Thermistor mounting structure, battery management system heat dissipation system and battery pack

Abstract

The application relates to the technical field of batteries, and discloses a thermistor mounting structure, a battery management system heat dissipation system and a battery pack, which comprise a mounting plate, a heat-conducting adhesive layer and a thermistor. The mounting plate is used for mounting a heating component, and the mounting plate is provided with a first through hole. The heat-conducting adhesive layer is arranged on the surface of the mounting plate. The thermistor is arranged in the first through hole, and the first through hole is at least partially provided with heat-conducting adhesive which is connected with the heat-conducting adhesive layer as a whole, and the detection head of the thermistor is embedded in the heat-conducting adhesive, so that the thermistor can detect the temperature of the heat-conducting adhesive in the first through hole. In this way, the heat of the heat-conducting adhesive layer is directly transmitted to the heat-conducting adhesive which is detected by the thermistor, the metal groove body is omitted on the heat transmission path, the heat transmission path is shortened, and the detection accuracy is improved.

Description

Technical Field

[0001] This application relates to the field of battery technology, specifically to a thermistor mounting structure, a battery management system heat dissipation system, and a battery pack. Background Technology

[0002] The Battery Management System (BMS) is an electrical system in a battery pack used to monitor and manage the performance, safety, and lifespan of the battery modules. It generates considerable heat during operation, making heat dissipation crucial within the battery pack. The BMS is typically mounted on a mounting plate inside the housing. To dissipate heat from the BMS, the mounting plate and the inner wall of the housing are connected by a thermally conductive adhesive layer. The housing incorporates liquid cooling channels through which a cooling medium dissipates heat from the housing, which in turn dissipates heat from the mounting plate via the thermally conductive adhesive layer, ultimately cooling the BMS.

[0003] To monitor the temperature of the liquid cooling channel, a thermistor is needed to detect the temperature. However, for easier electrical connection between the thermistor and the battery management system, the temperature of the thermally conductive adhesive layer is often detected using the thermistor instead. For accuracy, the thermistor's sensing head needs to be immersed in the thermally conductive medium. Therefore, during the thermistor installation, a metal tank is often connected to a mounting plate via a connector assembly, ensuring the outer wall of the metal tank adheres to the thermally conductive adhesive layer. The thermistor is then placed inside the metal tank, and the thermally conductive medium is poured into the tank.

[0004] However, the heat from the thermally conductive adhesive layer must first be transferred to the metal tank, and then transferred to the thermistor through the thermally conductive medium inside the metal tank. The heat transfer path is relatively long, resulting in poor detection accuracy.

[0005] Therefore, how to solve or improve the problem of poor detection accuracy caused by the long heat transfer path when thermistors detect the temperature of thermally conductive adhesive layers has become an important technical problem to be solved by those skilled in the art. Utility Model Content

[0006] In view of this, this application provides a thermistor mounting structure, a battery management system heat dissipation system, and a battery pack to solve the problem of poor detection accuracy caused by the long heat transfer path when the thermistor detects the thermally conductive adhesive layer.

[0007] In a first aspect, this application provides a thermistor mounting structure, including: A mounting plate is used to mount the heating element, and the mounting plate has a first through hole; A thermally conductive adhesive layer is disposed on the surface of the mounting plate; A thermistor is disposed in the first through hole, and at least part of the first through hole is provided with thermally conductive adhesive that is integrally connected with the thermally conductive adhesive layer. The detection head of the thermistor is embedded in the thermally conductive adhesive.

[0008] In one alternative implementation, it further includes: A sleeve is fitted around the outer periphery of the thermistor, and the outer wall of the sleeve abuts against the inner wall of the first through hole.

[0009] In one alternative embodiment, the sleeve is interference-fitted with the first through hole.

[0010] In one optional embodiment, the sleeve is provided with an exhaust hole along the extension direction of the first through hole.

[0011] In one alternative embodiment, the edge of the first through hole near the thermally conductive adhesive layer is chamfered.

[0012] In one optional embodiment, the mounting plate is provided with a boss, the boss is provided with a second through hole, the second through hole is coaxially aligned with the first through hole, and the thermistor is sequentially disposed through the second through hole and the first through hole.

