Automatic buffer air dryer for PCB board

Abstract

The utility model discloses an automatic buffer air -dryer for PCB board, including a transfer mechanism, the buffer mechanism of being located the one end of this transfer mechanism and the air -dry mechanism of being located the one end of this buffer mechanism, and transfer mechanism includes a transfer support frame, the transfer subassembly of being located on transfer support frame and the push -on plate subassembly of being located the one end of transfer subassembly, buffer mechanism includes a frame entry subassembly, the buffer storehouse of being located on frame entry subassembly, the progressive lifting subassembly of being located the junction of frame entry subassembly and transfer support frame and the push frame subassembly of being located one side of progressive lifting subassembly, and air -dry mechanism includes at least one fan, the heat supply component of being located the one end of fan air -outlet through air pipe and the air -dry storehouse of being located the one end of heat supply component, and the utility model discloses the automatic cooperation work of transfer mechanism, buffer mechanism and air -dry mechanism, has realized the full process automation operation from PCB board transfer, buffer to air -dry, has promoted production efficiency.

Description

Technical Field

[0001] This utility model relates to the technical field of PCB board buffer drying, and specifically to an automatic buffer drying machine for PCB boards. Background Technology

[0002] In the electronics manufacturing industry, PCB board buffer drying is a key process. It involves placing the PCB board, after surface treatment (such as coating, cleaning, or etching), in a specific environment and using air flow or temperature control to achieve natural evaporation or forced drying of residual solvents, moisture, and impurities. It is widely used in PCB production processes for consumer electronics, automotive electronics, and communication equipment. Equipment such as static drying racks, hot air circulating ovens, or ventilated drying rooms are often used. Precise control of ambient temperature, humidity, and air flow speed ensures uniform drying of the PCB board surface, avoiding warping, oxidation, or residue adhesion caused by localized over-drying or over-wetting. At the same time, by reasonably setting the buffer time and drying parameters (such as temperature gradient and air velocity distribution), the drying efficiency and board quality are balanced, making it an important technical means to ensure the electrical performance, dimensional accuracy, and surface cleanliness of PCB boards.

[0003] In the PCB manufacturing industry, existing practices such as static air drying racks, hot air circulating ovens, or ventilated drying rooms require workers to be on duty in real time, which is labor-intensive, requires a large area, and the long drip drying cycle leads to long periods of idle operation of downstream equipment. The process is not smooth, and the transfer, buffering, and air drying links are mostly independent equipment or segmented operations, requiring manual intervention and coordination, which leads to extended processing cycles and easy operational errors. Summary of the Invention

