A novel oxygen sensor package structure
Patent Information
- Application Number
- CN202522410401.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-13
- Publication Date
- 2026-09-29
- Estimated Expiration
- 2035-11-13
AI Technical Summary
[0002]目前市面上的气体传感器结构，至少包括芯片、端子组件等；而端子组件多由接线端子、陶瓷基座、卡箍、夹紧弹簧构成，其中接线端子安装在陶瓷基座中，陶瓷基座由对称的两部分构成，夹紧弹簧内部包裹陶瓷基座，外部与卡箍配合，夹紧弹簧和卡箍均具有弹性，借助卡箍内孔和夹紧弹簧的弹性夹紧陶瓷基座和接线端子，装配时芯片插入陶瓷基座内，芯片电极与接线端子接触，为了车在行驶过程中的震动不会导致芯片断裂，夹紧弹簧和卡箍均有较大弹性，但是，芯片插入具有较大弹性的空间时芯片电极很难准确对准接线端子，车行驶时的轻微震动也会导致芯片轻微移位，造成接触不良，传感器失效；另外，卡箍与传感器六角基座装配，距离六角基座的外螺纹距离很近，外螺纹与汽车排气管相连，行驶过程中的震动可直接通过螺纹连接传导至卡箍和夹紧弹簧，降低了卡箍和夹紧弹簧使用寿命，因此实践中卡箍和夹紧弹簧经常采用进口材料，对材料非金属夹杂物等缺陷要求较为苛刻，增加了生产控制难度和失效概率
[0011]1、本实用新型的接线端子与端子陶瓷组成半总成与卡箍装配到一起，卡箍起到防转减震作用，并且卡箍与外套筒通过环形压接形式固定，环形压接后卡箍防震防转效果能发挥作用。
Smart Images
Figure CN224816259U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of automotive sensor technology, and in particular to oxygen sensors or nitrogen-oxygen sensors for detecting exhaust gases from automotive engines. Background Technology
[0002] Currently, gas sensor structures on the market typically include at least a chip and terminal assemblies. The terminal assemblies usually consist of terminals, a ceramic base, clamps, and clamping springs. The terminals are mounted within the ceramic base, which is composed of two symmetrical parts. The clamping springs enclose the ceramic base internally and engage with the clamps externally. Both the clamping springs and clamps are elastic, using the inner hole of the clamps and the elasticity of the clamping springs to clamp the ceramic base and terminals. During assembly, the chip is inserted into the ceramic base, and the chip electrodes contact the terminals. To prevent chip breakage due to vibrations during vehicle operation, both the clamping springs and clamps have significant elasticity. Yes, when the chip is inserted into a space with a large degree of elasticity, it is difficult to accurately align the chip electrodes with the terminals. Slight vibrations during vehicle operation can also cause slight displacement of the chip, resulting in poor contact and sensor failure. In addition, the clamp is assembled with the sensor's hexagonal base, and the distance between the clamp and the external thread of the hexagonal base is very close. The external thread is connected to the vehicle's exhaust pipe. Vibrations during driving can be directly transmitted to the clamp and clamping spring through the threaded connection, reducing the service life of the clamp and clamping spring. Therefore, in practice, clamps and clamping springs often use imported materials, and the requirements for defects such as non-metallic inclusions in the materials are more stringent, which increases the difficulty of production control and the probability of failure. Utility Model Content
[0003] In view of the above problems, the purpose of this utility model is to provide a novel oxygen sensor packaging structure to improve the service life of the sensor and overcome the shortcomings of the prior art.
[0004] This utility model provides a novel oxygen sensor packaging structure, comprising: an external packaging structure consisting of an outer exhaust hood, a sealing ring, a hexagonal base, an outer sleeve, and a rubber plug connected in sequence; and an internal packaging structure consisting of an inner exhaust hood, a ceramic chip, an upper packaging ceramic, a powder ring, a lower packaging ceramic, a terminal ceramic, a clamp, and wiring terminals connected in sequence. The wiring terminals are fixedly connected inside the terminal ceramic, and the wiring terminals and terminal ceramic form a semi-assembly. The terminal ceramic is assembled and fixedly connected to the clamp, which serves to prevent rotation and reduce vibration. The clamp and outer sleeve are fixed by annular compression fitting. After the ring-shaped pressing, the shockproof and anti-rotation effect of the clamp can be achieved; the outer exhaust hood, outer sleeve and hexagonal base are fixed by ring laser welding; a powder ring is pressed between the upper and lower encapsulation ceramics; the connection between the upper and lower encapsulation ceramics (powder ring position) is sealed by high-temperature sintering; the inner and outer exhaust hoods are fixed to the hexagonal base by laser welding; the gas enters the internal encapsulation structure through the annularly distributed air inlet holes on the side of the outer exhaust hood and the bottom hole of the inner exhaust hood and comes into contact with the ceramic chip; after the exhaust gas comes into contact with the ceramic chip, a Nernst voltage is formed.