[0013] Secondly, this application also provides a heat dissipation structure for a battery management system, including: The housing has a liquid cooling channel inside its shell wall; In any of the above-described thermistor mounting structures, the heating component is a battery management system, the mounting plate is disposed inside the housing, and the thermally conductive adhesive layer is located between the housing wall and the mounting plate.

[0014] In one alternative implementation, it further includes: The cover plate has a flow groove on the outer wall of the housing opposite to the mounting plate, and the cover plate covers the flow groove to form the liquid cooling channel.

[0015] Thirdly, this application also provides a battery pack, including any of the above-described battery management system heat dissipation structures, wherein the liquid cooling channel has a liquid inlet and a liquid outlet, and the battery pack further includes: A liquid inlet is provided on the outer wall of the housing, and the liquid inlet is connected to the liquid inlet point; A liquid outlet is provided on the outer wall of the housing, and the liquid outlet is connected to the liquid outlet.

[0016] In one alternative implementation, it further includes: A partition, connected to the mounting plate, divides the interior of the housing into an electrical cavity and a battery cavity, with the battery management system located in the electrical cavity; The battery pack is disposed within the battery cavity.

[0017] This application provides a thermistor mounting structure. A mounting plate is used to mount a heating element, and the mounting plate has a first through hole. A thermally conductive adhesive layer is applied to the surface of the mounting plate, and the thermistor is disposed within the first through hole. At least a portion of the first through hole contains thermally conductive adhesive integrally bonded to the thermally conductive adhesive layer, and the thermistor's detection head is embedded within the thermally conductive adhesive. This design allows heat from the thermally conductive adhesive layer to be directly transferred to the thermally conductive adhesive for detection by the thermistor. The absence of a metal tray in the heat transfer path shortens the heat transfer path and improves detection accuracy. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the specific embodiments or related technologies of this application, the drawings used in the description of the specific embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the thermistor mounting structure of a heat dissipation structure for a battery management system within a battery pack, according to an embodiment of this application. Figure 2 This is a top view of a thermistor mounting structure of a heat dissipation structure for a battery management system within a battery pack, according to an embodiment of this application. Figure 3 for Figure 2 Sectional view of AA; Figure 4 for Figure 3 Enlarged view at point B in the middle; Figure 5 This is an exploded view of a mounting plate, a thermistor, and a thermally conductive adhesive layer in a thermistor mounting structure according to an embodiment of this application. Figure 6 This is an exploded view of the axial side portion of a battery pack according to an embodiment of this application.

[0020] Explanation of reference numerals in the attached figures: 1. Housing; 11. Flow channel; 2. Mounting plate; 21. First through hole; 211. Chamfer; 22. Boss; 221. Second through hole; 3. Thermally conductive adhesive layer; 4. Thermistor; 41. Detection head; 5. Sleeve; 6. Cover plate; 7. Partition plate; 8. Liquid inlet; 9. Liquid outlet. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] The following is combined with Figures 1 to 6 This describes an embodiment of the present application.

[0023] According to embodiments of this application, in one aspect, a thermistor mounting structure is provided, such as... Figures 1 to 4 As shown, it includes a mounting plate 2, a thermally conductive adhesive layer 3, and a thermistor 4. The mounting plate 2 is used to mount the heating element, and a first through hole 21 is provided on the mounting plate 2. The thermally conductive adhesive layer 3 is disposed on the surface of the mounting plate 2, and the heat generated by the heating element during operation can be transferred sequentially to the mounting plate 2 and the thermally conductive adhesive layer 3.

[0024] The mounting plate 2 has a through hole 21 extending through it. At least a portion of the through hole 21 is filled with thermally conductive adhesive, which is integrally connected to the thermally conductive adhesive layer 3. This allows heat from the thermally conductive adhesive layer 3 to be transferred to the thermally conductive adhesive within the through hole 21. A thermistor 4 is disposed within the through hole 21, and its detection head 41 is embedded in the thermally conductive adhesive. This allows the thermistor 4 to detect the temperature of the thermally conductive adhesive within the through hole 21.

