A semiconductor vacuum heating box rapid cooling device

Abstract

The utility model discloses a kind of semiconductor vacuum heating box rapid cooling device, including base, base one side upper is equipped with heating box, heating box one side is equipped with cooling box, the inner wall of cooling box is bonded with heat preservation layer by adhesive, cooling box top is equipped with semiconductor refrigerator, the refrigeration end of semiconductor refrigerator is sequentially penetrated inside cooling box and heat preservation layer, cooling box one side is equipped with blowing mechanism, the side of cooling box away from blowing mechanism is equipped with air guide pipe, air guide pipe one end is connected in heat preservation layer inside, another end air scoop sequentially penetrates heat preservation layer and cooling box and extends outward and is connected in heating box inside, heating box outside is equipped with exhaust pump, by setting cooling box in heating box one side, the cooperation use of heat preservation layer, semiconductor refrigerator, motor and fan blade in cooling box interior, the cold air that semiconductor refrigerator generates to cooling box interior can be rotated by motor drive to make fan blade to blow from air guide pipe to heating box interior.

Description

Technical Field

[0001] This utility model relates to the field of cooling devices, and more specifically, to a rapid cooling device for a semiconductor vacuum heating box. Background Technology

[0002] A semiconductor vacuum heating chamber is a device specifically designed for use in semiconductor manufacturing processes. It heats materials in a vacuum environment. This equipment plays a crucial role in ensuring the purity of semiconductor materials and devices, preventing oxidation, and controlling other surface contamination. In a vacuum environment, by removing air and other potential contaminants, the efficiency of the heating process and the quality of the product can be significantly improved.

[0003] Current semiconductor vacuum heating chambers require cooling devices during processing. However, most existing cooling devices for semiconductor vacuum heating chambers have low cooling efficiency and cannot quickly cool the chamber, thus reducing work efficiency.

[0004] There are currently no effective solutions to the problems in the relevant technologies. Utility Model Content

[0005] In view of the problems in the related technologies, this utility model proposes a rapid cooling device for a semiconductor vacuum heating box to overcome the above-mentioned technical problems existing in the existing related technologies.

[0006] Therefore, the specific technical solution adopted by this utility model is as follows:

[0007] A rapid cooling device for a semiconductor vacuum heating chamber includes a base, a heating chamber located above one side of the base, a cooling chamber located on one side of the heating chamber, an insulation layer bonded to the inner wall of the cooling chamber with adhesive, a semiconductor cooler located at the top of the cooling chamber, the cooling end of the semiconductor cooler penetrating the interior of the cooling chamber and the insulation layer in sequence, a blower mechanism located on one side of the cooling chamber, and an air guide pipe located on the side of the cooling chamber away from the blower mechanism, one end of the air guide pipe being connected to the interior of the insulation layer, and the other end of the air guide pipe penetrating the insulation layer and the cooling chamber in sequence and extending outward to connect to the interior of the heating chamber, an exhaust pump located outside the heating chamber, the exhaust port of the exhaust pump penetrating and connecting to the interior of the heating chamber, and the exhaust port of the exhaust pump penetrating the cooling chamber and the insulation layer in sequence and extending into their interior.

[0008] Furthermore, in order to accelerate the entry of cold air from inside the cooling box into the semiconductor vacuum heating box, the blower mechanism includes a sealing shell. One end of the opening of the sealing shell passes through the cooling box and the insulation layer in sequence and is connected to the inside of the insulation layer. A square hole is provided at the connection between the cooling box, the insulation layer and the sealing shell. A sealing strip is pasted at the connection between the sealing shell and the outer wall of the cooling box. A motor is provided inside the sealing shell, and the output shaft of the motor is connected to the fan blades.

[0009] Furthermore, in order to keep the cold air in the cooling box warm, the insulation layer is a composite structure layer composed of polyurethane foam, ceramic fiber cotton and glass wool.

[0010] Furthermore, in order to rapidly cool the interior of the semiconductor vacuum heating chamber, a cold water layer is provided inside the cooling chamber. The cold water layer is connected to the middle of the inner wall of the insulation layer by a fixing plate. The inlet and outlet of the cold water layer pass through the insulation layer and the cooling chamber in sequence and extend to the outside of the cooling chamber.

