A weighing mechanism and a wafer coating detection device comprising the same

Abstract

The utility model relates to wafer detection technical field especially, is related to a kind of weighing mechanism and the wafer gluing detection device containing the mechanism, including fixed frame and the cover plate fixedly installed at the top of fixed frame, further include: bottom plate, activity setting in fixed frame inside;Positioning spring, fixedly installed at bottom plate both ends, away from bottom plate one end and cover plate bottom fixed connection;Weighing instrument, installation in bottom plate middle part;Tray, fixedly installed at the top of weighing instrument;Fixed frame, axial symmetry is installed in fixed frame inside both ends, vertical groove is set in it;Buffering component, set in vertical groove bottom, avoid bottom plate excessive drop. The utility model is through setting positioning spring and plays the shock attenuation effect, let vibration amplitude tend to be stable in short time, quickly obtain more accurate weighing data;In addition, the descending speed of bottom plate and wafer can also be slowed down by buffering component, avoid speed too fast and lower component collision, cause damage.

Description

Technical Field

[0001] This utility model relates to the field of wafer inspection technology, and in particular to a weighing mechanism and a wafer coating inspection device containing the mechanism. Background Technology

[0002] A wafer is a circular thin film made of high-purity single-crystal silicon (or other semiconductor materials, such as gallium arsenide). It is the basic carrier for manufacturing chips (integrated circuits). In the chip manufacturing process, wafer coating (also known as "coating process") is a pre-process step of photolithography. The core is to uniformly coat a layer of photoresist (or functional adhesives such as adhesives) on the surface of the wafer. Weighing the wafer before and after coating is a direct way to calculate the actual weight of the adhesive coated on the wafer by the weight difference. The ultimate goal is to accurately control the thickness and uniformity of the adhesive film.

[0003] Weighing instruments (such as electronic balances) are typically used to weigh the coated wafers. Wafers weighed using weighing instruments of the same precision usually have similar weights. However, if the weight of the wafers differs too much, or if the weighing plate moves excessively downward due to manual pressure and there is a lack of corresponding limiting devices, it can lead to equipment damage (such as damage to critical components like weighing sensors, springs, and wafer carriers), wafer scrap (due to impact or breakage), and even a chain reaction of production line failures. Utility Model Content

[0004] Therefore, it is necessary to provide a weighing mechanism and a wafer coating inspection device containing the above-mentioned mechanism to effectively avoid damage caused by excessive descent of the weighing plate due to external factors or excessive differences in wafer weight.

[0005] The present invention provides a weighing mechanism, comprising a fixed frame and a cover plate fixedly installed on the top of the fixed frame, and further comprising: The base plate is movably set inside the fixed frame; A positioning spring is fixedly installed at both ends of the base plate, with the end furthest from the base plate being fixedly connected to the bottom of the cover plate. A weighing instrument is installed in the middle of the base plate; A carrier plate is fixedly installed on top of the weighing instrument; The fixing bracket is axially symmetrically installed at both ends inside the fixing frame, and vertical grooves are opened inside it; A buffer assembly is located at the bottom of the vertical groove to prevent the base plate from descending excessively.

[0006] In one embodiment, the buffer assembly includes a buffer spring, one end of which is fixedly connected to the inner wall of the bottom of the vertical groove, and the other end of which is fixedly mounted with a buffer plate. Movable blocks are axially symmetrically fixedly mounted at both ends of the base plate. The movable blocks are slidably connected to the vertical groove and movably abut against the buffer plate.

[0007] In one embodiment, a movable frame is fixedly provided at the bottom of the movable block, and a positioning frame is fixedly installed at the top of the buffer plate, with the movable frame and the positioning frame being slidably connected.

[0008] In one embodiment, a movable plate is fixedly provided on one side of the buffer plate. The end of the movable plate away from the buffer plate passes through one side of the fixed frame and slides up and down along the fixed frame. A slot is provided on the inner wall of the fixed frame, and the end of the movable plate is slidably connected to the slot.

[0009] In one embodiment, a limiting hole is provided on the outer side of the fixed frame, the limiting hole is connected to the slot, and a limiting ball is provided on one side of the movable plate, the limiting ball being movably engaged with the limiting hole.

