A type of I-based 2 Small-sized insulating gas pressure and temperature sensor for C-bus

Abstract

The utility model belongs to pressure temperature sensor technical field discloses a kind of based on I 2 Small volume insulating gas pressure temperature sensor of C bus, including pressure chip, sensor signal conditioning chip, pressure sensitive element base, koval tube leg, digital temperature chip and PCB board, koval tube leg is fixedly connected with pressure sensitive element base, PCB board and the bottom soldering tin fixed connection of koval tube leg, PCB board is located at the bottom of pressure sensitive element base, pressure chip is set to one side of PCB board, sensor signal conditioning chip is set to one side of PCB board, sensor signal conditioning chip is electrically connected with pressure chip, digital temperature chip 8 is set to the other side of PCB board 9, sensor signal conditioning chip and digital temperature chip are all connected by I 2 C bus communication, I 2 C bus exports data to outside through koval tube leg;The utility model can significantly improve the integration of sensor, compatibility and reliability.

Description

Technical Field

[0001] This utility model relates to the field of pressure and temperature sensor technology, specifically to a sensor based on I... 2 A small-volume insulating gas pressure and temperature sensor using a C-bus. Background Technology

[0002] Insulating gases are widely used in modern manufacturing and power industries. For example, nitrogen (N2) is a protective gas widely used in the semiconductor industry, and sulfur hexafluoride (SF6) is a synthesis gas widely used in the power industry. To ensure that these gases play an effective role in specific scenarios, their status needs to be monitored in all aspects through sensors such as pressure and temperature to achieve scientific management.

[0003] To address the need for precise measurement in such industrial conditions, traditional technical approaches generally employ discrete measurement solutions—that is, by deploying separate pressure and temperature sensors to achieve real-time monitoring of the corresponding physical quantities.

[0004] However, with the rapid iteration and large-scale application of Industrial Internet of Things (IIoT) technology, the inherent defects of discrete solutions are becoming increasingly apparent: On the one hand, the dispersed installation of independent sensors leads to a bulky overall equipment size, and the complex wiring design not only occupies more on-site space but also directly increases the cost of installation, construction, and subsequent maintenance; on the other hand, the inconsistent power supply interface specifications and different output signal protocols of each sensor significantly increase the difficulty of backend system integration. This not only requires additional resources for signal conversion and integration but also fundamentally restricts the flexibility and scalability of multi-sensor parallel networking, making it difficult to meet the core requirements of IIoT for device interconnection and data interoperability.

[0005] Therefore, there is an urgent need for a new technology that can solve the problems of bulky overall size, inconsistent power supply interface specifications, and differences in output signal protocols. Utility Model Content

[0006] The purpose of this utility model is to provide a method based on I 2 This invention presents a small-volume insulating gas pressure and temperature sensor using the C-bus. It solves the problems of bulky size, inconsistent power supply interfaces, and large differences in output signal protocols caused by analog interfaces and various protocols in traditional sensors. It can significantly improve the integration, compatibility, and reliability of the sensor.

[0007] To achieve the above objectives, the technical solution adopted by this utility model is as follows: This utility model provides a method based on I 2 Small-volume insulating gas pressure and temperature sensors using the C-bus include: Pressure-sensitive element base; The Kova tube leg is fixedly connected to the pressure-sensitive element base via a glass sintering process. The PCB board is fixedly connected to the bottom of the Kova tube leg with solder, and the PCB board is located at the bottom of the pressure-sensitive element base; The pressure chip is mounted on one side of the PCB board using a flip-chip bonding process and is used to collect pressure signals. A sensor signal conditioning chip is disposed on one side of the PCB board, and the sensor signal conditioning chip is electrically connected to the pressure chip; A digital temperature chip is located on the other side of the PCB board and is used to collect temperature signals. The sensor signal conditioning chip and the digital temperature chip are both connected via an I2C bus, and the I2C bus outputs data to the outside through the Kovar pin.

[0008] According to one embodiment of the present invention, a pressure chip protective cover is installed on one side of the PCB board, and the pressure chip is installed inside the pressure chip protective cover.

