A small power device thermal resistance test constant temperature platform

Abstract

The utility model relates to thermal resistance test technical field, specifically disclose a kind of low-power device thermal resistance test constant temperature platform, including workbench, constant temperature piece, rotating stand and press, workbench is equipped with support surface, constant temperature piece is located below support surface, rotating stand can rotate relative to support surface, and press is located on rotating stand and can slide along transverse direction relative to rotating stand.The low-power device thermal resistance test constant temperature platform in the utility model solves the problem that fixed structure cannot be adjusted.

Description

Technical Field

[0001] This invention relates to the field of thermal resistance testing technology, specifically to a constant temperature stage for testing the thermal resistance of low-power devices. Background Technology

[0002] In the research and development and manufacturing of low-power semiconductor devices and microelectronic components, accurate measurement of thermal resistance characteristics has become a key step in ensuring device reliability and optimizing heat dissipation design. As low-power devices develop towards higher power density, higher integration, and miniaturization, the heat generation per unit volume increases significantly, while the heat dissipation space is constantly being compressed, leading to a rapid rise in junction temperature. This greatly affects the performance and lifespan of low-power devices. Therefore, low-power devices need to undergo thermal resistance testing after assembly.

[0003] Thermal resistance testing of low-power devices quantifies the ease with which heat is conducted from the chip junction region to the casing or environment, and is a key parameter for evaluating the thermal management capabilities of power devices. During thermal resistance testing, low-power devices need to be placed in a constant-temperature environment, which is typically provided by a temperature-controlled bench.

[0004] A common type of constant temperature stage, as shown in the patent application CN120334702A, discloses a semiconductor device thermal resistance measurement device. It includes a worktable with a constant temperature base in the middle. A frame mounted on top of the constant temperature base is located on one side of the worktable, housing a thermal resistance detector. A pressing mechanism is located at the top of the frame, pressing down on the upper surface of the constant temperature base to contact the semiconductor device under test. A flexible thermally conductive contact pad, adaptable to the shape of the semiconductor device under test, is located in the middle of the upper surface of the constant temperature base. A temperature control component is located within the flexible thermally conductive contact pad. An environmental simulation mechanism is attached to the pressing mechanism, creating a simulated environment for the semiconductor device under test on the constant temperature base as the pressing mechanism contacts the semiconductor device. The temperature control component within the flexible thermally conductive contact pad includes a semiconductor cooling matrix. A mounting base is located at the bottom of the flexible thermally conductive contact pad, with a heat insulation layer fixed to its inner bottom surface. The semiconductor cooling matrix is ​​positioned between the flexible thermally conductive contact pad and the heat insulation layer.

[0005] When the aforementioned equipment is in operation, a constant temperature environment is provided through a flexible thermally conductive contact pad. The pressure head serves as a fixed structure to limit and fix the semiconductor device to be tested. However, the pressure head can only slide vertically and cannot be adjusted to fix its position according to the shape and size of the semiconductor device. When the semiconductor device is placed to the side of the pressure head, it is impossible to adjust the position of the pressure head to reposition it relative to the semiconductor device; only the semiconductor device can be moved. In practical implementation, when the size of the low-power device is small, especially its thickness, it is inconvenient to pick it up and move it after placing it on the worktable.

[0006] Real new content The novelty of this invention lies in providing a constant temperature stage for testing the thermal resistance of low-power devices, thereby solving the problem of fixed structures being unable to be adjusted.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a constant temperature stage for testing the thermal resistance of small power devices, comprising a worktable, a constant temperature component, a rotating frame, and a pressure fixture. The worktable is provided with a support surface, the constant temperature component is located below the support surface, the rotating frame can rotate relative to the support surface, and the pressure fixture is located on the rotating frame and can slide laterally relative to the rotating frame.

[0008] The beneficial effects of this plan are: In this design, the pressure fixture is mounted on a rotating frame. The rotation of the frame drives the pressure fixture to rotate as well. Therefore, when the pressure fixture's position on the rotating frame is offset from the rotation center along its vertical projection, the rotation of the frame allows the pressure fixture to be positioned relative to different parts of the support surface, and the adjustment path of the pressure fixture is circular. Furthermore, the pressure fixture in this design can slide along the rotating frame, meaning it can move radially along the circular adjustment path. Therefore, when using the constant temperature stage in this design, sliding the pressure fixture and rotating the frame allows the pressure fixture to be positioned relative to different parts of the support surface, enabling the fixing of different positions of the low-power device under test. This method is simple to operate and offers a wider adjustment range for the pressure fixture.

[0009] Furthermore, the cross-section of the worktable along the horizontal direction is circular.