[0010] In one embodiment, a ring is fixedly disposed inside the limiting hole, and a push rod is movably disposed through the center of the ring. One end of the push rod movably abuts against the limiting ball, and the push rod and the ring are fixedly connected by a snap-fit ​​spring.

[0011] In one embodiment, a locking block is slidably disposed laterally at the lower position inside the movable frame. One end of the locking block is fixedly connected to the inner wall of the movable frame by a return spring. A slot is opened at the lower position of the positioning frame, and the locking block is movably engaged with the slot.

[0012] In one embodiment, a vertical rod is fixedly provided at the bottom of the vertical groove. The vertical rod is located inside the buffer spring. An inclined groove is opened inside the card block. The top of the vertical rod movably passes through the bottom of the buffer plate and the positioning frame, and the end of the vertical rod movably abuts against the inclined groove.

[0013] In one embodiment, a fixing cylinder is fixedly installed at both ends of the cover plate. The fixing cylinder is located inside the positioning spring. A movable rod is movably arranged inside the fixing cylinder. The end of the movable rod away from the fixing cylinder is fixedly connected to the top of the base plate.

[0014] In one embodiment, a wafer coating inspection device includes the aforementioned weighing mechanism.

[0015] The aforementioned weighing mechanism and wafer coating detection device containing the mechanism can dampen vibrations through the positioning spring, stabilizing the vibration amplitude in a short time and quickly obtaining accurate weighing data. The buffer assembly slows the descent speed of the base plate and wafer, preventing excessive speed from colliding with lower components and causing damage. The engagement of the limiting ball and limiting hole ensures the stability of the movable plate, preventing the buffer plate from continuously moving downwards and colliding with lower components. The engagement of the locking block and locking slot ensures the stability of the base plate, guaranteeing that the base plate, the weighing instrument mounted on it, and the wafer will not be damaged. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the structure of the fixed frame in this utility model; Figure 3 This is a schematic diagram of the internal structure of the fixed frame in this utility model; Figure 4 for Figure 3 Enlarged diagram of part A in the middle; Figure 5 This is a schematic diagram of the card block structure in this utility model; Figure 6 This is a schematic diagram of the inclined groove in this utility model; Figure 7 This is a schematic diagram of the limiting ball in this utility model; Figure 8 This is a schematic diagram of the top rod in this utility model.

[0018] Figure label: 1. Fixed frame; 101. Groove; 102. Limiting hole; 2. Cover plate; 3. Base plate; 4. Positioning spring; 5. Weighing instrument; 6. Carrier tray; 7. Fixed frame; 71. Vertical groove; 8. Buffer assembly; 81. Buffer spring; 82. Buffer plate; 9. Movable block; 10. Movable frame; 11. Positioning frame; 111. Slot; 12. Movable plate; 13. Limiting ball; 14. Ring; 15. Top rod; 16. Snap-fit ​​spring; 17. Locking block; 171. Inclined groove; 18. Return spring; 19. Vertical rod; 20. Fixed cylinder; 21. Moving rod. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0020] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this specification are for illustrative purposes only and do not represent the only possible implementation.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0022] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0023] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this specification belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0024] The following is combined Figures 1-8This invention describes a weighing mechanism and a wafer coating detection device incorporating the same mechanism.

[0025] like Figures 1-4 As shown, in one embodiment, a weighing mechanism includes a fixed frame 1 and a cover plate 2 fixedly installed on the top of the fixed frame 1, and further includes: The base plate 3 is movably set inside the fixed frame 1; Positioning spring 4 is fixedly installed at both ends of base plate 3, with the end away from base plate 3 being fixedly connected to the bottom of cover plate 2; Weighing instrument 5 is installed in the middle of base plate 3; The carrier plate 6 is fixedly installed on top of the weighing instrument 5; The fixing bracket 7 is axially symmetrically installed at both ends inside the fixing frame 1, and a vertical groove 71 is provided inside it; The buffer assembly 8 is located at the bottom of the vertical groove 71 to prevent the base plate 3 from falling excessively.

