Transistor plating processing feeding mechanism

Abstract

The utility model discloses a transistor electroplating processing feeding mechanism relates to feeding mechanism technical field, including horizontal movement subassembly and transistor main part, and the vertical movement subassembly is installed to horizontal movement subassembly side, and the suction cup adsorption subassembly is installed to the vertical movement subassembly bottom, and the suction cup adsorption subassembly is connected with adsorption control system. The utility model, through horizontal movement subassembly and vertical movement subassembly cooperation, will suction cup adsorption subassembly and lateral clamping subassembly accurate transfer to transistor main part, first, the suction cup adsorption subassembly is under the adsorption control system regulation and control, with soft negative pressure adsorption force fixed transistor main part upper surface, then in lateral clamping subassembly, no. 2 air cylinder drive mounting plate and clamping plate of no. 3 fixed frame support, with the help of elastic buffer mechanism, moderate lateral force is applied to clamp both sides of transistor main body, both avoid the deformation of the pin because of the excessive stress, and also guarantee the stability of clamping.

Description

Technical Field

[0001] This utility model relates to the technical field of feeding mechanisms, and in particular to a feeding mechanism for transistor electroplating. Background Technology

[0002] In the electroplating process of transistors, due to the small size and precision of the workpieces, the requirements for the accuracy and efficiency of conveying and positioning are extremely high. The transistor electroplating loading mechanism, as a key piece of equipment, can achieve automated loading through robotic arms, vacuum adsorption and other devices. It can also ensure accurate positioning with the help of precision guide rails and vision positioning systems. Furthermore, it can connect with the preceding and following processes to form a continuous production line, effectively reducing manual intervention and workpiece damage, and significantly improving the overall production quality and efficiency.

[0003] However, in the existing technology, transistor pins are usually made of thin copper or alloy material, which is highly ductile but has poor bending resistance. Rigid clamping requires a certain clamping force to prevent the workpiece from falling off, and this force can easily exceed the pin's deformation resistance threshold. The pin deformation caused by rigid clamping will cause poor electrode contact during subsequent electroplating, resulting in quality defects such as uneven plating thickness and incomplete plating, and may even lead to the failure of transistor electrical performance. This not only reduces production efficiency, but also increases production costs due to increased scrap rate and downtime losses. Utility Model Content

[0004] The purpose of this utility model is to solve the problems existing in the prior art by proposing a transistor electroplating feeding mechanism.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a transistor electroplating feeding mechanism, comprising a horizontal moving component and a transistor body, a vertical moving component mounted on the side of the horizontal moving component, a suction cup adsorption component mounted on the bottom of the vertical moving component, an external adsorption control system connected to the suction cup adsorption component, and a lateral clamping component fixedly connected to the bottom of the vertical moving component, the lateral clamping component comprising a third fixing frame, a second cylinder fixedly connected to the bottom of the third fixing frame, a mounting plate fixedly connected to the end of the second cylinder, a clamping plate fixedly connected to the side of the mounting plate, the clamping plate clamping and fixing the transistor body, and the suction cup adsorption component adsorbing and fixing the transistor body.

[0006] Preferably, a third limiting rod is slidably inserted into the bottom of the third fixing frame, and the end of the third limiting rod is fixedly connected to the mounting plate.

[0007] Preferably, the horizontal moving component includes a first fixed frame, an electric push rod is fixedly connected to the upper part of the first fixed frame, and a mounting bracket is fixedly connected to the end of the electric push rod.

[0008] Preferably, a first limiting rod is fixedly connected to the upper part of the first fixing frame, and a limiting block is slidably connected to the surface of the first limiting rod. The limiting block is fixedly connected to the bottom of the mounting frame.

[0009] Preferably, the vertical moving component includes a second fixed frame, which is fixedly connected to the side of the mounting frame, and a first cylinder is fixedly connected to the upper part of the second fixed frame. A connecting plate is fixedly connected to the end of the first cylinder, a suction cup adsorption component is fixedly connected to the connecting plate, and a third fixed frame is fixedly connected to the connecting plate.

[0010] Preferably, a second limiting rod is fixedly connected to the upper part of the connecting plate, and the second limiting rod is slidably inserted into the second fixing frame.