[0025] With this configuration, the heat from the thermally conductive adhesive layer 3 is directly transferred to the thermally conductive adhesive and detected by the thermistor 4. The metal tank is eliminated from the heat transfer path, which shortens the heat transfer path and improves the detection accuracy.

[0026] Moreover, there is no need to set up a metal tank, thus eliminating the need for an additional mounting structure for the metal tank, reducing the installation cost of the thermistor 4, making installation more convenient, and avoiding installation errors when installing the metal tank through the mounting structure.

[0027] The side of the thermally conductive adhesive layer 3 away from the mounting plate 2 can be attached to the cooling component to achieve heat dissipation.

[0028] In one embodiment, such as Figure 3 and Figure 4 As shown, the thermistor mounting structure also includes a sleeve 5, which is sleeved on the outer periphery of the thermistor 4 and is disposed inside the first through hole 21. The outer wall of the sleeve 5 abuts against the inner wall of the first through hole 21.

[0029] Specifically, when the thermistor 4 is placed in the first through hole 21, the sleeve 5 is first inserted into the first through hole 21 so that the outer wall of the sleeve 5 abuts against the inner wall of the first through hole 21. Then, the thermistor 4 is inserted into the first through hole 21 and then into the sleeve 5 so that the outer wall of the thermistor 4 abuts against the inner wall of the sleeve 5. The detection head 41 of the thermistor 4 is embedded in the thermally conductive adhesive in the first through hole 21, thereby installing the thermistor 4 in the first through hole 21 through the sleeve 5.

[0030] With this configuration, the sleeve 5 acts as a buffer between the thermistor 4 and the inner wall of the first through hole 21, reducing the impact on the thermistor 4 and improving its service life.

[0031] Furthermore, the sleeve 5 acts as a heat insulation between the thermistor 4 and the inner wall of the first through hole 21, reducing the direct impact of the mounting plate 2's own temperature on the thermistor 4 and improving the detection accuracy.

[0032] In one embodiment, the sleeve 5 is interference-fitted with the first through hole 21, making the connection between the sleeve 5 and the first through hole 21 more stable, thereby increasing the stability of the thermistor 4 and preventing the thermistor 4 from detaching from the first through hole 21 and causing detection failure.

[0033] In some embodiments, the sleeve 5 and the first through hole 21 can be connected by a tight fit. That is, the outer diameter of the sleeve 5 is larger than the inner diameter of the first through hole 21, which further enhances the connection between the sleeve 5 and the first through hole 21.

[0034] In one embodiment, the sleeve 5 is provided with an exhaust hole along the extension direction of the first through hole 21.

[0035] Thus, when setting the mounting plate 2, the sleeve 5 is first inserted into the first through hole 21, so that the outer wall of the sleeve 5 abuts against the inner wall of the first through hole 21. The thermistor 4 is then inserted into the first through hole 21 and then into the sleeve 5.

[0036] Thermally conductive adhesive is applied to the cooling surface of the cooling component. Then, the mounting plate 2 is attached to the side of the thermally conductive adhesive away from the cooling component, and the mounting plate 2 is pressed onto the cooling component. Since the air in the space between the sleeve 5 and the thermally conductive adhesive in the first through hole 21 can be discharged through the vent hole on the sleeve 5, when the mounting plate 2 is pressed onto the cooling component, part of the thermally conductive adhesive enters the first through hole 21 and covers the detection head 41 of the thermistor 4.

[0037] After the thermally conductive adhesive solidifies, the thermally conductive adhesive between the mounting plate 2 and the cooling component forms a thermally conductive adhesive layer 3. The thermally conductive adhesive inside the first through hole 21 forms a thermally conductive adhesive covering the thermistor 4 detection head 41.

[0038] This configuration utilizes the thermally conductive adhesive layer 3 to form a thermally conductive adhesive coating over the thermistor 4 detection head 41 within the first through-hole 21. This eliminates the need to additionally fill the first through-hole 21 with thermally conductive adhesive, making the setup more convenient.

[0039] Moreover, since the thermally conductive adhesive in the first through hole 21 is formed by the overflow of the thermally conductive adhesive layer 3, the thermally conductive adhesive layer 3 and the thermally conductive adhesive in the first through hole 21 have better integration, less heat loss during heat transfer, and improved detection accuracy.

