Optoelectronic measurement probe array

CN224815727UActive Publication Date: 2026-09-29SUZHOU XUEC ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202522576159.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-04
Publication Date
2026-09-29
Estimated Expiration
2035-12-04

AI Technical Summary

Technical Problem

上述现有技术通过实际的使用情况得知,现有光电测量探针排(如CN218917479U)存在以下缺陷:悬挂可靠性低:可抽拉挂板采用滑动连接,悬挂时易因振动脱落,导致探针跌落损坏,而且安装方式单一,不能满足各种需求;散热性能差:固定板为环氧树脂层包裹金属涂层,热量积聚影响电阻稳定性,为此我们根据实际的使用情况,对上述现有技术改进

Benefits of technology

本文中提出的光电测量探针排,在固定块的底部外侧均通过安装槽设置了磁铁,并且磁铁均为永磁体,悬挂时无需抽拉,避免脱落,固定块与固定板之间是通过合页进行连接的,故固定块可向下转动调节,使固定块与固定板之间的夹角达到九十,然后通过侧面板与第二安装孔的配合,就可将整体结构进行固定安装,同时在固定板上也设置了第一安装孔,通过多种安装固定的方式,可满足充分的使用需求;在固定板的顶部两侧均通过散热凹槽设置了导热板,并在导热板的顶部均匀设置了散热片,这样设置可快速导热散热,以此来大大的增加延长整体结构额使用寿命。

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Abstract

The utility model discloses a kind of photoelectric measurement probe arrays, it is related to measurement probe technical field, the bottom of the left and right sides of fixed plate is uniformly provided with fixed block, the rear end surface of welding strip is uniformly provided with resistance, probe is installed in resistance, the top left and right sides of fixed plate are provided with heat dissipation groove, heat dissipation groove is provided with heat conduction plate, the top of heat conduction plate is sequentially provided with fin from left to right;Magnet is set on the bottom outside of fixed block through mounting groove, and magnet is permanent magnet, and it is not necessary to pull when hanging, avoid falling, fixed block and fixed plate are connected by hinge, so fixed block can be adjusted by rotating downward, the included angle between fixed block and fixed plate reaches ninety, then by the cooperation of side panel and second mounting hole, whole structure can be fixed installation, first mounting hole is also set on fixed plate, by a variety of installation fixed mode, sufficient use demand can be satisfied.
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Description

Technical Field

[0001] This utility model relates to the field of measurement probe technology, specifically to a photoelectric measurement probe array. Background Technology

[0002] A photoelectric probe array is an integrated sensor array device used for high-precision simultaneous detection of optical and electrical signals. It typically consists of multiple miniature photoelectric probes arranged in a specific spatial structure. This system can achieve parallel acquisition and signal conversion of multiple parameters such as light intensity, wavelength, phase, and electric field strength. It is widely used in semiconductor wafer testing, fiber optic communication quality monitoring, biochip imaging, and analysis of the photoelectric properties of material surfaces. The probe array structure typically includes photodiodes, microlens arrays, shielded wires, and signal conditioning circuits. It features high sensitivity, low noise, and good channel consistency, supporting real-time multi-channel synchronous data output, and is suitable for automated testing equipment and precision experimental measurement scenarios. Based on actual usage, the existing photoelectric measurement probe arrays (such as CN218917479U) have the following defects: low suspension reliability: the pull-out mounting plate uses a sliding connection, which is prone to falling off due to vibration during suspension, causing the probe to fall and be damaged. Moreover, the installation method is limited and cannot meet various needs; poor heat dissipation performance: the fixing plate is an epoxy resin layer wrapped with a metal coating, and heat accumulation affects the resistance stability. Therefore, based on actual usage, we have improved the above-mentioned existing technology. Utility Model Content

[0003] The purpose of this section is to outline some aspects of the embodiments of this utility model and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of this section, the abstract and the title of this utility model. Such simplifications or omissions shall not be used to limit the scope of this utility model.

[0004] In view of the problems existing in the above and / or prior art, the present invention is proposed.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A photoelectric measurement probe array includes a fixing plate and a heat-conducting plate; Fixing blocks are provided on the bottom of both the left and right sides of the fixing plate. The top front and rear ends of the fixing blocks are vertically provided with first mounting holes. The rear end face of the fixing plate is provided with a busbar. The rear end face of the busbar is provided with a welding strip. The rear end face of the welding strip is uniformly provided with resistors. Probes are installed in the resistors. The top left and right sides of the fixing plate are provided with heat dissipation grooves. Heat conduction plates are provided in the heat dissipation grooves. Heat dissipation fins are arranged on the top of the heat conduction plates from left to right. Hinges are provided on the bottom side of the fixing block near the bottom of the fixing plate. Side panels are provided on the top side of the fixing block away from the fixing plate. Second mounting holes are provided horizontally through the front and rear ends of the inner side of the side panels. Mounting grooves are provided on the bottom side of the fixing block away from the bottom of the fixing plate. Magnets are provided in the mounting grooves.

