Cover, pressing device, heating device and physical vapor deposition apparatus

Abstract

The utility model relates to the technical field of semiconductor, provide a kind of cover, press down device, heating device and physical vapor deposition equipment.The cover includes: cover body and positioning piece;The first end of the cover body has bearing surface along the first direction, the second end of the cover body is provided with assembly part along the first direction, the assembly part is used to cooperate with heater, and so that the cover body covers the heating surface of the heater;The positioning piece is set to the cover body, the positioning piece has locating surface, the locating surface is located the side of the bearing surface close to the second end, and the locating surface and the bearing surface have first set distance along the first direction.The cover is used to cooperate with existing heater, the cover can be used to limit the press down of press down piece formation, to prevent the press down piece pressure too large resulting in substrate fragment, and then accurately guarantee the position accuracy of press down piece.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a cover, a pressing device, a heating device, and a physical vapor deposition equipment. Background Technology

[0002] Physical vapor deposition (PVD) refers to the process of forming a thin film on a substrate surface using physical methods such as vacuum evaporation, sputtering, plasma deposition, and molecular beam epitaxy. In the very large-scale integrated circuit (VLSI) industry, sputtering is the most widely used PVD technology, primarily applied to electrodes and metal interconnects in integrated circuits.

[0003] Taking sputtering aluminum plating as an example, the coating process requires sputtering aluminum in a vacuum environment at 420℃. The back of the substrate is placed on a heater, and process gas (such as argon) needs to be introduced into the back of the substrate for temperature conduction. To ensure the stability of the substrate, existing processes add a pressure device on top of the substrate to hold it down and prevent the substrate from shifting due to excessive process gas pressure.

[0004] In existing equipment, a pressing component is typically driven to move, and the distance between the pressing component and the heater is set to ensure that the pressing component directly presses against the substrate. For substrates of different specifications, their thickness varies, requiring adaptive adjustments to the downward stroke of the pressing component. On the one hand, it is difficult to guarantee the positional accuracy of the pressing component; on the other hand, with prolonged use, the positional accuracy of the pressing component deteriorates, easily leading to excessive or insufficient pressure on the substrate. Furthermore, for some substrates (such as gallium nitride substrates), their brittle texture makes them prone to breakage under repeated stress in high-temperature environments, affecting substrate yield and output.

[0005] Therefore, the utility model requires a cover, a pressing device, a heating device, and a physical vapor deposition apparatus to improve the above-mentioned technical problems. Utility Model Content

[0006] This invention provides a cover, a pressing device, a heating device, and a physical vapor deposition apparatus. The cover is used in conjunction with an existing heater and can limit the pressing limit stroke of the pressing device, thereby accurately ensuring the positional accuracy of the pressing device and preventing excessive pressure from causing substrate fragmentation.

[0007] This utility model provides a cover, including: a cover body and a positioning element;

[0008] The cover body has a bearing surface at a first end along a first direction, and an assembly part is provided at a second end along the first direction. The assembly part is used to cooperate with the heater and make the cover body cover the heating surface of the heater.

[0009] The positioning element is disposed on the cover body, and the positioning element has a positioning surface. The positioning surface is located on the side of the bearing surface near the second end, and the positioning surface and the bearing surface have a first set distance along the first direction.

[0010] Optionally, the positioning surface is parallel to the bearing surface.

[0011] Optionally, the assembly part includes an assembly groove disposed at the second end, the bottom of the assembly groove being used to fit against the heating surface.

[0012] Optionally, the positioning element includes a boss, which is disposed on one side of the cover body perpendicular to the first direction, and the side of the boss close to the bearing surface along the first direction serves as the positioning surface.

[0013] Optionally, the positioning element includes a plurality of bosses;

[0014] Each of the aforementioned protrusions is provided with a positioning surface, and each of the aforementioned positioning surfaces is arranged around the bearing surface.

