the range of 0.05 mm to 0.2 mm.

6. The anti-molding lightweight composite structural panel according to claim 1, characterized in that: The thickness of the first epoxy curing adhesive layer (2) and the second epoxy curing adhesive layer (3) are both in the range of 0.01 mm to 0.1 mm.

7. The anti-molding lightweight composite structural panel according to claim 1, characterized in that: The thickness of the buffer adhesive layer (6) is 0.05mm to 0.15mm.