[0009] According to one embodiment of the present invention, the pressure chip is installed inside the pressure chip protective cover by a gelatin adhesive.

[0010] According to one embodiment of the present invention, the pressure chip is located at the bottom of the digital temperature chip.

[0011] According to one embodiment of the present invention, the pressure-sensitive element base includes a first base body, a back pressure cavity is provided at the top of the first base body, a second base body is installed at the bottom of the first base body, and the end of the second base body away from the first base body is a pressure measuring end. The Kova tube leg passes through the back pressure chamber and the pressure measuring end. The Kova tube leg is fixedly installed in the back pressure chamber. The PCB board is soldered to the end of the Kova tube leg near the pressure measuring end.

[0012] According to one embodiment of the present invention, the back pressure cavity is filled with potting compound.

[0013] According to one embodiment of the present invention, the first base body is an SW20 hexagonal.

[0014] According to one embodiment of the present invention, the second base body is provided with threads.

[0015] According to one embodiment of the present invention, the pressure chip is a piezoresistive pressure sensor chip.

[0016] According to one embodiment of the present invention, the pressure-sensitive element base is made of stainless steel.

[0017] The above technical solution has the following advantages or beneficial effects: This utility model provides a method based on I 2 The small-volume insulated gas pressure and temperature sensor using the I2C bus integrates the pressure chip, signal conditioning chip, and digital temperature chip onto a single PCB board. Utilizing Kova pins and a glass sintering process, it achieves a compact and reliable packaging structure, significantly reducing the overall sensor size and avoiding bulkiness. Furthermore, by adopting a unified I2C digital bus for external communication and outputting standardized digital signals, it completely solves the problems of bulkiness, inconsistent power supply interfaces, and significant differences in output signal protocols caused by analog interfaces and diverse protocols in traditional sensors. This significantly improves the sensor's integration, compatibility, and reliability.

[0018] In some embodiments, by setting a pressure chip protective cover on one side of the PCB board and encapsulating the pressure chip inside it, this structure provides robust mechanical protection for the fragile pressure sensing element, effectively resisting physical damage that may be caused by external collisions, dust contamination, and installation stress. While ensuring that the overall sensor remains compact and small, it significantly improves the environmental adaptability and long-term operational reliability of the core pressure-sensitive unit, making it particularly suitable for application scenarios such as insulating gas monitoring where complex working conditions may exist, thereby ensuring the accuracy and stability of pressure signal acquisition.

[0019] In some embodiments, using jelly adhesive to mount and fix the pressure chip can effectively absorb mechanical vibration and impact stress from the outside world, providing excellent buffer protection for the chip. This flexible encapsulation method can also compensate for the difference in thermal expansion coefficients between different materials, reduce thermal stress caused by temperature changes, thereby significantly improving the long-term stability and reliability of pressure measurement, and further enhancing the durability of the sensor in harsh environments.

[0020] In some embodiments, by placing the pressure chip at the bottom of the digital temperature chip, a compact three-dimensional stacked structure is formed, which maximizes the use of PCB board space and is the key to achieving small size of the sensor. This integration method reduces the planar wiring area, optimizes the internal thermal field distribution, and is conducive to the miniaturization and stability of the overall structure.

[0021] In some embodiments, by dividing the pressure-sensitive element base into a first base body with a back pressure cavity and a second base body serving as the pressure measuring end, and fixing a through-hole Kova tube leg in the back pressure cavity, mechanical decoupling and reliable isolation between the pressure sensing unit and the external electrical connection are achieved. The back pressure cavity provides a stable reference pressure environment for the pressure chip, while the Kova tube leg is directly soldered to the PCB board, which not only ensures a strong electrical connection and the shortest signal transmission path, but also greatly enhances the integrity of the internal structure of the sensor and its resistance to vibration and shock through its rigid support, thereby improving the long-term measurement accuracy and stability of the sensor under complex working conditions.

[0022] In some embodiments, potting a special potting compound into the back pressure chamber can effectively fix the internal components and fill the gaps, enhancing the overall mechanical strength and vibration resistance. At the same time, the potting compound can prevent moisture, dust and other contaminants from entering the sensitive chamber, providing a stable reference pressure environment for the pressure chip and significantly improving the long-term environmental adaptability and measurement reliability of the sensor.

