A circuit board warpage testing device

Abstract

The utility model relates to a kind of circuit board warping testing devices, comprising: pedestal;Positioning assembly, including bearing seat and pressing plate, the bearing seat is slidably arranged on the pedestal and can be moved along the first direction, the bearing seat is equipped with the positioning slot for placing the circuit board to be tested, the pressing plate is used to press the circuit board in the positioning slot before testing, the pressing plate is equipped with multiple through holes in array distribution;At least one test component, slidably erected above the moving path of the bearing seat, including at least one test piece, the test piece is configured to be movable, to select and pass one of the through hole and the surface of the circuit board contact;And jacking assembly, be equipped in the pedestal, for jacking the pressing plate when testing, to make the pressing plate and bearing seat separate.The utility model can flexibly configure test point quantity and position, to reflect the warping condition of circuit board truly and completely.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing, and more specifically, to a circuit board warpage testing device. Background Technology

[0002] In the field of circuit board manufacturing and assembly, the warpage of a board is a key quality indicator affecting its reliability and subsequent assembly yield. Currently used warpage testing devices typically employ a fixed number and layout of test probes. The position and number of test points are fixed, which makes it impossible to flexibly increase or decrease the number of test points according to specific needs such as changes in circuit board size or stress distribution in specific areas during actual testing. It is also difficult to adaptively adjust the test positions, resulting in an inability to comprehensively and accurately reflect the warpage state of the circuit board, thus limiting the accuracy and validity of the test results. Utility Model Content

[0003] The purpose of this invention is to provide a circuit board warpage testing device that can flexibly configure the number and position of test points, thereby reflecting the warpage condition of the circuit board in a true and complete manner.

[0004] A circuit board warpage testing device, comprising: Base; The positioning assembly includes a support base and a pressure plate. The support base is slidably disposed on the base and can move along a first direction. The support base is provided with a positioning groove for placing a circuit board to be tested. The pressure plate is used to press the circuit board located in the positioning groove before testing. The pressure plate is provided with a plurality of through holes distributed in an array. At least one test component, slidably mounted above the movement path of the carrier, includes at least one test element configured to be movable to select and contact the surface of the circuit board through one of the through holes; and A lifting assembly, located within the base, is used to lift the pressure plate during testing to separate the pressure plate from the support.

[0005] In the above technical solution, the positioning component includes a support base and a pressure plate. During testing, the operator places the circuit board in the positioning groove on the support base and presses the circuit board firmly with the pressure plate to keep it flat. Then, the support base slides along the first direction, transporting the circuit board to the testing station. Subsequently, the test piece is adjusted to the position to be tested, such as the four corners of the circuit board, and passes through the corresponding through holes on the pressure plate to contact the surface of the circuit board. Finally, the lifting component operates, lifting the pressure plate upward to separate it from the support base, thereby relieving the pressure on the circuit board. After a preset time, the stress inside the circuit board is released, and the location and degree of warping of the circuit board can be determined. The entire device has a reasonable structure, is easy to operate, can flexibly adjust the test position to meet different testing needs, and the measurement results are accurate and reliable, truly reflecting the actual warping condition of the circuit board.

[0006] Furthermore, the test assembly includes a support, the test piece is slidably disposed on the support, and the support is configured to move along a first direction.

[0007] In the above technical solution, by setting a bracket that can move along the first direction, the test component can slide as a whole, and the operator can flexibly move the test piece directly above the corresponding through hole, thereby improving the adaptability of the device to circuit boards of different sizes and different test point layouts.

[0008] Furthermore, the support includes a crossbar with a groove extending in a second direction, the groove having at least one slider, and the test piece being mounted on the slider.

[0009] In the above technical solution, a groove extending along the second direction is provided on the crossbar, the test piece is installed on the slider, and the slider can slide along the groove, so that the test piece can move along the second direction. With the movable structure of the bracket, the test piece can be flexibly adjusted in the plane formed by the first direction and the second direction to meet the needs of different tests.

[0010] Furthermore, the bottom of the chute is provided with an opening for the test piece to pass through.