[0005] As a preferred embodiment of this utility model, the outer sleeve and the hexagonal base are fixed by annular laser welding to achieve a seal between the base and the outer sleeve. At the same time, the outer sleeve and the internal clamp need to be annularly pressed together. After pressing, the clamp has better shockproof and anti-rotation effects.
[0006] As a preferred embodiment of this invention, the ceramic chip is placed inside the upper and lower encapsulation ceramics (at both ends), wherein the encapsulation ceramics and the lower encapsulation ceramics are joined and pressed together to form a powder ring at the joint gap, and then the front and rear ends of the ceramic chip are sealed by high-temperature sintering.
[0007] As a preferred embodiment of this invention, the sealing ring is fitted onto the stepped shoulder of the hexagonal base.
[0008] As a preferred embodiment of this invention, one end of the terminal block is connected to the chip electrode of the ceramic chip, and the other end is connected to the external wiring harness to enable signal conduction.
[0009] As a preferred embodiment of this utility model, the rubber plug is fixedly connected to the tail of the outer sleeve, and the rubber plug has a through hole through which the external wiring harness passes.
[0010] The beneficial effects of this utility model are as follows:
[0011] 1. The wiring terminal and terminal ceramic of this utility model are assembled together with the clamp. The clamp plays the role of anti-rotation and shock absorption. The clamp and the outer sleeve are fixed by annular pressing. After the annular pressing, the anti-vibration and anti-rotation effect of the clamp can be realized.
[0012] 2. The outer sleeve and hexagonal base of this utility model are sealed between the base and the outer sleeve by annular laser welding. At the same time, the outer sleeve needs to be annularly pressed with the internal clamp. After pressing, the clamp has better shockproof and anti-rotation effects.
[0013] 3. This utility model can avoid chip breakage during the assembly of ceramic chips and electrodes, and can also avoid wire breakage during the riveting of rubber plugs.
[0014] 4. When the sensor of this utility model is subjected to external vibration, the elastic clamp prevents the ceramic chip from being impacted and broken. Attached Figure Description
[0015] Figure 1 This is a cross-sectional view of the overall structure of this embodiment.
[0016] Figure 2 This is a schematic diagram of the clamp structure in this embodiment.
[0017] Figure 3 This is a schematic diagram of the ceramic connection of the wiring terminals, ceramic chip, and clamp terminals in this embodiment.
[0018] Reference numerals in the attached diagram: 1. External exhaust hood; 2. Internal exhaust hood; 3. Upper encapsulation ceramic; 4. Ceramic chip; 5. Hexagonal base; 6. Sealing ring; 7. Powder ring; 8. Lower encapsulation ceramic; 9. Clamp; 10. Outer sleeve; 11. Terminal ceramic; 12. Wire harness; 13. Rubber plug; 14. Wiring terminal. Detailed Implementation
[0019] See Figure 1-2As shown, this embodiment provides a novel oxygen sensor packaging structure, including: an external packaging structure consisting of an outer exhaust hood 1, a sealing ring 6, a hexagonal base 5, an outer sleeve 10, and a rubber plug 13 connected in sequence; and an internal packaging structure consisting of an inner exhaust hood 2, a ceramic chip 4, an upper packaging ceramic 3, a powder ring 7, a lower packaging ceramic 8, a terminal ceramic 11, a clamp 9, and a wiring terminal 14 connected in sequence. The wiring terminal 14 is fixed inside the terminal ceramic 11, and the wiring terminal 14 and the terminal ceramic 11 form a semi-assembly. One end of the wiring terminal 14 is connected to the chip electrode of the ceramic chip 4, and the other end is connected to the external wiring harness 12 to realize signal conduction. The terminal ceramic 11 is assembled and fixed to the clamp 9, which serves to prevent rotation and reduce vibration. The clamp 9 is fixed to the outer sleeve 10 by annular pressing, which enhances the clamp's anti-vibration and anti-rotation effects. The outer exhaust hood 1, the outer sleeve 10, and the hexagonal base 5 are fixed by annular laser welding. A powder ring 7 is press-fitted between the upper encapsulation ceramic 3 and the lower encapsulation ceramic 8. The connection between the upper encapsulation ceramic 3 and the lower encapsulation ceramic 8 (at the powder ring 7 position) is sealed by high-temperature sintering. The inner exhaust hood 2 and the