A thermal management integrated module

Abstract

The application discloses a heat management integrated module, which comprises a liquid storage tank and a first heat exchanger; the liquid storage tank comprises a tank body and a head, the head is fixedly connected with the tank body, the head is provided with a head flow channel, and the head flow channel is communicated with a tank cavity of the tank body; the first heat exchanger comprises a first end plate, the first end plate is provided with a first interface, the first interface is communicated with an internal passage of the first heat exchanger; the head is welded with the first end plate, and the first interface is communicated with the head flow channel. The heat management integrated module is beneficial to reducing the overall weight and volume through structure optimization.

Description

Technical Field

[0001] This application relates to the field of thermal management technology, specifically to a thermal management integrated module. Background Technology

[0002] The automotive heat exchange management system is used to regulate the operating temperature of various vehicle components, including all or some parts of the cab, battery, motor, and electronic control system. The heat exchange management system includes an integrated module that combines the reservoir, heat exchanger, flow channel plate, and related piping. This integrated module is relatively large in weight and size, occupying a significant amount of space within the vehicle and making it inconvenient for vehicle manufacturers to transport and assemble. Utility Model Content

[0003] The purpose of this application is to provide a thermal management integrated module that, through structural optimization, helps to reduce overall weight and volume.

[0004] To address the aforementioned technical problems, this application provides a thermal management integrated module, comprising a liquid storage tank and a first heat exchanger; the liquid storage tank includes a tank body and a head, the head being fixedly connected to the tank body, the head having a flow channel communicating with the tank cavity of the tank body; the first heat exchanger includes a first end plate, the first end plate having a first interface communicating with the internal channel of the first heat exchanger; the head is welded to the first end plate, and the first interface communicating with the flow channel of the head.

[0005] Using the above scheme, the first heat exchanger of the heat pipe integrated module is directly welded and fixed to the liquid storage tank. Specifically, the end cap of the liquid storage tank is welded to the first end plate of the first heat exchanger. The solder can be filled between the end cap and the first end plate, which can not only ensure the reliability of the connection, but also provide good sealing between the two. An end cap flow channel is set on the end cap, which connects the first interface of the first end plate and the tank cavity. In this way, the traditional joint assembly can be eliminated, and the joints and related accessories (such as connecting bolts, sealing rings, etc.) can be eliminated, reducing the space occupied by the traditional joint assembly, and reducing the overall volume and weight of the heat management integrated module. Attached Figure Description

[0006] Figure 1 This is a schematic diagram of the structure of the thermal management integrated module provided in one embodiment of this application;

[0007] Figure 2 for Figure 1 Schematic diagram of the intermediate liquid storage tank;

[0008] Figure 3 This is a schematic diagram of the structure after the liquid storage tank and the first heat exchanger are connected in a specific embodiment;

[0009] Figure 4 for Figure 3 Schematic diagram of the cross section along line P1-P1;

[0010] Figure 5 This is a schematic diagram of the structure after the partition plate, the first flow channel plate, and the second flow channel plate are assembled in a specific embodiment. Figure 1 ;

[0011] Figure 6 This is a schematic diagram of the structure after the partition plate, the first flow channel plate, and the second flow channel plate are assembled in a specific embodiment. Figure 2 ;

[0012] Figure 7 This is a schematic diagram of the partition plate in a specific embodiment;

[0013] Figure 8 This is a schematic diagram of the structure of the first flow channel plate in a specific embodiment from one viewpoint;

[0014] Figure 9 This is a schematic diagram of the first flow channel plate in a specific embodiment from another perspective;

[0015] Figure 10 This is a partial structural diagram of the thermal management integrated module in a specific embodiment;

[0016] Figure 11 for Figure 10 Schematic diagram of the cross section along the P2-P2 direction;

[0017] Figure 12 for Figure 10 A schematic diagram of the third interface connector from one perspective;

[0018] Figure 13 for Figure 10 A structural schematic diagram of the third interface connector from another perspective;

[0019] Figure 14 This is a schematic diagram of the flow path of the thermal management integrated module provided in one embodiment of this application.

[0020] The annotations in the attached figures are explained as follows:

[0021] Storage tank 100; tank body 110; tank cavity 111; end cap 120; end cap flow channel 121; flow channel groove 1211; flow hole 1212;

[0022] First heat exchanger 200; First end plate 210; Second end plate 220; First port 1A; Second port 2A; Third port 3A; Fourth port 4A;

[0023] Partition plate 300; First partition plate face 311; Second partition plate face 312; First connecting hole 321; Second connecting hole 322; Third connecting hole 323; Fourth connecting hole 324; Fifth connecting hole 325; Sixth connecting hole 326; Seventh connecting hole 327; Eighth connecting hole 328; Fourth receiving hole 330;

[0024] First flow channel plate 400; first flow channel groove 410; first receiving hole 411; second receiving hole 412; second flow channel groove 420; third receiving hole 421; third flow channel groove 430.