[0011] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0012] 1. In this utility model, the horizontal moving component and the vertical moving component work together to accurately move the suction cup adsorption component and the lateral clamping component to the transistor body. First, the suction cup adsorption component, under the control of the adsorption control system, fixes the upper surface of the transistor body with a gentle negative pressure adsorption force. Then, in the lateral clamping component, the second cylinder supported by the third fixing frame drives the mounting plate and clamping plate, and applies a moderate lateral force to clamp the two sides of the transistor body with the help of the elastic buffer mechanism. This not only avoids the pins from deforming due to excessive force, but also ensures the stability of clamping, effectively solves the quality problems caused by rigid clamping, and improves the reliability of the feeding process.

[0013] 2. In this utility model, when the mounting bracket is driven to move along the X-axis by the electric push rod of the horizontal moving component, the limiting block slides on the first limiting rod to ensure horizontal movement accuracy. When the first cylinder of the vertical moving component drives the connecting plate to rise and fall, the second limiting rod slides in the second fixed frame to ensure the verticality of the Z-axis movement. When the second cylinder of the lateral clamping component pushes the mounting plate and clamping plate to move laterally, the third limiting rod restricts their movement trajectory to ensure that the clamping plate clamps the transistor body in parallel. The multi-dimensional limiting structure not only achieves high-precision positioning, but also avoids uneven deformation of the pins through the combination of rigid guidance and flexible buffering, while improving movement stability and maintenance convenience. Attached Figure Description

[0014] Figure 1 A three-dimensional structural diagram of a transistor electroplating material feeding mechanism is provided for this utility model;

[0015] Figure 2 This utility model provides a cross-sectional structural diagram of the mounting frame in a transistor electroplating material feeding mechanism;

[0016] Figure 3 This utility model provides a three-dimensional structural diagram of a suction cup adsorption component in a transistor electroplating material feeding mechanism.

[0017] Figure 4This utility model presents a three-dimensional structural diagram of a lateral clamping component in a transistor electroplating feeding mechanism.

[0018] Legend: 1. Horizontal moving assembly; 11. Fixing frame 1; 12. Electric push rod; 13. Mounting frame; 14. Limiting rod 1; 15. Limiting block; 2. Vertical moving assembly; 21. Fixing frame 2; 22. Cylinder 1; 23. Connecting plate; 24. Limiting rod 2; 3. Transistor body; 4. Suction cup adsorption assembly; 5. Lateral clamping assembly; 51. Fixing frame 3; 52. Cylinder 2; 53. Mounting plate; 54. Clamping plate; 55. Limiting rod 3. Detailed Implementation

[0019] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0020] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0021] Example 1: As Figures 1-4 As shown, this utility model provides a transistor electroplating feeding mechanism, including a horizontal moving component 1 and a transistor body 3. A vertical moving component 2 is mounted on the side of the horizontal moving component 1, and a suction cup adsorption component 4 is mounted on the bottom of the vertical moving component 2. The suction cup adsorption component 4 is externally connected to an adsorption control system, and a lateral clamping component 5 is fixedly connected to the bottom of the vertical moving component 2. The lateral clamping component 5 includes a third fixing frame 51, a second cylinder 52 is fixedly connected to the bottom of the third fixing frame 51, a mounting plate 53 is fixedly connected to the end of the second cylinder 52, and a clamping plate 54 is fixedly connected to the side of the mounting plate 53. The clamping plate 54 clamps and fixes the transistor body 3, and the suction cup adsorption component 4 adsorbs and fixes the transistor body 3.

[0022] The specific settings and functions of this embodiment are described in detail below. The horizontal moving component 1 and the vertical moving component 2 work together to precisely move the suction cup adsorption component 4 and the lateral clamping component 5 to the transistor body 3. First, under the control of the adsorption control system, the suction cup adsorption component 4 uses a gentle negative pressure adsorption force to fix the upper surface of the transistor body 3. Then, in the lateral clamping component 5, the cylinder 52 supported by the third fixing frame 51 drives the mounting plate 53 and the clamping plate 54. With the help of the elastic buffer mechanism, a moderate lateral force is applied to clamp both sides of the transistor body 3. This not only avoids the pins from deforming due to excessive force, but also ensures the stability of the clamping, effectively solving the quality problems caused by rigid clamping, and improving the reliability of the feeding process.

