An electronic device

Abstract

The present disclosure provides an electronic device, which can include a housing, a collection assembly and a heat dissipation assembly, the housing has an air inlet and an air outlet; the collection assembly is detachably connected with the housing, the collection assembly has a collection space, the collection space communicates with the internal space of the housing when the collection assembly is connected with the housing, and the inner wall of the collection space has adsorption capacity; the heat dissipation assembly is arranged in the internal space of the housing, and the heat dissipation assembly can change the flow direction of the airflow in the internal space of the housing, so that at least part of the airflow flows to the collection space.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] The host is the "brain" and "heart" of a computer, responsible for computing, storing, and running programs.

[0003] In related technologies, the air inlet of the host needs to be able to block dust. Usually, a dust filter is installed at the air inlet. The dust filter can block large particles, but its filtering effect on small particles is limited. Small particles enter the host with the airflow and gradually accumulate, which not only affects the heat dissipation efficiency of the host, but may also cause risks such as poor contact of electronic components and short circuits. Utility Model Content

[0004] This disclosure provides an electronic device, the technical solution of which is as follows:

[0005] To address the aforementioned technical problems, this disclosure provides an electronic device, which may include: a housing, a collection component, and a heat dissipation component. The housing has an air inlet and an air outlet. The collection component is detachably connected to the housing and has a collection space. When the collection component is connected to the housing, the collection space communicates with the internal space of the housing, and the inner wall of the collection space has adsorption capacity. The heat dissipation component is disposed inside the housing and is capable of changing the airflow direction inside the housing so that at least a portion of the airflow flows to the collection space.

[0006] In some embodiments, the heat dissipation component includes: a cooling fan having a first operating state and a second operating state; in the first operating state, the cooling fan rotates along a target direction; in the second operating state, the cooling fan rotates in a direction opposite to the target direction and directs airflow toward the collection space, wherein the rotational speed of the cooling fan in the second operating state is less than the rotational speed in the first operating state.

[0007] In some embodiments, the housing is formed by a plurality of plates, including a first plate, the first plate having a plurality of through holes; the collection assembly includes: a collection box having a collection space with an opening, the collection box being detachably connected to the first plate corresponding to the outer side of the housing, and when connected to the first plate, the opening and the plurality of through holes are opposite to and communicate with each other.

[0008] In some embodiments, the electronic device further includes: a first slide structure, a second slide structure, and a brush structure. The first slide structure is disposed on the first plate and extends along a first direction parallel to the first plate. The second slide structure is disposed on the collection box and is slidably connected to the first slide structure to enable the collection box to be disassembled from the housing. The brush structure is disposed at the opening, and the collection box slides back and forth along the first direction so that the brush head of the brush structure can brush the side of the first plate facing away from the housing.

[0009] In some embodiments, the collection assembly further includes an adsorption coating disposed on the inner wall of the collection box, the adsorption coating having electrostatic adsorption capability.

[0010] In some embodiments, the first plate protrudes away from the internal space of the housing and forms a target portion. The target portion is located on one side of the collection box and is provided with the air inlet and a channel connecting the air inlet and the internal space of the housing. The air inlet is located on one side of the target portion in the thickness direction.

[0011] In some embodiments, the air inlet is located on the side of the target portion facing away from the collection box.

[0012] In some embodiments, the heat dissipation assembly further includes: a mounting mesh plate, the mounting mesh plate being disposed on one side of the first plate corresponding to the internal space of the housing and being arranged parallel to the first plate; wherein, a plurality of the heat dissipation fans are disposed on the mounting mesh plate.

[0013] In some embodiments, the electronic device further includes: a sensing component and an electronic component, the sensing component being disposed outside the housing and used to sense the connection status between the collecting component and the housing; the electronic component being signal-connected to the cooling fan and the sensing component, and controlling the cooling fan to change its rotation direction when the sensing component senses that the collecting component is connected to the housing.

[0014] In some embodiments, the electronic device further includes a control switch, which is signal-connected to the cooling fan and used to control the cooling fan to switch between the target direction and the direction opposite to the target direction.

