Multi-level capillary structure vapor chamber

Abstract

The utility model discloses a kind of multi-level capillary structure uniform temperature plates, including upper cover plate and lower cover plate, upper cover plate and lower cover plate between form steam cavity, core area groove corresponding recessed in steam cavity is located on lower cover plate, and multiple levels capillary structure are equipped in core area groove.The multiple levels capillary structure of gradient, liquid refrigerant around is quickly absorbed in the side close to heat source side, bubble after refrigerant evaporation is easy to overflow in the side to steam cavity, realize the high-speed transport of liquid and steam, to obtain high capillary force and high permeability simultaneously;More liquid refrigerant is also in the multiple levels capillary structure, to significantly improve the heat dissipation efficiency of uniform temperature plate;The multiple levels capillary structure of the utility model is formed by copper powder sintering, improve the performance of uniform temperature plate and simplify production process.

Description

Technical Field

[0001] This utility model relates to the field of radiator technology, and in particular to a multi-level capillary structure heat exchange plate. Background Technology

[0002] As server computing power increases, the heat flux density of server CPUs also increases, making traditional vapor chambers and heat pipes unable to meet the heat dissipation requirements. Existing vapor chambers mostly adopt a planar structure, which has the following shortcomings: First, it is difficult to balance capillary force and permeability when using a single capillary structure; second, it leads to complex manufacturing processes and high costs when using complex capillary structures.

[0003] Therefore, it is urgent to solve the problem that existing heat dissipation plates cannot balance heat dissipation efficiency and cost. Utility Model Content

[0004] The technical problem to be solved by this utility model embodiment is to provide a multi-level capillary structure heat dissipation plate to improve heat dissipation efficiency and reduce cost.

[0005] To solve the above-mentioned technical problems, this utility model provides a multi-level capillary structure heat spreader, including an upper cover plate and a lower cover plate, with a steam chamber formed between the upper cover plate and the lower cover plate. A core area groove located in the steam chamber is correspondingly recessed on the lower cover plate, and a multi-level capillary structure sintered with copper powder is provided in the core area groove.

[0006] Furthermore, the multi-level capillary structure consists of multiple capillary layers arranged from top to bottom.

[0007] Furthermore, the mesh size of the copper powder in the bottom capillary layer is greater than that in the top capillary layer.

[0008] Furthermore, the mesh size of the copper powder in the capillary layer of the multi-level capillary structure increases sequentially from top to bottom.

[0009] Furthermore, a second capillary structure is provided on the sidewall of the core area tank and the bottom side of the steam chamber, and the second capillary structure overlaps with the multi-level capillary structure.

[0010] Furthermore, a support column is provided in the core area groove, and a second capillary structure is provided on the outer periphery of the support column. The second capillary structure on the outer periphery of the support column overlaps with the multi-level capillary structure.

[0011] Furthermore, a first capillary structure is provided at the top of the steam chamber, and a second capillary structure on the outer periphery of the support column overlaps with the first capillary structure.

[0012] The beneficial effects of this invention are as follows: The multi-level capillary structure of this invention rapidly absorbs the surrounding liquid refrigerant near the heat source, and facilitates the overflow of bubbles after refrigerant evaporation near the vapor chamber, achieving high-speed transport of liquid and vapor, thereby simultaneously obtaining high capillary force and high permeability; the multi-level capillary structure also contains more liquid refrigerant, thus significantly improving the heat dissipation efficiency of the heat spreader; the multi-level capillary structure of this invention is formed by sintering copper powder, which improves the performance of the heat spreader and simplifies the production process. Attached Figure Description

[0013] Figure 1 This is an exploded view of an existing multi-level capillary structure heat exchanger.

[0014] Figure 2 This is a cross-sectional schematic diagram of the multi-level capillary structure heat exchange plate of Embodiment 1 of this utility model.

[0015] Figure 3 This is a cross-sectional schematic diagram of the multi-level capillary structure heat exchange plate of Embodiment 2 of this utility model.

[0016] Explanation of icon numbers 10. Upper cover plate, 11. First capillary structure, 20. Lower cover plate, 21. Core area groove, 22. Multi-level capillary structure, 23. Second capillary structure, 24. Support column, 25. Protrusion. Detailed Implementation

[0017] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other. The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0018] In this embodiment of the invention, directional indicators (such as up, down, left, right, front, back, etc.) are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the attached figure). If the specific posture changes, the directional indicators will also change accordingly.

[0019] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0020] Please refer to Figure 1 The multi-level capillary structure heat exchange plate of this utility model embodiment includes an upper cover plate and a lower cover plate.

[0021] A steam chamber is formed between the upper and lower cover plates, and a corresponding core area groove is recessed on the lower cover plate within the steam chamber. The back of the core area groove on the lower cover plate is in close contact with the heat source. That is, the back of the core area groove on the lower cover plate is a protrusion, which is used to contact the heat source (the electronic device to be cooled). This part of the structure of this utility model is prior art, such as... Figure 1 As shown.

