A fixing device for 5G mainboard research and development

Abstract

The utility model discloses a kind of fixing devices for 5G mainboard research and development, it is related to mainboard fixing technical field, including support leg, the support leg top is fixedly installed with fixed shell, the fixed shell inner wall is fixedly provided with first connecting rod, the first connecting rod is connected with the lifting assembly of driving mainboard to lift, the lifting assembly side is provided with the adjusting assembly of adjusting the angle of mainboard, and lifting assembly top is provided with the fixed component of the fixed mainboard;The lifting assembly includes the fixed frame of rotation installation in the first connecting rod far from fixed shell one end. The utility model is through setting fixed component, only by operator with hand downward pressing rotating handle, can drive fixed head to press down, finally press on mainboard, greatly improve research and development debugging efficiency, in the research and development scene of needing frequently replacing mainboard, this kind of fast operation saves a lot of time of screwing screw, make work flow more smooth.

Description

Technical Field

[0001] This utility model relates to the field of motherboard fixing technology, specifically a fixing device for 5G motherboard research and development. Background Technology

[0002] In the research and development of 5G communication technology, the motherboard, as a core hardware component, is crucial in its design, testing, and debugging. Researchers frequently need to perform tasks such as soldering, measuring, functional testing, and troubleshooting on the motherboard.

[0003] An existing patent (authorization announcement number: CN222337218U) discloses a fixing device for motherboard testing. The key technical points of the solution are: a threaded shaft is set inside the upper part of the first support plate, which passes through the interior of the first support plate and can rotate inside it. A fixing knob on the outer surface of the threaded shaft can rotate threadedly. A fixing plate limits the right side position of the threaded shaft. The clamping mechanism can rotate through the threaded shaft, thereby improving the flexibility of the device. At the same time, a telescopic rod is connected to the right side of the fixing plate. One end of the telescopic rod is vertically connected to the middle right side of the fixing plate. A tension spring is sleeved on the outside of the telescopic rod. The placement block can move elastically through the telescopic rod and the tension spring. A slot is fitted into the right side of the placement block. A bolt passes through the upper surface of the placement block. The bolt drives the pressing plate to move threadedly up and down, thereby facilitating the clamping of the motherboard by the operator.

[0004] However, the above technical solution still has certain defects. The clamping is achieved by adjusting the bolts, which requires tightening the bolts again to loosen and clamp the motherboard after each test and development of a motherboard. This is too inconvenient and makes the efficiency of repeatedly loosening and clamping the motherboard too low. Therefore, a fixing device for 5G motherboard development is proposed. Utility Model Content

[0005] The purpose of this utility model is to provide a fixing device for 5G motherboard research and development, so as to solve the problems in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A fixing device for 5G motherboard research and development includes a support leg, a fixing shell fixedly installed on the top of the support leg, a first connecting rod fixedly provided on the inner wall of the fixing shell, the first connecting rod being connected to a lifting component for driving the motherboard to rise and fall, an adjustment component for adjusting the angle of the motherboard being provided on the side of the lifting component, and a fixing component for fixing the motherboard being provided on the top of the lifting component.

[0008] The lifting assembly includes a fixed frame rotatably mounted on the end of the first connecting rod away from the fixed housing;

[0009] The fixing assembly includes a base fixedly installed on the top of the fixing frame. The base is provided with a first protrusion and a second protrusion. A connector is rotatably provided on the top of the first protrusion, and a rotating handle is rotatably provided at the end of the connector away from the first protrusion. An extension block is provided at the end of the rotating handle away from the handle. A rotating member is rotatably connected to the top of the second protrusion. The rotating member is rotatably connected to the extension block at the end of the rotating handle, and a fixing head is fixedly provided at the end of the rotating member away from the extension block.

[0010] Based on the above technical solutions, this utility model also provides the following optional technical solutions:

[0011] As a further embodiment of this utility model: the lifting assembly also includes a bolt threaded on the top of the fixed frame, and a heat dissipation plate threadedly connected to the bolt.

[0012] As a further improvement of this utility model: two sets of bolts are mirror-arranged along the center line of the long side of the heat sink plate, and multiple sets of heat dissipation holes are opened in the middle of the heat sink plate.

