A thin film etching thickness detection device based on a full spectrum ellipsometer
Patent Information
- Application Number
- CN202521859021.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-29
- Publication Date
- 2026-09-29
- Estimated Expiration
- 2035-08-29
AI Technical Summary
[0003]本实用新型的目的在于提供一种基于全光谱椭偏仪的薄膜蚀刻厚度检测装置,以解决上述背景技术中提出现有的基于全光谱椭偏仪的薄膜蚀刻厚度检测装置在使用时光源、检测头和斩波器角度调整不便、放置不稳定会影响薄膜的检测的问题
本实用新型对一种基于全光谱椭偏仪的薄膜蚀刻厚度检测装置进行了改进,在使用基于全光谱椭偏仪的薄膜蚀刻厚度检测装置时,先将薄膜放置在放置盘的内部,然后通过连接块将转管在放置孔内部转动,安装在放置孔内部的限制弹簧会防止转管滑脱,而安装在转管外部的限制套由于是采用橡胶材料制作的,从而会对放置孔的内壁进行挤压,这时再将限制旋钮通过外壁的外螺纹与限制孔内壁的内螺纹进行连接,使得限制旋钮对转管进行挤压,从而使得转管被限制住,进而使得连接块被限制住,以此来调整光源、探测头和斩波器的角度,接着就可以通过探测头对放置盘内部的薄膜进行检测了,检测后的数据会通过显示屏呈现出来,通过放置块、限制旋钮、限制孔、放置孔、转管、限制弹簧、限制套和连接块的配合使用,加强了探测头、光源、斩波器角度调整的便捷性和稳定性。
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Figure CN224815629U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of thin film detection technology, specifically relating to a thin film etching thickness detection device based on a full-spectrum ellipsometer. Background Technology
[0002] The thin film etching thickness detection device based on a full-spectrum ellipsometer has the ability to analyze the optical properties of materials such as single-layer films and multi-layer films. The film thickness measurement range can be from a single atomic layer to the micrometer level. The thin film etching thickness detection device based on a full-spectrum ellipsometer of this invention is mainly composed of a sample stage, support column, support pad, display screen, control button, cabinet door, handle, fixing block, placement block, placement plate, fixing plate, front and rear moving plate, left and right moving plate, connecting plate, placement tray, first slider, first groove, second slider, second groove, light source, detection head, chopper and other components. Existing thin film etching thickness detection devices based on a full-spectrum ellipsometer are inconvenient to adjust the angle of the light source, detection head and chopper and the placement is unstable, which will affect the detection of thin films. Therefore, a thin film etching thickness detection device based on a full-spectrum ellipsometer is essential. Utility Model Content
[0003] The purpose of this invention is to provide a thin film etching thickness detection device based on a full-spectrum ellipsometer, in order to solve the problems mentioned in the background art where the existing thin film etching thickness detection devices based on a full-spectrum ellipsometer are inconvenient to adjust the angles of the light source, detection head and chopper, and the unstable placement affects the detection of thin films.
[0004] To achieve the above objectives, this utility model provides the following technical solution: a thin film etching thickness detection device based on a full-spectrum ellipsometer, comprising... A sample stage and a support block disposed at the upper end of the sample stage; A placement plate is connected to the upper end of the support block, a fixing plate is installed at the upper end of the placement plate, a connecting plate is installed at the upper end of the fixing plate and outside the fixing plate, a front-back moving plate is connected to the upper end of the connecting plate, a left-right moving plate is installed at the upper end of the front-back moving plate and outside the front-back moving plate, and a placement tray is installed at the upper end of the front-back moving plate. A fixing block is installed at the upper rear side of the placement plate. A backing plate is connected to the upper end of the fixing block. An mounting plate is provided at the front of the backing plate. A placement block is installed at the front of the mounting plate. A limiting hole is provided on the left wall of the placement block. A limiting knob is installed inside the limiting hole and on the left wall of the placement block. A placement hole is provided inside the placement block. A limiting spring is installed inside the placement hole. A rotating tube is connected inside the placement hole and in front of the limiting spring. A limiting sleeve is installed inside the placement hole and outside the rotating tube. A connecting block is connected to the front of the rotating tube, a light source is installed at the lower end of the left connecting block, a probe is installed at the lower end of the middle connecting block, and a chopper is installed at the lower end of the right connecting block. The connecting block is electrically connected to an external power source; The combined use of the placement block, limiting knob, limiting hole, placement hole, rotating tube, limiting spring, limiting sleeve, and connecting block enhances the convenience and stability of adjusting the angles of the probe, light source, and chopper.
[0005] Preferably, a first sliding groove is provided at the left and right sides of the fixing plate, and a first slider is connected inside the first sliding groove and at the position of the inner wall of the connecting plate.