[0015] Optionally, the covering body is disc-shaped, and the first direction is the axial direction of the covering body.

[0016] This utility model also provides a pressing device, including the aforementioned cover, pressing member, and support member;

[0017] The pressing member is configured to move relative to the cover body in a first direction, and one end of the pressing member in the first direction has a pressing surface;

[0018] The support member is disposed on the lower pressure surface and is used to support the positioning surface, such that the lower pressure surface is parallel to the bearing surface and faces each other along the first direction while maintaining a second predetermined distance;

[0019] The pressing component has a hollow area along the first direction, the pressing surface surrounds the hollow area, and the hollow area faces the bearing surface.

[0020] Optionally, the support member has an annular protrusion around the hollowed-out area, and the inner diameter of the support member is larger than the inner diameter of the hollowed-out area.

[0021] This utility model also provides a heating device, including the aforementioned covering and heater;

[0022] The heater has a heating surface, and the heater cooperates with the assembly so that the cover body covers the heating surface of the heater.

[0023] This invention also provides a physical vapor deposition apparatus, including the aforementioned cover.

[0024] The cover in this invention has a positioning surface that contacts the support to limit the downward movement of the pressing member, thereby ensuring the positional accuracy of the pressing member. This allows for precise control of the pressure exerted by the pressing member on the substrate, improving the situation where poor positional error of the pressing member leads to excessive pressure on the substrate, causing substrate breakage, or insufficient pressure on the substrate, resulting in poor substrate positioning.

[0025] The cover in this invention is used to cover the heater, the substrate is supported by the cover body, and the pressing part is in contact with the positioning part, which changes the main stress point of the pressing part and can effectively improve the stress situation between the pressing part and the substrate.

[0026] The cover of this invention can be used with existing heaters. By controlling the distance between the bearing surface and the positioning surface on the cover, it can be adapted to the positioning of substrates of different thicknesses. This cover has good compatibility with existing heaters and can be used for coating substrates of different thicknesses.

[0027] The application of the cover element in this invention has been verified in existing equipment. During a batch of physical vapor deposition processes, no substrate breakage occurred, reducing the breakage rate from approximately 3% to 0%. This is expected to reduce the scrap of at least hundreds of substrates annually, saving millions of yuan in costs. The application of the cover element reduces the probability of substrate breakage, thereby reducing machine downtime and the frequency and duration of preventative maintenance (PM) due to breakage. Chamber uptime can be increased from 79% to 84%, reducing the number of chamber openings, increasing machine utilization, and reducing the frequency of process kit cleaning, resulting in estimated annual cost savings of tens of thousands of yuan.

[0028] The cover in this invention covers the existing heater. During the physical vapor deposition process, the substrate does not come into contact with the heater, and the heating surface of the heater is protected by the cover. This avoids the wear and tear caused by heater grinding and finishing, and helps to extend the service life of the heater. Attached Figure Description

[0029] Figure 1 This is a cross-sectional view of the pressing device according to an embodiment of the present invention;

[0030] Figure 2 This is a top view of the cover structure according to an embodiment of the present utility model;

[0031] Figure 3 This is a schematic diagram of the structure of a heating device according to an embodiment of the present invention.

[0032] In the attached diagram:

[0033] 10-Cover body; 11-Bearing surface; 12-Assembly part; 121-Assembly groove; 13-First groove;

[0034] 20 - Positioning component; 21 - Positioning surface; 201 - Boss;

[0035] 30 - Pressing part; 31 - Pressing surface; 32 - Hollowed-out area; 33 - Functional part;

[0036] 40 - Support component;

[0037] 50 - Heater; 51 - Second groove;

[0038] 60-substrate;

[0039] a - First direction. Detailed Implementation

[0040] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, provides further details regarding the cover, pressing device, heating device, and physical vapor deposition equipment proposed in this utility model. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this utility model.