[0011] Furthermore, solenoid valves are installed at the inlet and outlet of the cold water layer, and a solenoid valve is installed on the outside of the connection between the air duct and the heating box.

[0012] Furthermore, in order to facilitate observation and maintenance of the interior of the heating chamber and the cooling chamber, a sealing door is provided on one side of the heating chamber, and an observation window is provided on the sealing door. A sealing door is provided on one side of the cooling chamber, and an observation window is provided on the sealing door.

[0013] Furthermore, in order to increase the contact time and contact area between the hot air and the cold water layer, an air vent is provided above the cold water layer. The air vent is connected to the inner wall of the insulation layer, and the bottom of the cooling box is connected to the base. Several support legs are provided under the base.

[0014] The beneficial effects of this utility model are as follows: By setting a cooling box on one side of the heating box, the combined use of the insulation layer, semiconductor cooler, motor, and fan blades inside the cooling box allows the semiconductor cooler to generate cold air inside the cooling box, which in turn drives the fan blades to rotate and blow the cold air from the air duct into the heating box. When the heating box stops working, the combination of the cold water layer and the exhaust pump replaces the hot air inside the heating box with the cold air inside the cooling box, thereby achieving rapid cooling inside the heating box and improving cooling efficiency. At the same time, the insulation layer can keep the inside of the cooling box warm and prevent the loss of cold air. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of a semiconductor vacuum heating box rapid cooling device according to an embodiment of the present utility model;

[0017] Figure 2 This is a cross-sectional view of the cooling box in a rapid cooling device for a semiconductor vacuum heating box according to an embodiment of the present invention;

[0018] Figure 3 This is a rear view of a semiconductor vacuum heating chamber rapid cooling device according to an embodiment of the present utility model;

[0019] Figure 4 This is a side view of a rapid cooling device for a semiconductor vacuum heating box according to an embodiment of the present invention.

[0020] In the picture:

[0021] 1. Base; 2. Support legs; 3. Heating chamber; 4. Sealed door one; 5. Observation window one; 6. Cooling chamber; 7. Semiconductor cooler; 8. Blower mechanism; 801. Sealed shell; 802. Motor; 803. Fan blade; 804. Sealing strip; 9. Observation window two; 10. Sealed door two; 11. Insulation layer; 12. Cold water layer; 13. Air leakage plate; 14. Air duct; 15. Solenoid valve; 16. Water inlet; 17. Water outlet; 18. Exhaust pump; 19. Exhaust vent; 20. Vent; 21. Fixing plate. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] According to an embodiment of the present invention, a rapid cooling device for a semiconductor vacuum heating chamber is provided.

[0024] Example 1;

