A server GPU card uses a heat dissipation back plate

Abstract

The embodiment of the present disclosure provides a kind of server GPU card with heat dissipation backboard, including: heat dissipation substrate, heat-conducting gasket, heat dissipation fin, fixed support, connecting notch and heat dissipation channel, the heat dissipation substrate is attached with GPU card, the heat-conducting gasket is located between heat dissipation substrate and GPU card to enhance heat conduction;The heat dissipation fin is arranged on the back of heat dissipation substrate;The fixed support is fixedly connected to the two sides of heat dissipation substrate to realize;The connecting notch is located at the edge of heat dissipation substrate and matches with the interface slot of GPU card;The heat dissipation channel is arranged inside heat dissipation substrate, wherein the surface of the heat dissipation substrate in contact with GPU card is provided with micro rib array, and the micro rib array is periodically arranged in the edge area of heat dissipation substrate, wherein the edge of the heat dissipation substrate is provided with a plurality of dot-shaped convex structures.The scheme of the embodiment of the present disclosure can improve the local compression fit heat conduction efficiency.

Description

Technical Field

[0001] This application relates to the field of electronic heat dissipation technology, specifically to a heat dissipation backplate for server GPU cards. Background Technology

[0002] A server GPU card heatsink backplate is a component installed on the back of the GPU chip to improve heat dissipation efficiency. Its main function is to quickly conduct the heat generated by the GPU during operation to an external heat dissipation structure through thermally conductive materials, thereby reducing the chip temperature and ensuring stable operation of the device. However, in practical applications, unevenness or air gaps in the press-fit contact surface in some areas may limit heat conduction efficiency and affect the overall heat dissipation performance. Summary of the Invention

[0003] In view of this, the present disclosure provides a heat dissipation backplate for server GPU cards, which at least partially solves the problems existing in the prior art.

[0004] This application discloses a heat dissipation backplate for a server GPU card, comprising: a heat dissipation substrate, thermal pads, heat dissipation fins, a mounting bracket, a connecting slot, and a heat dissipation channel. The heat dissipation substrate is attached to the GPU card, and the thermal pads are disposed between the heat dissipation substrate and the GPU card to enhance heat conduction. The heat dissipation fins are disposed on the back of the heat dissipation substrate. The mounting bracket is fixedly connected to both sides of the heat dissipation substrate. The connecting slot is disposed on the edge of the heat dissipation substrate and matches the interface slot of the GPU card. The heat dissipation channel is disposed inside the heat dissipation substrate. The surface of the heat dissipation substrate that contacts the GPU card is provided with a micro-rib array, which is periodically arranged in the edge region of the heat dissipation substrate. The edge of the heat dissipation substrate is provided with multiple dot-shaped protrusions, which are located between the micro-rib arrays and have a height less than the height of the micro-rib arrays. Both the micro-rib array and the dot-shaped protrusions are concave-convex structures and are arranged sequentially along the mounting direction of the GPU card.

[0005] According to one embodiment, the surface of the heat dissipation substrate that contacts the GPU card is provided with a micro-rib array, and the micro-rib array is arranged in a straight line along the GPU card mounting direction.

[0006] According to one embodiment, the microrib array is a uniform height structure, and the height of the dot-shaped protrusion structure is 5mm to 1mm lower than the height of the microrib array.

[0007] According to one embodiment, the dotted protrusion structure is a cylindrical protrusion and is distributed in the gaps between the microrib array.

[0008] According to one embodiment, the micro-rib array and the dot-shaped protrusion structure are made of the same material as the heat dissipation substrate, which is aluminum. The micro-rib array and the dot-shaped protrusion structure are formed by laser processing.

[0009] According to one embodiment, the edge region of the heat dissipation substrate is provided with a recessed groove, and the micro-rib array is disposed in the recessed groove.

[0010] According to one embodiment, the thermal pad includes a silicone layer and a copper foil layer, the copper foil layer being adhered to the surface of the heat dissipation substrate.