[0004] The purpose of this utility model is to overcome the shortcomings of existing technologies and provide an automatic buffer drying machine for PCB boards. Through the automated coordination of the transfer mechanism, buffer mechanism, and drying mechanism, the stepper motor of the infeed assembly drives the conveyor belt to transport empty buffer bins; the lifting cylinder of the progressive lifting assembly drives the lifting frame downwards to match the storage interval of the buffer bins; the lifting cylinder of the pusher assembly lifts and pushes with the horizontal push rod; and the pusher cylinder of the pusher assembly pushes the buffer bins into the drying chamber. This coordinated operation achieves fully automated operation from PCB board transfer and buffering to drying, solving problems such as high labor intensity due to real-time worker supervision, large footprint, idle downstream equipment, need for manual intervention and coordination in segmented transfer, buffering, and drying operations, need for manual board insertion for line changes or spot checks disrupting continuous flow, and long drip drying cycles leading to extended processing cycles. It reduces the need for manual intervention and operational errors, improving production efficiency and... The process is seamless; the temperature control module of the heating component receives the temperature sensor signal in the liquid storage tank and feeds it back to the electrical control module to regulate the heating wire to stabilize the water solution temperature. The air outlet in the drying chamber is connected to the duct via branch pipes to ensure hot air circulation, solving the problems of unstable drying temperature leading to localized over-drying or over-wetting, and softening or dissolving of the sealant. This achieves constant temperature drying and uniform hot air output within the drying chamber, ensuring uniform drying of the PCB board surface and guaranteeing its electrical performance. The transfer component's drive motor drives the tension roller via a transmission belt, synchronously rotating the guide belt to achieve stable PCB board transfer. The pusher head of the horizontal push rod in the pusher component is equipped with a buffer pad to prevent damage during pushing. The guide mechanism rollers and stop plates at the bottom of the drying chamber ensure smooth entry of the buffer bin without slippage. This solves the problems of low efficiency and easy damage to PCB boards caused by manual board insertion, improving equipment operating safety, transfer efficiency, and overall process efficiency.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: An automatic buffer drying machine for PCB boards includes a transfer mechanism, a buffer mechanism at one end of the transfer mechanism, and a drying mechanism at one end of the buffer mechanism. The transfer mechanism includes a transfer support frame, a transfer component on the transfer support frame, and a pusher assembly at one end of the transfer component. The buffer mechanism includes an infeed assembly, a plurality of buffer compartments on the infeed assembly, a progressive lifting assembly at the connection between the infeed assembly and the transfer support frame, and a pusher assembly on one side of the progressive lifting assembly. The drying mechanism includes at least one fan, a heating component connected to the fan outlet via an air duct, and a drying compartment at one end of the heating component. The transfer mechanism is used to transfer the PCB board to the pusher assembly station at one end of the transfer support frame via the transfer component; the buffer mechanism is used to transfer the buffer compartments to the progressive lifting assembly station via the infeed assembly; and the pusher assembly is used to... The PCB board is pushed into the buffer chamber by a progressive lifting assembly, and the pusher assembly is used to transfer the buffer chamber into the drying chamber. The drying mechanism is used to transport the heated gas generated by the heating assembly to the drying chamber for constant temperature drying of the PCB board by a fan. The heating assembly includes an electrical control module located in the electrical box, a temperature control module electrically connected to the electrical control module, a heating conductor electrically connected to the electrical control module, a heat sink shell wrapped around the heating conductor, and a liquid storage tank connected to the heat sink shell through a connecting pipe. The liquid storage tank contains a solution, which is used to conduct the heat generated by the heating conductor to the heat sink shell. The heating conductor includes a positive electrode connection part, a negative electrode connection part, and a plurality of heating wires electrically connected between the positive electrode connection part and the negative electrode connection part. The heating wires are arranged in a ring around the heat sink shell. The heat sink shell is fixedly installed in a heating pipe, which is connected to an air duct.

[0006] The transfer assembly includes a guide belt on each of the two inner sides of the transfer support frame, a tension roller at each end of the two guide belts, and a drive motor connected to the tension roller via a transmission belt. The drive motor is used to drive the tension roller to rotate via the transmission belt, so that the guide belts rotate synchronously and transfer the PCB board.

[0007] The pusher assembly includes a pusher motor mounted on a transfer support frame via a support plate, a horizontal push rod mounted on the output end of the pusher motor via a synchronous belt, a slide rail slidably connected below the horizontal push rod, and four sets of lifting cylinders mounted on the support plate. The pusher motor is used to drive the horizontal push rod to move along the slide rail via the synchronous belt, and the lifting cylinders are used to lift the PCB board transferred by the transfer assembly to a certain height so that the horizontal push rod can return to push after the pusher has finished pushing the board.

[0008] One end of the horizontal push rod is equipped with a push head, and the push head is equipped with a buffer pad to prevent the push head from damaging the PCB board during pushing.

[0009] The frame feeding assembly includes a mounting frame, a conveyor belt mounted on the mounting frame via two tension rollers, and a stepper motor mounted at one end of the mounting frame via a motor encoder. The stepper motor is connected to a tension roller via a belt.

[0010] The progressive lifting assembly includes a lifting base, a lifting control ruler on one side of the lifting base, a lifting cylinder under the lifting base, a lifting frame on the lifting base, and a lifting plate on the lifting frame. The lifting cylinder is fixedly connected to the sliding end of the lifting frame via a lifting shaft. The lifting cylinder is used to drive the sliding end of the lifting frame to rise through the lifting shaft. The driving stroke of the lifting cylinder is controlled by a sensor on the lifting frame in conjunction with the lifting control ruler.

[0011] The push frame assembly includes a push frame bracket, at least one push frame cylinder mounted on the push frame bracket, and a push frame plate mounted at the output end of the push frame cylinder. The push frame cylinder is used to drive the push frame plate through the push frame shaft to push the buffer chamber into the drying chamber.