[0013] As a further embodiment of this utility model: the adjustment component includes a mounting shell fixedly installed on a fixed shell, two sets of limiting plates are fixedly arranged inside the mounting shell, a worm gear is provided through the middle of the limiting plate, the worm gear meshes with a worm wheel, and a second connecting rod is fixedly installed at the center of the worm wheel, and a fixing frame is fixedly connected to the end of the second connecting rod away from the worm wheel.

[0014] As a further improvement of this utility model: a base plate is fixedly installed at the bottom of the fixing frame, and a cable routing device for routing the circuits on the motherboard is provided on the base plate.

[0015] As a further improvement of this utility model: a fan is fixedly connected to the bottom of the base plate, and the fan air duct faces the heat sink.

[0016] As a further improvement of this utility model: the heat sink is covered with conductive sponge, and the conductive sponge has holes with the same diameter as the holes on the heat sink.

[0017] As a further improvement of this utility model, the heat sink is made of transparent anti-static acrylic material.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0019] 1. This utility model, by setting a fixing component, allows the operator to press down on the rotating handle by hand to drive the fixing head down and finally press it onto the motherboard, which greatly improves the efficiency of R&D and debugging. In R&D scenarios that require frequent motherboard replacement, this quick operation saves a lot of time on screwing, making the workflow smoother.

[0020] 2. This utility model, by setting up a lifting component, forces the entire heat sink to move precisely up or down relative to the fixed frame by rotating the bolt. Conductive sponge is laid on the surface of the heat sink, and its softness can protect the components on the back of the motherboard from scratches and prevent static electricity accumulation from damaging the precision chip. The heat sink itself is made of transparent anti-static acrylic material, which not only ensures that it will not generate static electricity, but also achieves visibility. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of this utility model;

[0022] Figure 2 This is a cross-sectional view of the present invention;

[0023] Figure 3 This is a schematic diagram of the structure of the base plate of this utility model;

[0024] Figure 4 This is a side view of the structure of this utility model;

[0025] Figure 5 This is a structural schematic diagram of the fixing component of this utility model.

[0026] Figure reference numerals: 1. Support leg; 2. Fixed housing; 3. First connecting rod; 4. Adjustment assembly; 5. Lifting assembly; 6. Fixing assembly; 7. Base plate; 8. Cable routing device; 9. Fan;

[0027] 41. Mounting housing; 42. Limiting plate; 43. Worm gear; 44. Worm wheel; 45. Second connecting rod;

[0028] 51. Mounting bracket; 52. Bolt; 53. Heat sink plate;

[0029] 61. Base; 62. Connector; 63. Rotating handle; 64. Rotating component; 65. Fixing head. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0031] In one embodiment, such as Figures 1-5 As shown, a fixing device for 5G motherboard research and development includes a support leg 1, a fixing shell 2 fixedly installed on the top of the support leg 1, a first connecting rod 3 fixedly provided on the inner wall of the fixing shell 2, the first connecting rod 3 being connected to a lifting component 5 for driving the motherboard to rise and fall, an adjustment component 4 for adjusting the angle of the motherboard being provided on the side of the lifting component 5, and a fixing component 6 for fixing the motherboard being provided on the top of the lifting component 5.

[0032] In this embodiment, the height of the motherboard is changed by the lifting component 5, and the motherboard is better fixed by the fixing component 6. The angle of the motherboard is adjusted by the adjusting component 4. By lifting and adjusting the angle, any area on the motherboard can be quickly moved to the most comfortable operating and observation position, which greatly reduces work fatigue and improves operating accuracy and efficiency.