[0041] In this invention, "outer diameter" and "inner diameter" refer to the diameter of a circular structure, while for a non-circular structure, the inner diameter refers to the diameter of its inscribed circle and the outer diameter refers to the diameter of its circumscribed circle. "Axial direction" refers to the direction of the central axis of a cylindrical rod, while for a non-cylindrical rod, the axial direction refers to the length direction of the rod.

[0042] As used in this invention, the singular forms “a,” “an,” and “the” include plural objects; the term “or” is generally used to mean “and / or”; the term “a number” is generally used to mean “at least one”; and the term “at least two” is generally used to mean “two or more”. Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with “first,” “second,” or “third” may explicitly or implicitly include one or at least two of that feature. Additionally, as used in this invention, “installed,” “connected,” “joined,” and “set” on one element from another should be interpreted broadly, generally indicating only a connection, coupling, cooperation, or transmission relationship between the two elements, which can be direct or indirect through an intermediate element. They should not be construed as indicating or implying a spatial positional relationship between the two elements, i.e., one element can be located inside, outside, above, below, or to one side of another element, unless otherwise explicitly stated. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to the specific circumstances. Furthermore, directional terms such as above, below, up, down, upward, downward, left, right, etc., are used relative to exemplary embodiments as shown in the figures, with upward or up direction pointing towards the top of the corresponding figure, and downward or down direction pointing towards the bottom of the corresponding figure.

[0043] In this embodiment, to more clearly illustrate the structural characteristics of the cover, the description will focus on the pressing device (including the cover, the pressing member, and the support member).

[0044] This embodiment provides a pressing device, which includes a cover, a pressing member 30, and a support member 40.

[0045] The cover is used to cooperate with the heater 50, and the support 40 is connected to the pressing member 30. The support 40 can be positioned by the cover, thereby ensuring the positional accuracy of the pressing member 30.

[0046] The covering components include: a covering body 10 and a positioning component 20.

[0047] In this embodiment, the cover body 10 cooperates with the heater 50. Since the existing heater 50 is a cylindrical structure, the upper end of the heater 50 serves as the heating surface, which is circular and used to support the substrate (e.g., a wafer). Therefore, in this embodiment, the cover body 10 is adapted to the shape of the existing heater 50 and is set as a disc shape.

[0048] like Figure 1 As shown, the first end of the covering body 10 along the first direction a ( Figure 1 The upper end of the cover body 10 has a bearing surface 11, which is circular, wherein a first direction a is perpendicular to the bearing surface 11 and parallel to the axial direction of the cover body 10. The bearing surface 11 is used to support the substrate 60, such as a wafer.

[0049] The second end of the covering body 10 along the first direction a ( Figure 1 The lower end of the cover body 10 is provided with an assembly part 12, which is used to cooperate with the heater 50 and to cover the heating surface of the heater 50.

[0050] like Figure 1 As shown, in this embodiment, the assembly part 12 includes an assembly groove 121 disposed at the lower end (second end) of the cover body 10, the bottom of the assembly groove 121 being used to connect with the heating surface of the heater 50. Figure 1 The upper end face of the heater 50 is attached.

[0051] Please continue to refer to this. Figure 1 As shown, in this embodiment, the assembly groove 121 is a circular groove, the inner diameter of which is the same as the outer diameter of the upper end of the heater 50. The upper end of the heater 50 extends into the interior of the assembly groove 121, and the heating surface of the heater 50 ( Figure 1 The upper surface of the cover body 10 conforms to the bottom of the mounting groove 121, so that the cover body 10 completely covers the upper end of the heater 50 and is positioned relative to the heater 50. At this time, the substrate 60 to be coated rests on the bearing surface 11 of the cover body 10 instead of the heater 50.