[0026] Specifically, in the initial state, the positioning spring 4 is in its normal extended state. When the wafer needs to be weighed, it is placed on the carrier 6 on top of the weighing instrument 5. The weight of the wafer itself will cause the carrier 6, the weighing instrument 5, and the base plate 3 to move downwards. During this process, the positioning spring 4 will be stretched. The positioning spring 4 can eliminate the vibration of the other mechanisms on the weighing unit, allowing the vibration amplitude to stabilize in a short time, making the measurement results more accurate. Similarly, the wafer after applying glue is measured in the same way. The weight of the glue-applied wafer can be obtained by subtracting the weight of the former from the latter measurement data. The weighing instrument 5 transmits this value to the control unit, which compares this value with the standard value to determine whether glue needs to be added again. Adhesives are used; if the operator is inexperienced, and one of the wafers weighs much more than the rest of the batch, or if the carrier 6 is accidentally pressed downwards, the carrier 6 and the base plate 3 will move downwards rapidly. To save space, the fixing frame 1 is equipped with a spin coating mechanism below the base plate 3. If the base plate 3 moves downwards excessively, it will collide with the spin coating mechanism below at high speed, thereby damaging the base plate 3 or the weighing instrument 5, and the weighed wafers will also be damaged. Therefore, when the base plate 3 moves downwards rapidly along the vertical groove 71 of the fixing frame 7 due to external force, the buffer assembly 8 can effectively slow down the downward movement of the base plate 3, avoiding high-speed collision between the base plate 3 and the spin coating mechanism below, which would cause unnecessary damage. The cover plate 2 provides support for the positioning spring 4.

[0027] See Figure 3 and Figure 4As shown, in this embodiment, the buffer assembly 8 includes a buffer spring 81. One end of the buffer spring 81 is fixedly connected to the inner wall of the bottom of the vertical groove 71, and the other end is fixedly installed with a buffer plate 82. Movable blocks 9 are axially symmetrically fixedly installed at both ends of the bottom plate 3. The movable blocks 9 are slidably connected to the vertical groove 71 and are in movable contact with the buffer plate 82.

[0028] Specifically, when the wafer weight is appropriate, the base plate 3 moves downward, causing the movable block 9 to move downward synchronously. The movable block 9 will not come into contact with the buffer plate 82. At this time, the weight of the wafer can be effectively measured. When the base plate 3 moves downward rapidly due to external force (human pressure or excessive wafer weight), the movable block 9 moves downward along the vertical groove 71. After the movable block 9 moves downward, it will come into contact with the buffer plate 82, causing the buffer plate 82 to move downward synchronously, thereby compressing the buffer spring 81. This can slow down the descent speed of the movable block 9 and the base plate 3, and play a certain protective role.

[0029] See Figure 3 and Figure 4 As shown, in this embodiment, a movable frame 10 is fixedly provided at the bottom of the movable block 9, and a positioning frame 11 is fixedly installed at the top of the buffer plate 82. The movable frame 10 and the positioning frame 11 are slidably connected.

[0030] Specifically, when the movable block 9 moves downward, it will drive the movable frame 10 to move downward synchronously. During the downward movement, the movable frame 10 first enters the interior of the positioning frame 11. When the bottom of the movable frame 10 abuts against the bottom of the positioning frame 11, the two will move downward synchronously. The buffer plate 82 also moves downward together, thereby compressing the buffer spring 81 and slowing down the descent speed.

[0031] See Figure 4 As shown, in this embodiment, a movable plate 12 is fixedly provided on one side of the buffer plate 82. The end of the movable plate 12 away from the buffer plate 82 passes through one side of the fixed frame 7 and slides up and down along the fixed frame 7. A slot 101 is provided on the inner wall of the fixed frame 1, and the end of the movable plate 12 is slidably connected to the slot 101.

[0032] Specifically, the downward movement of the buffer plate 82 will cause the movable plate 12 on one side to move downward synchronously along the slot 101. The downward movement of the movable plate 12 along the slot 101 can ensure the stability of the buffer plate 82 during the downward movement process and prevent deviation.