[0015] The above description is only an overview of the technical solution of this disclosure. In order to better understand the technical means of this disclosure and to implement it in accordance with the contents of the specification, the preferred embodiments of this disclosure are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 Schematic diagram of the structure of the electronic device provided in this disclosure Figure 1 ;

[0018] Figure 2 Schematic diagram of the structure of the electronic device provided in this disclosure Figure 2 ;

[0019] Figure 3 An exploded view of the electronic device provided in this disclosure;

[0020] Figure 4 A schematic diagram of the structure of the collection component of the electronic device provided in this disclosure;

[0021] Figure 5 This is a partial structural diagram of the heat dissipation assembly of the electronic device provided in this disclosure;

[0022] Figure 6 This is a schematic diagram of the air inlet side of the electronic device provided in this disclosure;

[0023] Figure 7 This is a schematic diagram of the air outlet side of the electronic device provided in this disclosure.

[0024] Explanation of reference numerals in the attached figures:

[0025] 10. Electronic device; 11. Housing; 111. Air inlet; 112. Air outlet; 113. Plate; 114. Internal space; 115. First plate; 1151. Through hole; 1152. Target part; 12. Collection assembly; 121. Collection space; 122. Collection box; 1221. Handle; 123. Opening; 13. Heat dissipation assembly; 131. Cooling fan; 1311. Cover; 1312. Fan blade; 132. Mounting mesh plate; 14. First slide structure; 141. First track; 142. Second track; 15. Second slide structure; 151. First sliding part; 152. Second sliding part; 16. Brush structure. Detailed Implementation

[0026] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0027] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0028] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0029] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0030] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0031] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0032] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0033] The host is the "brain" and "heart" of a computer, responsible for computing, storing, and running programs.

[0034] In related technologies, the air inlet of the host needs to be able to block dust. Usually, a dust filter is installed at the air inlet. The dust filter can block large particles, but its filtering effect on small particles is limited. Small particles enter the host with the airflow and gradually accumulate, which not only affects the heat dissipation efficiency of the host, but may also cause risks such as poor contact of electronic components and short circuits.

[0035] The inventors of this disclosure have discovered that an electronic device can be provided. The electronic device can be a host, and it can include: a housing, a collection component, and a heat dissipation component. The housing can be the outer shell of the host, and the housing can be provided with an air inlet and an air outlet, so that external airflow can enter the housing through the air inlet and then be discharged through the air outlet, thereby reducing the temperature inside the housing. The collection component is detachably connected to the housing, and when connected, the collection space of the collection component is connected to the internal space of the housing, and the collection space is provided with a material or structure capable of adsorbing particulate matter. The heat dissipation component is disposed inside the housing and can at least allow airflow to flow to the collection space. During the operation of the heat dissipation component, the airflow inside the housing can flow to the collection space, so that small particles inside the housing are sent into the collection space through the airflow through the connection between the housing and the collection space and are adsorbed in the collection space. In this way, the probability of particulate matter accumulating in the internal space of the host can be reduced, thereby reducing the impact of particulate matter on the heat dissipation efficiency of the host and electronic components.

[0036] This disclosure provides an electronic device 10, see [link to relevant documentation] Figures 1 to 7The electronic device 10 may include: a housing 11, a collection component 12, and a heat dissipation component 13. The housing 11 has an air inlet 111 and an air outlet 112. The collection component 12 is detachably connected to the housing 11 and has a collection space 121. When the collection component 12 is connected to the housing 11, the collection space 121 communicates with the internal space 114 of the housing 11. The inner wall of the collection space 121 has an adsorption capacity. The heat dissipation component 13 is disposed inside the housing 11 and can change the airflow direction inside the housing 11 so that at least part of the airflow flows to the collection space 121.

[0037] The housing 11 can be an outer shell with an internal space 114 formed by multiple plates 113. For example, the housing 11 is formed by six plates 113 forming a cuboid shape. The plates 113 can be made of metal so that the plates 113 have thermal conductivity and can quickly conduct heat inside the housing 11 to themselves and dissipate it to the outside of the housing 11, thereby improving the heat dissipation efficiency of the electronic device 10. The housing 11 is provided with an air inlet 111 and an air outlet 112. The air inlet 111 is used to allow airflow to enter the internal space 114 of the housing 11 through the air inlet 111, and the air outlet 112 is used to allow the airflow in the internal space 114 of the housing 11 to be discharged to the outside of the housing 11 through the air outlet 112. The air inlet 111 and the air outlet 112 can be provided on the same plate 113 or on different plates 113. The height of the air inlet 111 and the air outlet 112 on the housing 11 may be the same or different. The air inlet 111 and / or the air outlet 112 can be arranged in multiple rows and columns in a regular manner or in an irregular manner.