[0023] Example 2: Figures 1-4 As shown, a third limiting rod 55 is slidably inserted into the bottom of the third fixing frame 51. The end of the third limiting rod 55 is fixedly connected to the mounting plate 53. The horizontal moving assembly 1 includes a first fixing frame 11. An electric push rod 12 is fixedly connected to the upper part of the first fixing frame 11. A mounting frame 13 is fixedly connected to the end of the electric push rod 12. A first limiting rod 14 is fixedly connected to the upper part of the first fixing frame 11. A limiting block 15 is slidably connected to the surface of the first limiting rod 14. The limiting block 15 is connected to the bottom of the mounting frame 13. The fixed connection, the vertical moving component 2 includes a second fixed frame 21, which is fixedly connected to the side of the mounting frame 13, and a first cylinder 22 is fixedly connected to the upper part of the second fixed frame 21. A connecting plate 23 is fixedly connected to the end of the first cylinder 22. The suction cup adsorption component 4 is fixedly connected to the connecting plate 23. The third fixed frame 51 is fixedly connected to the connecting plate 23. A second limiting rod 24 is fixedly connected to the upper part of the connecting plate 23. The second limiting rod 24 is slidably inserted into the second fixed frame 21.

[0024] The overall effect of this embodiment is as follows: when the electric push rod 12 of the horizontal moving component 1 drives the mounting bracket 13 to move along the X-axis, the limiting block 15 slides on the first limiting rod 14 to ensure horizontal movement accuracy; when the first cylinder 22 of the vertical moving component 2 drives the connecting plate 23 to rise and fall, the second limiting rod 24 slides in the second fixing frame 21 to ensure the verticality of the Z-axis movement; when the second cylinder 52 of the lateral clamping component 5 pushes the mounting plate 53 and the clamping plate 54 to move laterally, the third limiting rod 55 restricts their movement trajectory to ensure that the clamping plate 54 clamps the transistor body 3 in parallel. The multi-dimensional limiting structure not only achieves high-precision positioning, but also avoids uneven deformation of the pins through the combination of rigid guidance and flexible buffering, while improving movement stability and maintenance convenience.

[0025] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A transistor electroplating feeding mechanism, characterized in that: The device includes a horizontal moving component (1) and a transistor body (3). A vertical moving component (2) is mounted on the side of the horizontal moving component (1). A suction cup adsorption component (4) is mounted on the bottom of the vertical moving component (2). The suction cup adsorption component (4) is externally connected to an adsorption control system. A lateral clamping component (5) is fixedly connected to the bottom of the vertical moving component (2). The lateral clamping component (5) includes a third fixing frame (51). A second cylinder (52) is fixedly connected to the bottom of the third fixing frame (51). A mounting plate (53) is fixedly connected to the end of the second cylinder (52). A clamping plate (54) is fixedly connected to the side of the mounting plate (53). The clamping plate (54) is clamped and fixed to the transistor body (3). The suction cup adsorption component (4) is adsorbed and fixed to the transistor body (3).

2. The transistor electroplating feeding mechanism according to claim 1, characterized in that: The bottom of the third fixing frame (51) is slidably inserted with a third limiting rod (55), and the end of the third limiting rod (55) is fixedly connected to the mounting plate (53).

3. The transistor electroplating feeding mechanism according to claim 1, characterized in that: The horizontal moving component (1) includes a first fixed frame (11), an electric push rod (12) is fixedly connected to the upper part of the first fixed frame (11), and an installation frame (13) is fixedly connected to the end of the electric push rod (12).

4. The transistor electroplating feeding mechanism according to claim 3, characterized in that: The first fixed frame (11) is fixedly connected to the upper part of the first limiting rod (14), and the first limiting rod (14) is slidably connected to the surface of the limiting block (15), and the limiting block (15) is fixedly connected to the bottom of the mounting frame (13).

5. The transistor electroplating feeding mechanism according to claim 1, characterized in that: The vertical moving component (2) includes a second fixed frame (21), which is fixedly connected to the side of the mounting frame (13), and a first cylinder (22) is fixedly connected to the upper part of the second fixed frame (21). A connecting plate (23) is fixedly connected to the end of the first cylinder (22). The suction cup adsorption component (4) is fixedly connected to the connecting plate (23), and the third fixed frame (51) is fixedly connected to the connecting plate (23).

6. The transistor electroplating feeding mechanism according to claim 5, characterized in that: The upper part of the connecting plate (23) is fixedly connected to the second limiting rod (24), and the second limiting rod (24) is slidably inserted into the second fixing frame (21).

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