[0012] The drying chamber is equipped with several air outlets, which are connected to the air duct via branch pipes. The drying chamber has an outlet on one side for removing the buffer chamber.

[0013] The bottom of the drying chamber is equipped with a guide mechanism, which is used to cooperate with the push frame assembly to allow the buffer chamber to slide into the drying chamber.

[0014] The guiding mechanism includes two sets of mounting seats fixed to the bottom of the drying chamber, several rollers rotatably connected to the two mounting seats, and a stop plate at one end of the mounting seats. The stop plate is used to prevent the buffer compartment from sliding out of the drying chamber.

[0015] The beneficial effects of this utility model are as follows: 1. Through the automated coordination of the transfer mechanism, buffer mechanism and drying mechanism, the stepper motor of the frame feeding component drives the conveyor belt to transport empty buffer bins, the lifting cylinder of the progressive lifting component drives the lifting frame to descend to match the storage interval of the buffer bins, the lifting cylinder of the push plate component lifts and pushes with the horizontal push rod, and the push frame component pushes the buffer bins into the drying chamber. The coordinated operation of these mechanisms realizes the fully automated operation of the entire process from PCB board transfer, buffering to drying, reduces the need for manual intervention and operational errors, and improves production efficiency and process continuity. 2. The temperature control module of the heating component receives the temperature sensor signal in the liquid storage tank and feeds it back to the electronic control module to regulate the heating wire to stabilize the water temperature. The air outlet in the drying chamber is connected to the air duct branch pipe to achieve hot air circulation, ensuring that the PCB board surface is dried evenly and guaranteeing its electrical performance. 3. The PCB board is stably transferred by the drive motor of the transfer component driving the tension roller through the transmission belt to drive the guide belt to rotate synchronously. The pusher head of the horizontal push rod of the pusher assembly is equipped with a buffer pad to prevent damage during pushing. The guide mechanism rollers and stop plate at the bottom of the drying chamber ensure that the buffer chamber enters smoothly without slipping out, which improves the safety of equipment operation, transfer efficiency and overall process efficiency. Attached Figure Description

[0016] Figure 1 This is one of the perspective views of this utility model.

[0017] Figure 2 This is the second perspective view of this utility model.

[0018] Figure 3 This is a perspective view of the transfer mechanism of this utility model.

[0019] Figure 4 This is a perspective view of the push plate assembly of this utility model.

[0020] Figure 5 This is a perspective view of the cache mechanism of this utility model.

[0021] Figure 6 This is a perspective view of the lifting frame of this utility model.

[0022] Figure 7 This is a perspective view of the progressive lifting component of this utility model.

[0023] Figure 8 This is a cross-sectional view of the progressive lifting component of this utility model.

[0024] Figure 9 This is one of the perspective views of the air-drying mechanism of this utility model.

[0025] Figure 10 This is the second perspective view of the air-drying mechanism of this utility model.

[0026] Figure 11 This is a side view of the air-drying mechanism of this utility model.

[0027] Figure 12 This is a cross-sectional view of the heating component of this utility model.

[0028] Figure 13 This is a three-dimensional view of the heating conductor of this utility model.

[0029] Explanation of icon numbers: 1-Transfer mechanism, 10-Transfer support frame, 11-Transfer assembly, 110-Guide belt, 111-Tension roller, 112-Transmission belt, 113-Drive motor, 114-Rotating bearing, 115-Motor mounting plate, 12-Push plate assembly, 120-Support plate, 121-Push plate motor, 122-Synchronous belt, 123-Horizontal push rod, 124-Slide rail, 125-Push head, 126-Buffer pad, 127-Lifting mechanism Lifting cylinder, 128-Lifting cylinder shaft, 2-Buffer mechanism, 20-Frame entry assembly, 200-Mounting bracket, 201-Tension wheel, 202-First bearing, 203-Conveyor belt, 204-Motor encoder plate, 205-Stepper motor, 21-Buffer compartment, 22-Progressive lifting assembly, 220-Lifting base, 221-Lifting control ruler, 222-Lifting cylinder, 2220-Lifting shaft, 223-Lifting frame, 2230 - Upper frame, 2231 Fixed frame, 2232 Second bearing, 2233 Linear optical axis, 224 Lifting plate, 2240 Ball bearing cavity, 2241 Ball bearing, 225 Sensor, 226 Limiting plate, 23 Push frame assembly, 230 Push frame bracket, 231 Push frame cylinder, 232 Push frame plate, 3 Drying mechanism, 30 Fan, 31 Air duct, 32 Heating assembly, 320 Electrical box, 32 1-Electrical control module, 322-Temperature control module, 323-Heating conductor, 3230-Positive electrode connection, 3231-Negative electrode connection, 3232-Heating wire, 324-Heat dissipation shell, 325-Heating pipe, 326-Connecting pipe, 327-Liquid storage tank, 328-Liquid return pipe, 33-Drying chamber, 330-Outlet, 34-Air outlet, 4-Guide mechanism, 40-Mounting base, 41-Roller, 42-Stop plate. Detailed Implementation