[0011] According to one embodiment, the fixing bracket is provided with multiple screw holes for threaded connection with the mounting holes of the chassis.

[0012] According to one embodiment, the connection slot is provided with a guide ramp to assist in the insertion of the GPU card.

[0013] According to one embodiment, the heat dissipation channel includes at least two staggered flow channels to enhance air circulation efficiency.

[0014] This disclosure provides a heatsink backplate for a server GPU card, comprising: a heatsink substrate, thermal pads, heatsink fins, a mounting bracket, a connection slot, and a heat dissipation channel. The heatsink substrate is attached to the GPU card, and the thermal pads are disposed between the heatsink substrate and the GPU card to enhance heat conduction. The heatsink fins are disposed on the back of the heatsink substrate. The mounting bracket is fixedly connected to both sides of the heatsink substrate. The connection slot is located at the edge of the heatsink substrate and matches the interface slot of the GPU card. The heat dissipation channel is disposed inside the heatsink substrate. The surface of the heatsink substrate in contact with the GPU card has a micro-rib array, which is periodically arranged in the edge region of the heatsink substrate. The edge of the heatsink substrate has multiple dot-shaped protrusions located between the micro-rib arrays and with a height less than the height of the micro-rib arrays. Both the micro-rib array and the dot-shaped protrusions are concave-convex structures and are arranged sequentially along the mounting direction of the GPU card. This disclosure solves the problem of improving the efficiency of localized pressure-fit heat conduction. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the exemplary embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a front view of the overall structure of this utility model;

[0017] Figure 2 This is a bottom view of the overall structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the internal structure of the heat dissipation substrate in this utility model;

[0019] Figure 4 In this utility model Figure 1 Enlarged view of point A in the middle.

[0020] In the diagram: 1. Heat dissipation substrate; 11. Micro-rib array; 12. Dot-shaped raised structure; 2. Thermal pad; 21. Silicone layer; 22. Copper foil layer; 3. Heat dissipation fins; 4. Fixing bracket; 41. Screw hole; 5. Connecting slot; 51. Guide slope; 6. Heat dissipation channel; 61. Flow channel; 7. Recessed groove Detailed Implementation

[0021] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0022] like Figures 1-4As shown, a heat dissipation backplate for a server GPU card according to this application includes a heat dissipation substrate 1, a thermal pad 2, a heat dissipation fin 3, a fixing bracket 4, a connecting slot 5, and a heat dissipation channel 6. The structure together achieves the functions of efficient heat conduction and stable installation. The heat dissipation substrate 1, as the core component of the entire heat dissipation backplate, is in direct contact with the GPU card, supporting other heat dissipation components and conducting heat. Its surface features a micro-rib array 11, which enhances the contact area with the GPU card and local heat conduction efficiency through periodic arrangement, while reducing the impact of air gaps. Furthermore, the heat dissipation substrate 1 has multiple dot-shaped protrusions 12 along its edges. These structures are located between the micro-rib arrays 11 and are lower than the micro-rib arrays 11, thus avoiding damage caused by stress concentration during assembly and ensuring that the micro-rib arrays 11 effectively conform to the GPU card surface. The heat dissipation substrate 1 has internal heat dissipation channels 6, which guide airflow through specific internal channels, improving heat dissipation efficiency. The heat dissipation substrate 1 also has a connection slot 5, which matches the GPU card's interface slot for quick docking and positioning, ensuring accurate and reliable installation. Heat dissipation fins 3 are located on the back of the heat dissipation substrate 1, increasing surface area for further heat dissipation. Fixing brackets 4 are fixed to both sides of the heat dissipation substrate 1, used to securely install the entire backplate into the server chassis, enhancing overall structural stability.