[0023] In some embodiments, the first base body is designed as an SW20 hexagonal structure, which provides a convenient force-bearing surface for standard tool installation, greatly facilitating the on-site installation, disassembly and maintenance of the sensor; the standardized mechanical interface enhances the product's versatility and interchangeability, while its compact hexagonal shape maintains the miniaturization of the overall sensor structure while ensuring a secure installation.

[0024] In some embodiments, threads are provided on the second base body, allowing it to be directly screwed into the standard interface of the gas pipeline or device being measured, achieving a quick, secure, and sealed installation connection; the integrated threaded design eliminates the need for additional installation accessories, simplifies the assembly process, further reduces the overall installation space of the sensor, and improves its ease of integration and reliability in compact devices.

[0025] In some embodiments, a piezoresistive pressure sensor chip is used as the sensing core. This chip has advantages such as high sensitivity, good linearity, and fast response. Its compact structure and low power consumption make it ideal for miniaturized integrated design, and it can be integrated with backend signal conditioning chips and I / O... 2 The C-bus digital interface works efficiently to ensure that the sensor achieves high-precision and high-stability pressure measurement within a compact size.

[0026] In some embodiments, the pressure-sensitive element base is made of stainless steel, which gives the sensor excellent mechanical strength, corrosion resistance and long-term stability. Stainless steel can reliably withstand insulating gas environments and external pressure, ensuring the safety of internal precision electronic components. Its good processing performance is also conducive to the precision manufacturing of complex cavity structures of the base, thereby ensuring the overall reliability and long life of the sensor. Attached Figure Description

[0027] Figure 1 According to some embodiments of this specification, an I-based 2 A schematic diagram of one side of a small-volume insulating gas pressure and temperature sensor using a C-bus; Figure 2 According to some embodiments of this specification, an I-based 2 A schematic diagram of the other side of the small-volume insulating gas pressure and temperature sensor with C-bus; Figure 3 This is a front layout diagram of a PCB board according to some embodiments of this specification; Figure 4 This is a reverse layout diagram of a PCB board according to some embodiments of this specification; Figure 5 The circuit topology shown is based on some embodiments of this specification; In all the accompanying drawings, the same reference numerals denote the same technical features, specifically: 1. Pressure chip; 2. Pressure chip protective cover; 3. Sensor signal conditioning chip; 4. Pressure sensitive element base; 5. Encapsulating adhesive; 6. Kova tube leads; 7. Jelly adhesive; 8. Digital temperature chip; 9. PCB board; 91. Pre-reserved bonding position for pressure chip protective cover; 92. Pre-reserved soldering position for pressure sensor chip; 93. Pre-reserved soldering position for temperature sensor chip; 94. SMT traceability code silkscreen area. Detailed Implementation

[0028] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0029] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0031] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] Example: The purpose of this invention is to provide a small-volume insulating gas pressure and temperature sensor based on the I2C bus, which enables real-time monitoring of insulating gas pressure and temperature. This invention solves the problems of bulky size, inconsistent power supply interfaces, and large differences in output signal protocols caused by analog interfaces and various protocols in traditional sensors, and can significantly improve the integration, compatibility, and reliability of the sensor.