[0030] The present invention will be further described below with reference to the accompanying drawings: like Figure 1-13As shown, this utility model relates to an automatic buffer drying machine for PCB boards, including a transfer mechanism 1, a buffer mechanism 2 disposed at one end of the transfer mechanism 1, and a drying mechanism 3 disposed at one end of the buffer mechanism 2. The transfer mechanism 1 includes a transfer support frame 10, a transfer component 11 disposed on the transfer support frame 10, and a pusher assembly 12 disposed at one end of the transfer component 11. The buffer mechanism 2 includes an infeed assembly 20, a plurality of buffer compartments 21 disposed on the infeed assembly 20, a progressive lifting assembly 22 disposed at the connection between the infeed assembly 20 and the transfer support frame 10, and a pusher assembly 22 disposed on one side of the progressive lifting assembly 22. 3; The drying mechanism 3 includes at least one fan 30, a heating component 32 disposed at one end of the air outlet of the fan 30 via an air duct 31, and a drying chamber 33 disposed at one end of the heating component 32; The transfer mechanism 1 is used to transfer the PCB board to the push plate assembly 12 station at one end of the transfer support frame 10 via the transfer assembly 11; the buffer mechanism 2 is used to transfer the buffer chamber 21 to the progressive lifting assembly 22 station via the frame feeding assembly 20; the push plate assembly 12 is used to cooperate with the progressive lifting assembly 22 to push the PCB board into the buffer chamber 21; the frame pushing assembly 23 is used to transfer the buffer chamber 21 into the drying chamber 33; The drying mechanism 3 uses Heated gas generated by the heating component 32 is delivered to the drying chamber 33 via a fan 30 for constant-temperature drying of the PCB board. The heating component 32 includes an electrical control module 321 housed in an electrical box 320, a temperature control module 322 electrically connected to the electrical control module 321, a heating conductor 323 electrically connected to the electrical control module 321, a heat dissipation shell 324 encasing the heating conductor 323, and a liquid storage tank 327 connected to the heat dissipation shell 324 via a connecting pipe 326. The liquid storage tank 327 contains a solution used to conduct the heat generated by the heating conductor 323 to the heat dissipation shell 324. The solution may be water. The liquid storage tank 327 and the heat dissipation shell 324 are also provided with a return pipe 328; specifically, the heating assembly 32 can be equipped with a number of heat dissipation shells 324 that wrap the heating conductor 323. The heating conductor 323 includes a positive electrode connection part 3230, a negative electrode connection part 3231 and a number of heating wires 3232 electrically connected between the positive electrode connection part 3230 and the negative electrode connection part 3231. The heating wires 3232 are arranged in a ring circumference in the heat dissipation shell 324. The heat dissipation shell 324 is fixedly installed in a heating pipe 325. The two ends of the heating pipe 325 are respectively connected to a duct 31.The aqueous solution can flow freely between the storage tank 327 and the heat sink 324 via the connecting pipe 326 and the return pipe 328. When the heating wire 3232 heats up, it raises the temperature of the aqueous solution in the heat sink 324. Through heat conduction, the temperature of the liquid in the storage tank 327 and the aqueous solution in the heat sink 324 tend to be the same. The temperature control module 322 receives the monitoring signal from the temperature sensor in the storage tank 327 and transmits the signal to the electronic control module 321. The electronic control module 321 controls the on / off state of the circuit and the current magnitude to keep the heat output of the heating wire 3232 within the parameter range, such as 50 to 60 degrees Celsius. This ensures that the heat transferred from the aqueous solution to the heat sink 324 is constant, and the temperature of the gas flowing through the heat sink 324 remains relatively stable. This prevents the sealant on the PCB board from softening or dissolving during high-temperature airflow and also achieves a good drying effect. The heat sink 324 can be integrally formed from aluminum material with good heat dissipation performance, and its interfaces are sealed with sealing rings and sealant.