[0006] Preferably, a second sliding groove is provided at the front and rear walls of the front and rear moving plates, and a second slider is connected inside the second sliding groove and located at the inner wall of the left and right moving plates.
[0007] Preferably, the first slider and the first slide groove, and the second slider and the second slide groove are connected by a snap-fit mechanism. The use of the first slider, the first slide groove, the second slider, the second slide groove, the front-to-back moving plates, the left-to-right moving plates, the connecting plate, and the fixing plate together enhances the convenience of placing the tray in the front-to-back and left-to-right positions.
[0008] Preferably, a display screen and control buttons are installed on the left wall of the sample stage, and a cabinet door is provided at the front of the sample stage, with a handle at the front of the cabinet door.
[0009] Preferably, a support column is provided at the lower end of the sample stage, and a total of four support columns are provided, which are welded to the four corners at the lower end of the sample stage.
[0010] Preferably, a support pad is provided at the lower end of the support column, and the support column and the support pad are fixedly connected by welding.
[0011] Preferably, the support column and support pad are made of stainless steel. The support column and support pad enhance the stability of the sample stage and the ease of handling.
[0012] Compared with the prior art, this utility model provides a thin film etching thickness detection device based on a full-spectrum ellipsometer, which has the following beneficial effects: This invention improves a thin film etching thickness detection device based on a full-spectrum ellipsometer. When using this device, the thin film is first placed inside a placement tray. Then, a rotating tube is rotated inside a placement hole via a connecting block. A limiting spring installed inside the placement hole prevents the rotating tube from slipping out, while a limiting sleeve, made of rubber, presses against the inner wall of the placement hole. A limiting knob is then connected to the inner thread of the limiting hole via its external thread, further pressing against the rotating tube and thus restricting it. This restricts the connecting block, allowing adjustment of the angles of the light source, probe, and chopper. The probe can then detect the thin film inside the placement tray, and the detected data is displayed on a screen. The coordinated use of the placement block, limiting knob, limiting hole, rotating tube, limiting spring, limiting sleeve, and connecting block enhances the convenience and stability of adjusting the angles of the probe, light source, and chopper. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the overall structure of the thin film etching thickness detection device based on a full-spectrum ellipsometer according to this utility model.
[0014] Figure 2 This is a side-view magnified structural diagram of the placement block of the thin film etching thickness detection device based on a full-spectrum ellipsometer according to this utility model.
[0015] Figure 3 This is a frontal view magnified structural diagram of the placement block of the thin film etching thickness detection device based on a full-spectrum ellipsometer according to this utility model.
[0016] Figure 4 This is an enlarged structural schematic diagram of the slider and groove of the thin film etching thickness detection device based on a full-spectrum ellipsometer according to this utility model.
[0017] In the diagram: 1. Support column; 2. Sample stage; 3. Control button; 4. Display screen; 5. Front and rear moving plate; 6. Light source; 7. Fixing block; 8. Backrest plate; 9. Placement block; 10. Limiting knob; 11. Probe head; 12. Connecting block; 13. Chopper; 14. Placement tray; 15. Support block; 16. Fixing plate; 17. Placement plate; 18. Handle; 19. Support pad; 20. Cabinet door; 21. Placement hole; 22. Limiting spring; 23. Rotary tube; 24. Limiting sleeve; 25. Limiting hole; 26. Mounting plate; 27. Connecting plate; 28. Second slide rail; 29. First slide rail; 30. First slider; 31. Left and right moving plate; 32. Second slider. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0019] This utility model provides, for example Figure 1-4The thin film etching thickness detection device based on a full-spectrum ellipsometer shown includes a sample stage 2 and a support block 15 disposed at the upper end of the sample stage 2. A placement plate 17 is connected to the upper end of the support block 15, and a fixing plate 16 is installed at the upper end of the placement plate 17. A connecting plate 27 is installed at the upper end of the fixing plate 16 and outside the fixing plate 16. A front-to-back moving plate 5 is connected to the upper end of the connecting plate 27. A left-to-right moving plate 31 is installed at the upper end of the front-to-back moving plate 5 and outside the front-to-back moving plate 5. A placement disk 14 is installed at the upper end of the front-to-back moving plate 5. A fixing block 7 is installed at the rear side of the upper end of the placement plate 17. A backing plate 8 is connected to the upper end of the fixing block 7. A mounting plate 26 is disposed at the front of the backing plate 8. A placement block 9 is disposed at the front of the mounting plate 26. A limiting hole 25 is disposed on the left wall of the placement block 9. A limiting knob 10 is installed inside the limiting hole 25 and on the left wall of the placement block 9. A placement hole 21 is provided inside the placement block 9. A limiting spring 22 is installed inside the placement hole 21. A rotating tube 23 is connected inside the placement hole 21 and in front of the limiting spring 22. A limiting sleeve 24 is installed inside the placement hole 21 and outside the rotating tube 23. A connecting block 12 is connected to the front of the rotating tube 23. A light source 6 is installed at the lower end of the left connecting block 12. A probe head 11 is installed at the lower end of the middle connecting block 12. A chopper 13 is installed at the lower end of the right connecting block 12. The connecting block 12 is electrically connected to an external power source. Through the coordinated use of the placement block 9, limiting knob 10, limiting hole 25, placement hole 21, rotating tube 23, limiting spring 22, limiting sleeve 24, and connecting block 12, the convenience and stability of adjusting the angles of the probe head 11, light source 6, and chopper 13 are enhanced.