[0010] The beneficial effects of this solution are as follows: the shape of the workbench is closer to the moving path of the pressure fixture when the rotating frame rotates, which can make fuller use of the space under the pressure fixture and form a larger support surface, which can install larger or more small power devices under test.

[0011] Furthermore, the rotating frame includes a column and at least two transverse sections. The rotating frame is provided with at least two strip slots, which correspond one-to-one with the transverse sections. The press can be installed into any one of the strip slots.

[0012] The beneficial effect of this solution is that, in actual implementation, the pressure fixture can be installed into the corresponding slot according to the position of the low-power device to be tested, thereby enabling the pressure fixture to be quickly aligned with the low-power device to be tested.

[0013] Furthermore, at least two pressure fixtures are provided, and at least one pressure fixture is provided in each strip groove.

[0014] The advantages of this solution are: it allows for a greater number of pressure fixtures, eliminating the need for disassembly and installation. Alignment between one of the pressure fixtures and the low-power device under test can be achieved simply by sliding the fixture slightly or rotating the frame slightly, simplifying operation. Furthermore, multiple pressure fixtures can simultaneously secure multiple low-power devices, or, when the low-power device is large, multiple fixtures provide better fixation.

[0015] Furthermore, there are two horizontal sections, which are arranged in a cross shape, and the strip grooves on the two horizontal sections are connected to each other at the intersection of the two horizontal sections.

[0016] The advantages of this solution are as follows: First, the longer length of the strip grooves allows for a wider range of adjustment of the clamping fixture. Second, the two cross-shaped strip grooves, when the rotating frame rotates by less than 90°, can be quickly slid to the position directly opposite the low-power device when used in conjunction with the lateral sliding clamping fixture, further improving the fixing speed.

[0017] Furthermore, the press includes an inner cylinder and an outer cylinder, with the inner cylinder located inside the inner cylinder and extending out from the outer cylinder.

[0018] The advantages of this solution are: when it is necessary to fix the power device, the inner cylinder can be slid down relative to the outer cylinder to quickly achieve fixation, and the operation is simple.

[0019] Furthermore, the press also includes a limiting cylinder, the lower end of which is located between the inner cylinder and the outer cylinder, and the upper end extends to the outside of the outer cylinder. The limiting cylinder is provided with a longitudinal groove, which extends along the axial direction of the inner cylinder. The upper and lower parts of the longitudinal groove are connected to the limiting groove. A slider that can slide along the longitudinal groove and the limiting groove is fixed on the upper part of the inner cylinder. The inner wall of the outer cylinder is provided with a threaded groove. The side of the slider away from the inner cylinder is located in the threaded groove and can slide along the threaded groove.

[0020] The beneficial effects of this solution are as follows: Rotating the outer cylinder allows the slider to slide along the longitudinal groove, causing the inner cylinder to slide downwards relative to the outer cylinder, thus fixing the power device. When the outer cylinder slides upwards, once the slider aligns with the upper limiting groove, rotating the inner cylinder relative to the outer cylinder allows the slider to slide into the upper limiting groove. At this point, the slider is blocked by the side wall of the limiting groove, preventing the inner cylinder from sliding downwards relative to the outer cylinder. This maintains a greater distance between the inner cylinder and the worktable, making it easier to place the power device to be tested.

[0021] Furthermore, a sleeve-shaped buffer pad is fixed to the lower end of the inner cylinder.

[0022] The beneficial effects of this solution are as follows: When the buffer pad is subjected to significant pressure, its sidewalls will concave or convex, thereby reducing the height of the buffer pad and further decreasing the pressure between the buffer pad and the power device. Compared to directly using materials with greater elasticity and softness, such as sponge, the buffer pad in this solution can provide greater force for fixing the power device, thus improving the fixing effect. Compared to directly using materials with relatively low elasticity, such as rubber, the buffer pad in this solution can provide a better cushioning effect, further preventing deformation or damage to the power device.

[0023] Furthermore, the thermostatic component includes a spiral flow channel, and the vertical projection of any part of the flow channel is an arc shape. The flow channel has an inlet on its inner circumference and an outlet on its outer circumference.

[0024] The beneficial effects of this solution are: the flow channel is smooth, the fluid velocity is uniform throughout the flow channel, and the internal flow resistance is reduced, which increases the heat dissipation area while reducing the pressure drop, resulting in a more uniform temperature throughout the support surface.

[0025] Furthermore, the flow channel is higher at the inlet end than at the outlet end.