[0040] In one embodiment, such as Figure 3 and Figure 4 As shown, the first through hole 21 has a chamfer 211 at one end edge near the thermally conductive adhesive layer 3. The presence of the chamfer 211 allows for a larger space within the first through hole 21 to accommodate the thermally conductive adhesive, thereby ensuring that the thermally conductive adhesive completely covers the detection head 41 of the thermistor 4, and preventing poor detection accuracy of the thermistor 4 due to incomplete coverage of the thermistor 4 by the thermally conductive adhesive.

[0041] Furthermore, the presence of the chamfer 211 reduces the difficulty of the thermally conductive adhesive layer 3 overflowing into the first through hole 21. That is, after applying thermally conductive adhesive to the cooling surface of the cooling component, when the mounting plate 2 is attached to the side of the thermally conductive adhesive away from the cooling component and the mounting plate 2 is pressed into the cooling component, the thermally conductive adhesive is more likely to overflow into the first through hole 21. This ensures that enough thermally conductive adhesive enters the first through hole 21 to cover the detection head 41 of the thermistor 4, avoiding poor detection accuracy of the thermistor 4 due to incomplete coverage of the thermistor 4 by the thermally conductive adhesive.

[0042] In one embodiment, such as Figures 1 to 5 As shown, a boss 22 is provided on the mounting plate 2, and a second through hole 221 is provided on the boss 22. The second through hole 221 is coaxially aligned with the first through hole 21, and the thermistor 4 is sequentially inserted through the second through hole 221 and the first through hole 21.

[0043] Specifically, when installing the thermistor 4, the thermistor 4 is first inserted through the second through hole 221 on the boss 22, and then through the first through hole 21. In this way, the existence of the second through hole 221 is equivalent to increasing the length of the first through hole 21, thereby increasing the installation distance of the thermistor 4 and making the installation of the thermistor 4 more stable.

[0044] When a sleeve 5 is provided, during the installation of the thermistor 4, the sleeve 5 is first inserted through the second through hole 221 on the boss 22, and then through the first through hole 21. In this way, the outer wall of the sleeve 5 abuts against the inner wall of the second through hole 221, and partially abuts against the inner wall of the first through hole 21, increasing the installation space of the sleeve 5 and allowing for the installation of longer sleeves 5. This results in a larger connection area between the thermistor 4 and the sleeve 5 after the thermistor 4 is inserted, making the installation of the thermistor 4 more stable.

[0045] In some embodiments, the boss 22 may be welded to the mounting plate 2.

[0046] In other embodiments, a first through hole 21 can be formed by punching one side of the mounting plate 2. At this time, the punched material forms a boss 22 on the side of the mounting plate 2 away from the punched surface, and a second through hole 221 is formed on the boss 22. The second through hole 221 and the first through hole 21 are formed by a single punching, thereby ensuring coaxial alignment.

[0047] According to embodiments of this application, another aspect provides a heat dissipation structure for a battery management system, such as... Figures 1 to 5 As shown, the system includes a housing 1 and any of the thermistor mounting structures. The heat-generating component is a battery management system (BMS). A mounting plate 2 is disposed inside the housing 1, and a thermally conductive adhesive layer 3 is located between the housing wall of the housing 1 and the mounting plate 2. The BMS is mounted on the mounting plate 2. Thus, the heat generated by the BMS can be transferred to the mounting plate 2, and the heat on the mounting plate 2 can be transferred to the housing 1 through the thermally conductive adhesive layer 3. A liquid cooling channel is provided inside the housing wall of the housing 1. The liquid cooling channel is used for the flow of cooling medium, allowing the cooling medium to exchange heat with the housing 1, thereby dissipating heat from the BMS.

[0048] The mounting plate 2 has a through hole 21 extending through it. At least a portion of the through hole 21 is filled with thermally conductive adhesive, which is integrally connected to the thermally conductive adhesive layer 3. This allows heat from the thermally conductive adhesive layer 3 to be transferred to the thermally conductive adhesive within the through hole 21. A thermistor 4 is disposed within the through hole 21, and its detection head 41 is embedded in the thermally conductive adhesive. This allows the thermistor 4 to detect the temperature of the thermally conductive adhesive within the through hole 21.