[0023] The thermal pad 2 is located between the heat dissipation substrate 1 and the GPU card, and serves to fill the gap between the two to improve the heat conduction efficiency. The thermal pad 2 is usually made of materials with good thermal conductivity, such as graphite pads or phase change materials, to compensate for the situation where the contact surfaces are not completely in contact. Through compression or embedded design, the pad can effectively fill the micro-uneven areas and improve the heat conduction effect under local pressure.

[0024] Heat sink fins 3 are located on the back of the heat sink substrate 1. They utilize their ability to increase the heat dissipation area to quickly dissipate the heat conducted from the GPU card to the external environment. Heat sink fins 3 are usually made of metal materials such as aluminum alloy or copper. The surface can be designed to be corrugated or needle-like to increase the air contact area. In conjunction with the air duct system or other heat dissipation components, the heat dissipation capacity is further enhanced.

[0025] The mounting bracket 4 is fixed to both ends of the heat dissipation base plate 1 and is used to connect and support the entire heat dissipation backplate. It is usually designed as an L-shaped or C-shaped structure and equipped with screw holes or other fixing methods to facilitate fixing to the mounting parts of the server chassis. This structure not only ensures the installation is firm, but also helps the heat dissipation base plate 1 to cooperate stably with other mechanical components.

[0026] The connection slot 5 is designed on the edge of the heat sink 1 and matches the shape of the GPU card's interface slot, so that the GPU card can be precisely embedded into the corresponding position of the heat sink backplate. This structure reduces the difficulty of manual insertion and removal through geometric matching and guiding design, while also ensuring installation stability and electrical connection reliability during long-term operation.

[0027] The heat dissipation channel 6 is located inside the heat dissipation substrate 1 and consists of multiple through-flow channels 61, which are used to guide the cooling air to flow evenly on the surface and inside of the heat dissipation substrate 1. This structure can be manufactured by CNC machining or injection molding, and the airflow direction and velocity can be optimized by combining thermodynamic simulation design. This design helps to enhance airflow efficiency, reduce local hot spots, and improve overall heat dissipation performance.

[0028] This application enhances the local pressure fit heat conduction efficiency between the GPU card and the heat sink substrate 1 by combining a micro-rib array 11 with a dot-shaped protrusion structure 12. The high-density arrangement of the micro-rib array 11 expands the contact area and increases the physical fit between the two by using the concave-convex structure, reducing the thermal resistance caused by interface unevenness. The dot-shaped protrusion structure 12 reduces the risk of excessive compression or uneven force during assembly while maintaining the function of the micro-rib structure. The two work together to improve the stability of heat conduction. At the same time, by rationally designing the heat dissipation channel 6 inside the heat sink substrate 1 and the heat dissipation fin 3 on the outer surface, the heat dissipation efficiency of the entire system is further enhanced, so that local high-temperature areas can be cooled faster and more stably, ultimately achieving the goal of improving the overall performance of the heat sink backplate.

[0029] like Figure 1 As shown, in one embodiment, the heat dissipation substrate 1 of a server GPU card heat dissipation backplate of this application has a micro-rib array 11 on the surface that contacts the GPU card. The micro-rib array 11 is arranged in a straight line along the GPU card mounting direction. This structural design aims to improve the heat conduction efficiency between the heat dissipation substrate 1 and the GPU card by increasing the roughness and contact area of ​​the contact surface. The arrangement of the micro-rib array 11 can not only effectively disperse heat, but also enhance local thermal conductivity. The micro-rib array 11 is located in the area near the edge of the heat dissipation substrate 1, which helps to reduce stress concentration during installation and improve the stability of the overall structure.

[0030] Specifically, a micro-rib structure can be machined on the surface of the heat dissipation substrate 1 using milling or molding, with the micro-ribs arranged sequentially along the GPU card mounting direction, maintaining a certain spacing and height. Simultaneously, dot-shaped protrusion structures 12 are set between the micro-ribs, with the height of these structures lower than the micro-ribs, thus forming a contact surface with an uneven morphology. Both the micro-rib array 11 and the dot-shaped protrusion structures 12 are achieved through mechanical processing or chemical etching to ensure structural consistency and installation compatibility.