[0011] In the above technical solution, by setting an opening at the bottom of the chute for the test piece to pass through, it is ensured that the test piece installed on the slider can pass vertically downward through the opening and through the through hole of the pressure plate to abut against the surface of the circuit board, avoiding structural interference, ensuring the simplicity of the measurement path, thereby improving the accuracy of the test and the convenience of operation.

[0012] Furthermore, the pressure plate has extensions at both ends, and the lifting assembly lifts the pressure plate through the extensions.

[0013] In the above technical solution, extensions are provided at both ends of the pressure plate, and the lifting assembly lifts the pressure plate through the extensions. The overall structure is reasonable and can achieve stable lifting of the pressure plate.

[0014] Furthermore, the lifting assembly includes a driving component 41, the output end of the driving component 41 is provided with a connecting plate, and both ends of the connecting plate are provided with lifting blocks. When the support seat moves to the test position, the lifting blocks correspond to the positions of the extensions at both ends of the pressure plate.

[0015] In the above technical solution, the lifting assembly uses a driving component 41 to drive the connecting plate. Lifting blocks are set at both ends of the connecting plate, and the lifting blocks correspond to the position of the pressure plate extension. This enables the lifting blocks on both sides to move simultaneously through a single driving component 41, ensuring that the pressure plate is subjected to a balanced lifting force at both ends. The action synchronization is good, the structure is stable and reliable, and the stability of the pressure plate during lifting is effectively ensured.

[0016] Furthermore, the thickness of the extension is less than the thickness of the pressure plate, and the extension is close to the upper end face of the pressure plate.

[0017] In the above technical solution, the thickness of the extension is designed to be less than the thickness of the pressure plate, and it is set at the upper end face of the pressure plate, so as to ensure that the lower end face of the pressure plate can press the circuit board tightly.

[0018] Furthermore, the test piece is a dial indicator.

[0019] Compared with existing technologies, the advantages of this invention are as follows: The positioning component includes a support base and a pressure plate. During testing, the operator places the circuit board in the positioning groove on the support base and presses the circuit board firmly with the pressure plate to keep it flat. Then, the support base slides along a first direction to transport the circuit board to the testing station. Subsequently, the test piece is adjusted to the position to be tested, such as the four corners of the circuit board, and passes through the corresponding through holes on the pressure plate to contact the surface of the circuit board. Finally, the lifting component is activated to lift the pressure plate upward to separate it from the support base, thereby relieving the pressure on the circuit board. After a preset time, the stress inside the circuit board is released, and the location and degree of warping of the circuit board can be determined. The entire device has a reasonable structure, is easy to operate, can flexibly adjust the test position to meet different testing needs, and the measurement results are accurate and reliable, truly reflecting the actual warping condition of the circuit board. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the circuit board warpage testing device according to an embodiment of the present invention.

[0021] Figure 2 This is a schematic diagram of the structure of the test component in an embodiment of the present invention.

[0022] Figure 3 for Figure 2 A partial structural diagram.

[0023] Figure 4 This is a schematic diagram of the structure of the pressure plate in an embodiment of the present utility model.

[0024] Figure 5 This is a schematic diagram of the lifting assembly according to an embodiment of the present invention.

[0025] Explanation of icon numbers: Base 1, platform 11, first guide rail 12, second guide rail 13, positioning component 2, bearing seat 21, pressure plate 22, through hole 221, extension 222, test component 3, test piece 31, bracket 32, crossbar 321, slide groove 322, opening 323, upright plate 324, slider 33, lifting component 4, driving component 41, connecting plate 42, lifting block 43, first direction X, second direction Y. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0028] Please refer to Figures 1 to 5 In a preferred embodiment, the circuit board warpage testing device of this utility model mainly includes a base 1, a positioning component 2, a testing component 3, and a lifting component 4. The positioning component 2 includes a support seat 21 and a pressure plate 22. The support seat 21 is slidably disposed on the base 1 and can move along a first direction X. The support seat 21 has a positioning groove for placing the circuit board to be tested. The pressure plate 22 is used to press the circuit board located in the positioning groove before testing. The pressure plate 22 has a plurality of through holes 221 arranged in an array. The testing component 3 is slidably mounted above the moving path of the support seat 21 and includes at least one test piece 31. The test piece 31 is configured to be movable to select and pass through one of the through holes 221 to contact the surface of the circuit board. The lifting component 4 is disposed within the base 1 and is used to lift the pressure plate 22 during testing, so that the pressure plate 22 is separated from the support seat 21.