[0025] like Figures 1-3As shown, a semiconductor vacuum heating chamber rapid cooling device according to an embodiment of the present invention includes a base 1, a heating chamber 3 is provided on one side of the base 1, a sealing door 4 is provided on one side of the heating chamber 3, an observation window 5 is provided on the sealing door 4, a sealing strip is provided at the connection between the observation window 5 and the sealing door 4, and a handle is provided on the sealing door 4. A cooling chamber 6 is provided on one side of the heating chamber 3, a sealing door 10 is provided on one side of the cooling chamber 6, an observation window 9 is provided on the sealing door 10, a sealing strip is provided at the connection between the observation window 9 and the sealing door 10, and a handle is provided on the sealing door 10. The bottom of the cooling chamber 6 is connected to the base 1, and several support legs 2 are provided below the base 1. An insulation layer 11 is bonded to the inner wall of the cooling chamber 6 with adhesive. The insulation layer 11 is... A composite structure layer composed of polyurethane foam, ceramic fiber cotton, and glass wool ensures that the low temperature inside the cooling box 6 does not dissipate rapidly. A semiconductor cooler 7 is installed at the top of the cooling box 6, which cools the interior of the cooling box 6. The cooling end of the semiconductor cooler 7 passes through the interior of the cooling box 6 and the insulation layer 11. A blower mechanism 8 is located on one side of the cooling box 6, and an air duct 14 is located on the side of the cooling box 6 away from the blower mechanism 8. One end of the air duct 14 is connected to the interior of the insulation layer 11, and the other end passes through the insulation layer 11 and the cooling box 6, extending outwards and connecting to the interior of the heating box 3. A solenoid valve 15 is located on the outside of the connection between the air duct 14 and the heating box 3. A cold water layer 12 is located inside the cooling box 6. The curved cold water pipes are arranged horizontally in a crisscross pattern. The cold water layer 12 is connected to the middle of the inner wall of the insulation layer 11 by a fixing plate 21. The inlet 16 and outlet 17 of the cold water layer 12 pass through the insulation layer 11 and the cooling box 6 respectively and extend to the outside of the cooling box 6. A vent plate 13 is provided above the cold water layer 12. The vents of the vent plate 13 are arranged vertically in a crisscross pattern and perpendicular to the direction of the outlet of the cold water layer 12 below, so as to achieve multiple circulation contacts between the hot air and the cold water layer 12. The vent plate 13 is connected to the inner wall of the insulation layer 11. Solenoid valves 15 are provided at the inlet 16 and outlet 17 of the cold water layer 12 respectively. When it is necessary to cool the inside of the semiconductor vacuum box, the semiconductor cooler 7 and the motor 802 are started, and the solenoid valves 15 of the air duct 14 are opened. The connection between the heating chamber 3 and the cooling chamber 6 is achieved by a motor 802 driving a fan 803 to rotate and blow cold air from the cooling chamber 6 into the heating chamber 3 to cool it down. An exhaust pump 18 is located on the outside of the heating chamber 3. The exhaust port 19 of the exhaust pump 18 passes through and connects to the inside of the heating chamber 3, while the exhaust port 20 of the exhaust pump 18 passes through the cooling chamber 6 and the insulation layer 11 and extends into them. After a period of time, the exhaust pump 18 is activated to extract the hot and cold mixed gas from the heating chamber 3 and discharge it into the cooling chamber 6. Then, the inlet pipe of the cold water layer 12 is opened. The hot and cold mixed gas enters the cooling chamber 6 and gradually moves upwards under air pressure, passing through the cold water layer 12 for cooling.Finally, the rotating fan blades 803 blow gas into the heating chamber 3 for another round of hot and cold gas exchange, thereby achieving rapid cooling of the heating chamber 3.

[0026] Example 2;

[0027] like Figure 1 and Figure 4 As shown, a rapid cooling device for a semiconductor vacuum heating chamber according to an embodiment of the present invention includes a blower mechanism 8. The blower mechanism 8 includes a sealing shell 801. One end of the opening of the sealing shell 801 passes through the cooling chamber 6 and the insulation layer 11 in sequence and is connected to the inside of the insulation layer 11. A square hole is provided at the connection between the cooling chamber 6 and the insulation layer 11 and the sealing shell 801. A sealing strip 804 is pasted at the connection between the sealing shell 801 and the outer wall of the cooling chamber 6. A motor 802 is provided inside the sealing shell 801. The output shaft of the motor 802 is connected to a fan blade 803. The motor 802 drives the fan to rotate, blowing the cold air inside the cooling chamber 6 into the heating chamber 3. When the fan rotates, it also indirectly guides the airflow inside the cooling chamber 6 to flow from the bottom to the top, improving the efficiency of water cooling inside the cooling chamber 6. The combined use of air cooling and water cooling accelerates the reduction of the temperature inside the heating chamber 3, thereby improving production efficiency.