[0031] like Figure 4 As shown, in one embodiment, the micro-rib array 11 of a server GPU card heatsink backplate of this application is periodically arranged in the edge region of the contact surface with the GPU card to optimize the heat conduction path and improve heat dissipation efficiency. Dot-like protrusions 12 are distributed between the micro-rib array 11, with a height lower than the micro-rib array 11, thereby providing additional disturbance to the fluid channels and improving heat dissipation performance without affecting the overall structural strength. Both the micro-rib array 11 and the dot-like protrusions 12 are designed as concave-convex structures, enabling them to form a stable contact interface with the GPU card surface during installation without interfering with the installation process.

[0032] Specifically, the micro-rib array 11 can be directly formed onto the surface of the heat dissipation substrate 1 by milling or stamping, while the dot-shaped protrusion structure 12 can be processed between the micro-rib array 11 by laser engraving or secondary pressing. The relative height difference between the two is achieved by adjusting the processing parameters. For example, in the mold design, the forming depth of the micro-rib array 11 is made greater than that of the dot-shaped protrusion structure 12, thereby ensuring that their height difference meets the technical requirements.

[0033] like Figure 4 As shown, in one embodiment, the dot-shaped protrusion structure 12 of the heat sink backplate for a server GPU card of this application is a cylindrical protrusion, distributed in the gaps between the micro-rib array 11. The micro-rib array 11 is disposed on the surface of the heat sink substrate 1 that contacts the GPU card, and is arranged periodically along the edge region. Its function is to increase the contact area with the GPU card and enhance the heat conduction efficiency. The dot-shaped protrusion structure 12 is disposed between the micro-rib array 11. By adding cylindrical protrusions in the gaps of the concave and convex structures, the bonding effect between the heat sink substrate 1 and the GPU card is further optimized, preventing local poor contact caused by stress concentration during installation. At the same time, the height of the dot-shaped protrusion structure 12 is lower than that of the micro-rib array 11, ensuring that the overall flatness and the continuity of the heat dissipation channel 6 are not affected during installation.

[0034] Specifically, the dotted protrusion structure 12 can be integrally processed with the heat dissipation substrate 1 by molding. Its cylindrical protrusions are located between the micro rib array 11, forming an uneven contact surface together with the micro rib array 11. This design allows the heat dissipation substrate 1 to fit more tightly against the surface of the GPU card during installation, improving heat conduction efficiency while keeping the internal heat dissipation channels 6 unobstructed.

[0035] In one embodiment, the micro-rib array 11 and the dot-shaped protrusion structure 12 of the heat sink backplate for a server GPU card are made of the same material as the heat sink substrate 1, namely aluminum. This design ensures consistency in heat conduction performance among different structural components, contributing to improved overall heat distribution uniformity. Both the micro-rib array 11 and the dot-shaped protrusion structure 12 are located on the surface of the heat sink substrate 1 that contacts the GPU card. The micro-rib array 11 is disposed at the edge region of the heat sink substrate 1, while the dot-shaped protrusion structure 12 is distributed between the micro-rib array 11. Both are concave-convex structures, arranged sequentially along the mounting direction of the GPU card, enhancing the adhesion to the GPU card and improving heat conduction efficiency.

[0036] Specifically, by using the same material for milling or stamping processes during the processing of the heat dissipation substrate 1, the micro-rib array 11 and the dot-shaped protrusion structure 12 can be formed synchronously. For example, a mold can be used to locally thicken and emboss the aluminum plate, so that the micro-rib array 11 and the dot-shaped protrusion structure 12 are integrally formed with the heat dissipation substrate 1, thereby ensuring the material consistency and structural integrity of both.