[0033] See Figure 2 , Figure 4 and Figure 7 As shown, in this embodiment, a limiting hole 102 is provided on the outer side of the fixed frame 1, and the limiting hole 102 is connected to the slot 101. A limiting ball 13 is provided on one side of the movable plate 12, and the limiting ball 13 is movably engaged with the limiting hole 102.

[0034] Specifically, the limiting ball 13 is made of an elastic material. When the limiting ball 13 is above the limiting hole 102, it is compressed by the squeezing action of the inner wall of the slot 101. When the buffer plate 82 moves downward, it will drive the movable plate 12 and the limiting ball 13 to move downward together. This process will squeeze the buffer spring 81 and slow down the descent speed of the bottom plate 3. When the limiting ball 13 descends to be flush with the limiting hole 102, it engages with the limiting hole 102. At this time, the movable plate 12 cannot continue to move downward, and the buffer plate 82 also remains in a positioning state, preventing the bottom plate 3 from descending further and avoiding collisions with other components below, which could cause unnecessary damage.

[0035] See Figure 2 , Figure 4 and Figures 7-8 As shown, in this embodiment, a ring 14 is fixedly installed inside the limiting hole 102, and a push rod 15 is movably installed through the center of the ring 14. One end of the push rod 15 is movably abutting against the limiting ball 13, and the push rod 15 and the ring 14 are fixedly connected by a snap-fit ​​spring 16.

[0036] Specifically, when it is necessary to release the engagement between the limiting ball 13 and the limiting hole 102, the push rod 15 is moved inward along the limiting hole 102. The push rod 15 moves inward and squeezes the limiting ball 13, thereby releasing the engagement between the limiting ball 13 and the limiting hole 102. During this process, the locking spring 16 is compressed. The ring 14 provides support for the locking spring 16. After the limiting ball 13 is no longer engaged with the limiting hole 102, the movable plate 12 can move upward relative to the slot 101. Then, the inward force applied to the push rod 15 is removed. Under the action of the locking spring 16, the push rod 15 will move outward along the limiting hole 102 to the initial position.

[0037] See Figures 4-6 As shown, in this embodiment, a locking block 17 is slidably arranged at the lower position inside the movable frame 10. One end of the locking block 17 is fixedly connected to the inner wall of the movable frame 10 by a reset spring 18. A slot 111 is opened at the lower position of the positioning frame 11, and the locking block 17 is movably engaged with the slot 111.

[0038] Specifically, when the movable frame 10 moves into the positioning frame 11 and the bottoms of the two abut against each other, they move downwards synchronously. At this time, the locking block 17 and the slot 111 are flush, and the reset spring 18 is in a normal extension and retraction state. When the limiting ball 13 engages with the limiting hole 102, the movable plate 12 and the base plate 3 remain fixed. At this time, the locking block 17 is moved towards the slot 111 until the locking block 17 engages with the slot 111 and is maintained in this state. During this process, the reset spring 18 will be stretched. The engagement of the locking block 17 with the slot 111 can ensure that the base plate 3 and the buffer plate 82 remain relatively stable. The base plate 3 is also in a fixed and immovable state, which can further ensure the stability of the wafers placed on the base plate 3 and the carrier plate 6.

[0039] See Figures 4-6 As shown, in this embodiment, a vertical rod 19 is fixedly provided at the bottom of the vertical groove 71. The vertical rod 19 is located inside the buffer spring 81. An inclined groove 171 is provided inside the locking block 17. The top of the vertical rod 19 moves through the bottom of the buffer plate 82 and the positioning frame 11, and its end moves into contact with the inclined groove 171.

[0040] Specifically, when the movable frame 10 moves into the positioning frame 11 and the bottoms of the two abut against each other, they move downwards synchronously, the buffer plate 82 also moves downwards synchronously, and the vertical rod 19 moves upwards relative to the buffer plate 82. After the vertical rod 19 passes through the buffer plate 82 and the positioning frame 11, its top moves upwards along the inclined groove 171, which will push the locking block 17 to move towards the locking groove 111 and engage with the locking groove 111, thus ensuring the stability of the base plate 3.

