Spraying device and atomic layer deposition apparatus

CN224812632UActive Publication Date: 2026-09-29TRINA SOLAR CO LTD
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Patent Information

Application Number
CN202522284992.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-29
Publication Date
2026-09-29
Estimated Expiration
2035-10-29

AI Technical Summary

Technical Problem

[0005]本实用新型旨在解决上述技术问题,即,解决现有的原子层沉积设备的喷淋装置喷淋扩散不均匀的问题

Benefits of technology

[0017]在采用上述技术方案的情况下,本实用新型能够通过第一喷淋单元和第二喷淋单元改善前驱体和惰性保护气体的扩散状态,提高喷淋的均一性,获得良好的喷淋效果。

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to atomic layer deposition equipment technical field, concretely provides a spraying device and atomic layer deposition equipment, aims at solving the problem of uneven spraying diffusion of the spraying device of the existing atomic layer deposition equipment. For this purpose, the spraying device of the utility model comprises a plurality of first spraying units and a plurality of second spraying units arranged at intervals, each first spraying unit comprises a first shell and a first spraying plate assembly arranged in the first shell, the first spraying plate assembly comprises upper and lower spraying plates opposite to each other, is used for spraying the precursor suitable for atomic layer deposition and shunting the precursor, each second spraying unit is configured to spray the inert protective gas suitable for providing the inert environment for atomic layer deposition and shunt the inert protective gas. The spraying device improves the diffusion state of the precursor and the inert protective gas through the first spraying unit and the second spraying unit, improves the uniformity of spraying, and obtains good spraying effect.
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Description

Technical Field

[0001] This utility model relates to the field of atomic layer deposition equipment technology, specifically providing a spraying device and atomic layer deposition equipment. Background Technology

[0002] Atomic layer deposition (ALD) is a thin film deposition technique based on surface chemical vapor reaction. It involves separately introducing two or more chemical gas precursors into a reaction chamber, allowing each precursor to undergo a fully saturated surface chemical reaction on the substrate surface. During this process, the gaseous reaction products and unreacted gases are purged after the saturated surface reaction. Therefore, materials can be deposited on the substrate surface in the form of a single-atom film, and the thickness and uniformity of the deposited film can be precisely controlled within the atomic layer thickness range.

[0003] Spatial ALD is a technique for atomic layer deposition that achieves atomic layer deposition by spatially separating the reactive gases rather than using traditional time-sequential methods. Its high deposition rate, excellent uniformity, and conformal properties have led to its rapid penetration into fields such as semiconductors, optics, and aerospace. Unlike traditional time-sequential ALD, which relies on time cycles, spatial ALD uses physical structures (such as rotary tables or linear conveyor belts) to spatially isolate the precursor reaction regions. The substrate is sequentially exposed to different reactive gas regions during rotation or translation, achieving continuous deposition.

[0004] The spray system, as a crucial component of atomic layer deposition (ALD) equipment, significantly impacts the deposition results. Existing spray systems are relatively simple in structure; precursors (such as metal and oxygen sources) are transported to the spray plate via pipelines and then sprayed out in a linear pattern. This results in a concentrated distribution of the metal and oxygen sources, leading to uneven diffusion within the ALD chamber. Oxygen sources, in particular, can cause significant damage to materials sensitive to water and oxygen. The linear spraying of oxygen also has a substantial impact on the battery. Furthermore, the source pressure is entirely controlled by the pressure of the carrier gas; however, the amount of carrier gas determines the source flow rate, making adjustments difficult. Utility Model Content

[0005] The present invention aims to solve the above-mentioned technical problems, namely, to solve the problem of uneven spray diffusion in the spray device of existing atomic layer deposition equipment.

[0006] In a first aspect, the present invention provides a spraying device for an atomic layer deposition (ALD) apparatus, the spraying device comprising a plurality of first spraying units and a plurality of second spraying units arranged at intervals; each first spraying unit comprising a first housing and a first spraying plate assembly disposed within the first housing; the first spraying plate assembly comprising an upper spraying plate and a lower spraying plate opposite to each other, for spraying a precursor suitable for ALD and diverting the precursor; each second spraying unit configured to spray an inert protective gas suitable for providing an inert environment for ALD and divert the inert protective gas.

[0007] Further, the first housing includes: a top plate with a first injection hole for injecting the precursor into the first housing; and a side wall with a limiting groove, the upper spray plate and the lower spray plate being inserted into the limiting groove respectively, and the upper spray plate being located between the top plate and the lower spray plate.

[0008] Furthermore, the upper spray plate has multiple first air channels arranged radially on the upper spray plate, which are used to perform a first diversion of the precursor injected into the first housing.