[0025] Second heat exchanger 500; Fifth port 5A; Sixth port 6A;

[0026] Second flow channel plate 600; fourth flow channel groove 610; fifth flow channel groove 620;

[0027] First interface socket 701; sensor socket 702; second interface socket 703; third interface socket 704; first seat portion 741; first mounting cavity 7411; second seat portion 742; second mounting cavity 7421; adapter groove portion 743; fourth interface socket 705;

[0028] First valve 801; Second valve 802;

[0029] First connecting seat 901; Second connecting seat 902;

[0030] First flow channel cavity 11B; second flow channel cavity 12B; third flow channel cavity 13B; fourth flow channel cavity 14B; fifth flow channel cavity 15B; transition channel 2B. Detailed Implementation

[0031] To enable those skilled in the art to better understand the technical solutions of this application, the specific embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0032] The ordinal numbers used in the embodiments of this application are for distinguishing different components with the same name and do not indicate a specific order or primary / secondary relationship. The term "multiple" in this application refers to two or more.

[0033] Please refer to Figures 1 to 4 , Figure 1 This is a schematic diagram of the structure of the thermal management integrated module provided in one embodiment of this application; Figure 2 for Figure 1 Schematic diagram of the intermediate liquid storage tank; Figure 3 This is a schematic diagram of the structure after the liquid storage tank and the first heat exchanger are connected in a specific embodiment; Figure 4 for Figure 3 Schematic diagram of cross section from P1 to P1.

[0034] This embodiment provides a thermal management integrated module applicable to a vehicle's thermal management system. The integrated module includes a liquid storage tank 100 and a first heat exchanger 200. The liquid storage tank 100 includes a tank body 110 and a head 120, which is fixedly connected to the tank body 110. The tank body 110 has an open structure, and the head 120 is used to seal the openness of the tank body 110. The head 120 has a flow channel 121 that communicates with the tank cavity 111 of the tank body 110. The first heat exchanger 200 includes a first end plate 210 with a first interface 1A that communicates with the internal channel of the first heat exchanger 200. The head 120 is welded to the first end plate 210, and the first interface 1A communicates with the flow channel 121; in other words, the position of the flow channel 121 corresponds to the position of the first interface 1A.

[0035] Using the above scheme, the first heat exchanger 200 of the heat pipe integrated module is directly welded to the liquid storage tank 100. Specifically, the end cap 120 of the liquid storage tank 100 is welded to the first end plate 210 of the first heat exchanger 200. The solder can be filled between the end cap 120 and the first end plate 210, which can ensure the reliability of the connection and provide good sealing between the two. An end cap flow channel 121 is provided on the end cap 120, which connects the first interface 1A and the tank cavity 111. In this way, the traditional joint assembly can be eliminated, and the joints and related accessories (such as connecting bolts, sealing rings, etc.) can be eliminated, reducing the space occupied by the traditional joint assembly. This reduces the overall volume and weight of the heat management integrated module, and also reduces material costs. In addition, the direct connection between the end cap flow channel 121 and the first interface 1A of the first heat exchanger 200 can reduce flow resistance.

[0036] In application, the tank body 110 of the storage tank 100 can be formed by stretching, and the end cap 120 can be formed by precision carving or hot forging. The end cap 120 and the tank body 110 can be fixed by welding, such as laser welding, which provides a reliable connection and good sealing performance.

[0037] In some implementations, such as Figure 4 As shown, the end cap flow channel 121 may include a flow channel groove portion 1211 and a flow hole portion 1212, combined with Figure 2The flow channel 1211 can have a certain length. The flow channel 1211 is recessed from the surface of the end cap 120 toward the first heat exchanger 200 toward the tank body 110. The flow hole 1212 penetrates the end cap 120 and communicates with the flow channel 1211. After assembly, the tank cavity 111 can communicate with the first interface 1A through the flow hole 1212 and the flow channel 1211. The wall forming the end cap flow channel 121 includes the wall forming the flow channel 1211 and part of the wall of the first end plate 210. In this way, even when there are manufacturing tolerances or assembly tolerances, the communication between the first interface 1A and the flow channel 1211 can be ensured, thereby ensuring the communication between the first interface 1A and the tank cavity 111.

[0038] In addition, compared with the related technology of setting a flow channel inside the head that connects to the outlet of the liquid storage tank, in this implementation, a groove is opened on the surface of the head 120 to form a flow channel with the first end plate 210 of the first heat exchanger 200, which can help reduce the thickness of the head 120.

[0039] The shape and size of the flow channel 1211 can be set according to the application requirements, and no specific limitation is made here.

[0040] In some other implementations, the head flow channel 121 may also consist only of a flow hole 1212 penetrating the head 120.