[0038] The collecting component 12 can be detachably connected to the housing 11 via sliding connection, snap-fit ​​connection, screw connection, or other connection methods, enabling both connection and separation. When the collecting component 12 is connected to the housing 11, its collecting space 121 communicates with the internal space 114 of the housing 11. This communication allows particles in the internal space 114 of the housing 11 to be drawn into the collecting space 121 by external force (such as airflow provided by the heat dissipation component 13). The collected particles can then be emptied from the collecting space 121 by separating the collecting component 12 from the housing 11. The inner wall of the collecting space 121 has adsorption capacity; it can be provided with materials or structures capable of adsorbing particles.

[0039] The heat dissipation component 13 is disposed in the internal space 114 of the housing 11 and can generate airflow. The direction of the airflow can be directed towards the collection space 121 so that particulate matter in the internal space 114 of the housing 11 can enter the collection space 121. The airflow generated by the heat dissipation component 13 can also be directed towards the internal space 114 of the housing 11 so as to drive the gas in the air inlet 111 to the air outlet 112, thereby accelerating the rapid discharge of high temperature in the internal space 114 of the housing 11 and improving the heat dissipation efficiency of the electronic device 10. Here, the heat dissipation component 13 can switch its operation. Before switching, the airflow direction output by the heat dissipation component 13 changes. Before switching, the airflow flows towards the collection space 121, and after switching, the airflow flows towards the internal space 114 of the housing 11. Thus, during the operation of the electronic device 10, the airflow can be set to flow towards the internal space 114 of the housing 11 to meet the cooling requirements of the electronic device 10. When the electronic device 10 is about to stop working, the airflow can be set to flow towards the collection space 121 to clean the particulate matter in the internal space 114 of the housing 11.

[0040] See one example. Figures 1 to 7 Electronic device 10 is the host of a computer. Electronic device 10 may include: housing 11, collection component 12 and heat dissipation component 13. Housing 11 is the outer shell of the host. Housing 11 has an air inlet 111 and an air outlet 112. When housing 11 is aligned, the position of air inlet 111 is lower than the position of air outlet 112 to conform to the natural rising law of hot air. Collection component 12 is detachably connected to housing 11. Collection component 12 has a collection space 121. When collection component 12 is connected to housing 11, collection space 121 is connected to the internal space 114 of housing 11. The inner wall of collection space 121 has adsorption capacity. Heat dissipation component 13 (including cooling fan 131, etc.) is disposed inside housing 11. Heat dissipation component 13 can deliver airflow to the internal space 114 of housing 11 and can also deliver airflow to collection space 121 so that at least part of the airflow flows to collection space 121. Specifically, when the electronic device 10 receives a power-off command or the heat dissipation component 13 receives a stop-work command, the heat dissipation component 13 can be triggered to switch from the state of supplying airflow to the internal space 114 of the housing 11 to the state of supplying airflow to the collection space 121, so as to complete the cleaning of particulate matter inside the housing 11; here, the cleaning time can also be limited by the control program to clean as many particulate matter as possible.

[0041] In this embodiment, the electronic device 10 can be a host device, which includes a housing 11, a collection component 12, and a heat dissipation component 13. The housing 11 can serve as the outer cover of the host device, and is provided with an air inlet 111 and an air outlet 112, so that external air can enter the housing 11 through the air inlet 111 and be discharged through the air outlet 112, thereby achieving cooling of the interior of the housing 11. The collection component 12 is detachably connected to the housing 11. When it is connected to the housing 11, the collection space 121 of the collection component 12 is connected to the internal space 114 of the housing 11, and the collection space 121 is provided with materials or structures for adsorbing particulate matter. The heat dissipation component 13 is disposed inside the housing 11 and can guide the airflow toward the collection space 121. During the operation of the heat dissipation component 13, the airflow inside the housing 11 can be guided to the collection space 121, so that particulate matter inside the housing 11 can enter the collection space 121 through the communication between the housing 11 and the collection space 121 and be captured by the adsorption material therein. This reduces the likelihood of particulate matter accumulating inside the host, thereby minimizing its adverse effects on heat dissipation and the normal operation of electronic components.