[0020] like Figure 1 , Figure 2 and Figure 3As shown, to enhance the convenience and stability of angle adjustment for the probe 11, light source 6, and chopper 13, when using the thin film etching thickness detection device based on a full-spectrum ellipsometer, the thin film is first placed inside the placement disk 14. Then, the rotating tube 23 is rotated inside the placement hole 21 via the connecting block 12. The limiting spring 22 installed inside the placement hole 21 prevents the rotating tube 23 from slipping. The limiting sleeve 24 installed outside the rotating tube 23, being made of rubber, compresses the inner wall of the placement hole 21. At this point, the limiting knob 10 is then engaged with the inner thread of the limiting hole 25 via the external thread on the outer wall. The connection allows the limiting knob 10 to press against the rotating tube 23, thereby restricting the rotating tube 23 and consequently restricting the connecting block 12. This allows for adjustment of the angles of the light source 6, the probe head 11, and the chopper 13. The probe head 11 can then be used to detect the thin film inside the placement plate 14, and the detected data will be displayed on the screen 4. Through the coordinated use of the placement block 9, the limiting knob 10, the limiting hole 25, the placement hole 21, the rotating tube 23, the limiting spring 22, the limiting sleeve 24, and the connecting block 12, the convenience and stability of adjusting the angles of the probe head 11, the light source 6, and the chopper 13 are enhanced.
[0021] The fixed plate 16 has a first sliding groove 29 on its left and right sides. A first slider 30 is connected to the inside of the first sliding groove 29 and located on the inner wall of the connecting plate 27. The front and back sliding plates 5 have a second sliding groove 28 on their front and back sides. A second slider 32 is connected to the inside of the second sliding groove 28 and located on the inner wall of the left and right sliding plates 31. The first slider 30 and the first sliding groove 29, and the second slider 32 and the second sliding groove 28 are connected by a snap-fit mechanism. The cooperation of the first slider 30, the first sliding groove 29, the second slider 32, the second sliding groove 28, the front and back sliding plates 5, the left and right sliding plates 31, the connecting plate 27 and the fixed plate 16 enhance the convenience of placing the tray 14 on the front and back and left and right sliding plates 31.
[0022] like Figure 1 and Figure 4As shown, in order to enhance the convenience of moving the front-back and left-right moving plates 31 of the placement tray 14, when using the thin film etching thickness detection device based on a full-spectrum ellipsometer, the thin film is first placed inside the placement tray 14. Then, the connecting plate 27 moves back and forth in the first grooves 29 on the left and right walls of the fixed plate 16 via the first slider 30, thereby realizing the front-back movement of the front-back moving plate 5, and thus realizing the front-back movement of the placement tray 14. Next, the left-right moving plate 31 moves left and right in the front and back walls of the front-back moving plate 5 via the second slider 32, thereby realizing the left-right movement of the left-right moving plate 5, and thus realizing the left-right movement of the placement tray 14. Through the coordinated use of the first slider 30, the first groove 29, the second slider 32, the second groove 28, the front-back moving plate 5, the left-right moving plate 31, the connecting plate 27, and the fixed plate 16, the convenience of moving the front-back and left-right moving plates 31 of the placement tray 14 is enhanced.
[0023] A display screen 4 and control buttons 3 are installed on the left wall of the sample stage 2. A cabinet door 20 is installed at the front of the sample stage 2, and a handle 18 is installed at the front of the cabinet door 20. Support columns 1 are installed at the lower end of the sample stage 2. There are four support columns 1 in total. The four support columns 1 are welded to the four corners of the lower end of the sample stage 2. Support pads 19 are installed at the lower end of the support columns 1. The support columns 1 and support pads 19 are fixedly connected by welding. Both the support columns 1 and support pads 19 are made of stainless steel. The installation of support columns 1 and support pads 19 enhances the stability of the sample stage 2 and the convenience of handling.