outer exhaust hood 1 are fixed to the hexagonal base 5 by laser welding. Gas enters the internal encapsulation structure through the annularly distributed air inlets on the side of the outer exhaust hood 1 and the bottom hole of the inner exhaust hood 2, and comes into contact with the ceramic chip 4. The exhaust gas forms a Nernst voltage upon contact with the ceramic chip 4. The outer sleeve 10 and the hexagonal base 5 are fixed by annular laser welding to achieve a seal between the base and the outer sleeve. At the same time, the outer sleeve 10 and the inner clamp need to be annularly pressed, which further enhances the clamp's anti-vibration and anti-rotation effects. The ceramic chip 4 is placed inside the upper encapsulating ceramic 3 and the lower encapsulating ceramic 8 (at both ends). The encapsulating ceramic and the lower encapsulating ceramic are mated and pressed together to form a powder ring at the mating gap. After high-temperature sintering, the front and rear ends of the ceramic chip 4 are sealed. The sealing ring 6 is fitted onto the stepped shoulder of the hexagonal base 5. The rubber plug 13 is fixed to the tail of the outer sleeve 10, and the rubber plug 13 has a through hole for the external wiring harness to pass through.
[0020] Working principle: The terminals are connected to the chip electrodes and wires respectively to realize signal conduction. The gas enters the internal encapsulation structure through the annular air inlet holes on the side of the outer exhaust hood 1 and the bottom hole of the inner exhaust hood 2 and comes into contact with the ceramic chip 4. After the exhaust gas comes into contact with the ceramic chip 4, a Nernst voltage is formed, thereby realizing the detection of automobile engine exhaust gas.
[0021] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.
Claims
1. A novel oxygen sensor packaging structure, characterized in that, include: The external encapsulation structure consists of an outer exhaust hood, a sealing ring, a hexagonal base, an outer sleeve, and a rubber plug connected in sequence. The internal encapsulation structure consists of an inner exhaust hood, a ceramic chip, an upper encapsulation ceramic, a powder ring, a lower encapsulation ceramic, a terminal ceramic, a clamp, and a wiring terminal connected in sequence. The wiring terminal is fixed inside the terminal ceramic. The terminal ceramic is assembled and fixed to the clamp. The clamp is fixed to the outer sleeve by annular pressing. The outer exhaust hood, the outer sleeve, and the hexagonal base are fixed by annular laser welding. A powder ring is press-fitted between the upper and lower encapsulation ceramics. The connection between the upper and lower encapsulation ceramics is sealed by high-temperature sintering. The inner and outer exhaust hoods are fixed to the hexagonal base by laser welding. Gas enters the internal encapsulation structure through the annularly distributed air inlet holes on the side of the outer exhaust hood and the bottom hole of the inner exhaust hood and comes into contact with the ceramic chip. After the exhaust gas comes into contact with the ceramic chip, a Nernst voltage is formed.
2. The novel oxygen sensor packaging structure according to claim 1, characterized in that, The outer sleeve and the hexagonal base are fixed by annular laser welding. At the same time, the outer sleeve and the inner clamp need to be annularly pressed together. After pressing, the clamp has better shock absorption and anti-rotation effect.
3. The novel oxygen sensor packaging structure according to claim 1, characterized in that, The ceramic chip is placed inside the upper and lower encapsulation ceramics, wherein the encapsulation ceramics and the lower encapsulation ceramics are joined and pressed together to form a powder ring at the joint gap, and then the front and rear ends of the ceramic chip are sealed by high-temperature sintering.
4. The novel oxygen sensor packaging structure according to claim 1, characterized in that, The sealing ring is fitted onto the stepped shoulder of the hexagonal base.
5. The novel oxygen sensor packaging structure according to claim 1, characterized in that, One end of the terminal block is connected to the chip electrode of the ceramic chip, and the other end is connected to the external wiring harness to enable signal conduction.
6. The novel oxygen sensor packaging structure according to claim 1, characterized in that, The rubber plug is fixed to the tail of the outer sleeve, and the rubber plug has a through hole through which the external wiring harness passes.