[0042] In some embodiments, see Figure 1 and Figure 5 The heat dissipation component 13 may include a cooling fan 131, which has a first working state and a second working state. In the first working state, the cooling fan 131 rotates along a target direction. In the second working state, the cooling fan 131 rotates in a direction opposite to the target direction and directs airflow toward the collection space 121. The rotational speed of the cooling fan 131 in the second working state is less than that in the first working state.

[0043] Cooling fan 131, which can be like Figure 5 The device shown has a cover 1311, a rotating shaft, and a fan blade 1312. The cover 1311 can be fixedly connected to the internal structure of the housing 11. The cover 1311 can be provided with an air inlet and an air outlet. The rotating shaft can be connected to the cover 1311 and can rotate relative to the cover 1311. The fan blade 1312 is connected to the rotating shaft and can rotate with the rotation of the rotating shaft, so as to drive the air inlet and the air outlet to generate airflow and send it to the internal space 114 of the housing 11 or the collection space 121 of the collection assembly 12.

[0044] The cooling fan 131 can have a first operating state and a second operating state. In the first operating state, the cooling fan 131 rotates in a target direction (e.g., clockwise) to direct the airflow from the outlet to the internal space 114 of the housing 11, and finally out through the outlet 112 or out of the housing 11 itself, thereby cooling the electronic device 10. In the second operating state, the cooling fan 131 rotates in the opposite direction to the target direction (e.g., counterclockwise) to direct the airflow from the outlet to the collection space 121, thereby clearing particulate matter from the housing 11 into the collection space 121. The rotational speed of the cooling fan 131 in the second operating state is lower than that in the first operating state. This can be achieved by reducing the rotational speed of the shaft, which can be achieved by reducing the output power of the motor or other structures supplied to the shaft.

[0045] In this embodiment, by changing the rotation direction of the cooling fan 131, the internal temperature of the housing 11 can be cooled before the change, and the internal particulate matter of the housing 11 can be cleaned after the change, so that the cooling fan 131 integrates the two functions of cooling and cleaning particulate matter. In addition, the rotation speed of the cooling fan 131 in the second working state of cleaning particulate matter is lower than the rotation speed in the first working state of cooling function, so as to reduce energy consumption and extend the service life of the cooling fan 131.

[0046] In some embodiments, see Figures 1 to 3 The housing 11 is surrounded by multiple plates 113, including a first plate 115. The first plate 115 is provided with multiple through holes 1151. The collection assembly 12 may include a collection box 122, which is provided with a collection space 121 with an opening 123. The collection box 122 is detachably connected to the first plate 115 on the outside of the housing 11. When connected to the first plate 115, the opening 123 and the multiple through holes 1151 are opposite to and communicate with each other.

[0047] The multiple through holes 1151 provided on the first plate 115 can be arranged in a manner that allows for... Figure 3 The regular arrangement of multiple rows and columns shown can also be irregular. The apertures of the multiple through holes 1151 provided on the first plate 115 can be the same or different; the through holes 1151 are channels for particles in the internal space 114 of the shell 11 to enter the collection space 121. Therefore, the aperture of any through hole 1151 is larger than the particle size.

[0048] Collection box 122 can be as follows Figure 4The structure shown, consisting of five plates forming an opening 123, can also be other structural components. At least one plate can be made of a transparent material so that the user can visually see whether the collection space 121 is full of particles. If it is full, the collection box 122 can be detached for emptying. When the collection box 122 is connected to the outside of the first plate 115, the opening 123 of the collection box 122, projected onto the first plate 115, covers multiple through holes 1151, connecting the internal space 114 of the housing 11 and the collection space 121 of the collection box 122 through the multiple through holes 1151.