[0029] For example, the base 1 includes a platform 11, with a positioning component 2 and a testing component 3 both mounted on the platform 11. A lifting component 4 is located inside the base 1 and below the platform 11. The platform 11 has a through slot corresponding to the position of the lifting component 4 to ensure that the lifting component 4 can rise and lift the pressure plate 22. The support seat 21 is slidably connected to the platform 11 via a first guide rail 12. The support seat 21 has a positioning slot (not shown), the shape and size of which match the circuit board. The lower end face of the pressure plate 22 can extend into the positioning slot and press the circuit board. The pressure plate 22 can be made of metal or alloy to ensure sufficient pressure. Through holes 221 are arranged in a rectangular array on the pressure plate 22, penetrating the pressure plate 22 in the height direction, allowing the test piece 31 to pass through. In this embodiment, the test piece 31 is a dial indicator, the diameter of which is smaller than the diameter of the through hole 221, so that it can pass through the through hole 221 and abut against the surface of the circuit board. This embodiment uses two test components 3 as an example. In other possible embodiments, test components 3 can be added or reduced according to the actual test requirements.

[0030] During testing, the operator places the circuit board in the positioning groove on the support 21 and presses it down with the pressure plate 22 to keep it flat. The support 21 then slides along the first direction X, transporting the circuit board to the testing station. The test piece 31 is then adjusted to the desired testing position, such as one of the four corners of the circuit board, and passes through the corresponding through holes 221 on the pressure plate 22 to contact the circuit board surface. Finally, the lifting assembly 4 actuates, lifting the pressure plate 22 upwards to separate it from the support 21, thus relieving pressure on the circuit board. Understandably, because the diameter of the through hole 221 is larger than the diameter of the test end of the test piece 31, the pressure plate 22 will not contact the test piece 31 during its ascent, thus ensuring the stability of the test piece 31 and the accuracy of the testing structure. After a preset time, the stress inside the circuit board is released, allowing the determination of the location and degree of warping. The entire device has a reasonable structure, is easy to operate, can flexibly adjust the testing position to meet different testing needs, and provides accurate and reliable measurement results that truly reflect the actual warping condition of the circuit board.

[0031] Please refer to Figure 2 and Figure 3 The test assembly 3 includes a bracket 32, on which the test piece 31 is slidably disposed. The bracket 32 ​​is configured to move along a first direction X. For example, the platform 11 has a second guide rail 13 extending along the first direction X, and the bracket 32 ​​has upright plates 324 at both ends, which are slidably connected to the second guide rail 13, allowing the bracket 32 ​​to slide along the first direction X. By providing a bracket 32 ​​that can move along the first direction X, the test assembly 3 can slide as a whole, allowing the operator to flexibly move the test piece 31 directly above the corresponding through hole 221, thus improving the device's adaptability to circuit boards of different sizes and test point layouts.

[0032] The support 32 includes a crossbar 321, which has a groove 322 extending along the second direction Y. The groove 322 has at least one slider 33, and the test piece 31 is mounted on the slider 33. For example, the groove 322 is a T-shaped groove, and the lower end of the slider 33 can extend into the groove 322, thereby slidably connecting with the crossbar 321. The test pieces 31 are mounted one-to-one on the sliders 33. In this embodiment, each support 32 has two test pieces 31. In other possible embodiments, the number of test pieces 31 on each support 32 can be increased or decreased according to actual testing needs. By providing a groove 322 extending along the second direction Y on the crossbar 321, the test piece 31 is mounted on the slider 33, and the slider 33 can slide along the groove 322, allowing the test piece 31 to move along the second direction Y. Combined with the movable structure of the support 32, this enables flexible adjustment of the test piece 31 within the plane formed by the first direction X and the second direction Y, meeting different testing requirements.