[0052] During normal processing, process gas (e.g., argon) needs to be introduced into the back of the substrate 60 through the heater 50 for temperature conduction. Therefore, the cover body 10 should have multiple through-holes along the first direction a to allow the process gas to flow upward and contact the back of the substrate 60. In addition, the pressure of the process gas can be detected to check whether the substrate 60 is fragmented. If the substrate 60 is fragmented, the process gas will leak upward through the cracks in the substrate 60, and the pressure of the process gas will decrease.

[0053] Please continue to refer to this. Figure 1 As shown, the positioning element 20 is disposed on the cover body 10, and the positioning element 20 has a positioning surface 21, which is located on the bearing surface 11 near the second end ( Figure 1 On one side of the lower middle section, i.e., the positioning surface 21 Figure 1 The center is located below the bearing surface 11. The positioning surface 21 and the bearing surface 11 are at a first predetermined distance along the first direction a.

[0054] The positioning surface 21 is used to contact the support member 40 to limit the downward movement of the pressing member 30, thereby ensuring the positional accuracy of the pressing member 30. This allows for precise control of the pressure exerted by the pressing member 30 on the substrate 60, thus improving the situation where excessive positional error of the pressing member 30 leads to excessive pressure on the substrate 60, causing the substrate 60 to break, or insufficient pressure on the substrate 60, resulting in poor positioning of the substrate 60.

[0055] The material of the aforementioned cover is consistent with that of the heater 50 to ensure better heat conduction and reduce contamination caused by material differences. The substrate is supported by the cover body 10, and the pressing member 30 is in contact with the positioning member 20, which changes the main stress point of the pressing member 30 and can effectively improve the stress situation between the pressing member 30 and the substrate 60.

[0056] The aforementioned cover can be used with the existing heater 50. By controlling the distance between the bearing surface 11 and the positioning surface 21 on the cover, it can be adapted to the positioning of substrates of different thicknesses. The cover has good compatibility with existing heaters and can be used for coating substrates of different thicknesses.

[0057] The application of the aforementioned cover has been validated on existing equipment. During a batch of physical vapor deposition (PVD) processes, no substrate breakage occurred, reducing the breakage rate from approximately 3% to 0%. This is expected to reduce the scrap of hundreds of substrates annually, saving millions of yuan in costs. The application of this cover reduces the probability of substrate breakage, thereby reducing equipment downtime and the frequency and duration of preventative maintenance (PM) due to breakage. Chamber uptime can be increased from 79% to approximately 84%, reducing the number of chamber openings, increasing equipment utilization, and reducing the frequency of process kit cleaning, resulting in estimated annual cost savings of tens of thousands of yuan.

[0058] The aforementioned cover is applied over the existing heater. During the physical vapor deposition process, the substrate does not come into contact with the heater, and the heating surface of the heater is protected by the cover. This avoids damage caused by heater grinding and finishing, and helps to extend the service life of the heater.

[0059] In this embodiment, the cover body 10 is configured as a disc shape, and the mounting groove 121 is configured as a circular recess. Both of these shapes are adapted to the shape of the existing heater 50. In other alternative embodiments, the shapes of the cover body 10 and the mounting groove 121 can be adapted to the shape of the actual heater 50. For example, the cover body 10 can be configured as a cuboid structure, and the mounting groove 121 can be configured as a square groove.

[0060] Please continue to refer to this. Figure 1As shown, the pressing member 30 has a pressing surface 31 at one end along the first direction a. The pressing surface 31 is used to contact the substrate 60 to prevent the substrate 60 from shifting and to ensure the stability of the substrate 60.

[0061] The pressing member 30 is configured to move relative to the cover body 10 along the first direction a. For example, the pressing member 30 is connected to an external lifting device (linear motor) to drive its lifting and lowering. When the pressing member 30 moves downward toward the cover body 10, it is used to press down the substrate 60 carried on the bearing surface 11.