[0041] The end cap 120 of the liquid storage tank 100 may also be fixed with a connecting seat that communicates with the tank cavity 111, so as to facilitate the connection of relevant components in the thermal management system to the connecting seat through pipelines to introduce refrigerant into the liquid storage tank 100; it is understood that the connecting seat has a connecting channel, the end cap 120 has a connecting through hole, and the connecting through hole can connect the connecting channel and the tank cavity 111. Figure 2 In the example, the end cap 120 is fixedly connected to a first connecting seat 901 and a second connecting seat 902. The first connecting seat 901 and the second connecting seat 902 can be formed by a stretching process. The first connecting seat 901 and the second connecting seat 902 can be welded to the end cap 120, such as by brazing, which is convenient to implement and ensures good sealing.

[0042] Please refer to this as well. Figures 5 to 11 , Figure 5 and Figure 6 The diagrams show the assembled structure of the partition plate, the first flow channel plate, and the second flow channel plate from two different perspectives. Figure 7 This is a schematic diagram of the partition plate in a specific embodiment; Figure 8 and Figure 9 Separate dust removal schematic diagrams of the first flow channel plate from two different perspectives; Figure 10 This is a partial structural diagram of the thermal management integrated module in a specific embodiment; Figure 11 for Figure 10Schematic diagram of the cross section from P2 to P2.

[0043] In some embodiments, the thermal management integrated module includes a partition plate 300 and a first flow channel plate 400. The partition plate 300 has opposing first partition plate facets 311 and 312, the first partition plate facet 311 being welded to a first heat exchanger 200, and the second partition plate facet 312 being welded to the first flow channel plate 400. Figure 1 As shown, the first heat exchanger 200 is located below the partition plate 300, the first partition plate surface 311 of the partition plate 300 faces the first heat exchanger 200, the second partition plate surface 312 faces upward, and the first flow channel plate 400 is located above the partition plate 300.

[0044] The partition plate 300 and the first flow channel plate 400 enclose at least one flow channel cavity. The partition plate 300 is provided with at least one connecting hole, and one interface of the first heat exchanger 200 can be connected to one flow channel cavity through one connecting hole. In this way, the flow of fluid can be distributed through the arrangement of the flow channel cavity. Welding the partition plate 300 and the first flow channel plate 400 can ensure the sealing of the flow channel cavity. The first heat exchanger 200 is directly welded to the partition plate 300, and the sealing between the two can be guaranteed. The interface of the first heat exchanger 200 can be aligned with the connecting hole of the partition plate 300 to achieve communication, eliminating the need for traditional joint assembly, making the structure of the thermal management integrated module compact, and reducing the overall space and weight.

[0045] In a specific implementation, the first heat exchanger 200 includes a second end plate 220, which is disposed opposite to the first end plate 210. The first partition plate face 311 of the partition plate 300 is welded to the second end plate 220. Along the plate stacking direction of the first heat exchanger 200, at least a portion of the first heat exchanger 200 is located between the first partition plate face 311 and the liquid storage tank 100. In this way, the liquid storage tank 100 and the partition plate 300 are respectively disposed on both sides of the first heat exchanger 200, which facilitates the integration of related structures on the partition plate 300 and avoids interference with the side where the liquid storage tank 100 is located.

[0046] The following is combined with Figure 14 The specific configuration of the flow channel cavity and other related structures is illustrated using the specific embodiment shown in the figure. In application, adaptive adjustments can be made based on actual needs. Figure 14 It shows Figure 1 The diagram shows the flow path of the basic thermal management module.

[0047] like Figure 14As shown, the first heat exchanger 200 can have two internal channels, each with two ports for fluid inflow and outflow, respectively. The first internal channel has a first port 1A and a fourth port 4A, with port 1A serving as the inlet and port 4A as the outlet. The second internal channel has a second port 2A and a third port 3A, with port 3A serving as the inlet and port 2A as the outlet. This illustration uses the example of high-pressure and low-pressure refrigerant flowing within the first heat exchanger 200; however, in practical applications, the fluid within the first heat exchanger 200 can be other fluids.

[0048] In some embodiments, at least one flow channel cavity formed by the partition plate 300 and the first flow channel plate 400 includes a first flow channel cavity 11B. At least one connecting hole in the partition plate 300 includes a first connecting hole 321, which corresponds to and communicates with the second interface 2A of the first heat exchanger 200. The first connecting hole 321 communicates with the first flow channel cavity 11B and is located on the cavity wall of the first flow channel cavity 11B. It is understood that the first connecting hole 321 is located on the partition plate 300 in the plate area used to enclose the first flow channel cavity 11B. The first flow channel plate 400 has a first receiving hole 411, which communicates with the first flow channel cavity 11B. It is understood that the first receiving hole 411 is located on the first flow channel plate 400 in the plate area used to enclose the first flow channel cavity 11B.

[0049] In this way, the refrigerant in the internal channel of the first heat exchanger 200 can flow out from the second interface 2A to the first flow channel cavity 11B, and connect to other components (such as the compressor) in the thermal management system through the first connector hole 411. Since the traditional joint assembly is eliminated, the flow resistance of the refrigerant can be reduced.