[0024] like Figure 1 As shown, in order to enhance the stability of sample stage 2 and the ease of handling, when using the thin film etching thickness detection device based on full-spectrum ellipsometer, the support column 1 is first welded to the support pad 19, and then the support column 1 is welded to the four corners at the bottom of the sample stage 2. Then, the sample stage 2 is placed in contact with the ground through the support pad 19, so that the sample stage 2 is placed on the ground through the support column 1. The setting of support column 1 and support pad 19 enhances the stability of sample stage 2 and the ease of handling.
[0025] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A thin film etching thickness detection device based on a full-spectrum ellipsometer, characterized in that: include Sample stage (2) and support block (15) located at the upper end of the sample stage (2); A placement plate (17) is connected to the upper end of the support block (15), a fixing plate (16) is installed at the upper end of the placement plate (17), a connecting plate (27) is installed at the upper end of the fixing plate (16) and at the outer position of the fixing plate (16), a front and rear moving plate (5) is connected to the upper end of the connecting plate (27), a left and right moving plate (31) is installed at the upper end of the front and rear moving plate (5) and at the outer position of the front and rear moving plate (5), and a placement tray (14) is installed at the upper end of the front and rear moving plate (5). A fixing block (7) is installed at the upper rear side of the placement plate (17). A backing plate (8) is connected to the upper end of the fixing block (7). An mounting plate (26) is provided at the front of the backing plate (8). A placement block (9) is installed at the front of the mounting plate (26). A limiting hole (25) is provided on the left wall of the placement block (9). A limiting knob (10) is installed inside the limiting hole (25) and on the left wall of the placement block (9). A placement hole (21) is provided inside the placement block (9). A limiting spring (22) is installed inside the placement hole (21). A rotating tube (23) is connected inside the placement hole (21) and on the front side of the limiting spring (22). A limiting sleeve (24) is installed on the inner side of the placement hole (21) and outside the rotating tube (23). A connecting block (12) is connected to the front of the rotating tube (23). A light source (6) is installed at the lower end of the left connecting block (12), a probe (11) is installed at the lower end of the middle connecting block (12), and a chopper (13) is installed at the lower end of the right connecting block (12). The connecting block (12) is electrically connected to an external power source; The use of the placement block (9), limiting knob (10), limiting hole (25), placement hole (21), rotating tube (23), limiting spring (22), limiting sleeve (24) and connecting block (12) enhances the convenience and stability of angle adjustment of probe head (11), light source (6) and chopper (13).
2. The thin film etching thickness detection device based on a full-spectrum ellipsometer according to claim 1, characterized in that: The fixing plate (16) has a first sliding groove (29) on its left and right sides, and a first slider (30) is connected inside the first sliding groove (29) and on the inner wall of the connecting plate (27).
3. The thin film etching thickness detection device based on a full-spectrum ellipsometer according to claim 1, characterized in that: A second slide groove (28) is provided at the front and rear walls of the front and rear moving plate (5), and a second slider (32) is connected inside the second slide groove (28) and at the inner wall of the left and right moving plate (31).
4. The thin film etching thickness detection device based on a full-spectrum ellipsometer according to claim 2, characterized in that: The first slider (30) is connected to the first slide groove (29), and the second slider (32) is connected to the second slide groove (28) by snap-fit. The cooperation of the first slider (30), the first slide groove (29), the second slider (32), the second slide groove (28), the front and back moving plate (5), the left and right moving plate (31), the connecting plate (27), and the fixing plate (16) enhances the convenience of the front and back and left and right moving plate (31) of the placement tray (14).
5. The thin film etching thickness detection device based on a full-spectrum ellipsometer according to claim 1, characterized in that: The sample stage (2) is equipped with a display screen (4) and control buttons (3) on the left wall. The sample stage (2) is equipped with a cabinet door (20) at the front and a handle (18) at the front.
6. The thin film etching thickness detection device based on a full-spectrum ellipsometer according to claim 5, characterized in that: A support column (1) is provided at the lower end of the sample stage (2). There are four support columns (1) in total, and the four support columns (1) are welded to the four corners at the lower end of the sample stage (2).
7. A thin film etching thickness detection device based on a full-spectrum ellipsometer according to claim 6, characterized in that: A support pad (19) is provided at the lower end of the support column (1), and the support column (1) and the support pad (19) are fixedly connected by welding.
8. A thin film etching thickness detection device based on a full-spectrum ellipsometer according to claim 7, characterized in that: The support column (1) and support pad (19) are both made of stainless steel. The support column (1) and support pad (19) enhance the stability of the sample stage (2) and the ease of handling.