[0031] like Figure 9-10 As shown, the bottom of the drying chamber 33 is provided with a guide mechanism 4, which is used to cooperate with the push frame assembly 23 to make the buffer chamber 21 slide into the drying chamber 33. The guide mechanism 4 includes two sets of mounting seats 40 fixed to the bottom of the drying chamber 33, a number of rollers 41 rotatably connected to the two mounting seats 40, and a stop plate 42 at one end of the mounting seat 40. The stop plate 42 is used to prevent the buffer chamber 21 from sliding out of the drying chamber 33.

[0032] like Figure 1-3 As shown, the transfer assembly 11 includes a guide belt 110 on each of the two inner sides of the transfer support frame 10, a tension roller 111 at each end of the two guide belts 110, and a drive motor 113 connected to the tension roller 111 via a transmission belt 112. The two tension rollers 111 are rotatably connected to the transfer support frame 10 via a rotary bearing 114. The drive motor 113 is fixedly connected to the transfer support frame 10 via a motor mounting plate 115. The drive motor 113 is used to drive the tension roller 111 to rotate via the transmission belt 112, so that the guide belts 110 rotate synchronously and drive the PCB board to transfer.

[0033] like Figure 1-4As shown, the pusher assembly 12 includes a pusher motor 121 mounted on the transfer support frame 10 via a support plate 120, a horizontal push rod 123 mounted on the output end of the pusher motor 121 via a synchronous belt 122, a slide rail 124 slidably connected below the horizontal push rod 123, and four sets of lifting cylinders 127 mounted on the support plate 120. The slide rail 124 is fixedly connected to the support plate 120. The pusher motor 121 is used to drive the horizontal push rod 123 to move along the slide rail 124 via the synchronous belt 122. The lifting cylinders 127 are used to lift the PCB board transferred by the transfer assembly 11 to a certain height so that the horizontal push rod 123 can return to push after pushing the board. One end of the horizontal push rod 123 is provided with a push head 125, and the push head 125 is provided with a buffer pad 126. The buffer pad 126 is used to prevent the push head 125 from damaging the PCB board during pushing.

[0034] like Figure 1-2 As shown in Figure 5, the feeding assembly 20 includes a mounting frame 200, a conveyor belt 203 mounted on the mounting frame 200 via two tensioning rollers 201, and a stepper motor 205 mounted at one end of the mounting frame 200 via a motor encoder 204. The stepper motor 205 is connected to one tensioning roller 201 via a belt, and its two tensioning rollers 201 are rotatably connected to the mounting frame 200 via a first bearing 202. The stepper motor 205 is used to drive the tensioning rollers 201 to rotate via the belt, and the tensioning rollers 201 synchronously drive the conveyor belt 203 to rotate, thus feeding the empty buffer bins 21 on the conveyor belt 203 forward.

[0035] like Figure 1-2As shown in Figure 5-8, the progressive lifting assembly 22 includes a lifting base 220, a lifting control ruler 221 disposed on one side of the lifting base 220, a lifting cylinder 222 disposed under the lifting base 220, a lifting frame 223 disposed on the lifting base 220, and a lifting plate 224 disposed on the lifting frame 223. The lifting cylinder 222 is fixedly connected to the sliding end of the lifting frame 223 via a lifting shaft 2220. The lifting cylinder 222 is used to drive the sliding end of the lifting frame 223 upward through the lifting shaft 2220. The driving stroke of the lifting cylinder 222 is controlled by a sensor 225 on the lifting frame 223 in conjunction with the lifting control ruler 221. The lifting plate 224 is provided with a plurality of ball bearing cavities 2240, and the ball bearing cavities 2240 contain freely movable ball bearings. The rolling ball bearing 2241 and the lifting plate 224 are provided with a limiting plate 226 on one side to position the buffer compartment 21. Each mark height of the lifting control ruler 221 matches the height of the space between the two sets of PCB boards stored in the buffer compartment 21. The lifting frame 223 includes an upper frame 2230 and a fixed frame 2231 located below the upper frame 2230. The fixed frame 2231 is fixedly connected to the lifting base 220. The upper frame 2230 is slidably connected to the fixed frame 2231 through several linear optical shafts 2233 passing through the second bearing 2232. The second bearing 2232 is fixedly connected to the fixed frame 2231. One end of the linear optical shaft 2233 is fixedly connected to the upper frame 2230. The linear optical shaft 2233 slides freely within the second bearing 2232.