[0049] With this setup, when detecting the temperature of the thermally conductive adhesive layer 3 to monitor the temperature of the liquid cooling channel, the heat from the thermally conductive adhesive layer 3 is directly transferred to the thermally conductive adhesive and detected by the thermistor 4. The metal tank is eliminated from the heat transfer path, shortening the heat transfer path and improving the detection accuracy.

[0050] Moreover, there is no need to set up a metal tank, thus eliminating the need for an additional mounting structure for the metal tank, reducing the installation cost of the thermistor 4, making installation more convenient, and avoiding installation errors when installing the metal tank through the mounting structure.

[0051] In one embodiment, such as Figure 6 As shown, the heat dissipation structure of the battery management system also includes a cover plate 6. A flow groove 11 is provided on the outer wall of the housing 1 opposite to the mounting plate 2. The cover plate 6 covers the flow groove 11 to form a liquid cooling channel.

[0052] Specifically, a flow channel 11 for the flow of cooling medium is opened on the outer wall surface of the housing 1 opposite to the mounting plate 2. A cover plate 6 is placed on the outer wall surface of the housing 1 opposite to the mounting plate 2. At this time, the cover plate 6 seals the flow channel 11, thereby forming a liquid cooling channel, which is convenient for disassembly and maintenance.

[0053] In some embodiments, multiple heat dissipation teeth can be provided on the inner wall of the flow channel 11. The presence of heat dissipation teeth increases the contact area between the inner wall of the flow channel 11 and the cooling medium, thereby improving the heat exchange efficiency between the cooling medium and the shell 1.

[0054] According to an embodiment of this application, in another aspect, a battery heat dissipation structure is also provided, including a housing 1 and any of the above-mentioned thermistor mounting structures. The heat-generating component is a battery. A mounting plate 2 is disposed inside the housing 1, and a thermally conductive adhesive layer 3 is located between the housing wall of the housing 1 and the mounting plate 2. The battery is mounted on the mounting plate 2. Thus, the heat generated by the battery management system can be transferred to the mounting plate 2, and the heat on the mounting plate 2 can be transferred to the housing 1 through the thermally conductive adhesive layer 3. A liquid cooling channel is provided inside the housing wall of the housing 1. The liquid cooling channel is used for the flow of a cooling medium, so that the cooling medium can exchange heat with the housing 1 to achieve heat dissipation for the battery.

[0055] With this setup, when detecting the temperature of the thermally conductive adhesive layer 3 to monitor the temperature of the liquid cooling channel, the heat from the thermally conductive adhesive layer 3 is directly transferred to the thermally conductive adhesive and detected by the thermistor 4. The metal tank is eliminated from the heat transfer path, shortening the heat transfer path and improving the detection accuracy.

[0056] According to an embodiment of this application, in another aspect, a battery pack is also provided, including any of the above-described battery management system heat dissipation structures. The battery management system is mounted on a mounting plate 2, so that the heat generated by the battery management system can be transferred to the mounting plate 2. The heat on the mounting plate 2 can be transferred to the housing 1 through the thermally conductive adhesive layer 3. A liquid cooling channel is provided inside the housing 1, and the liquid cooling channel is used to circulate a cooling medium, so that the cooling medium can exchange heat with the housing 1 to achieve heat dissipation of the battery management system.

[0057] The technical benefits of this battery pack are consistent with the heat dissipation structure of the battery management system, so they will not be described in detail here.

[0058] In one embodiment, the liquid cooling channel has an inlet and an outlet, and the cooling medium enters from the inlet and flows through the liquid cooling channel to the outlet.

[0059] The battery pack also includes a liquid inlet 8 and a liquid outlet 9. The liquid inlet 8 is located on the outer wall of the housing 1 and communicates with the liquid inlet, while the liquid outlet 9 is located on the outer wall of the housing 1 and communicates with the liquid outlet. Thus, the liquid inlet pipe can be connected to the liquid inlet 8, and the liquid outlet pipe can be connected to the liquid outlet 9. Cooling medium is introduced into the liquid inlet 8 through the liquid inlet, and the cooling medium flows through the liquid cooling channel, exchanging heat with the housing 1 as it flows through the liquid cooling channel. It then flows out through the liquid outlet 9 and back to the liquid outlet pipe.