[0049] In this embodiment, the shell 11 is formed by multiple plates 113. The manufacturing process of the plates 113 is mature, which enables the mass production of the shell 11. Among the multiple plates 113 of the shell 11, there is a first plate 115. The first plate 115 is provided with multiple through holes 1151. The collection box 122 is detachably connected to the first plate 115. When connected, the opening 123 of the collection box 122 is opposite to the multiple through holes 1151, so as to realize the communication between the collection box 122 and the internal space 114 of the shell 11.

[0050] In some embodiments, see Figures 2 to 4 The electronic device 10 may further include: a first slide structure 14, a second slide structure 15, and a brush structure 16. The first slide structure 14 is disposed on the first plate 115, and the first slide structure 14 is along a first direction (e.g., Figure 2 The first direction extends in the X direction and is parallel to the first plate 115; the second slide structure 15 is disposed on the collection box 122 and is slidably connected to the first slide structure 14 to realize the assembly and disassembly of the collection box 122 and the shell 11; the brush structure 16 is disposed in the opening 123, and the collection box 122 slides back and forth along the first direction so that the brush head of the brush structure 16 can brush the side of the first plate 115 facing away from the internal space 114 of the shell 11.

[0051] See Figures 2 to 4The first slide structure 14 may include a first track 141 and a second track 142, both parallel to the first plate 115, and the first track 141 and the second track 142 are parallel to each other. The second slide structure 15 may include a first sliding part 151 slidably connected to the first track 141 and a second sliding part 152 slidably connected to the second track 142. Thus, with the cooperation of the first slide structure 14 and the second slide structure 15, the collection box 122 can slide relative to the housing 11, and connect or separate from the housing 11 after sliding, thereby realizing a detachable connection between the collection component 12 and the housing 11. The sliding setting allows for convenient operation. Here, a handle 1221 may be provided on the outside of the collection box 122 so that the user can grasp the handle 1221 and apply a sliding force to the handle 1221, thereby realizing the sliding of the collection box 122 relative to the housing 11.

[0052] The opening 123 of the collection box 122 is equipped with a brush structure 16. During the sliding process of the collection box 122 relative to the housing 11 (sliding connection or sliding separation), it can brush the surface of the housing 11 corresponding to the opening 123 of the collection box 122 (i.e., the outer surface of the first plate 115), reducing the probability of particles adhering to this surface connecting with each other and clogging the through hole 1151. This allows the through hole 1151 to remain unobstructed, ensuring smooth cleaning. Figure 3 and Figure 4 As shown, the length direction of the brush structure 16 can be perpendicular to the first direction to increase the brushing area of ​​the brush structure 16. The number of brush structures 16 can be multiple and they are opposite to different positions on the outside of the first plate 115 so that the outside of the first plate 115 can be brushed multiple times during a single sliding process between the collection box 122 and the first plate 115, thereby improving the brushing effect.

[0053] In some embodiments, the collection component 12 further includes an adsorption coating disposed on the inner wall of the collection box 122, the adsorption coating having electrostatic adsorption capability.

[0054] The adsorption coating can be fixed to the inner wall of the collection box 122 by means of bonding or other methods. It can be made of materials with electrostatic adsorption function, such as polypropylene, polytetrafluoroethylene, etc. It is permanently charged by corona charging or thermal polarization. After the particles enter the collection space 121 through the through hole 1151, they will be polarized by the electrostatic field and subjected to the Coulomb force, thus being firmly adsorbed on the surface of the adsorption coating. This can effectively prevent the particles that have entered the collection space 121 from entering the internal space 114 of the shell 11 through the through hole 1151 again.

[0055] In some embodiments, see Figure 2 and Figure 3The first plate 115 protrudes in a direction away from the internal space 114 of the housing 11 and forms a target portion 1152. The target portion 1152 is located on one side of the collection box 122, and the target portion 1152 is provided with an air inlet 111 and a channel connecting the air inlet 111 and the internal space 114 of the housing 11. The air inlet 111 is located on one side of the thickness direction of the target portion 1152.

[0056] In other words, the target part 1152 and the collection box 122 can both be connected to the first plate 115. After the electronic device 10 is positioned correctly (i.e., the electronic device 10 is positioned correctly according to the designed left-right-front-back orientation), the first plate 115 can correspond to the bottom of the electronic device 10, so that the target part 1152 and the collection box 122 can both be hidden at the bottom of the electronic device 10, thereby improving the visual effect of the electronic device 10.