[0036] like Figure 1-2As shown in Figure 5-8, further, the infeed assembly 20 operates first. Its stepper motor 205 drives the tension wheel 201 to rotate via a belt. The tension wheel 201 synchronously drives the conveyor belt 203 to rotate, feeding the empty buffer bin 21 on the conveyor belt 203 forward. During movement, the mounting frame 200 has side positioning plates on both sides to limit the buffer bin 21, preventing it from swinging or shifting left and right. The buffer bin 21 slides to the lifting plate 224 and contacts the ball bearings 2241. Through the action of the ball bearings 2241, the buffer bin 21 smoothly enters the lifting plate 224. Under the guidance of the limiting plate 226, the buffer bin 21 accurately slides into the work position. When the transfer assembly 11 operates, its drive motor 113 drives the tension roller 111 to rotate via the transmission belt 112, causing the guide belt 110 to rotate synchronously and transfer the PCB board to the pusher assembly 12 work position. At this time, the horizontal push rod 123 is located at the end of the slide rail 124, and is lifted by four sets of... Cylinder 127 drives lifting cylinder shaft 128 to lift the PCB board to a certain height. Push plate motor 121 drives horizontal push rod 123 to move along slide rail 124 to the front end of slide rail 124 via synchronous belt 122. Lifting cylinder 127 drives lifting cylinder shaft 128 to retract and reset the PCB board. Push plate motor 121 drives in the opposite direction, causing horizontal push rod 123 to move along slide rail 124 to the rear end of slide rail 124. Push head 125 at one end of horizontal push rod 123 pushes the PCB board into the first compartment of buffer bin 21. Next, progressive lifting assembly 22 starts working. Lifting cylinder 222 under lifting base 220 drives lifting frame 223 to descend one marked height via lifting shaft 2220, so that the second compartment of buffer bin 21 is aligned with the push plate assembly 12 station. Then the drive motor 113 of transfer assembly 11 works again to transfer the next PCB board to the station. The cycle continues until buffer bin 21 is full.

[0037] like Figure 5 As shown, the push frame assembly 23 includes a push frame bracket 230, at least one push frame cylinder 231 disposed on the push frame bracket 230, and a push frame plate 232 disposed at the output end of the push frame cylinder 231. The push frame cylinder 231 is used to push the push frame plate 232 through the push frame shaft to push the buffer chamber 21 into the drying chamber 33.

[0038] like Figure 9 As shown, the drying chamber 33 is provided with several air outlets 34. The air outlets 34 are connected to the air duct 31 through the air duct branch pipe. The drying chamber 33 is provided with an outlet 330 on one side. The outlet 330 is used to take out the buffer chamber 21. The outlet 330 is provided with a sliding door through several latches.

[0039] Furthermore, when the buffer chamber 21 is full of boards, the push frame assembly 23 operates. The push frame cylinder 231 pushes the push frame plate 232 through the push frame shaft to push the buffer chamber 21 into the drying chamber 33. Here, the electrical control module 321 is pre-activated to heat the aqueous solution to the set temperature by the heating conductor 323. The fan 30 sends air through the air duct 31 to the heating pipe 325. When the air flows through the heating pipe 325, it is heated by the heat dissipation shell 324. Then, the hot air is blown out through the air outlet 34 after passing through the air duct branch pipe at one end of the air duct 31, so that the heated air continuously circulates in the drying chamber 33 to dry the PCB boards in the buffer chamber 21. After drying, the buffer chamber 21 is taken out from the outlet 330 on one side of the drying chamber 33 by the frame removal trolley or the robotic arm, so that the batch buffering and drying of PCB boards is fully automated, improving production efficiency.