[0060] This setup makes connecting the inlet and outlet pipes much more convenient.

[0061] In some embodiments, a first connecting channel and a second connecting channel are provided in the side wall of the housing 1, the liquid inlet 8 is connected to the liquid inlet through the first connecting channel, and the liquid outlet 9 is connected to the liquid outlet through the second connecting channel.

[0062] In one embodiment, the battery pack further includes a separator 7 and a battery pack.

[0063] The housing 1 has a receiving cavity, the mounting plate 2 is disposed in the receiving cavity, the partition 7 is connected to the mounting plate 2, and the partition 7 divides the housing 1 into an electrical cavity and a battery cavity. The battery management system is located in the electrical cavity; the battery pack is located in the battery cavity.

[0064] With this configuration, the separator 7 separates the battery management system from the battery pack, reducing the impact of heat generated by the battery pack during operation on the battery management system.

[0065] Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and such modifications and variations all fall within the scope defined by this application.

Claims

1. A thermistor mounting structure, characterized in that, include: Mounting plate (2) is used to mount heating components, and the mounting plate (2) has a first through hole (21). A thermally conductive adhesive layer (3) is disposed on the surface of the mounting plate (2); A thermistor (4) is disposed in the first through hole (21). At least part of the first through hole (21) is provided with thermally conductive adhesive that is integrally connected with the thermally conductive adhesive layer (3). The detection head (41) of the thermistor (4) is embedded in the thermally conductive adhesive.

2. The thermistor mounting structure according to claim 1, characterized in that, Also includes: A sleeve (5) is fitted around the outer periphery of the thermistor (4), and the outer wall of the sleeve (5) abuts against the inner wall of the first through hole (21).

3. The thermistor mounting structure according to claim 2, characterized in that, The sleeve (5) is interference-fitted with the first through hole (21).

4. The thermistor mounting structure according to claim 2, characterized in that, The sleeve (5) is provided with an exhaust hole along the extension direction of the first through hole (21).

5. The thermistor mounting structure according to claim 4, characterized in that, The first through hole (21) has a chamfer (211) at one end edge near the thermally conductive adhesive layer (3).

6. The thermistor mounting structure according to claim 1, characterized in that, The mounting plate (2) is provided with a boss (22), and the boss (22) is provided with a second through hole (221). The second through hole (221) is coaxially aligned with the first through hole (21). The thermistor (4) is sequentially inserted through the second through hole (221) and the first through hole (21).

7. A heat dissipation structure for a battery management system, characterized in that, include: The housing (1) has a liquid cooling channel inside its shell wall; The thermistor mounting structure according to any one of claims 1-6, wherein the heating component is a battery management system, the mounting plate (2) is disposed inside the housing (1), and the thermally conductive adhesive layer (3) is located between the shell wall of the housing (1) and the mounting plate (2).

8. The heat dissipation structure of the battery management system according to claim 7, characterized in that, Also includes: The cover plate (6) has a flow groove (11) on the outer wall opposite to the mounting plate (2), and the cover plate (6) covers the flow groove (11) to form the liquid cooling channel.

9. A battery pack, characterized in that, The battery management system heat dissipation structure includes the liquid cooling channel as described in any one of claims 7-8, wherein the liquid cooling channel has a liquid inlet and a liquid outlet, and the battery pack further includes: A liquid inlet (8) is provided on the outer wall of the housing (1), and the liquid inlet (8) is connected to the liquid inlet. The liquid outlet (9) is located on the outer wall of the housing (1) and is connected to the liquid outlet.

10. The battery pack according to claim 9, characterized in that, Also includes: A partition (7) is connected to the mounting plate (2), the partition (7) dividing the interior of the housing (1) into an electrical cavity and a battery cavity, the battery management system being located in the electrical cavity; The battery pack is disposed within the battery cavity.

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