[0035] Figure 1 According to some embodiments of this specification, an I-based 2A schematic diagram of one side of a small-volume insulating gas pressure and temperature sensor using a C-bus. Figure 2 According to some embodiments of this specification, an I-based 2 A schematic diagram of the other side of the small-volume insulating gas pressure and temperature sensor based on the C-bus, which is described below. 2 The small-volume insulating gas pressure and temperature sensor of the C-bus includes a pressure chip 1, a sensor signal conditioning chip 3, a pressure-sensitive element base 4, a Kovar pin 6, a digital temperature chip 8, and a PCB board 9. The Kova tube 6 is fixedly connected to the pressure-sensitive element base 4 via a glass sintering process. The PCB board 9 is fixedly connected to the bottom of the Kova tube 6 via solder. The PCB board 9 is located at the bottom of the pressure-sensitive element base 4. The pressure chip 1 is disposed on one side of the PCB board 9 via a flip-chip bonding process for collecting pressure signals. The sensor signal conditioning chip 3 is disposed on one side of the PCB board 9 and is electrically connected to the pressure chip 1 for conditioning and analog-to-digital conversion of the pressure signal collected by the pressure chip 1. The digital temperature chip 8 is disposed on the other side of the PCB board 9 for collecting temperature signals. Both the sensor signal conditioning chip 3 and the digital temperature chip 8 are connected via I / O. 2 C-bus communication connection, the I 2 The C bus is communicatively connected to the Kovar pin 6, and the I... 2 The C bus outputs data externally through the Kovar pin 6.

[0036] In some embodiments, a pressure chip protective cover 2 is installed on one side of the PCB board 9, and the pressure chip 1 is installed inside the pressure chip protective cover 2.

[0037] In some embodiments, the pressure chip 1 is mounted inside the pressure chip protective cover 2 using a gel 7.

[0038] In some embodiments, the pressure chip 1 is located at the bottom of the digital temperature chip 8.

[0039] In some embodiments, the pressure-sensitive element base 4 includes a first base body, a back pressure chamber is provided at the top of the first base body, a second base body is installed at the bottom of the first base body, and the end of the second base body away from the first base body is a pressure measuring end; The Kova tube 6 is disposed through the back pressure cavity and the pressure measuring end. The Kova tube 6 is fixedly installed in the back pressure cavity. The PCB board 9 is soldered to the end of the Kova tube 6 near the pressure measuring end.

[0040] In some embodiments, the back pressure cavity is filled with potting compound 5.

[0041] In some embodiments, the first base body is an SW20 hexagonal.

[0042] In some embodiments, the second base body is provided with a thread, which is an M13×1 thread.

[0043] In some embodiments, the spacing of the Kova legs 6 is controlled so that one end of the Kova legs 6 can be soldered and fixed to the PCB board 9, and the other end of the Kova legs 6 is soldered and fixed to the wire. The soldering position is filled with two-component epoxy resin to ensure the reliability of the sensor during long-term use.

[0044] In some embodiments, the pressure chip 1 is a piezoresistive pressure sensor chip; the digital temperature chip 8 is a digital temperature sensor chip.

[0045] In some embodiments, Figure 3 This is a front layout diagram of a PCB board according to some embodiments of this specification. Figure 4 According to the PCB layout diagram shown in some embodiments of this specification, the PCB board 9 (circuit board) is designed with the piezoresistive pressure sensor chip and the digital temperature chip 8 arranged opposite each other at the front end of the pressure sensing end, greatly reducing measurement deviations caused by inconsistent acquisition positions of temperature and pressure signals. The pressure measurement scheme uses a piezoresistive pressure sensor chip with flip-chip bonding, which is soldered and fixed to the PCB board 9 (front side). The pressure-sensing diaphragm of the flip-chip bonded piezoresistive pressure sensor chip is exposed, and after long-term operation, it may be affected by impurities in the measurement medium and corrosion, leading to performance degradation. A pressure chip protective cover 2 (protective cap) is bonded around the pressure chip 1, with a reserved bonding position 91. The gap between the pressure chip 1 and the pressure chip protective cover 2 is filled with silicone gel to achieve physical isolation and media protection; specifically, gel adhesive 7 is used for filling and protection. The temperature measurement scheme uses a high-precision digital temperature sensor chip that has been pre-calibrated, which is soldered and fixed to the reserved soldering position 93 (located on the back side of the PCB board 9). This is achieved through I... 2 The C bus protocol directly outputs temperature data; the reverse side of the PCB board also has an SMT traceability code silkscreen area 94.

[0046] In some embodiments, the overall size of the PCB board 9 is 8×16 mm. The pressure chip 1 and the digital temperature chip 8 are both located at the front end of the PCB board 9 to ensure that the measurement positions are basically consistent during the measurement of the pressure and temperature of the insulating gas. The pressure chip 1 and the sensor signal conditioning chip 3 are arranged close to each other on the same side of the PCB board 9 to reduce the possibility of interference with sensitive signals.