[0040] Working principle: During use, the stepper motor 205 of the frame feeding assembly 20 drives the tension wheel 201 to rotate via a belt, which in turn drives the conveyor belt 203 to transport the empty buffer bin 21 forward to the lifting plate 224 of the progressive lifting assembly 22. At this time, the buffer bin 21 remains stable under the limit of the side plate and is precisely positioned to the work station by the ball bearings 2241 on the lifting plate 224 and the limit plate 226. At the same time, the drive motor 113 of the transfer mechanism 1 drives the tension roller 111 to rotate via the transmission belt 112, so that the guide belt 110 rotates synchronously to transfer the PCB board to the work station of the pusher assembly 12. At this time, the four sets of lifting cylinders 127 drive the lifting cylinder shaft 1 28. The PCB board is lifted to a certain height. The pusher motor 121 drives the horizontal push rod 123 to move along the slide rail 124 to the front end via the synchronous belt 122. The lifting cylinder 127 resets, causing the PCB board to fall into place. The pusher motor 121 drives the horizontal push rod 123 back in the opposite direction, pushing the PCB board into the first compartment of the buffer bin 21 via the pusher head 125. Subsequently, the lifting cylinder 222 of the progressive lifting assembly 22 drives the upper frame 2230 to descend along the linear optical axis 2233 by a marked height (matching the spatial spacing height of the two sets of PCB boards stored in the buffer bin 21), so that the second compartment of the buffer bin 21 is aligned with the pusher assembly 12 station. The transfer mechanism 1 transports the next PCB board again, repeating the above pushing and lifting actions until the buffer bin 21 is full of PCB boards. At this time, the pushing cylinder 231 of the pushing frame assembly 23 drives the pushing plate 232 through the pushing frame shaft, pushing the full buffer bin 21 along the roller 41 of the guide mechanism 4 into the drying chamber 33. The guide mechanism 4 ensures that the buffer bin 21 enters smoothly and does not slip out through the mounting base 40, roller 41 and stop plate 42. When the drying mechanism 3 is working, the electronic control module 321 is started, the heating conductor 323 heats the aqueous solution, and the temperature control module 322 receives the temperature sensor signal in the liquid storage tank 327 and feeds it back to the electronic control module 321. The power of the heating wire 3232 is adjusted by controlling the circuit on / off state and the current magnitude to stabilize the temperature of the aqueous solution within a certain range. The fan 30 delivers external air to the heating pipe 325 through the air duct 31. The air is heated as it flows through the heat dissipation shell 324. The hot air is evenly blown out from the air outlet 34 of the drying chamber 33 through the air duct branch pipe to dry the PCB board in the buffer chamber 21 at a constant temperature, avoiding the softening of the sealant at high temperature while ensuring the drying effect. After drying, the buffer chamber 21 is removed from the outlet 330 on one side of the drying chamber 33 by a frame removal trolley or a robotic arm, realizing the full automation of the PCB board from transfer, buffering to drying, and improving production efficiency.

[0041] The above description is only a preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model. Therefore, without departing from the design spirit of the present utility model, any equivalent changes or modifications made by those skilled in the art to the structure, features and principles of the present utility model should fall within the protection scope of the patent application of the present utility model.