[0009] Furthermore, the lower spray plate is a hollow cavity structure, and the top and bottom surfaces of the lower spray plate are provided with first air holes that are opposite to each other and form fluid communication with the cavity structure, for the purpose of performing a second diversion of the precursor passing through the upper spray plate.

[0010] Furthermore, a movable spray plate is provided within the cavity structure, and a second air hole is provided on the movable spray plate; a rotating shaft is provided within the cavity structure, and the movable spray plate is pivotally connected to the rotating shaft, so that the movable spray plate can rotate around the rotating shaft, for adjusting the channel through which the precursor passes through the lower spray plate.

[0011] Furthermore, the edge of the movable spray plate is provided with a manual adjustment part for rotating the movable spray plate.

[0012] Furthermore, each of the upper spray plate and the lower spray plate is provided with a flange that can be inserted into the limiting groove.

[0013] Furthermore, each of the second spray units includes a second housing;

[0014] The top surface of the second housing has a second injection hole for injecting inert protective gas into the second housing; the bottom surface of the second housing has multiple second gas channels for diverting the inert protective gas injected into the second housing.

[0015] Furthermore, the second spray unit also includes a foldable baffle disposed at the edge of the bottom surface of the second housing; the foldable baffle can be unfolded from the edge of the bottom surface of the second housing towards the center to block the second air passage disposed on the bottom surface of the second housing.

[0016] In a second aspect, the present invention also provides an atomic layer deposition apparatus, which includes a spraying device and a substrate as described above, wherein the substrate is disposed below the spraying device and is used to support the component to be sprayed.

[0017] By adopting the above technical solution, this utility model can improve the diffusion state of the precursor and the inert protective gas through the first spray unit and the second spray unit, improve the uniformity of spraying, and obtain a good spraying effect. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] In the attached image:

[0020] Figure 1 This is a top view of the spray device in an embodiment of this application;

[0021] Figure 2 This is a top view of the first spray unit of the spraying device in an embodiment of this application.

[0022] Figure 3 This is a cross-sectional view of the first spray unit of the spraying device in an embodiment of this application;

[0023] Figure 4 This is a schematic diagram of the structure of the upper spray plate of the first spray unit in the embodiments of this application;

[0024] Figure 5 This is a schematic diagram of the structure of the lower spray plate of the first spray unit in the embodiments of this application;

[0025] Figure 6 This is a schematic diagram of the structure of the movable spray plate of the first spray unit in the embodiments of this application;

[0026] Figure 7 This is a schematic diagram of the structure of the lower spray plate and the movable spray plate of the first spray unit in the embodiment of this application.

[0027] Figure 8This is a schematic diagram of the structure of the second spray unit in the embodiments of this application;

[0028] Figure 9 This is a cross-sectional view of the second spray unit in an embodiment of this application.

[0029] Figure label:

[0030] 10. First spray unit; 11. First housing; 111. Top plate; 112. Side wall; 113. First injection hole; 114. Limiting groove; 12. First spray plate assembly; 121. Upper spray plate; 1211. First air passage; 122. Lower spray plate; 1221. First air hole; 123. Movable spray plate; 1231. Second air hole; 1232. Manual adjustment part; 124. Rotating shaft; 125. Flange; 20. Second spray unit; 21. Second housing; 211. Second air passage; 22. Foldable baffle. Detailed Implementation

[0031] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. Those skilled in the art can make adjustments as needed to adapt to specific application scenarios.

[0032] First, it should be noted that in the description of this utility model, the terms "upper," "lower," "left," "right," "vertical," "horizontal," "longitudinal," "inner," and "outer," which indicate directional or positional relationships, are based on the directional or positional relationships shown in the accompanying drawings. These are merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0033] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] like Figures 1 to 9As shown in the figure, this application provides a spraying device. This spraying device is used in an atomic layer deposition apparatus to achieve the corresponding reaction by spraying specific process jets, such as precursors (e.g., metal sources, oxygen sources) and inert protective gases (e.g., nitrogen, helium, neon, argon), into the reaction chamber of the atomic layer deposition apparatus.

[0035] like Figure 1 As shown, the spraying device in this embodiment includes a plurality of first spraying units 10 and a plurality of second spraying units 20 arranged at intervals. The number of first spraying units 10 and second spraying units 20 can be the same or different. For example, the arrangement of the first spraying units 10 and second spraying units 20 can be: two first spraying units 10 -- one second spraying unit 20 -- two first spraying units 10 -- one second spraying unit 20. It can also be as follows: Figure 1 The arrangement shown is as follows: The spray device includes two first spray units 10 and two second spray units 20; each spray unit is a quarter circle, and the four spray units are combined to form a circle. The two first spray units 10 are separated by the two second spray units 20. The arrangement order of the four spray units is: first spray unit 10 -- second spray unit 20 -- first spray unit 10 -- second spray unit 20.