[0050] In some implementations, the first flow channel plate 400 has a second receiving hole 412, which communicates with the first flow channel cavity 11B. The second receiving hole 412 is positioned relative to the first receiving hole 411 and close to the first communicating hole 321. The thermal management integrated module includes a sensor holder 702 and a first interface holder 701. The sensor holder 702 is mounted in the second receiving hole 412, and the first interface holder 701 is mounted in the first receiving hole 411. The sensor holder 702 can be used to install a sensor, which can facilitate the detection of relevant parameters of the refrigerant flowing out of the first heat exchanger 200, so that the thermal management system can perform relevant control based on the sensor feedback. The first interface holder 701 can be used to connect pipelines to introduce the refrigerant flowing out of the second interface 2A into other components such as the compressor.

[0051] Since the second connector hole 412 is close to the first connecting hole 321, the refrigerant flowing out of the second interface 2A can first pass through the sensor seat 702 and then through the first interface seat 701 after flowing out of the first connecting hole 321, which can ensure the accuracy of the detection of the refrigerant flowing out of the first heat exchanger 200.

[0052] In applications, the sensor mounted on the sensor mount 702 can be a temperature sensor or a pressure sensor, or it can be an integration of temperature and pressure sensors.

[0053] Both the first interface seat 701 and the sensor seat 702 can be formed using a stretching process to reduce costs. Welding tabs can be installed between the first interface seat 701 and the sensor seat 702 and the first flow channel plate 400, allowing for reliable connection and easy sealing.

[0054] In practice, the partition plate 300 can be a flat plate structure to facilitate welding of the partition plate 300 to the first heat exchanger 200, and also to ensure the sealing between the partition plate 300 and the first heat exchanger 200.

[0055] A flow channel groove can be provided on the first flow channel plate 400. The opening of the flow channel groove faces the second partition plate surface 312 of the partition plate 300. After the first flow channel plate 400 and the partition plate 300 are welded, the second partition plate surface 312 and the plate area corresponding to the flow channel groove form a flow channel cavity. The position of the connecting hole on the partition plate 300 that communicates with the flow channel cavity corresponds to the position of the flow channel groove.

[0056] Both the partition plate 300 and the first flow channel plate 400 can be made of stamped plates, that is, formed by stamping process, which is simple to manufacture and has a reliable structure.

[0057] The first flow channel plate 400 is provided with a first flow channel groove 410. The first flow channel groove 410 is recessed from the side of the first flow channel plate 400 facing the partition plate 300 in a direction away from the partition plate 300. The first flow channel groove 410 and a portion of the partition plate 300 enclose each other to form the aforementioned first flow channel cavity 11B. The groove wall of the first flow channel groove 410 is provided with a first receiving hole 411 and a second receiving hole 412. The first receiving hole 411 and the second receiving hole 412 can be respectively located at two ends of the first flow channel groove 410. The first connecting hole 321 on the partition plate 300 can correspond to the position of the second receiving hole 412. In this way, after the refrigerant flowing out of the second interface 2A of the first heat exchanger 200 flows out of the first connecting hole 321, it can be detected by the sensor installed in the second receiving hole 412. Afterward, the refrigerant flows to the other end of the first flow channel groove 410 and flows out from the first interface seat 701 connected to the second receiving hole 412.

[0058] In some implementations, the thermal management integrated module includes a second heat exchanger 500, which is welded to the first partition plate face 311 of the partition plate 300. In other words, the second heat exchanger 500 and the first heat exchanger 200 are located on the same side of the partition plate 300. This improves the integration of the thermal management integrated module and makes its structure more compact.

[0059] like Figure 14 As shown, the second heat exchanger 500 may have two internal channels, each with two interfaces for fluid inflow and outflow, respectively. In application, the two internal channels of the second heat exchanger 500 can be used for the flow of refrigerant and coolant, respectively. In a vehicle's thermal management system, this can be used for thermal management of components such as batteries. In this integrated thermal management module, the internal channel in the second heat exchanger 500 for refrigerant flow can be connected to the first heat exchanger 200. Figure 14 Only the fifth port 5A and the sixth port 6A in the second heat exchanger 500 are marked. The internal channels connected to the fifth port 5A and the sixth port 6A are used for the flow of refrigerant. The fifth port 5A serves as the inlet and is connected to the fourth port 4A of the first heat exchanger 200. The sixth port 6A serves as the outlet and is connected to the third port 3A of the first heat exchanger 200.

[0060] The partition plate 300 and the first flow channel plate 400 enclose at least one flow channel cavity, including a second flow channel cavity 12B. The partition plate 300 has at least one connecting hole, including a second connecting hole 322 and a third connecting hole 323. The second connecting hole 322 corresponds to and is connected to the third interface 3A of the first heat exchanger 200. The third connecting hole 323 corresponds to and is connected to the fifth interface 5A of the second heat exchanger 500. Both the second connecting hole 322 and the third connecting hole 323 are connected to the second flow channel cavity 12B. Both the second connecting hole 322 and the third connecting hole 323 are located on the cavity wall of the second flow channel cavity 12B.