[0026] The beneficial effects of this solution are: after testing, the temperature of the support surface in this solution is more uniform, and the temperature control effect is better. Attached Figure Description

[0027] Figure 1 This is a perspective view of the present invention. Figure 2 This is a front view of the temperature control component in this new embodiment; Figure 3 for Figure 2 A three-dimensional image; Figure 4 for Figure 1 A three-dimensional view of the intermediate pressure fixture; Figure 5 for Figure 4 Installation diagram of the inner and outer cylinders; Figure 6 for Figure 4 Installation diagram of the inner cylinder and sleeve. Detailed Implementation

[0028] The following detailed description illustrates the specific implementation method: The reference numerals in the accompanying drawings include: outer shell 1, thermostatic component 2, water inlet pipe 21, water outlet pipe 22, slot 23, outer cylinder 3, threaded groove 31, longitudinal groove 32, limiting groove 33, inner cylinder 4, slider 41, buffer pad 5, sleeve 6, column 7, transverse part 8, and strip groove 81.

[0029] Example The implementation examples are basically as follows Figure 1 As shown, a temperature-controlled stage for testing the thermal resistance of small power devices includes a worktable, a temperature-controlled element 2, a rotating frame, and four pressure fixtures. The worktable includes a shell 1 and the temperature-controlled element 2. The temperature-controlled element 2 has a spiral flow channel inside, and the vertical projection of any part of the flow channel is an arc shape. Adjacent parts of the spiral flow channel are separated by thin plates to increase the flow channel area and improve the temperature control effect. The inner circumference of the flow channel has an inlet, and the outer circumference has an outlet. The end of the flow channel near the inlet is higher than the end near the outlet. In this embodiment, the inlet is connected to a water inlet pipe 21, and the outlet is connected to a water outlet pipe 22. The shell 1 has a circular cross-section in the horizontal direction. The opening of the shell 1 faces downward and covers the temperature-controlled element 2. The sidewall of the shell 1 is in contact with the temperature-controlled element 2, and the top of the shell 1 forms a support surface. The thermostat 2 has a slot 23 on its top, and a locking block is welded to the inner wall of the top of the outer shell 1. After the outer shell 1 is placed on the thermostat 2, the locking block is opposite to the slot 23 and located in the slot 23, so that there will be no relative rotation between the outer shell 1 and the thermostat 2 in this embodiment.

[0030] The rotating frame includes four uprights 7 and two transverse sections 8. The four uprights 7 are evenly distributed around the outer perimeter of the outer shell 1, with the sidewalls of the uprights 7 close to the outer shell 1. The two transverse sections 8 are arranged in a cross shape, with their ends welded to the four uprights 7. Therefore, in this design, the outer shell 1 limits the movement of the four uprights 7, allowing the rotating frame to rotate relative to the outer shell 1 without lateral translation. Each of the two transverse sections 8 has a strip groove 81 extending along its length, and the two strip grooves 81 are interconnected at their intersection. The vertical cross-section of the strip groove 81 is I-shaped, and the strip groove 81 penetrates the transverse section 8 vertically.

[0031] Each slot 81 is equipped with two pressure fixtures, located at opposite ends of the slot 81. Each pressure fixture includes an outer cylinder 3, an inner cylinder 4, and a sleeve 6. The upper part of the outer cylinder 3 has an annular groove that engages with the I-shaped slot 81, ensuring that the outer cylinder 3 slides along the slot 81 without vertically moving relative to the longitudinal support. The outer diameter of the inner cylinder 4 is smaller than the inner diameter of the outer cylinder 3, and the inner cylinder 4 is located inside the outer cylinder 3. The lower end of the inner cylinder 4 extends below the outer cylinder 3, and a sleeve-shaped buffer pad 5, made of rubber, is glued to the lower end of the inner cylinder 4. The lower end of the buffer pad 5 is located below the inner cylinder 4.

[0032] The lower part of the sleeve 6 is located between the inner cylinder 4 and the outer cylinder 3, and the upper end extends above the outer cylinder 3. The sleeve 6 is provided with two longitudinal grooves 32, which extend along the axial direction of the sleeve 6 and are respectively located on both sides of the sleeve 6. The upper and lower parts of the longitudinal grooves 32 are connected to the limiting grooves 33. Two sliders 41 are fixed to the inner wall of the inner cylinder 4. The ends of the two sliders 41 away from the outer cylinder 3 pass through the two longitudinal grooves 32 and can slide along the longitudinal grooves 32 and the limiting grooves 33.