[0057] In some embodiments, see Figures 1 to 3 The air inlet 111 is located on the side of the target portion 1152 facing away from the collection box 122. This reduces the obstruction of the air inlet 111 by the collection box 122, allowing more airflow to enter the internal space 114 of the housing 11 through the air inlet 111 and be discharged through the air outlet 112, thereby effectively reducing the temperature of the internal space 114 of the housing 11.

[0058] See here. Figure 3 As shown, the surface of the air inlet 111 can be perpendicular to the surface of the air outlet 112, and the target portion 1152 has a groove structure on one side corresponding to the internal space 114 of the housing 11. The air inlet 111 communicates with the internal space 114 of the housing 11 through the interior of the groove structure. Thus, after the airflow enters through the air inlet 111, the flow direction changes vertically within the groove structure and flows towards the air outlet 112. This design allows dust to accumulate in the groove structure after entering through the air inlet 111, and the dust in the groove structure can be periodically cleaned to reduce the probability of dust directly entering the internal space 114 of the housing 11.

[0059] In some embodiments, see Figure 1 and Figure 5 The heat dissipation assembly 13 may also include: a mounting mesh plate 132, which is disposed on one side of the first plate 115 corresponding to the internal space 114 of the housing 11 and is disposed parallel to the first plate 115; and a plurality of cooling fans 131 are disposed on the mounting mesh plate 132.

[0060] The mounting mesh plate 132 has an opening that connects the through hole 1151 and the internal space 114 of the housing 11. The airflow delivered by the cooling fan 131 connected to the mounting mesh plate 132 can enter the collection space 121 through the opening and through hole 1151, or directly enter the internal space 114 of the housing 11.

[0061] In this embodiment, multiple cooling fans 131 are mounted on the mounting mesh plate 132 to improve the integration of the multiple cooling fans 131. The openings on the mounting mesh plate 132 connect the cooling fans 131 and the through holes 1151 to reduce interference with the cleaning process of particulate matter inside the housing 11.

[0062] In some embodiments, the electronic device 10 may further include: a sensing component and an electronic component, wherein the sensing component is disposed outside the housing 11 and is used to sense the connection status between the collecting component 12 and the housing 11; the electronic component is signal-connected to the cooling fan 131 and the sensing component, and controls the cooling fan 131 to change its rotation direction when the sensing component senses that the collecting component 12 is connected to the housing 11.

[0063] The sensing component can be an image acquisition component, a pressure acquisition component, or other structures.

[0064] In one example, the sensing component is an image acquisition component, which can acquire images of the location of the collection component 12. The electronic component can then determine whether the collection component 12 is connected to the housing 11 based on the image. The electronic component (such as a processor) can control the cooling fan 131 to be in a first working state, causing the cooling fan 131 to rotate in the target direction to deliver air to the internal space 114 of the housing 11, thereby cooling the electronic device 10. When it is necessary to clean the particulate matter in the internal space 114 of the housing 11, the user can send a cleaning command to the electronic component. At this time, the electronic component can first determine that the collection component 12 is connected to the housing 11 through the image acquisition component, and then control the change of the rotation direction of the cooling fan 131 to switch the cooling fan 131 to a second working state and clean the particulate matter inside the housing 11.

[0065] In one example, the sensing component is a pressure acquisition component (such as a displacement sensor, strain gauge sensor, etc.). The pressure acquisition component squeezes the collection box 122 and can acquire the squeezing force of the collection box 122. If the acquired squeezing force is the first squeezing force, the collection box 122 is connected to the housing 11; if the acquired squeezing force is the second squeezing force, the collection box 122 is not connected to the housing 11, and the second squeezing force is less than the first squeezing force. The electronic component (such as a processor, etc.) can control the cooling fan 131 to be in a first working state, so that the cooling fan 131 rotates in the target direction to provide power to the housing 11. Air is supplied to the internal space 114 to cool the electronic device 10. When it is necessary to clean the particulate matter in the internal space 114 of the housing 11, the user can send a cleaning command to the electronic component. At this time, the electronic component can first determine that the collecting component 12 is connected to the housing 11 through the pressure acquisition component, and then control the change of the rotation direction of the cooling fan 131, so that the electronic component controls the cooling fan 131 to switch to the second working state, and cleans the particulate matter in the housing 11.