[0047] The structure and working principle of this utility model will be further explained below: The purpose of this utility model is to provide a method based on I 2 A small-volume insulated gas pressure and temperature sensor using the C-bus; when using this device... Figure 5 Based on the circuit topology diagrams shown in some embodiments of this specification, and according to the characteristics of piezoresistive pressure sensor chips with different ranges / series, a constant current or constant voltage power supply method is selected. Both the constant current and constant voltage sources are derived from the on-chip design of the sensor signal conditioning chip 3. The constant current source can be adjusted via programming. The weak electrical signal measured and converted by the piezoresistive pressure sensor chip is filtered to remove noise by a filtering circuit before being connected to the internal operational amplifier module and AD conversion module of the sensor signal conditioning chip 3. The sensor signal conditioning chip 3 normalizes the signal according to the algorithm and temperature compensation coefficient, and then... 2 C communication pin output; the digital temperature sensor 8 has been pre-calibrated and can be directly connected via I... 2 The C communication pin outputs temperature data; the entire system is based on I... 2 The small-sized insulated gas pressure and temperature sensor using the C-bus is powered by an external power supply. This solution supports a wide power supply range and can operate normally under both 3.3V and 5V typical digital circuit power supply conditions; via I... 2 By sending different communication addresses and reading protocols using the C protocol, the required pressure and temperature data can be read.

[0048] During the manufacturing of this device, the pressure chip 1 is first fixed to the substrate using a flip-chip bonding process, and then reflow soldered onto the pressure sensor chip's reserved soldering position 92 on the PCB board 9. The pressure chip protective cover 2 is then securely bonded to the pressure chip protective cover's reserved adhesive position 91. Jelly adhesive 7 is filled between the pressure chip 1 and the pressure chip protective cover 2 to protect the pressure-sensing diaphragm of the pressure chip 1 from contamination. In use, the weak pressure signal collected by the pressure chip 1 is transmitted to the sensor signal conditioning chip 3 for filtering, amplification, AD conversion, and algorithm processing, and then transmitted via I... 2 The C communication protocol is mounted on the bus, and the temperature signal collected by the digital temperature chip 8 is also transmitted via I... 2 The C-communication protocol is mounted on the bus. The Kova leg 6 and the pressure sensor base 4 are fused together using a glass sintering process. Encapsulating compound 5 smooths the back pressure cavity (near the hexagonal end) of the pressure sensor base 4. The sensor base soldering end of the PCB board 9 is fixed to the pressure measuring end (near the threaded end) of the pressure sensor base 4, specifically the Kova leg 6, using solder. Finally, the temperature and pressure signals are transmitted via I... 2 The C bus protocol is used, and the output is completed by the 6th pin of the Kova tube.

[0049] The sensor signal conditioning chip 3 and its peripheral circuits sequentially perform the following processes: First, they acquire the output of the piezoresistive pressure sensor chip at multiple temperature and pressure points. Then, they filter, amplify, and perform analog-to-digital conversion on the signal. Next, the built-in algorithm of the sensor signal conditioning chip 3 performs second-order temperature drift compensation and third-order nonlinear calibration on the acquired raw data. This suppresses the temperature drift of the piezoresistive pressure sensor chip and improves nonlinearity. Simultaneously, the compensated and calibrated pressure signal is normalized. Finally, the processed signal is transmitted through I... 2 Output is performed using the C bus protocol.

[0050] It should be noted that the filtering, amplification, AD conversion, and algorithm processing of the sensor signal conditioning chip 3 described in this embodiment are all existing technologies. That is, conventional sensor signal conditioning chips 3 can achieve filtering, amplification, AD conversion, and algorithm processing. What this utility model aims to protect is the technology based on I... 2 Structure of a small-volume insulating gas pressure and temperature sensor using a C-bus.