[0006] Furthermore: the thickness of the heat-conducting plate is the same as the thickness of the heat dissipation groove, and bolts are installed between the top and all four sides of the heat-conducting plate and the bottom of the inner cavity of the heat dissipation groove.

[0007] Furthermore, multiple sets of heat dissipation holes are arranged sequentially from left to right on both the front and rear ends of the bottom of the heat dissipation groove, and a silicone sealing layer is provided around the bottom of the heat dissipation groove.

[0008] Furthermore: Anti-collision protection blocks are provided on both the left and right sides of the rear end face of the fixing plate, and the anti-collision protection blocks are integrally formed with the fixing plate.

[0009] Furthermore: the bottoms of both the fixing plate and the fixing block are set on the same horizontal plane, and the thickness of the fixing block is two-thirds of the thickness of the fixing plate.

[0010] Furthermore: the included angle between the side panel and the fixing block on the same side is set to 90 degrees, and the side panel and the fixing block on the same side are fixedly welded together.

[0011] Furthermore: pads are provided around the bottom of the fixing block, and the pads are all made of rubber. The top of the pads is fixedly bonded to the bottom of the fixing block.

[0012] Compared with the prior art, the beneficial effects of this utility model are: The photoelectric measurement probe array proposed in this paper features magnets mounted on the outer bottom of the fixing block via mounting slots. These magnets are permanent magnets, eliminating the need for pulling during suspension and preventing detachment. The fixing block and fixing plate are connected via hinges, allowing the fixing block to rotate downwards to adjust the angle between them to 90 degrees. The entire structure is then fixed in place by engaging the side panel with the second mounting hole. The fixing plate also has a first mounting hole, providing multiple mounting options to meet various usage requirements. Heat-conducting plates with heat dissipation grooves are located on both sides of the top of the fixing plate, with heat sinks evenly distributed on top of the heat-conducting plates. This design enables rapid heat conduction and dissipation, significantly extending the overall structure's service life.

[0013] Other features and advantages of this application will be set forth in the following description and will be apparent in part from the description or may be learned by practicing the application. The objectives and other advantages of this application may be realized and obtained by means of the structures particularly pointed out in the written description and the accompanying drawings.

[0014] The technical solution of this application will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the connection structure between the fixing plate and the fixing block of this utility model; Figure 3 This is a schematic diagram of the structure of the heat sink after disassembly.

[0017] In the diagram: 1. Fixing plate; 2. Fixing block; 3. First mounting hole; 4. Probe; 5. Heat dissipation groove; 6. Heat conduction plate; 7. Bolt; 8. Heat sink; 9. Hinge; 10. Side panel; 11. Second mounting hole; 12. Mounting groove; 13. Magnet; 14. Heat dissipation hole; 15. Anti-collision protection block. Detailed Implementation

[0018] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0019] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0020] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, actual manufacturing should include the three-dimensional spatial dimensions of length, width, and depth.

[0021] Furthermore, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0022] Example 1: Please see Figure 1-3 This utility model provides a technical solution: a photoelectric measurement probe array, including a fixing plate 1 and a heat-conducting plate 6; Fixing blocks 2 are provided on the bottom of both sides of the fixing plate 1. The top front and rear ends of the fixing blocks 2 are provided with first mounting holes 3 vertically, which are used to fix the fixing plate 1 to the mounting base by fixing bolts. The rear end face of the fixing plate 1 is provided with a busbar, the rear end face of the busbar is provided with a welding strip, and the rear end face of the welding strip is uniformly provided with resistors. Probes 4 are installed in the resistors. The top left and right sides of the fixing plate 1 are provided with heat dissipation grooves 5. Heat conduction plates 6 are provided in the heat dissipation grooves 5. The heat conduction plates 6 are made of aluminum alloy. Heat dissipation fins 8 are arranged from left to right on the top of the heat conduction plates 6. The heat dissipation fins 8 are evenly spaced to increase the heat dissipation area and improve the overall heat dissipation performance. Each of the bottom sides of the fixing block 2, near the bottom of the fixing plate 1, is provided with a hinge 9. The fixing block 2 can be adjusted downward by rotating the hinge 9 so that the included angle between the fixing block 2 and the fixing plate 1 reaches 90 degrees. Each of the top sides of the fixing block 2, away from the fixing plate 1, is provided with a side panel 10. The front and rear ends of the inner side of the side panel 10 are provided with second mounting holes 11 that run horizontally through it. After the angle of the fixing block 2 is adjusted, the entire structure can be fixed by cooperating with the fixing bolts through the second mounting holes 11 on the side panel 10. Each of the bottom sides of the fixing block 2, away from the bottom of the fixing plate 1, is provided with a mounting groove 12. Each mounting groove 12 is provided with a magnet 13. The magnets 13 are all permanent magnets. Through the magnets 13, the equipment can be quickly positioned and temporarily fixed by magnetic attraction, which is especially suitable for metal mounting bases.