Claims

1. An automatic buffer drying machine for PCB boards, comprising a transfer mechanism, a buffer mechanism disposed at one end of the transfer mechanism, and a drying mechanism disposed at one end of the buffer mechanism, characterized in that: The transfer mechanism includes a transfer support frame, a transfer component mounted on the transfer support frame, and a pusher assembly at one end of the transfer component; the buffer mechanism includes an infeed assembly, several buffer compartments mounted on the infeed assembly, a progressive lifting assembly at the connection between the infeed assembly and the transfer support frame, and a pusher assembly on one side of the progressive lifting assembly; the drying mechanism includes at least one fan, a heating assembly located at one end of the fan outlet via a duct, and a drying compartment at one end of the heating assembly; the transfer mechanism is used to transfer the PCB board to the pusher assembly station at one end of the transfer support frame via the transfer component; the buffer mechanism is used to transfer the buffer compartments to the progressive lifting assembly station via the infeed assembly; the pusher assembly is used to cooperate with the progressive lifting assembly to push the PCB board into the buffer compartment; the pusher assembly... The buffer chamber is used to transfer the buffer chamber to the drying chamber; the drying mechanism is used to transport the heated gas generated by the heating component to the drying chamber for constant temperature drying of the PCB board by means of a fan; the heating component includes an electrical control module located in the electrical box, a temperature control module electrically connected to the electrical control module, a heating conductor electrically connected to the electrical control module, a heat dissipation shell wrapped around the heating conductor, and a liquid storage tank connected to the heat dissipation shell through a connecting pipe. The liquid storage tank contains a solution, which is used to conduct the heat generated by the heating conductor to the heat dissipation shell; the heating conductor includes a positive electrode connection part, a negative electrode connection part, and a plurality of heating wires electrically connected between the positive electrode connection part and the negative electrode connection part. The heating wires are arranged in a ring around the heat dissipation shell. The heat dissipation shell is fixedly installed in a heating pipe, which is connected to an air duct.

2. The automatic buffer air dryer for PCB boards according to claim 1, characterized in that: The transfer assembly includes a guide belt on each of the two inner sides of the transfer support frame, a tension roller at each end of the two guide belts, and a drive motor connected to the tension roller via a transmission belt. The drive motor is used to drive the tension roller to rotate via the transmission belt, so that the guide belts rotate synchronously and transfer the PCB board.

3. The automatic buffer air dryer for PCB boards according to claim 1, characterized in that: The pusher assembly includes a pusher motor mounted on a transfer support frame via a support plate, a horizontal push rod mounted on the output end of the pusher motor via a synchronous belt, a slide rail slidably connected below the horizontal push rod, and four sets of lifting cylinders mounted on the support plate. The pusher motor is used to drive the horizontal push rod to move along the slide rail via the synchronous belt, and the lifting cylinders are used to lift the PCB board transferred by the transfer assembly to a certain height so that the horizontal push rod can return to push after the pusher has finished pushing the board.

4. The automatic buffer air dryer for PCB boards according to claim 3, characterized in that: One end of the horizontal push rod is equipped with a push head, and the push head is equipped with a buffer pad to prevent the push head from damaging the PCB board during pushing.

5. The automatic buffer air dryer for PCB boards according to claim 1, characterized in that: The frame feeding assembly includes a mounting frame, a conveyor belt mounted on the mounting frame via two tension rollers, and a stepper motor mounted at one end of the mounting frame via a motor encoder. The stepper motor is connected to a tension roller via a belt.

6. The automatic buffer air dryer for PCB boards according to claim 1, characterized in that: The progressive lifting assembly includes a lifting base, a lifting control ruler on one side of the lifting base, a lifting cylinder under the lifting base, a lifting frame on the lifting base, and a lifting plate on the lifting frame. The lifting cylinder is fixedly connected to the sliding end of the lifting frame via a lifting shaft. The lifting cylinder is used to drive the sliding end of the lifting frame to rise through the lifting shaft. The driving stroke of the lifting cylinder is controlled by a sensor on the lifting frame in conjunction with the lifting control ruler.

7. The automatic buffer air dryer for PCB boards according to claim 1, characterized in that: The push frame assembly includes a push frame bracket, at least one push frame cylinder mounted on the push frame bracket, and a push frame plate mounted at the output end of the push frame cylinder. The push frame cylinder is used to drive the push frame plate through the push frame shaft to push the buffer chamber into the drying chamber.

8. The automatic buffer air dryer for PCB boards according to claim 1, characterized in that: The drying chamber is equipped with several air outlets, which are connected to the air duct via branch pipes. The drying chamber has an outlet on one side for removing the buffer chamber.

9. The automatic buffer air dryer for PCB boards according to claim 1, characterized in that: The bottom of the drying chamber is equipped with a guide mechanism, which is used to cooperate with the push frame assembly to allow the buffer chamber to slide into the drying chamber.

10. The automatic buffer air dryer for PCB boards according to claim 9, characterized in that: The guiding mechanism includes two sets of mounting seats fixed to the bottom of the drying chamber, several rollers rotatably connected to the two mounting seats, and a stop plate at one end of the mounting seats. The stop plate is used to prevent the buffer compartment from sliding out of the drying chamber.

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