[0051] This utility model provides a method for measuring the pressure and temperature of insulating gases in modern manufacturing and power industries, based on I... 2 This compact, insulated gas pressure and temperature sensor using the IIC bus, compared to traditional measurement solutions, employs a flip-chip bonding process to integrate a piezoresistive pressure sensor chip and a digital temperature chip, along with an on-chip signal conditioning system, significantly reducing the sensor's size. Through the IIC bus protocol, the power supply requirements and output signals of the pressure and temperature sensors are integrated, resulting in clear wiring and simple, efficient system integration. This solution integrates a high-precision pressure sensor and a temperature sensor using a single structural design, reducing the cost to less than half that of a separate solution. 2 The C-bus protocol outputs pressure and temperature measurement signals, greatly reducing the complexity of signals in application scenarios, facilitating system integration, and supporting multi-sensor networking applications, thus contributing to the refined and digital development of related industries.

[0052] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0053] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that can be understood by those skilled in the art. The above content is only for illustrating the technical concept of this utility model and should not be used to limit the scope of protection of this utility model. Any modifications made to the technical solutions based on the technical concept proposed by this utility model shall fall within the scope of protection of the claims of this utility model.

Claims

1. A method based on I 2 A small-volume insulating gas pressure and temperature sensor using a C-bus, characterized in that... include: Pressure-sensitive element base (4); The Kova tube leg (6) is fixedly connected to the pressure-sensitive element base (4) by glass sintering process; The PCB board (9) is fixedly connected to the bottom of the Kova tube leg (6) by solder, and the PCB board (9) is located at the bottom of the pressure-sensitive element base (4); The pressure chip (1) is set on one side of the PCB board (9) by flip-chip bonding process and is used to collect pressure signals; A sensor signal conditioning chip (3) is disposed on one side of the PCB board (9), and the sensor signal conditioning chip (3) is electrically connected to the pressure chip (1). A digital temperature chip (8) is disposed on the other side of the PCB board (9) for collecting temperature signals; The sensor signal conditioning chip (3) and the digital temperature chip (8) are both connected via I... 2 C-bus communication connection, the I 2 The C bus outputs data to the outside through the Kovar pin (6).

2. A method based on I according to claim 1 2 A small-volume insulating gas pressure and temperature sensor using a C-bus, characterized in that... A pressure chip protective cover (2) is installed on one side of the PCB board (9), and the pressure chip (1) is installed inside the pressure chip protective cover (2).

3. A method based on I according to claim 2 2 A small-volume insulating gas pressure and temperature sensor using a C-bus, characterized in that... The pressure chip (1) is installed inside the pressure chip protective cover (2) by a gel (7).

4. A method based on I according to claim 1 2 A small-volume insulating gas pressure and temperature sensor using a C-bus, characterized in that... The pressure chip (1) is located at the bottom of the digital temperature chip (8).

5. A method based on I according to claim 1 2 A small-volume insulating gas pressure and temperature sensor using a C-bus, characterized in that... The pressure-sensitive element base (4) includes a first base body, a back pressure cavity is provided at the top of the first base body, a second base body is installed at the bottom of the first base body, and the end of the second base body away from the first base body is the pressure measuring end; The Kova tube (6) is disposed through the back pressure cavity and the pressure measuring end. The Kova tube (6) is fixedly installed in the back pressure cavity. The PCB board (9) is soldered to the end of the Kova tube (6) near the pressure measuring end.

6. A method based on I according to claim 5 2 A small-volume insulating gas pressure and temperature sensor using a C-bus, characterized in that... The back pressure cavity is filled with potting compound (5).

7. A method based on I according to claim 5 2 A small-volume insulating gas pressure and temperature sensor using a C-bus, characterized in that... The first base body is an SW20 hexagonal.

8. A method based on I according to claim 5 2 A small-volume insulating gas pressure and temperature sensor using a C-bus, characterized in that... The second base body is provided with threads.

9. A method based on I according to claim 1 2 A small-volume insulating gas pressure and temperature sensor using a C-bus, characterized in that... The pressure chip (1) is a piezoresistive pressure sensor chip.

10. A method based on I according to claim 1 2 A small-volume insulating gas pressure and temperature sensor using a C-bus, characterized in that... The pressure-sensitive element base (4) is made of stainless steel.

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