[0037] like Figure 3 As shown, in one embodiment, the heat dissipation substrate 1 of a server GPU card heat dissipation backplate of this application has a recessed groove 7 on its edge region, and a micro-rib array 11 is disposed within the recessed groove 7. The recessed groove 7 is used to accommodate the micro-rib array 11 and reduce interference with external structures, so that the micro-rib array 11 can be more stably distributed on the edge region of the heat dissipation substrate 1. The micro-rib array 11 forms a surface structure with enhanced heat dissipation effect through periodic arrangement, and its distribution position is close to the mounting end of the GPU card to improve local heat conduction efficiency. At the same time, the design of the recessed groove 7 can also optimize the overall structural layout of the heat dissipation substrate 1, which is convenient for working together with other components.

[0038] Specifically, by machining multiple continuous or discontinuous recessed grooves 7 along the edge of the heat dissipation substrate 1, a micro-rib array 11 is embedded therein, ensuring that the micro-rib array 11 is flush with or slightly below the surface of the heat dissipation substrate 1 to avoid collisions with the chassis or other components. This structure can be achieved through machining or molding, ensuring a tight fit between the micro-rib array 11 and the recessed grooves 7, and maintaining stable geometric shape and dimensional accuracy.

[0039] like Figure 3As shown, in one embodiment, the thermal pad 2 of a server GPU card heatsink backplate of this application includes a silicone layer 21 and a copper foil layer 22, with the copper foil layer 22 attached to the surface of the heatsink substrate 1. The copper foil layer 22 has high thermal conductivity, effectively transferring the heat generated by the GPU card to the heatsink substrate 1, thereby improving the overall heat dissipation efficiency. The silicone layer 21 serves to fill gaps and enhance structural stability, ensuring tight contact between the copper foil layer 22 and the heatsink substrate 1, and preventing air gaps during heat conduction. This design improves the stability and reliability of the heat dissipation system.

[0040] Specifically, the copper foil layer 22 is bonded tightly to the mounting surface of the heat dissipation substrate 1 by adhesive bonding, and the silicone layer 21 is located between the copper foil layer 22 and the GPU card, and is fixed between the two by extrusion or curing processes to form a continuous heat conduction path. This combined structure not only enhances thermal conductivity but also adapts to GPU cards of different thicknesses, improving product compatibility.

[0041] like Figure 2 As shown, in one embodiment, the heat dissipation fins 3 of a server GPU card heat dissipation backplate of this application are fixed to the back of the heat dissipation substrate 1 by welding. This structure can effectively improve heat dissipation efficiency and enhance overall mechanical stability. Compared with other fixing methods, welding connection has higher bonding strength and heat conduction efficiency, which helps to ensure good thermal contact performance between the heat dissipation fins 3 and the heat dissipation substrate 1. At the same time, the welding process can ensure the positioning accuracy of the fins, making them less prone to displacement or loosening during operation, thereby improving the reliability of the heat dissipation system.

[0042] Specifically, the heat dissipation fins 3 are precisely placed on the back of the heat dissipation substrate 1, and a fixed connection between the two is achieved using solder or laser welding. The welding area is located on the bottom surface where the heat dissipation fins 3 contact the heat dissipation substrate 1. The material is melted at high temperature to form a stable metallurgical bond, ensuring a tight bond between the two and avoiding an increase in thermal resistance during heat transfer.

[0043] like Figure 2 As shown, in one embodiment, the mounting bracket 4 for a server GPU card heatsink backplate of this application has multiple screw holes 41 for threaded connection with the mounting holes of the chassis. The mounting bracket 4 is fixedly connected to both sides of the heatsink base plate 1 to stably install the entire heatsink backplate inside the chassis. The screw holes 41 are evenly distributed on the mounting bracket 4, corresponding to the positions of the mounting holes provided inside the chassis, ensuring the stability of the connection and the accuracy of the positioning. The threaded fasteners allow for quick assembly and disassembly, facilitating later maintenance and replacement.