[0033] The inner wall of the outer cylinder 3 is provided with two threaded grooves 31. Two sliders 41 extend to one end of the sleeve 6 and slide in cooperation with the two threaded grooves 31 respectively. When the outer cylinder 3 rotates relative to the sleeve 6, the sliders 41 slide along the longitudinal groove 32 and the limiting groove 33 under the action of the longitudinal groove 32, so as to realize the automatic upward or downward sliding of the inner cylinder 4.

[0034] The specific implementation process is as follows: Before testing, the heat-insulating fluid is introduced into the flow channel through the inlet pipe 21. In this embodiment, hot water is used as the heat-insulating fluid. The hot water enters the flow channel from the inlet and flows along the flow channel. Finally, it flows out from the outlet through the outlet pipe 22. The heat in the hot water is transferred to the support surface through the thermostat 2, so that the support surface maintains a certain temperature.

[0035] During testing, the low-power device under test is placed on the support surface. Then, based on the position of the low-power device, the pressure fixture closest to it is selected as the object to fix the device. The pressure fixture is then slid above the low-power device using a combination of rotating the rotating frame and sliding it along the strip groove 81. Finally, the outer cylinder 3 is rotated, causing the inner cylinder 4 to slide downwards until the buffer pad 5 presses onto the power device, thus fixing it in place.

[0036] After the test, the outer cylinder 3 is rotated in the opposite direction to the inner cylinder 4, causing the inner cylinder 4 to slide upward relative to the outer cylinder 3, thus releasing the low-power device. Throughout the entire process of fixing and releasing the low-power device, the inner cylinder 4 in this design will not rotate, which avoids the buffer pad 5 from rotating as it contacts and continues to press down on the low-power device, causing the low-power device to move with the buffer pad 5 and rub against the support surface.

[0037] The above descriptions are merely embodiments of this invention, and well-known technical solutions and / or characteristics are not described in detail here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the original technical solution, and these should also be considered within the scope of protection of this invention. These modifications will not affect the effectiveness of the implementation of this invention or the practicality of the patent. The scope of protection claimed in this application shall be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A constant temperature stage for testing the thermal resistance of low-power devices, characterized in that: It includes a worktable, a temperature control component, a rotating frame, and a press. The worktable has a support surface, the temperature control component is located below the support surface, the rotating frame can rotate relative to the support surface, and the press is located on the rotating frame and can slide laterally relative to the rotating frame.

2. The constant temperature stage for testing the thermal resistance of low-power devices according to claim 1, characterized in that: The worktable has a circular cross-section along the horizontal direction.

3. The constant temperature stage for testing the thermal resistance of low-power devices according to claim 2, characterized in that: The rotating frame includes a column and at least two horizontal sections. The rotating frame is provided with at least two strip slots, which correspond one-to-one with the horizontal sections. The press can be installed into any one of the strip slots.

4. The constant temperature stage for testing the thermal resistance of low-power devices according to claim 3, characterized in that: There are at least two presses, and each slot has at least one press.

5. The constant temperature stage for testing the thermal resistance of low-power devices according to claim 4, characterized in that: There are two horizontal sections, which are arranged in a cross shape. The strip grooves on the two horizontal sections are connected to each other at the intersection of the two horizontal sections.

6. The constant temperature stage for testing the thermal resistance of low-power devices according to claim 1, characterized in that: The press includes an inner cylinder and an outer cylinder, with the inner cylinder located inside the inner cylinder and extending out from the outer cylinder.

7. The constant temperature stage for testing the thermal resistance of low-power devices according to claim 6, characterized in that: The press also includes a limiting cylinder, the lower end of which is located between the inner cylinder and the outer cylinder, and the upper end extends to the outside of the outer cylinder. The limiting cylinder is provided with a longitudinal groove, which extends along the axial direction of the inner cylinder. The upper and lower parts of the longitudinal groove are connected to the limiting groove. The upper part of the inner cylinder is fixed with a slider that can slide along the longitudinal groove and the limiting groove. The inner wall of the outer cylinder is provided with a threaded groove. The side of the slider away from the inner cylinder is located in the threaded groove and can slide along the threaded groove.

8. A temperature-controlled stage for testing the thermal resistance of low-power devices according to claim 6 or 7, characterized in that: A sleeve-shaped cushioning pad is fixed to the lower end of the inner cylinder.

9. The constant temperature stage for testing the thermal resistance of low-power devices according to claim 1, characterized in that: The thermostatic component includes a spiral flow channel, and the vertical projection of any part of the flow channel is an arc shape. The flow channel has an inlet on its inner circumference and an outlet on its outer circumference.

10. The constant temperature stage for testing the thermal resistance of a low-power device according to claim 9, characterized in that: The flow channel is higher at the inlet end than at the outlet end.

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