[0033] The bottom of the slide groove 322 has an opening 323 for the test piece 31 to pass through. The opening 323 extends along the second direction Y, preventing interference with the test end of the test piece 31 when the slider 33 slides. By providing an opening 323 at the bottom of the slide groove 322 for the test piece 31 to pass through, it is ensured that the test piece 31 mounted on the slider 33 can pass vertically downwards through the opening 323 and through the through hole 221 of the pressure plate 22 to abut against the circuit board surface. This avoids structural interference, ensures a simple measurement path, and thus improves the accuracy of the test and the convenience of operation.

[0034] Please refer to Figure 4 and Figure 5 The pressure plate 22 has extensions 222 at both ends, and the lifting assembly 4 lifts the pressure plate 22 through the extensions 222. By providing extensions 222 at both ends of the pressure plate 22, the lifting assembly 4 lifts the pressure plate 22 through the extensions 222. The overall structure is reasonable and can achieve a smooth lifting of the pressure plate 22.

[0035] Specifically, the lifting assembly 4 includes a drive member 41. The output end of the drive member 41 is provided with a connecting plate 42, and both ends of the connecting plate 42 are provided with lifting blocks 43. When the support seat 21 moves to the test position, the lifting blocks 43 correspond to the positions of the extensions 222 at both ends of the pressure plate 22. For example, the drive member 41 can be an existing linear drive device, such as a cylinder, whose output end is connected to the connecting plate 42. The connecting plate 42 extends along the first direction X, and the lifting blocks 43 are provided at both ends of the connecting plate 42. The length of the connecting plate 42 matches the length of the pressure plate 22, so that the two lifting blocks 43 can be opposite to the two extensions 222. The lifting assembly 4 uses a driving component 41 to drive the connecting plate 42. Lifting blocks 43 are set at both ends of the connecting plate 42, and the lifting blocks 43 correspond to the position of the extension 222 of the pressure plate 22. This enables the lifting blocks 43 on both sides to move simultaneously through a single driving component 41, ensuring that the pressure plate 22 is subjected to a balanced lifting force at both ends. The movement is synchronized, the structure is stable and reliable, and the stability of the pressure plate 22 during lifting is effectively ensured.

[0036] In this embodiment, the thickness of the extension 222 is less than the thickness of the pressure plate 22, and the extension 222 is close to the upper end surface of the pressure plate 22. By designing the thickness of the extension 222 to be less than the thickness of the pressure plate 22 and placing it at the upper end surface of the pressure plate 22, it is ensured that the lower end surface of the pressure plate 22 can press the circuit board tightly.

[0037] In the description of this utility model, it should be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A circuit board warpage testing device, characterized in that, include: Base; The positioning assembly includes a support base and a pressure plate. The support base is slidably disposed on the base and can move along a first direction. The support base is provided with a positioning groove for placing a circuit board to be tested. The pressure plate is used to press the circuit board located in the positioning groove before testing. The pressure plate is provided with a plurality of through holes distributed in an array. At least one test component, slidably mounted above the movement path of the carrier, includes at least one test element configured to be movable to select and pass through one of the through holes to contact the surface of the circuit board; as well as A lifting assembly, located within the base, is used to lift the pressure plate during testing to separate the pressure plate from the support.

2. The circuit board warpage testing device according to claim 1, characterized in that, The test assembly includes a support, on which the test piece is slidably disposed, and the support is configured to move along a first direction.

3. The circuit board warpage testing device according to claim 2, characterized in that, The support includes a crossbar with a groove extending in a second direction, the groove having at least one slider, and the test piece being mounted on the slider.

4. The circuit board warpage testing device according to claim 3, characterized in that, The bottom of the chute has an opening for the test piece to pass through.

5. The circuit board warpage testing device according to claim 1, characterized in that, The pressure plate has extensions at both ends, and the lifting assembly lifts the pressure plate through the extensions.

6. The circuit board warpage testing device according to claim 5, characterized in that, The lifting assembly includes a driving component, the output end of which is provided with a connecting plate, and both ends of the connecting plate are provided with lifting blocks. When the support seat moves to the test position, the lifting blocks correspond to the positions of the extensions at both ends of the pressure plate.

7. The circuit board warpage testing device according to claim 5, characterized in that, The thickness of the extension is less than the thickness of the pressure plate, and the extension is close to the upper end face of the pressure plate.

8. The circuit board warpage testing device according to claim 1, characterized in that, The test piece is a dial indicator.

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