[0044] Specifically, the mounting bracket 4 is connected to the heat dissipation base plate 1 by welding or mechanical fixing. The screw hole 41 is located near the edge of the mounting bracket 4 to align with the mounting holes on the side of the chassis. The diameter of the screw hole 41 is consistent with the standard screw specification, which can be compatible with various types of chassis structures, thereby improving the product's versatility and ease of installation.

[0045] like Figure 4 As shown, in one embodiment, the connection slot 5 of a server GPU card heatsink backplate of this application is provided with a guide ramp 51 to assist in the insertion of the GPU card. The guide ramp 51 is located at the edge of the connection slot 5, corresponding to the insertion end of the GPU card, and is used to guide the GPU card to align with the installation position during insertion, thereby improving the convenience and stability of installation. The guide ramp 51 and the connection slot 5 form a continuous transition structure, ensuring a smooth and interference-free contact surface during insertion, while also accommodating axial offset during GPU card insertion, preventing excessive resistance or wear during connection.

[0046] For example, the guide ramp 51 can be integrally formed with the connecting slot 5. A certain angled surface is machined on the front end of the connecting slot 5, so that when the GPU card is inserted, its edge can slide into the slot along the guide ramp 51, reducing the risk of installation failure or damage due to alignment errors. The guide ramp 51 is integrally formed with the connecting slot 5 through machining or injection molding, ensuring the stability and service life of the structure.

[0047] like Figure 3 As shown, in one embodiment, the heat dissipation channel 6 of a server GPU card heat dissipation backplate of this application includes at least two staggered flow channels 61 to enhance airflow efficiency. The flow channels 61 are disposed inside the heat dissipation substrate 1, arranged along the length of the heat dissipation substrate 1, and are arranged in a crisscross pattern in local areas. This design allows the air to generate more complex flow paths during flow, thereby improving heat exchange efficiency. The staggered flow channels 61 are tightly fitted to the inner wall of the heat dissipation substrate 1, ensuring that the air fully contacts the heat dissipation structure during flow. Simultaneously, the spacing between the flow channels 61 prevents short circuits during airflow, ensuring that heat is effectively carried away.

[0048] Specifically, the heat dissipation channel 6 is achieved by machining staggered grooves on the inner side of the heat dissipation substrate 1. These grooves extend along different parts of the heat dissipation substrate 1 and overlap each other, forming multiple staggered flow channels 61. Specifically, two flow channels 61 are located in the upper and lower regions of the heat dissipation substrate 1, respectively, and intersect each other in a certain region. This structure can increase the contact area for airflow under the same volume conditions, thereby improving the overall heat dissipation performance. At the same time, the design of the staggered flow channels 61 avoids the problem of localized overheating caused by concentrated airflow in one direction.

[0049] like Figure 2 As shown, in one embodiment, the micro-rib array 11 and the dot-shaped protrusion structure 12 of the heat dissipation backplate for a server GPU card of this application are formed by laser processing to ensure the consistency of surface morphology. The micro-rib array 11 is located at the edge region of the contact surface between the heat dissipation substrate 1 and the GPU card and is distributed in a periodic manner, while the dot-shaped protrusion structure 12 is disposed in the gaps between the micro-rib array 11. The height of the dot-shaped protrusion structure 12 is lower than that of the micro-rib array 11, so that there is a significant difference in morphology between the two, while maintaining the flatness of the overall surface. This process can ensure the independence of the micro-rib array 11 and the dot-shaped protrusion structure 12, so that the two form a stable and uniform morphological structure on the same direct contact surface.

[0050] Specifically, the surface of the heat dissipation substrate 1 is processed by laser cutting or engraving. The laser energy is controlled by adjusting parameters within a preset area to realize the raised structure of the micro rib array 11 and the recessed or protruding shape of the dot-shaped raised structure 12, thereby forming a structure with hierarchical differences on the same substrate surface. This ensures that the relative position and height ratio of the two meet the design requirements, and that the overall surface is free from obvious damage or deformation.