[0033] In one embodiment, such as Figure 2 As shown, the lifting assembly 5 includes a fixed frame 51 rotatably mounted on the end of the first connecting rod 3 away from the fixed housing 2, a bolt 52 threaded onto the top of the fixed frame 51, and a heat sink 53 threadedly connected to the bolt 52. Two sets of bolts 52 are mirror-image arranged along the center line of the long side of the heat sink 53, and multiple sets of heat dissipation holes are opened in the middle of the heat sink 53. Conductive sponge is laid on the heat sink 53, and holes with the same diameter as the holes on the heat sink 53 are opened in the conductive sponge. The heat sink 53 is made of transparent anti-static acrylic material. When researchers need to adjust the motherboard height, they use tools or their hands to rotate the bolts 52. Rotating the bolts 52 forces the entire heat sink... The heat sink 53 moves precisely up or down relative to the fixed bracket 51, while the motherboard is placed directly on the heat sink 53. The dense ventilation holes on the heat sink 53 increase the heat dissipation area in contact with air, forming an effective passive cooling airflow channel, facilitating heat dissipation from the holes. Conductive sponge is laid on the surface of the heat sink 53; its softness protects the components on the back of the motherboard from scratches, while its conductivity safely conducts static electricity from the motherboard to the entire device and into the ground through the support leg 1, preventing static electricity buildup from damaging the precision chips. The heat sink 53 itself is made of transparent anti-static acrylic material, ensuring that it does not generate static electricity and enabling visualization. R&D personnel can see the circuitry and solder joints on the back of the motherboard through the tray, greatly facilitating debugging and inspection.

[0034] In one embodiment, such as Figure 2As shown, the adjusting assembly 4 includes a mounting shell 41 fixedly installed on the fixed shell 2. Two sets of limiting plates 42 are fixedly installed inside the mounting shell 41. A worm gear 43 is threaded through the center of each limiting plate 42. The worm gear 43 meshes with a worm wheel 44, and a second connecting rod 45 is fixedly installed at the center of the worm wheel 44. The end of the second connecting rod 45 away from the worm wheel 44 is fixedly connected to a fixing frame 51. The researchers can rotate the worm gear 43 by hand or with tools. The worm gear 43 is confined between the two limiting plates 42, allowing only rotational movement without axial movement, ensuring the stability of the meshing. The center of the worm wheel 44 is fixed to the second connecting rod 45. The rotation of the worm wheel 44 directly converts into the rotational movement of the second connecting rod 45, the other end of which is rotatably connected to the fixing frame 51. Therefore, the rotation of the second connecting rod 45 will drive the entire lifting assembly 5 to rotate 360 ​​degrees around the axis of the second connecting rod 45, and the worm wheel 44 and worm gear 43 mechanism has a reverse self-locking characteristic. This means that when the worm 43 rotates actively, it can drive the worm wheel 44; however, when the transmission stops (i.e., after the person releases their hand), the worm wheel 44 cannot drive the worm 43 in reverse, thus solving the problem of needing to operate the motherboard from multiple angles during the research and development process.

[0035] In one embodiment, such as Figure 5 As shown, the fixing assembly 6 includes a base 61 fixedly mounted on the top of the fixing frame 51. The base 61 has a first protrusion and a second protrusion. A connector 62 is rotatably mounted on the top of the first protrusion, and a rotating handle 63 is rotatably mounted on the end of the connector 62 away from the first protrusion. An extension block is provided on the end of the rotating handle 63 away from the handle. A rotating member 64 is rotatably connected to the top of the second protrusion. The rotating member 64 is rotatably connected to the extension block at the end of the rotating handle 63, and a fixing head 65 is fixedly mounted on the end of the rotating member 64 away from the extension block. When the rotating handle 63 is in the raised position, the fixing head 65 is away from the base. The motherboard can be placed or removed at seat 61. The operator presses down on the rotating handle 63, which rotates around its hinge point with the connector 62. The extension block at the end of the rotating handle 63 moves downward accordingly. The extension block is hinged to the rotating component 64, so the downward force pulls the rotating component 64, causing it to rotate downward around its hinge point with the second protrusion. The fixing head 65 changes from an upward movement to a downward movement, eventually pressing on the motherboard to fix it. This greatly improves the efficiency of R&D and debugging. In R&D scenarios where motherboards need to be replaced frequently, this quick operation saves a lot of time on screwing in screws, making the workflow smoother.

[0036] In one embodiment, such as Figure 3 and Figure 4As shown, a base plate 7 is fixedly mounted on the bottom of the mounting bracket 51, and a cable routing device 8 is provided on the base plate 7 for routing the circuits on the motherboard. A fan 9 is fixedly connected to the bottom of the base plate 7, and the airflow of the fan 9 faces the heat sink 53. Various data cables, power cables, and test cables leading from the motherboard are intentionally guided to the edge of the base plate 7 or specific positions. R&D personnel can neatly pass these cables through or fix them on the cable routing device 8, avoiding multiple cables from getting tangled or knotted. Neat wiring reduces the risk of accidental plugging and unplugging. The fan 9 generates directional airflow, and the airflow direction is clearly designed to be towards the heat sink 53 directly above it, preventing the chip from triggering frequency reduction protection or permanent damage due to overheating.