[0041] See Figure 3 As shown, in this embodiment, a fixing cylinder 20 is fixedly installed at both ends of the cover plate 2. The fixing cylinder 20 is located inside the positioning spring 4. A moving rod 21 is movably arranged inside the fixing cylinder 20. The end of the moving rod 21 away from the fixing cylinder 20 is fixedly connected to the top of the base plate 3.

[0042] Specifically, when weighing the wafer, the base plate 3 moves downward and stretches the positioning spring 4. At the same time, the moving rod 21 also moves downward relative to the fixed cylinder 20. This ensures that the base plate 3 remains horizontal during the downward movement and does not tilt, thus avoiding any impact on the measurement data.

[0043] In this embodiment, a wafer coating inspection device includes the aforementioned weighing mechanism.

[0044] Specifically, the above-mentioned weighing mechanism can be set in the adhesive coating testing device, and a spin coating mechanism can be set on one side of the weighing mechanism to apply adhesives such as glue to the wafer surface, simplifying the operation process and improving efficiency.

[0045] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0046] The above-described embodiments are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.

Claims

1. A weighing mechanism, comprising a fixed frame and a cover plate fixedly installed on the top of the fixed frame, characterized in that, Also includes: The base plate is movably set inside the fixed frame; A positioning spring is fixedly installed at both ends of the base plate, with the end furthest from the base plate being fixedly connected to the bottom of the cover plate. A weighing instrument is installed in the middle of the base plate; A carrier plate is fixedly installed on top of the weighing instrument; The fixing bracket is axially symmetrically installed at both ends inside the fixing frame, and vertical grooves are opened inside it; A buffer assembly is located at the bottom of the vertical groove to prevent the base plate from descending excessively.

2. The weighing mechanism according to claim 1, characterized in that, The buffer assembly includes a buffer spring, one end of which is fixedly connected to the inner wall of the bottom of the vertical groove, and the other end is fixedly installed with a buffer plate. Movable blocks are axially symmetrically fixedly installed at both ends of the base plate. The movable blocks are slidably connected to the vertical groove and movably abut against the buffer plate.

3. A weighing mechanism according to claim 2, characterized in that, A movable frame is fixedly installed at the bottom of the movable block, and a positioning frame is fixedly installed at the top of the buffer plate. The movable frame and the positioning frame are slidably connected.

4. A weighing mechanism according to claim 2, characterized in that, A movable plate is fixedly installed on one side of the buffer plate. The end of the movable plate away from the buffer plate passes through one side of the fixed frame and slides up and down along the fixed frame. A slot is opened in the inner wall of the fixed frame, and the end of the movable plate is slidably connected to the slot.

5. A weighing mechanism according to claim 4, characterized in that, A limiting hole is provided on the outer side of the fixed frame, and the limiting hole is connected to the slot. A limiting ball is provided on one side of the movable plate, and the limiting ball is movably engaged with the limiting hole.

6. A weighing mechanism according to claim 5, characterized in that, A ring is fixedly installed inside the limiting hole, and a push rod is movably installed through the center of the ring. One end of the push rod is movably abutting against the limiting ball, and the push rod and the ring are fixedly connected by a snap-fit ​​spring.

7. A weighing mechanism according to claim 4, characterized in that, A locking block is horizontally slidably disposed at the lower position inside the movable frame. One end of the locking block is fixedly connected to the inner wall of the movable frame by a return spring. A slot is opened at the lower position of the positioning frame, and the locking block is movably engaged with the slot.

8. A weighing mechanism according to claim 7, characterized in that, A vertical rod is fixedly installed at the bottom of the vertical groove. The vertical rod is located inside the buffer spring. An inclined groove is opened inside the card block. The top of the vertical rod moves through the bottom of the buffer plate and the positioning frame, and the end moves into contact with the inclined groove.

9. A weighing mechanism according to claim 1, characterized in that, Both ends of the cover plate are fixedly installed with a fixing cylinder, which is located inside the positioning spring. A movable rod is movably arranged inside the fixing cylinder, and the end of the movable rod away from the fixing cylinder is fixedly connected to the top of the base plate.

10. A wafer coating inspection device, characterized in that, It includes the weighing mechanism as described in any one of claims 1-9.

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