[0036] The number and shape of the first spray unit 10 and the second spray unit 20 can be determined as needed, and this application does not impose specific limitations on this. As long as the uniformity of spraying can be guaranteed, it is acceptable.

[0037] like Figure 2 and Figure 3 As shown, the first spray unit 10 includes a first housing 11 and a first spray plate assembly 12 disposed within the first housing 11 for spraying a precursor (e.g., a metal source or an oxygen source). The first housing 11 includes a top plate 111 and a side wall 112. The first spray plate assembly 12 includes an upper spray plate 121 and a lower spray plate 122 disposed opposite to each other for spraying a precursor suitable for atomic layer deposition and for diverting the precursor. A first injection hole 113 is provided on the top plate 111 for injecting the precursor into the first housing 11. A limiting groove 114 is provided on the side wall 112 so that the upper spray plate 121 and the lower spray plate 122 can be respectively inserted into the limiting groove 114, and the upper spray plate 121 is located between the top plate 111 and the lower spray plate 122. After the precursor enters the first housing 11 through the first injection hole 113, it passes through the upper spray plate 121 and the lower spray plate 122 in sequence and is then sprayed out from the spraying device.

[0038] Specifically, such as Figure 4As shown, multiple first air passages 1211 are provided on the upper spray plate 121. The multiple first air passages 1211 are arranged radially on the upper spray plate 121 to perform the first diversion of the precursor injected into the first housing 11.

[0039] like Figure 3 and Figure 5 As shown, the lower spray plate 122 is a hollow cavity structure. The top and bottom surfaces of the lower spray plate 122 are provided with first air holes 1221 that are opposite to each other and form fluid communication with the cavity structure, which are used to perform a second diversion of the precursor passing through the upper spray plate 121.

[0040] Furthermore, such as Figures 6 to 7 As shown, a movable spray plate 123 is provided within the cavity structure of the lower spray plate 122, and a second air hole 1231 is provided on the movable spray plate 123. Typically, multiple second air holes 1231 are provided on the movable spray plate 123. The diameter, number, arrangement range, and arrangement method of the second air holes 1231 on the movable spray plate 123 can be determined as needed (e.g., the spacing between two adjacent second air holes 1231, etc.).

[0041] A rotating shaft 124 is also provided in the cavity structure of the lower spray plate 122. The movable spray plate 123 is pivotally connected to the rotating shaft 124, allowing the movable spray plate 123 to rotate around the rotating shaft 124. By rotating the movable spray plate 123, the overlap area between the second air hole 1231 provided on the movable spray plate 123 and the first air hole 1221 opened on the top and bottom surfaces of the lower spray plate 122 can be adjusted, that is, the channel area through which the precursor passes through the lower spray plate 122. This allows adjustment of the airflow size and pressure of the precursor passing through the lower spray plate 122.

[0042] Furthermore, such as Figure 6 As shown, the movable spray plate 123 is provided with a manual adjustment part 1232 on its edge for rotating the movable spray plate 123. The movable spray plate 123 can also be adjusted by electric or mechanical means.

[0043] like Figure 3 As shown, each of the upper spray plate 121 and the lower spray plate 122 is provided with a flange 125 that can be inserted into a limiting groove 114 provided on the side wall 112 of the first housing 11. Typically, the flange 125 is provided on the side wall of the upper spray plate 121 and the lower spray plate 122 at a position opposite to the limiting groove 114.

[0044] The spraying device in this embodiment of the application improves the diffusion state of the precursor and enhances the uniformity of the precursor spraying by using an upper spray plate 121 and a lower spray plate 122 in the first spraying unit 10 to divert the precursor injected into the first housing 11 of the first spraying unit 10 twice. A rotatable movable spray plate 123 is provided in the lower spray plate 122, allowing the movable spray plate 123 to cooperate with the lower spray plate 122 and control the size of the actual spray nozzle. This configuration allows for flexible adjustment of the flow rate and pressure of the precursor sprayed by the spraying device according to process requirements. It also prevents the precursor from directly blowing onto the battery, thus avoiding damage to the battery.

[0045] like Figure 8 and Figure 9 As shown, the second spray unit 20 includes a second housing 21 for spraying an inert protective gas (e.g., nitrogen). A second injection hole (not shown) is provided on the top surface of the second housing 21 for injecting the inert protective gas into the second housing 21; multiple second gas channels 211 are provided on the bottom surface of the second housing 21 for diverting the inert protective gas injected into the second housing 21.