[0028] In summary, with the help of the above-mentioned technical solution of this utility model, during use, the semiconductor cooler 7 and motor 802 are started, the solenoid valve 15 on the air duct 14 is opened to blow the cold air inside the cooling box 6 into the heating box 3, and then the solenoid valve 15 of the water inlet 16 is opened to start filling the cold water layer 12 with cold water. The exhaust pump 18 is started to discharge the hot and cold mixed gas inside the heating box 3 into the cooling box 6. The hot and cold mixed gas continuously gathers and flows upward under the rotation of the fan blade 803. During the flow, the cold water... Layer 12 is cooled down, and finally the fan blades 803 rotate and blow air into the heating box 3 for further cooling. The heating box 3 is rapidly cooled by the combination of water cooling and air cooling. When the temperature inside the heating box drops to the required temperature, the solenoid valve 15 on the air duct 14 and the valves at the exhaust pump 18 and the exhaust port 19 of the exhaust pump 18 are closed to disconnect the heating box 3 from the cooling box 6. Then, the solenoid valves 15 of the motor 802, the semiconductor cooler 7, the water inlet 16, and the water outlet 17 inside the cooling box 6 are closed.

[0029] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A rapid cooling device for a semiconductor vacuum heating chamber, characterized in that, The system includes a base (1), a heating box (3) located above one side of the base (1), a cooling box (6) located on one side of the heating box (3), an insulation layer (11) bonded to the inner wall of the cooling box (6) by adhesive, a semiconductor cooler (7) located on the top of the cooling box (6), the cooling end of the semiconductor cooler (7) passing through the interior of the cooling box (6) and the insulation layer (11) in sequence, a blower mechanism (8) located on one side of the cooling box (6), and a cooling device (8) located on the side of the cooling box (6) away from the blower mechanism (8). The air duct (14) is connected at one end to the interior of the insulation layer (11), and at the other end, it passes through the insulation layer (11) and the cooling box (6) in sequence and extends outward to connect to the interior of the heating box (3). An exhaust pump (18) is provided on the outside of the heating box (3). The exhaust port (19) of the exhaust pump (18) passes through and connects to the interior of the heating box (3). The exhaust port (20) of the exhaust pump (18) passes through the cooling box (6) and the insulation layer (11) in sequence and extends into its interior.

2. The rapid cooling device for a semiconductor vacuum heating chamber according to claim 1, characterized in that, The blower mechanism (8) includes a sealing shell (801). One end of the opening of the sealing shell (801) passes through the cooling box (6) and the insulation layer (11) in sequence and is connected to the inside of the insulation layer (11). A square hole is provided at the connection between the cooling box (6) and the insulation layer (11) and the sealing shell (801). A sealing strip (804) is pasted at the connection between the sealing shell (801) and the outer wall of the cooling box (6). A motor (802) is provided inside the sealing shell (801). The output shaft of the motor (802) is connected to a fan blade (803).

3. The rapid cooling device for a semiconductor vacuum heating chamber according to claim 1, characterized in that, The insulation layer (11) is a composite structure layer composed of polyurethane foam, ceramic fiber cotton and glass wool.

4. The rapid cooling device for a semiconductor vacuum heating chamber according to claim 1, characterized in that, The cooling tank (6) is equipped with a cold water layer (12). The cold water layer (12) is connected to the middle of the inner wall of the insulation layer (11) by a fixing plate (21). The inlet (16) and outlet (17) of the cold water layer (12) pass through the insulation layer (11) and the cooling tank (6) respectively and extend to the outside of the cooling tank (6).

5. A rapid cooling device for a semiconductor vacuum heating chamber according to claim 4, characterized in that, Solenoid valves (15) are provided at the inlet (16) and outlet (17) of the cold water layer (12), and solenoid valves (15) are provided on the outside of the connection between the air duct (14) and the heating box (3).

6. The rapid cooling device for a semiconductor vacuum heating chamber according to claim 1, characterized in that, The heating box (3) has a sealing door (4) on one side, and an observation window (5) is provided on the sealing door (4). The cooling box (6) has a sealing door (10) on one side, and an observation window (9) is provided on the sealing door (10).

7. A rapid cooling device for a semiconductor vacuum heating chamber according to claim 1, characterized in that, An air vent plate (13) is provided above the cold water layer (12). The air vent plate (13) is connected to the inner wall of the insulation layer (11). The bottom of the cooling box (6) is connected to the base (1). Several support legs (2) are provided below the base (1).

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