[0051] In actual operation, when this device is used, the server GPU card is installed on the surface of the heat sink 1. The thermal pad 2 is located between the GPU card and the heat sink 1 to enhance the heat conduction efficiency. At the same time, the micro-rib array 11 and the dot-shaped protrusion structure 12 on the heat sink 1 can increase the contact area and improve the heat transfer effect. The GPU card is connected to its own interface slot through the connection slot 5. The fixing bracket 4 makes the entire device firmly installed in the chassis. The internal heat dissipation channel 6 guides the air flow, and the heat dissipation fins 3 further improve the heat dissipation efficiency, so that the heat generated by the GPU card during operation can be effectively dissipated, thereby maintaining its stable working state.

[0052] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0053] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heatsink backplate for a server GPU card, characterized in that, include: The system comprises a heat dissipation substrate (1), thermal pads (2), heat dissipation fins (3), a mounting bracket (4), a connecting slot (5), and a heat dissipation channel (6). The heat dissipation substrate (1) is attached to the GPU card. The thermal pads (2) are disposed between the heat dissipation substrate (1) and the GPU card to enhance heat conduction. The heat dissipation fins (3) are disposed on the back of the heat dissipation substrate (1). The mounting bracket (4) is fixedly connected to both sides of the heat dissipation substrate (1). The connecting slot (5) is located on the edge of the heat dissipation substrate (1) and matches the interface slot of the GPU card. The heat dissipation channel (6)... The heat sink is located inside the heat sink substrate (1). The surface of the heat sink substrate (1) that contacts the GPU card is provided with a micro rib array (11). The micro rib array (11) is periodically arranged in the edge region of the heat sink substrate (1). The edge of the heat sink substrate (1) is provided with a plurality of dot-shaped protrusion structures (12). The dot-shaped protrusion structures (12) are located between the micro rib arrays (11) and their height is less than the height of the micro rib arrays (11). Both the micro rib arrays (11) and the dot-shaped protrusion structures (12) are concave and convex structures and are arranged sequentially along the mounting direction of the GPU card.

2. The heat dissipation backplate for a server GPU card according to claim 1, characterized in that: The surface of the heat dissipation substrate (1) that contacts the GPU card is provided with a micro rib array (11), and the micro rib array (11) is arranged in a straight line along the GPU card mounting direction.

3. The heat dissipation backplate for a server GPU card according to claim 1, characterized in that: The microrib array (11) has a uniform height structure, and the height of the dot-shaped protrusion structure (12) is 0.5 mm to 1 mm lower than the height of the microrib array (11).

4. A heatsink backplate for a server GPU card according to claim 1, characterized in that: The dotted protrusion structure (12) is a cylindrical protrusion and is distributed in the gaps between the microrib array (11).

5. A heat dissipation backplate for a server GPU card according to claim 1, characterized in that: The micro-rib array (11) and the dot-shaped protrusion structure (12) are made of the same material as the heat dissipation substrate (1), which is aluminum. The micro-rib array (11) and the dot-shaped protrusion structure (12) are formed by laser processing.

6. A heat dissipation backplate for a server GPU card according to claim 1, characterized in that: The edge region of the heat dissipation substrate (1) is provided with a recessed groove (7), and the micro rib array (11) is disposed in the recessed groove (7).

7. A heat dissipation backplate for a server GPU card according to claim 1, characterized in that: The thermal pad (2) includes a silicone layer (21) and a copper foil layer (22), the copper foil layer (22) being attached to the surface of the heat dissipation substrate (1).

8. A heatsink backplate for a server GPU card according to claim 1, characterized in that: The fixed bracket (4) is provided with multiple screw holes (41) for threaded connection with the mounting holes of the chassis.

9. A heat dissipation backplate for a server GPU card according to claim 1, characterized in that: The connection slot (5) is provided with a guide slope (51) to assist in the insertion of the GPU card.

10. A heatsink backplate for a server GPU card according to claim 1, characterized in that: The heat dissipation channel (6) includes at least two staggered flow channels (61) to enhance air circulation efficiency.

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