[0062] A support member 40 is provided on the pressing member 30. The support member 40 is disposed on the pressing surface 31, thus forming a protruding structure on the pressing surface 31. When the pressing member 30 moves along the first direction a towards the cover body 10, the support member 40 supports the positioning surface 21, so that the pressing surface 31 is parallel to the bearing surface 11 and faces it along the first direction a, maintaining a second set distance. This second set distance can be set based on the thickness of the substrate 60 being supported, to ensure that the pressing surface 31 is in contact with or about to contact the substrate 60, so as to form appropriate pressure on the substrate 60 to limit its displacement, and to prevent the substrate 60 from being damaged by excessive pressure. The specific size of the second set distance is determined by the first set distance and the dimension of the support member 40 along the first direction a, so the second set distance can be adjusted by setting the size of the first set distance and the size of the support member 40 along the first direction a.

[0063] The aforementioned second set distance can be slightly greater than or equal to the thickness of the substrate 60. The setting of the second set distance can ensure the limit position of the pressing member 30 moving towards the cover body 10, thereby ensuring the limit position accuracy of the pressing member 30.

[0064] like Figure 1 As shown, the pressing member 30 has a hollow area 32 along the first direction a, and the pressing surface 31 forms a closed ring structure around the hollow area 32, so that the pressing surface 31 is in complete contact with the edge of the upper surface of the substrate 60. The hollow area 32 is directly opposite the bearing surface 11, so that the middle position of the substrate 60 supported on the bearing surface 11 is directly opposite the hollow area 32. This ensures that the middle position of the substrate 60 is not obstructed, so as to facilitate the formation of a film by vapor deposition at the middle position of the substrate 60.

[0065] In this embodiment, the hollow area 32 is a circular region, and the outer peripheral surface of the pressing member 30 is cylindrical. The hollow area 32 and the outer peripheral surface of the pressing member 30 are coaxially arranged, making the pressing member 30 have an overall annular structure. This exposes the central circular area on the upper surface of the substrate 60 for vapor deposition. In other alternative embodiments, the shape of the hollow area 32 can be set based on actual process requirements. Furthermore, the shape of the outer contour of the pressing member 30 can be set based on actual needs; for example, the outer contour of the pressing member 30 can be set as a square or other polygonal structure.

[0066] Please continue to refer to this. Figure 1 As shown, the support member 40 is an annular protrusion surrounding the hollow area 32, and the inner diameter of the support member 40 is larger than the inner diameter of the hollow area 32.

[0067] Specifically, the support member 40 is configured as a circular protrusion, and a portion of the support member 40 ( Figure 1 The middle part near the lower end is covered by the outer cover of the main body 10, and the support member 40 is supported on the positioning surface 21.

[0068] like Figure 1 As shown, in this embodiment, the outer circumferential surface of the support member 40 is a cylindrical surface of equal diameter, and the inner circumferential surface of the support member 40 is a variable diameter structure, which extends along the first direction a from the side near the pressing surface 31 to the side away from the pressing surface 31 (along... Figure 1 From top to bottom, the inner diameter of the inner circumferential surface of the support member 40 gradually increases. The minimum inner diameter of the inner circumferential surface of the support member 40 is smaller than the outer diameter of the cover body 10, and the maximum inner diameter of the inner circumferential surface of the support member 40 is larger than the outer diameter of the cover body 10. The upper end of the support member 40 (the end with the smallest inner diameter) is higher than the bearing surface 11, so the upper end of the support member 40 will not contact the outer wall of the cover body 10. Furthermore, since the inner diameter of the inner circumferential surface of the support member 40 gradually increases downwards, the inner circumferential surface of the support member 40 will not contact the outer wall of the cover body 10 to prevent interference.

[0069] like Figure 1 As shown, in this embodiment, a chamfer is provided at the edge of the upper surface (bearing surface 11) of the cover body 10. The chamfer is provided to avoid interference with the inner circumferential surface of the support member 40.

[0070] In other alternative embodiments, the inner circumferential surface of the support member 40 can be configured as a constant diameter structure. In this case, the inner diameter of the support member 40 should be larger than the outer diameter of the cover body 10 to prevent the inner wall of the support member 40 from contacting the outer wall of the cover body 10.