[0022] Example 1: Please refer to Figure 2 The core area of ​​the tank has a multi-layered capillary structure at the bottom, constructed using copper powder sintering. This multi-layered capillary structure is a porous structure with multiple layers, where the mesh size of the copper powder near the steam chamber is smaller than that near the protrusion on the lower cover plate. Preferably, the multi-layered capillary structure is a three-layer porous structure. In one embodiment, the multi-layered capillary structure consists of multiple layers of capillary powder stacked from top to bottom. Preferably, the mesh size of the copper powder in the bottom capillary layer is larger than that in the top capillary layer. Preferably, the multi-layered capillary structure is a gradient capillary structure, where the mesh size of the copper powder in the capillary layers increases sequentially from top to bottom. The larger particle size of the capillary layer near the steam chamber allows for easier overflow of bubbles after refrigerant evaporation; the smaller particle size of the capillary layer near the protrusion on the lower cover plate results in stronger capillary action, quickly absorbing the surrounding liquid refrigerant; the multi-layered capillary structure also contains more liquid refrigerant, significantly improving the heat dissipation efficiency of the vapor chamber.

[0023] Example 2: Please refer to Figure 3 The core area tank sidewalls and the lower cover plate of the non-core area tank region at the bottom of the steam chamber are provided with a second capillary structure, which overlaps with the multi-level capillary structure. Several support columns are provided inside the core area tank (i.e., several support columns are provided between the lower and upper cover plates), and a second capillary structure is provided around the outer periphery of each support column, overlapping with the multi-level capillary structure. A first capillary structure is provided on the upper cover plate corresponding to the top of the steam chamber, and the second capillary structure around the outer periphery of the support columns overlaps with the first capillary structure.

[0024] As one implementation method, the multi-level capillary structure is formed by integral sintering of copper powder. By integrally sintering, the multi-level capillary structure avoids the capillary force deficiencies and reliability issues caused by copper grain growth resulting from multiple sintering processes, and also reduces costs.

[0025] The preparation method of the multi-level capillary structure heat spreader of this utility model includes the following steps: S1. Prepare the lower cover plate and the upper cover plate; S2. A jig is used to fill the lower cover plate with a mixture of copper powder and additives in multiple layers, and then the whole plate is sintered to form a multi-level capillary structure. S3. Sinter the first capillary structure on the upper cover plate and sinter the second capillary structure on the lower cover plate. S4. Diffusion welding is used to weld and press the outer edges of the lower cover plate and the upper cover plate together to form a closed cavity (i.e., a steam cavity). S5. After the diffusion welding of the lower cover plate and the upper cover plate is completed, a mixture of N2 and H2 gas is used for reduction. S6. Vacuum is drawn into the vapor chamber and refrigerant is introduced. The lower and upper cover plates are then sealed to obtain a multi-level capillary structure temperature distribution plate.

[0026] In one implementation, in step S1, the bottom of the middle part of the lower cover plate has a protrusion, and the lower cover plate in the steam chamber has a core area groove corresponding to the protrusion. The core area groove has several support columns and is formed by forging. In one implementation, in step S2, a layer of copper powder and additive mixture with a larger mesh size is first filled into the core area groove of the lower cover plate, and then multiple layers of copper powder and additive mixture with a smaller mesh size are sequentially filled into its upper surface; the area inside the steam chamber of the lower cover plate, except for the core area groove, is filled with a second capillary structure with a set mesh size, and then the whole is sintered. In one implementation, in step S4, diffusion welding is used to weld and press together the outer edge joint of the lower cover plate and the upper cover plate, as well as the support column.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-level capillary structure heat spreader, comprising an upper cover plate and a lower cover plate, wherein a steam chamber is formed between the upper cover plate and the lower cover plate, and a core area groove correspondingly recessed in the lower cover plate within the steam chamber, characterized in that, The core area has a multi-level capillary structure with copper powder sintering inside the tank.

2. The multi-level capillary structure heat exchanger as described in claim 1, characterized in that, The multi-level capillary structure consists of multiple capillary layers from top to bottom.

3. The multi-level capillary structure heat exchanger as described in claim 2, characterized in that, The mesh size of the copper powder in the bottom capillary layer is greater than that in the top capillary layer.

4. The multi-level capillary structure heat exchanger as described in claim 3, characterized in that, The mesh size of the copper powder in the capillary layer of the multi-level capillary structure increases sequentially from top to bottom.

5. The multi-level capillary structure heat exchanger as described in claim 1, characterized in that, The core area tank sidewall and the bottom of the steam chamber are provided with a second capillary structure, which overlaps with the multi-level capillary structure.

6. The multi-level capillary structure heat exchanger as described in claim 5, characterized in that, The core area is equipped with a support column, and a second capillary structure is provided on the outer periphery of the support column. The second capillary structure on the outer periphery of the support column overlaps with the multi-level capillary structure.

7. The multi-level capillary structure heat exchanger as described in claim 6, characterized in that, The top of the steam chamber is provided with a first capillary structure, and the second capillary structure on the outer periphery of the support column overlaps with the first capillary structure.

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