[0037] The above embodiment discloses a fixing device for 5G motherboard R&D. In this device, by setting up a lifting component 5, the rotating bolt 52 forces the entire heat sink 53 to move precisely up or down relative to the fixed bracket 51. At the same time, the motherboard is placed directly on the heat sink 53, which facilitates heat dissipation. Simultaneously, the operator presses down on the rotating handle 63, which rotates around its hinge point with the connector 62. The extension block at the end of the rotating handle 63 moves downward, and the fixing head 65 changes from an upward movement to a downward movement, eventually pressing down on the motherboard to fix it and prevent it from moving, which would cause the R&D personnel to focus for a long time. The operator rotates the worm gear 43, which drives the worm wheel 44 to rotate. The worm wheel 44 drives the entire lifting component 5 to rotate, solving the problem of operating the motherboard from multiple angles.

[0038] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A fixing device for 5G motherboard R&D, comprising a support leg (1), wherein a fixing shell (2) is fixedly installed on the top of the support leg (1), and a first connecting rod (3) is fixedly disposed on the inner wall of the fixing shell (2), characterized in that, The first connecting rod (3) is connected to a lifting assembly (5) that drives the motherboard to rise and fall. The lifting assembly (5) is provided with an adjustment assembly (4) on its side to adjust the angle of the motherboard, and a fixing assembly (6) is provided on the top of the lifting assembly (5) to fix the motherboard. The lifting assembly (5) includes a fixing frame (51) rotatably mounted on the end of the first connecting rod (3) away from the fixed shell (2); The fixing component (6) includes a base (61) fixedly installed on the top of the fixing frame (51). The base (61) is provided with a first protrusion and a second protrusion. A connector (62) is rotatably provided on the top of the first protrusion, and a rotating handle (63) is rotatably provided at the end of the connector (62) away from the first protrusion. An extension block is provided at the end of the rotating handle (63) away from the handle. A rotating component (64) is rotatably connected to the top of the second protrusion. The rotating component (64) is rotatably connected to the extension block at the end of the rotating handle (63), and a fixing head (65) is fixedly provided at the end of the rotating component (64) away from the extension block.

2. The fixing device for 5G motherboard R&D according to claim 1, characterized in that, The lifting assembly (5) also includes a bolt (52) threaded on the top of the fixed frame (51) and a heat sink (53) threaded to the bolt (52).

3. The fixing device for 5G motherboard R&D according to claim 2, characterized in that, Two sets of bolts (52) are mirrored along the center line of the long side of the heat sink (53), and multiple sets of heat dissipation holes are opened in the middle of the heat sink (53).

4. The fixing device for 5G motherboard R&D according to claim 1, characterized in that, The adjustment assembly (4) includes a mounting shell (41) fixedly installed on the fixed shell (2). Two sets of limiting plates (42) are fixedly installed inside the mounting shell (41). A worm (43) is inserted through the middle of the limiting plate (42). The worm (43) meshes with a worm wheel (44). A second connecting rod (45) is fixedly installed at the center of the worm wheel (44). The end of the second connecting rod (45) away from the worm wheel (44) is fixedly connected to a fixing frame (51).

5. A fixing device for 5G motherboard R&D according to claim 4, characterized in that, The bottom of the mounting bracket (51) is fixedly installed with a base plate (7), and the base plate (7) is provided with a cable tray (8) for routing the circuits on the motherboard.

6. The fixing device for 5G motherboard R&D according to claim 5, characterized in that, A fan (9) is fixedly connected to the bottom of the base plate (7), and the air duct of the fan (9) faces the heat sink (53).

7. A fixing device for 5G motherboard R&D according to claim 2, characterized in that, The heat sink (53) is covered with conductive sponge, and the conductive sponge has holes with the same diameter as the holes on the heat sink (53).

8. A fixing device for 5G motherboard R&D according to claim 2, characterized in that, The heat sink (53) is made of transparent antistatic acrylic material.

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