[0061] With the above configuration, the refrigerant flowing out of the fifth port 5A of the second heat exchanger 500 can directly flow into the second flow channel cavity 12B through the third connecting hole 323, and then flow into the first heat exchanger 200 through the second connecting hole 322 and the third port 3A. The flow path connection between the second heat exchanger 500 and the first heat exchanger 200 is achieved through the partition plate 300 and the first flow channel plate 400, eliminating the need for traditional joint assembly and connecting pipes. This further reduces the space and weight occupied by the thermal management integrated module, making its structure more compact, and also reduces flow resistance.

[0062] In its specific implementation, the thermal management integration module includes a second interface socket 703. The first flow channel plate 400 has a third connector hole 421, which communicates with the second flow channel cavity 12B. The second interface socket 703 is installed in the third connector hole 421. In this way, refrigerant flowing out from other components in the thermal management system can flow into the first heat exchanger 200 through the second interface socket 703. Specifically, the pipe connected to the second interface socket 703 and the fifth interface 5A of the second heat exchanger 500 are both connected to the second flow channel cavity 12B. To prevent reverse flow, a one-way valve can be installed on the pipe connected to the second interface socket 703. This further improves the integration of the thermal management system and reduces the need for additional piping and pipe fittings.

[0063] The first flow channel plate 400 is provided with a second flow channel groove 420. The second flow channel groove 420 is recessed from the side of the first flow channel plate 400 facing the partition plate 300 in a direction away from the partition plate 300. The second flow channel groove 420 and a portion of the partition plate 300 enclose each other to form the aforementioned second flow channel cavity 12B. The groove wall of the second flow channel groove 420 is provided with a third receiving hole 421. The third receiving hole 421 can be located close to the second connecting hole 322 to reduce the flow resistance of the connecting pipe of the second interface seat 703. Specifically, the position of the third receiving hole 421 can correspond to the position of the second connecting hole 322, so that the flow path of the refrigerant flowing from the second interface seat 703 into the first heat exchanger 200 is relatively short and the flow resistance is low.

[0064] The second interface seat 703 has an interface channel communicating with the third interface hole 421 to facilitate pipe connection. The second interface seat 703 can be formed by a stretching process to reduce costs. A welding tab can be provided between the second interface seat 703 and the first flow channel plate 400 for welding connection, which ensures reliable connection and easy sealing.

[0065] In some embodiments, at least one flow channel cavity formed by the partition plate 300 and the first flow channel plate 400 includes a third flow channel cavity 13B. At least one connecting hole in the partition plate 300 includes a fourth connecting hole 324 and a fifth connecting hole 325. The fourth connecting hole 324 corresponds to and communicates with the fourth interface 4A of the first heat exchanger 200, and the fifth connecting hole 325 corresponds to and communicates with the sixth interface 6A of the second heat exchanger 500. The partition plate 300 has a fourth receiving hole 330. The fourth connecting hole 324, the fifth connecting hole 325, and the fourth receiving hole 330 all communicate with the third flow channel cavity 13B. The fourth connecting hole 324 is located on the cavity wall of the third flow channel cavity 13B. Thus, the refrigerant flowing out of the fourth interface 4A of the first heat exchanger 200 can be divided into two paths through the third flow channel cavity 13B: one path flows into the second heat exchanger 500 through the fifth connecting hole 325, and the other path, through the fourth receiving hole 330, flows into other components in the thermal management system. This allows for a more compact structure for the thermal management integrated module.

[0066] The thermal management integrated module includes a fourth interface socket 705, which is mounted in a fourth connector hole 330. The fourth interface socket 705 allows for easy access to external piping or related structures.

[0067] The fourth interface seat 705 can be formed using a stretching process to reduce costs. A welding tab can be installed between the fourth interface seat 705 and the partition plate 300, and the two are connected by welding, which ensures good connection reliability and easy sealing.

[0068] In its specific implementation, the thermal management integrated module includes a second flow channel plate 600 and a third interface seat 704. The second flow channel plate 600 is welded to the first partition plate surface 311 of the partition plate 300, and the second flow channel plate 600 and the partition plate 300 together form a fourth flow channel cavity 14B. The third interface seat 704 is welded to the second partition plate surface 312 of the partition plate 300, and the third interface seat 704 and the partition plate 300 together form a transition channel 2B.

[0069] The partition plate 300 has at least one connecting hole, including a sixth connecting hole 326 and a seventh connecting hole 327. The sixth connecting hole 326 is located on the cavity wall of the third flow channel cavity 13B and the cavity wall of the fourth flow channel cavity 14B; in other words, the sixth connecting hole 326 communicates with both the third flow channel cavity 13B and the fourth flow channel cavity 14B. The seventh connecting hole 327 is located on the cavity wall of the fourth flow channel cavity 14B and the channel wall of the transition channel 2B; in other words, the seventh connecting hole 327 communicates with both the fourth flow channel cavity 14B and the transition channel 2B.