[0046] Furthermore, such as Figure 8 and Figure 9 As shown, the second spray unit 20 also includes a foldable baffle 22 disposed at the bottom edge of the second housing 21; the foldable baffle 22 can be unfolded from the edge of the bottom surface of the second housing 21 toward the middle to block the second air passage 211 disposed on the bottom surface of the second housing 21, thereby increasing the number of second air passages 211 that output inert protective gas.

[0047] In this embodiment, the spraying device achieves the diversion of inert protective gas through multiple second air channels 211 disposed on the bottom surface of the second housing 21 of the second spraying unit 20. Furthermore, the foldable baffle 22 disposed at the edge of the bottom surface of the second housing 21 optimizes the area of ​​inert protective gas sprayed by the second spraying unit 20, allowing for adjustment of the area according to process requirements.

[0048] This application also provides an atomic layer deposition apparatus, which includes a spraying device as described above and a substrate. The substrate is disposed below the spraying device, and the component to be sprayed is placed on the substrate. During the spraying process, the substrate rotates, causing the component placed on the substrate to pass sequentially below the first spraying unit 10 and the second spraying unit 20 in the spraying device, so that the spraying device sprays a specific process jet onto the surface of the component to achieve the corresponding reaction.

[0049] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A spraying device for use in atomic layer deposition equipment, characterized in that, The spraying device includes a plurality of first spraying units (10) and a plurality of second spraying units (20) arranged at intervals. Each of the first spray units (10) includes a first housing (11) and a first spray plate assembly (12) disposed within the first housing (11). The first spray plate assembly (12) includes an upper spray plate (121) and a lower spray plate (122) opposite to each other for spraying a precursor suitable for atomic layer deposition and for diverting the precursor; Each of the second spray units (20) is configured to spray an inert protective gas suitable for providing an inert environment for the atomic layer deposition and to divert the inert protective gas.

2. The spraying device according to claim 1, characterized in that, The first housing (11) includes: Top plate (111), on which a first injection hole (113) is provided for injecting the precursor into the first housing (11); and Side wall (112), a limiting groove (114) is provided on the side wall (112), the upper spray plate (121) and the lower spray plate (122) are respectively inserted into the limiting groove (114), and the upper spray plate (121) is located between the top plate (111) and the lower spray plate (122).

3. The spraying device according to claim 2, characterized in that, The upper spray plate (121) has multiple first air passages (1211) arranged radially on the upper spray plate (121) to perform the first diversion of the precursor injected into the first housing (11).

4. The spraying device according to claim 3, characterized in that, The lower spray plate (122) is a hollow cavity structure. The top and bottom surfaces of the lower spray plate (122) are provided with first air holes (1221) that are opposite to each other and form fluid communication with the cavity structure, for the second diversion of the precursor passing through the upper spray plate (121).

5. The spraying device according to claim 4, characterized in that, A movable spray plate (123) is provided inside the cavity structure, and a second air hole (1231) is provided on the movable spray plate (123); a rotating shaft (124) is provided in the cavity structure, and the movable spray plate (123) is pivotally connected to the rotating shaft (124), so that the movable spray plate (123) can rotate around the rotating shaft (124) to adjust the channel of the precursor through the lower spray plate (122).

6. The spraying device according to claim 5, characterized in that, The edge of the movable spray plate (123) is provided with a manual adjustment part (1232) for rotating the movable spray plate (123).

7. The spraying device according to any one of claims 2 to 6, characterized in that, Each of the upper spray plate (121) and the lower spray plate (122) is provided with a flange (125) that can be inserted into the limiting groove (114).

8. The spraying device according to claim 1, characterized in that, Each of the second spray units (20) includes a second housing (21); a second injection hole is provided on the top surface of the second housing (21) for injecting inert protective gas into the second housing (21); a plurality of second gas channels (211) are provided on the bottom surface of the second housing (21) for diverting the inert protective gas injected into the second housing (21).

9. The spraying device according to claim 8, characterized in that, The second spray unit (20) also includes a foldable baffle (22) disposed at the bottom edge of the second housing (21); the foldable baffle (22) can be unfolded from the edge of the bottom surface of the second housing (21) toward the middle to block the second air passage (211) disposed on the bottom surface of the second housing (21).

10. An atomic layer deposition apparatus, characterized in that, include: The spraying device as described in any one of claims 1 to 9; and A substrate, which is disposed below the spraying device, is used to support the parts to be sprayed.