[0066] In this embodiment, before cleaning the particulate matter inside the housing 11, the sensing component can be used to confirm whether the collecting component 12 is connected to the housing 11. If it is confirmed that the collecting component 12 is connected to the housing 11, the electronic component can be used to control the rotation direction of the cooling fan 131 to clean the particulate matter inside the housing 11, thereby reducing the probability that the particulate matter discharged from the housing 11 will fall onto the ground or other surfaces outside the housing 11 and require further cleaning.

[0067] In some embodiments, the electronic device 10 may further include a control switch, which is signal-connected to the cooling fan 131 and used to control the cooling fan 131 to switch between a target direction and a direction opposite to the target direction.

[0068] The control switch can be a physical button, a touch surface, or any other control switch that can be connected to the cooling fan 131 and control the rotation direction of the cooling fan 131. The user can observe whether the collection component 12 is connected to the housing 11, and if the collection component 12 is connected to the housing 11, the user can operate the control switch to change the rotation direction of the cooling fan 131 to clean the particulate matter inside the housing 11.

[0069] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0070] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.

Claims

1. An electronic device, characterized in that, include: A housing having an air inlet and an air outlet; A collection component is detachably connected to the housing. The collection component has a collection space. When the collection component is connected to the housing, the collection space communicates with the internal space of the housing. The inner wall of the collection space has an adsorption capacity. A heat dissipation component is disposed inside the housing, and the heat dissipation component is capable of changing the airflow direction inside the housing so that at least part of the airflow flows to the collection space.

2. The electronic device according to claim 1, characterized in that, The heat dissipation component includes: A cooling fan, the cooling fan having a first working state and a second working state; In the first operating state, the cooling fan rotates along the target direction; In the second operating state, the cooling fan rotates in the opposite direction to the target direction and directs the airflow toward the collection space. The speed of the cooling fan in the second operating state is less than the speed in the first operating state.

3. The electronic device according to claim 2, characterized in that, The shell is formed by multiple plates, including a first plate, and the first plate has multiple through holes. The collection component includes: a collection box having an open collection space, the collection box being detachably connected to the first plate corresponding to the outer side of the housing, and when connected to the first plate, the opening and the plurality of through holes being opposite to and communicating with each other.

4. The electronic device according to claim 3, characterized in that, The electronic device also includes: A first slide rail structure is disposed on the first plate, and the first slide rail structure extends along a first direction, which is parallel to the first plate. The second slide structure is disposed on the collection box and is slidably connected to the first slide structure to realize the assembly and disassembly of the collection box and the shell. A brush structure is provided at the opening, and the collection box slides back and forth along the first direction so that the brush head of the brush structure can brush the side of the first plate facing away from the internal space of the housing.

5. The electronic device according to claim 3, characterized in that, The collection component also includes: An adsorption coating is disposed on the inner wall of the collection box, and the adsorption coating has electrostatic adsorption capability.

6. The electronic device according to claim 3, characterized in that, The first plate protrudes away from the internal space of the housing and forms a target portion. The target portion is located on one side of the collection box and is provided with the air inlet and a channel connecting the air inlet and the internal space of the housing. The air inlet is located on one side of the target portion in the thickness direction.

7. The electronic device according to claim 6, characterized in that, The air inlet is located on the side of the target portion facing away from the collection box.

8. The electronic device according to claim 3, characterized in that, The heat dissipation component also includes: The mounting mesh plate is disposed on one side of the first plate corresponding to the internal space of the shell and is arranged parallel to the first plate. Multiple cooling fans are mounted on the mounting mesh plate.

9. The electronic device according to claim 2, characterized in that, The electronic device also includes: A sensing component is disposed outside the housing and is used to sense the connection status between the collecting component and the housing; An electronic component is connected to the cooling fan and the sensing component, and controls the cooling fan to change its rotation direction when the sensing component detects that the collecting component is connected to the housing.

10. The electronic device according to claim 2, characterized in that, The electronic device also includes: A control switch is connected to the cooling fan via a signal and is used to control the cooling fan to switch between the target direction and the opposite direction.

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