[0070] The first flow channel plate 400 is provided with a third flow channel groove 430. The third flow channel groove 430 is recessed from the side of the first flow channel plate 400 toward the partition plate 300 toward the side away from the partition plate 300. The third flow channel groove 430 and a portion of the partition plate 300 enclose each other to form the aforementioned third flow channel cavity 13B.

[0071] Please refer to this as well. Figure 12 and Figure 13 , Figure 12 and Figure 13 The diagram shows the structure of the third interface seat 704 from two different perspectives. The third interface seat 704 includes a first seat portion 741, which has a first mounting cavity 7411. The first mounting cavity 7411 is connected to both the adapter channel 2B and the fifth connecting hole 325. The positions of the first mounting cavity 7411 and the fifth connecting hole 325 are corresponding.

[0072] After the above settings are configured, the refrigerant flowing out from the fourth port 4A of the first heat exchanger 200 flows into the third flow channel cavity 13B through the fourth connecting hole 324, and can flow into the fourth flow channel cavity 14B through the sixth connecting hole 326. It can then flow into the transfer channel 2B through the seventh connecting hole 327, and flow into the first mounting cavity 7411 through the transfer channel 2B. After that, it flows into the second heat exchanger 500 through the fifth connecting hole 325.

[0073] The first mounting cavity 7411 of the third interface seat 704 can be fitted with other components as needed to meet system requirements. For example, the thermal management integrated module may include a first valve 801, which is installed in the first mounting cavity 7411. The inlet of the first valve 801 is connected to the transfer channel 2B, and the outlet of the first valve 801 is connected to the fifth connecting hole 325. That is, the outlet of the first valve 801 can correspond to the position of the fifth connecting hole 325. In this way, the refrigerant flowing from the transfer channel 2B to the first valve 801 can be regulated by the first valve 801 before flowing into the second heat exchanger 500. The refrigerant flow distribution is achieved through the setting of the first valve 801. Integrating the first valve 801 onto the partition plate 300 through the third interface seat 704 can further improve the integration and reduce the flow resistance.

[0074] A welding tab can be installed between the third interface seat 704 and the partition plate 300, and the two are fixed by welding, which ensures a reliable connection and good sealing. The third interface seat 704 can be formed by forging.

[0075] The third flow channel 430 can extend from the side of the first flow channel plate 400 near the first heat exchanger 200 to the side of the second flow channel plate 600 near the second heat exchanger 500. The sixth connecting hole 326 can be set near the second heat exchanger 500, so that the fourth flow channel cavity 14B and the third interface seat 704 can both be set near the side where the second heat exchanger 500 is located, which can reduce the volume occupied by the third interface seat 704 and help reduce the weight of the thermal management integrated module.

[0076] In a specific implementation, the second flow channel plate 600 and the partition plate 300 enclose a fifth flow channel cavity 15B. At least one flow hole in the partition plate 300 includes an eighth connecting hole 328. The eighth connecting hole 328 and the fourth receiving hole 330 are both located on the cavity wall of the fifth flow channel cavity 15B, meaning that both the eighth connecting hole 328 and the fourth receiving hole 330 communicate with the fifth flow channel cavity 15B. The third interface seat 704 also includes a second seat portion 742, which has a second mounting cavity 7421. The transfer channel 2B communicates with the second mounting cavity 7421, and the second mounting cavity 7421 corresponds to the position of the eighth connecting hole 328, and the second mounting cavity 7421 communicates with the eighth connecting hole 328.

[0077] After the above settings are configured, the refrigerant flowing out from the fourth port 4A of the first heat exchanger 200 flows into the third flow channel cavity 13B through the fourth connecting hole 324, and can flow into the fourth flow channel cavity 14B through the sixth connecting hole 326. It can then flow into the transfer channel 2B through the seventh connecting hole 327, and flow into the second mounting cavity 7421 through the transfer channel 2B. After that, it flows into the fourth mounting hole 330 through the fifth flow channel cavity 15B.

[0078] The second mounting cavity 7421 of the third connector 704 can accommodate other components as needed to meet system requirements. For example, the thermal management integrated module may include a second valve 802, which is mounted in the second mounting cavity 7421. The inlet of the second valve 802 is connected to the transfer channel 2B, and the outlet of the second valve 802 is connected to the eighth connecting hole 328, meaning the outlet of the second valve 802 corresponds to the position of the eighth connecting hole 328. In this way, the refrigerant flowing from the transfer channel 2B to the second valve 802 can be regulated by the second valve 802 before flowing to the fourth connector hole 330. The refrigerant flow distribution can be achieved through the configuration of the second valve 802. Integrating the second valve 802 onto the partition plate 300 via the third connector 704 further improves integration and reduces flow resistance.

[0079] The third interface seat 704 may be provided with a transition groove 743. The opening of the transition groove 743 faces the partition plate 300. The transition groove 743 is recessed from the surface of the third interface seat 704 facing the partition plate 300 in a direction away from the partition plate 300. The transition groove 743 and part of the partition plate 300 form a transition channel 2B.