[0071] Please continue to refer to this. Figure 1As shown, in this embodiment, the inner diameter of the pressing member 30 gradually increases from bottom to top along the first direction a. That is, the hollow area 32 of the pressing member 30 has an upwardly expanding flared structure, which on the one hand can ensure a larger pressing surface 31 to meet the pressing requirements of the substrate 60; on the other hand, it can minimize the obstruction of the coating material located above the substrate 60 to ensure the effect of physical deposition on the upper surface of the substrate 60.

[0072] Please continue to refer to this. Figure 1 As shown, in this embodiment, the lower surface (pressing surface 31) of the pressing member 30 is provided with a downwardly protruding functional member 33, which surrounds the support member 40. The functional member 33 can be reserved for cooperation with external equipment.

[0073] In this embodiment, the functional component 33 is integrally formed on the pressing member 30, and the support member 40 is integrally formed on the pressing member 30. In other alternative embodiments, the support member 40 and the functional component 33 may also be connected to the pressing member 30 as independent components.

[0074] Please continue to refer to this. Figure 1 As shown, in this embodiment, the positioning surface 21 is a planar structure and is parallel to the bearing surface 11. In other alternative embodiments, the positioning surface 21 can be configured as a curved structure, and the first predetermined distance between the positioning surface 21 and the bearing surface 11 is the distance from the position where the support member 40 contacts the positioning surface 21 along the first direction a from the bearing surface 11.

[0075] Please continue to refer to this. Figure 1 and Figure 2 As shown, in this embodiment, the positioning member 20 includes a boss 201. The boss 201 is disposed on one side of the covering body 10 perpendicular to the first direction a. In this embodiment, the covering body 10 has a disc-shaped structure, so the boss 201 is disposed on the outer peripheral surface of the covering body 10.

[0076] The boss 201 is positioned on the side of the bearing surface 11 along the first direction a.

[0077] like Figure 2 As shown, specifically, the positioning member 20 includes two bosses 201; the two bosses 201 are evenly disposed on the outer peripheral surface of the covering body 10 along the circumference of the covering body 10. The bosses 201 have a semi-circular structure, and the two bosses 201 are circumferentially spaced apart. Each of the bosses 201 is provided with a positioning surface 21, such that each positioning surface 21 is disposed around the bearing surface 11 to form circumferentially uniform support for the support member 40.

[0078] In other alternative embodiments, the number of bosses 201 can be three, four, or more, with each boss 201 evenly distributed circumferentially. Alternatively, only one boss 201 can be provided, and the boss 201 can be configured as a closed annular structure formed along the circumference of the covering body 10. The number and specific structure of the bosses 201 can be adjusted based on actual support requirements.

[0079] In addition, this embodiment also provides a heating device, which includes the cover and heater 50 described above.

[0080] Combination Figure 1 and Figure 3 As shown, the heater 50 has a heating surface, and the heater 50 cooperates with the mounting part 12 so that the covering body 10 covers the heating surface of the heater.

[0081] Specifically, in combination Figure 1 and Figure 3 As shown, the upper surface of the heater 50 serves as the heating surface. The upper end of the heater 50 is fitted into the mounting groove 121, and the upper surface of the heater 50 is in contact with the bottom of the mounting groove 121. At this time, the entire cover body 10 covers the upper surface of the heater, and the upper surface of the heater 50 is parallel to the bearing surface 11 of the cover body 10. The bearing surface 11 of the cover body 10 is used to support the substrate 60, and to position the pressing member 30 and the support member 40. In addition, it also protects the upper surface of the heater 50.

[0082] like Figure 3 As shown, in this embodiment, a plurality of first grooves 13 are provided on the outer periphery of the cover body 10. The first grooves 13 and the second grooves 51 on the heater 50 are arranged opposite each other along the first direction a to meet their installation requirements.