[0023] Preferably, the thickness of the heat-conducting plate 6 is the same as the thickness of the heat dissipation groove 5, and bolts 7 are provided between the top and the bottom of the inner cavity of the heat dissipation groove 5. This arrangement can ensure structural stability and unobstructed heat conduction path.

[0024] Preferably, the bottom front and rear ends of the heat dissipation groove 5 are provided with multiple sets of heat dissipation holes 14 from left to right. The heat dissipation holes 14 can enhance air convection and further improve heat dissipation efficiency. The bottom of the heat dissipation groove 5 is provided with a silicone sealing layer. The silicone sealing layer not only plays a shockproof and buffering role, but also prevents dust and moisture from entering, thereby improving the environmental adaptability of the equipment.

[0025] Preferably, anti-collision protection blocks 15 are provided on both the left and right sides of the rear end face of the fixing plate 1. The anti-collision protection blocks 15 are integrally formed with the fixing plate 1. The anti-collision protection blocks 15 can effectively prevent the probe 4 from being damaged due to collision during installation or use.

[0026] Preferably, the bottoms of the fixing plate 1 and the fixing block 2 are both set on the same horizontal plane, the overall structure is flat and easy to install, and the thickness of the fixing block 2 is two-thirds of the thickness of the fixing plate 1, taking into account both structural strength and overall lightweight requirements.

[0027] Example 2: Reference Figure 1-3 This embodiment differs from the first embodiment in that: the included angle between the side panel 10 and the fixing block 2 on the same side is set to 90 degrees, and the side panel 10 and the fixing block 2 on the same side are fixedly welded together. This arrangement can significantly enhance the lateral support force and overall rigidity. The bottom of the fixing block 2 is provided with pads around its perimeter. The pads are all rubber pads, and the top of the pads are fixedly bonded to the bottom of the fixing block 2. The rubber pads can effectively reduce shock and prevent slippage, adapting to the installation requirements of various working conditions.

[0028] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0029] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A photoelectric measurement probe array, characterized in that: Includes a fixing plate (1) and a heat-conducting plate (6); The fixing plate (1) has fixing blocks (2) on both the bottom of its left and right sides. The top front and rear ends of the fixing blocks (2) are vertically connected with first mounting holes (3). The rear end of the fixing plate (1) is provided with a busbar. The rear end of the busbar is provided with a welding strip. The rear end of the welding strip is uniformly provided with resistors. The resistors are all equipped with probes (4). The top left and right sides of the fixing plate (1) are provided with heat dissipation grooves (5). The heat dissipation grooves (5) are all provided with heat conduction plates (6). The top of the heat conduction plates (6) is provided with heat sinks (8) from left to right. The bottom of the fixing block (2) is provided with a hinge (9) on the side near the bottom of the fixing plate (1). The top of the fixing block (2) is provided with a side panel (10) on the side away from the fixing plate (1). The inner front and rear end faces of the side panel (10) are provided with a second mounting hole (11) through the side. The bottom of the fixing block (2) is provided with a mounting groove (12) on the side away from the bottom of the fixing plate (1). The mounting groove (12) is provided with a magnet (13).

2. The photoelectric measurement probe array according to claim 1, characterized in that: The thickness of the heat-conducting plate (6) is the same as the thickness of the heat dissipation groove (5), and bolts (7) are provided between the top of the heat-conducting plate (6) and the bottom of the inner cavity of the heat dissipation groove (5).

3. The photoelectric measurement probe array according to claim 1, characterized in that: The bottom front and rear ends of the heat dissipation groove (5) are provided with multiple sets of heat dissipation holes (14) from left to right, and a silicone sealing layer is provided around the bottom of the heat dissipation groove (5).

4. The photoelectric measurement probe array according to claim 1, characterized in that: Anti-collision protection blocks (15) are provided on both the left and right sides of the rear end face of the fixing plate (1), and the anti-collision protection blocks (15) are integrally formed with the fixing plate (1).

5. The photoelectric measurement probe array according to claim 1, characterized in that: The bottoms of the fixing plate (1) and the fixing block (2) are both set on the same horizontal plane, and the thickness of the fixing block (2) is two-thirds of the thickness of the fixing plate (1).

6. The photoelectric measurement probe array according to claim 1, characterized in that: The included angle between the side panel (10) and the fixing block (2) on the same side is set to 90 degrees, and the side panel (10) and the fixing block (2) on the same side are fixedly welded together.

7. The photoelectric measurement probe array according to claim 1, characterized in that: The bottom of the fixing block (2) is provided with pads around its perimeter. The pads are all rubber pads, and the top of each pad is fixedly bonded to the bottom of the fixing block (2).

Citation Information

Patent Citations

  • Photoelectric measurement probe row

    CN218917479U