[0080] The arrangement of the third interface 704, the fourth flow channel cavity 14B, the fifth flow channel cavity 15B, and related hole structures can divide the refrigerant flowing out of the fourth interface 4A of the first heat exchanger 200 into two paths, which flow to different components respectively, making the thermal management integrated module more integrated and the structure more compact.

[0081] The second flow channel plate 600 may be provided with a fourth flow channel groove 610 and a fifth flow channel groove 620. Both the fourth flow channel groove 610 and the fifth flow channel groove 620 may be recessed from the side of the second flow channel plate 600 facing the partition plate 300 in a direction away from the partition plate 300. The fourth flow channel groove 610 and part of the partition plate 300 enclose a fourth flow channel cavity 14B, and the fifth flow channel groove 620 and part of the partition plate 300 enclose a fifth flow channel cavity 15B. In this way, the partition plate 300 can be designed as a flat plate structure, which facilitates welding with the first heat exchanger 200 and the second heat exchanger 500.

[0082] by Figure 1Taking the orientation shown as an example, the first heat exchanger 200 and the second heat exchanger 500 can be arranged in one direction, such as the left-right direction shown in the figure. The third flow channel groove 430 of the first flow channel plate 400 can extend from the side of the first flow channel plate 400 near the first heat exchanger 200 to the side of the first flow channel plate 400 near the second heat exchanger 500, that is, the third flow channel groove 430 extends approximately from the left side of the partition plate 300 to the right side of the partition plate 300. The second heat exchanger 500 can extend from the right side of the partition plate 300. In this way, the second flow channel plate 600 can be welded to the first partition plate surface 311 of the partition plate 300, that is, the second flow channel plate 600 and the second heat exchanger 500 are located on the same side of the partition plate 300, so as not to affect the installation of the third interface seat 704, the fourth interface seat 705 and related valve components and other structures.

[0083] The second flow channel plate 600 can be made of stamped plate, which is convenient to manufacture.

[0084] The first partition plate surface 311 and the second partition plate surface 312 of the partition plate 300 can be composite brazing filler metal. The partition plate 300 can be welded and fixed to the first flow channel plate 400 and the second flow channel plate 600, which makes it easy to ensure the sealing of each flow channel cavity.

[0085] In practice, the second heat exchanger 500 can be positioned away from the liquid storage tank 100 relative to the first heat exchanger 200. The side of the partition plate 300 away from the first heat exchanger 200 and the second heat exchanger 500 is connected to the first flow channel plate 400. Related interface seats, valves, etc., can be installed on the side of the partition plate 300 away from the first heat exchanger 200. This layout is reasonable, allowing the thermal management integrated module to be more compact and occupy less space.

[0086] The above examples illustrate the principles and implementation methods of this application. The descriptions of the embodiments are merely for the purpose of helping to understand the solution and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. A thermal management integrated module, characterized in that, The thermal management integrated module includes a liquid storage tank (100) and a first heat exchanger (200). The liquid storage tank (100) includes a tank body (110) and a head (120). The head (120) is fixedly connected to the tank body (110). The head (120) has a head flow channel (121), which is connected to the tank cavity (111) of the tank body (110). The first heat exchanger (200) includes a first end plate (210), the first end plate (210) having a first interface (1A), the first interface (1A) being connected to an internal channel of the first heat exchanger (200); The end cap (120) is welded to the first end plate (210), and the first interface (1A) is connected to the end cap flow channel (121).

2. The thermal management integrated module according to claim 1, characterized in that, The end cap flow channel (121) includes a flow hole (1212) penetrating the end cap (120); or, the end cap flow channel (121) includes a flow channel groove (1211) and a flow hole (1212) penetrating the end cap (120), the flow hole (1212) and the flow channel groove (1211) are connected, the flow channel groove (1211) is recessed from the surface of the end cap (120) toward the first end plate (210) toward the side where the tank body (110) is located, and the wall forming the end cap flow channel (121) includes the wall forming the flow channel groove (1211) and part of the wall of the first end plate (210).

3. The thermal management integrated module according to claim 1, characterized in that, The thermal management integrated module includes a partition plate (300) and a first flow channel plate (400). The partition plate (300) has a first partition plate face (311) and a second partition plate face (312) opposite to each other, the first partition plate face (311) being welded to the first heat exchanger (200), and the second partition plate face (312) being welded to the first flow channel plate (400); The partition plate (300) and the first flow channel plate (400) enclose and form at least one flow channel cavity. The partition plate (300) is provided with at least one connecting hole. One interface of the first heat exchanger (200) is connected to one of the flow channel cavities through one of the connecting holes.

4. The thermal management integrated module according to claim 3, characterized in that, The first heat exchanger (200) includes a second end plate (220) which is disposed opposite to the first end plate (210) and is welded to the first partition plate face (311); along the plate stacking direction of the first heat exchanger (200), at least a portion of the first heat exchanger (200) is located between the first partition plate face (311) and the liquid storage tank (100).