[0083] In this embodiment, the heating device differs from the existing heater in that a cover is added on the basis of the existing heater. The heater 60 in this embodiment can be consistent with the structure of the existing heater, which will not be described in detail here.

[0084] This embodiment also provides a physical vapor deposition apparatus, including the cover, pressure member 30, support member 40 and heater 50 described above.

[0085] In addition, physical vapor deposition equipment also includes a process chamber, a vacuum system, a gas introduction system, and a target and cathode.

[0086] The process chamber provides a clean and controllable process environment. During the deposition process, the process chamber is evacuated to a high vacuum to remove contaminants such as moisture and oxygen, preventing target oxidation and film contamination. The aforementioned cover, pressure member 30, support member 40, and heater 50 are all housed within the process chamber.

[0087] The vacuum system is used to achieve and maintain a high vacuum within the process chamber. The gas introduction system is used to precisely introduce process gas into the process chamber. After being ionized, the process gas is accelerated by an electric field and bombards the target material, causing momentum transfer and achieving sputtering. The target material is the raw material to be deposited (such as aluminum, titanium, copper, etc.). The cathode is the electrode used to apply a negative potential and is the core component of sputtering.

[0088] In this embodiment, the physical vapor deposition equipment differs from existing equipment in the setting of the cover, the assembly method of the cover and the heater 50, and the setting of the pressure member 30 and the support member 40. Other structures are consistent with existing physical vapor deposition equipment and will not be described in detail here.

[0089] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0090] The above description is merely a description of a preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A cover, characterized in that, include: Covering the main body and positioning components; The cover body has a bearing surface at a first end along a first direction, and an assembly part is provided at a second end along the first direction. The assembly part is used to cooperate with the heater and make the cover body cover the heating surface of the heater. The positioning element is disposed on the cover body, and the positioning element has a positioning surface. The positioning surface is located on the side of the bearing surface near the second end, and the positioning surface and the bearing surface have a first set distance along the first direction.

2. The cover as claimed in claim 1, characterized in that, The positioning surface is parallel to the bearing surface.

3. The cover as claimed in claim 1, characterized in that, The assembly part includes an assembly groove disposed at the second end, the bottom of which is used to fit against the heating surface.

4. The cover as claimed in claim 1, characterized in that, The positioning element includes a boss, which is disposed on one side of the cover body perpendicular to the first direction, and the side of the boss close to the bearing surface along the first direction serves as the positioning surface.

5. The cover as claimed in claim 4, characterized in that, The positioning element includes multiple bosses; Each of the aforementioned protrusions is provided with a positioning surface, and each of the aforementioned positioning surfaces is arranged around the bearing surface.

6. The cover as claimed in claim 1, characterized in that, The covering body is disc-shaped, and the first direction is the axial direction of the covering body.

7. A pressing device, characterized in that, Includes the cover as described in any one of claims 1 to 6, as well as the pressing member and the support member; The pressing member is configured to move relative to the cover body in a first direction, and one end of the pressing member in the first direction has a pressing surface; The support member is disposed on the lower pressure surface and is used to support the positioning surface, such that the lower pressure surface is parallel to the bearing surface and faces each other along the first direction while maintaining a second predetermined distance; The pressing component has a hollow area along the first direction, the pressing surface surrounds the hollow area, and the hollow area faces the bearing surface.

8. The pressing device as described in claim 7, characterized in that, The support member has an annular protrusion around the hollowed-out area, and the inner diameter of the support member is larger than the inner diameter of the hollowed-out area.

9. A heating device, characterized in that, Includes the cover and heater as described in any one of claims 1 to 6; The heater has a heating surface, and the heater cooperates with the assembly so that the cover body covers the heating surface of the heater.

10. A physical vapor deposition apparatus, characterized in that, Includes the cover as described in any one of claims 1 to 6.

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