5. The thermal management integrated module according to claim 3, characterized in that, The at least one flow channel cavity includes a first flow channel cavity (11B), and the at least one connecting hole includes a first connecting hole (321). The first connecting hole (321) corresponds to and is connected to the second interface (2A) of the first heat exchanger (200). The first connecting hole (321) is connected to the first flow channel cavity (11B) and is located on the cavity wall of the first flow channel cavity (11B). The first flow channel plate (400) has a first receiving hole (411) which communicates with the first flow channel cavity (11B).

6. The thermal management integrated module according to claim 5, characterized in that, The first flow channel plate (400) has a second receiving hole (412), which communicates with the first flow channel cavity (11B). The second receiving hole (412) is disposed near the first communicating hole (321) relative to the first receiving hole (411). The thermal management integrated module includes a sensor seat (702) and a first interface seat (701). The sensor seat (702) is installed in the second receiving hole (412), and the first interface seat (701) is installed in the first receiving hole (411).

7. The thermal management integrated module according to claim 3, characterized in that, The thermal management integrated module includes a second heat exchanger (500), which is welded to the first partition plate face (311); The at least one flow channel cavity includes a second flow channel cavity (12B), and the at least one connecting hole includes a second connecting hole (322) and a third connecting hole (323). The second connecting hole (322) corresponds to and is connected to the third interface (3A) of the first heat exchanger (200), and the third connecting hole (323) corresponds to and is connected to the fifth interface (5A) of the second heat exchanger (500). Both the second connecting hole (322) and the third connecting hole (323) are connected to the second flow channel cavity (12B), and both the second connecting hole (322) and the third connecting hole (323) are located on the cavity wall of the second flow channel cavity (12B).

8. The thermal management integrated module according to claim 7, characterized in that, The thermal management integrated module includes a second interface seat (703), the first flow channel plate (400) has a third connector hole (421), the third connector hole (421) communicates with the second flow channel cavity (12B), and the second interface seat (703) is installed in the third connector hole (421).

9. The thermal management integrated module according to claim 3, characterized in that, The thermal management integrated module includes a second heat exchanger (500) and a fourth interface seat (705), wherein the second heat exchanger (500) is welded to the first partition plate face (311); The at least one flow channel cavity includes a third flow channel cavity (13B), the at least one connecting hole includes a fourth connecting hole (324) and a fifth connecting hole (325), the partition plate (300) has a fourth receiving hole (330), the fourth connecting hole (324) corresponds to and communicates with the fourth interface (4A) of the first heat exchanger (200), the fifth connecting hole (325) corresponds to and communicates with the sixth interface (6A) of the second heat exchanger (500), and the fourth interface seat (705) is installed in the fourth receiving hole (330); the fourth connecting hole (324), the fifth connecting hole (325) and the fourth receiving hole (330) are all connected to the third flow channel cavity (13B), and the fourth connecting hole (324) is located on the cavity wall of the third flow channel cavity (13B).

10. The thermal management integrated module according to claim 9, characterized in that, The thermal management integrated module includes a second flow channel plate (600) and a third interface socket (704). The second flow channel plate (600) is welded to the face of the first partition plate (311), and the second flow channel plate (600) and the partition plate (300) together form a fourth flow channel cavity (14B). The third interface seat (704) is welded to the second partition plate face (312), and the third interface seat (704) and the partition plate (300) enclose a transfer channel (2B). The at least one connecting hole includes a sixth connecting hole (326) and a seventh connecting hole (327); the sixth connecting hole (326) is disposed on the cavity wall of the third flow channel cavity (13B) and on the cavity wall of the fourth flow channel cavity (14B); the seventh connecting hole (327) is disposed on the cavity wall of the fourth flow channel cavity (14B) and on the channel wall of the transition channel (2B); The third interface seat (704) includes a first seat portion (741), the first seat portion (741) has a first mounting cavity (7411), the adapter channel (2B) communicates with the first mounting cavity (7411), the first mounting cavity (7411) corresponds to the position of the fifth connecting hole (325), and the fifth connecting hole (325) communicates with the first mounting cavity (7411).

11. The thermal management integrated module according to claim 10, characterized in that, The second flow channel plate (600) and the partition plate (300) enclose a fifth flow channel cavity (15B). The at least one connecting hole includes an eighth connecting hole (328). The eighth connecting hole (328) and the fourth receiving hole (330) are both located on the cavity wall of the fifth flow channel cavity (15B). The third interface seat (704) includes a second seat portion (742), the second seat portion (742) has a second mounting cavity (7421), the adapter channel (2B) communicates with the second mounting cavity (7421), the second mounting cavity (7421) corresponds to the position of the eighth connecting hole (328), and the second mounting cavity (7421) communicates with the eighth connecting hole (328).

12. The thermal management integrated module according to any one of claims 3-11, characterized in that, Both the partition plate (300) and the first flow channel plate (400) are stamped plates. The partition plate (300) has a flat plate structure. The first flow channel plate (400) has at least one flow channel groove. The groove opening of the flow channel groove faces the second partition plate face (312). The flow channel groove and part of the second partition plate face (312) enclose the flow channel cavity.

Images