Electronic device liquid cooling heat dissipation system

Abstract

The utility model discloses an electronic equipment liquid cooling heat dissipation system, include: at least one for with electronic equipment inside heat -generating element heat contact's inner liquid cooling board and respectively set up in the circulating pump, water cooling row of electronic equipment outside, set up as the first inner conduit of flat tube, second inner conduit each all has at least one U type section, the first section, the second section of both ends of U type section are each close to the area of U type section mutual parallel and its each all have a with corresponding first radiating fin group, second radiating fin group far from the end face of one end of inner liquid cooling board sticking's bending part, make the first inner conduit, second inner conduit each same side surface respectively with corresponding first radiating fin group, second radiating fin group's two side surface sticking contact. The utility model can save the space in electronic equipment inside while increasing the length of liquid cooling pipeline and its contact area between radiating fin, thereby further improve the heat dissipation efficiency in electronic equipment inside.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation in electronic products, and in particular to a liquid cooling heat dissipation system for electronic devices. Background Technology

[0002] With continuous technological advancements, laptop processors are becoming increasingly powerful, but their power consumption and heat generation are also rising accordingly. This can lead to overheating and frequency throttling during prolonged high-load operation, thus affecting performance. Simultaneously, consumers' demands for laptop portability are increasing, prompting manufacturers to continuously pursue thinner and lighter designs. However, thinner and lighter bodies mean further compression of heat dissipation space, making traditional air-cooling systems insufficient for cooling requirements. Utility Model Content

[0003] The purpose of this invention is to provide a liquid cooling system for electronic devices. This liquid cooling system can save internal space in electronic devices while increasing the length of the liquid cooling pipes and the contact area between them and the heat dissipation fins, thereby further improving the heat dissipation efficiency inside the electronic devices.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a liquid cooling heat dissipation system for electronic devices, comprising: at least one inner liquid cooling plate for thermally contacting the heat-generating elements inside the electronic device, and a circulation pump and a water cooling radiator respectively disposed outside the electronic device; one end of a first inner conduit is connected to the liquid outlet end of the inner liquid cooling plate, the other end of the first inner conduit is connected to one end of a first outer conduit via an adapter, the other end of the first outer conduit is connected to the liquid inlet end of the water cooling radiator, the other end of a second outer conduit connected to the liquid outlet end of the water cooling radiator is connected to the adapter, the circulation pump is mounted on the second outer conduit, and the adapter is connected to the liquid inlet end of the inner liquid cooling plate via the second inner conduit; The electronic device is internally provided with a first heat dissipation fin group and a second heat dissipation fin group that respectively cooperate with the first inner conduit and the second inner conduit. The first inner conduit and the second inner conduit, which are configured as flat tubes, each have at least one U-shaped segment. The regions of the first segment and the second segment located at both ends of the U-shaped segment are parallel to each other and each has a bent portion that fits against the end face of the corresponding first heat dissipation fin group and the second heat dissipation fin group away from the inner liquid cooling plate, so that the same side surface of the first inner conduit and the second inner conduit respectively fits and contacts the two side surfaces of the corresponding first heat dissipation fin group and the second heat dissipation fin group.

[0005] The following are further improvements to the above technical solution: 1. In the above solution, the adapter is installed on the electronic device.

[0006] 2. In the above scheme, the two internal liquid cooling plates, which are connected in series via conduits, respectively make thermal contact with the CPU chip and GPU chip inside the electronic device.

[0007] 3. In the above scheme, both of the inner liquid cooling plates are mounted on a base plate, and the base plate is provided with a number of mounting holes spaced apart, and a number of bolts for connecting with electronic equipment pass through the corresponding mounting holes.

[0008] 4. In the above scheme, a spring is fitted on the outside of each bolt and between the base plate and the bolt cap.

[0009] 5. In the above scheme, a fan is installed on the outside of the water cooling radiator.

[0010] 6. In the above scheme, the first heat dissipation fin group and the second heat dissipation fin group are respectively disposed on both sides of the inner liquid cooling plate.

[0011] Due to the application of the above technical solution, this utility model has the following advantages and effects compared with the prior art: This utility model relates to a liquid cooling system for electronic devices. The electronic device contains a first heat dissipation fin group and a second heat dissipation fin group that respectively cooperate with a first inner conduit and a second inner conduit. The first and second inner conduits, each configured as flat tubes, each have at least one U-shaped segment. The regions of the first and second segments near the U-shaped segments are parallel to each other, and each segment has a bent portion that fits against the end face of the corresponding first or second heat dissipation fin group away from the inner liquid cooling plate. This allows the same side surface of the first and second inner conduits to contact the two side surfaces of the corresponding first and second heat dissipation fin groups. Through the interconnected liquid cooling pipeline, the system significantly improves the heat dissipation performance of the electronic device, while saving internal space and increasing the length of the liquid cooling pipeline and the contact area between it and the heat dissipation fins, thereby further enhancing the internal heat dissipation efficiency of the electronic device. Attached Figure Description

[0012] Appendix Figure 1 This is a schematic diagram of the liquid cooling heat dissipation system for electronic devices according to this utility model; Appendix Figure 2 This is a partial structural diagram of the liquid cooling heat dissipation system for electronic devices according to this utility model.

[0013] In the above attached diagram: 1. Inner liquid cooling plate; 2. Circulation pump; 3. Water cooling radiator; 41. First inner conduit; 42. Second inner conduit; 5. Adapter joint; 61. First outer conduit; 62. Second outer conduit; 71. First heat dissipation fin group; 72. Second heat dissipation fin group; 81. U-shaped section; 82. First section; 83. Second section; 9. Bending part; 10. Fan; 11. Water tank; 12. Base plate; 121. Mounting hole; 13. Bolt; 131. Cap body; 14. Spring. Detailed Implementation

[0014] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.

[0015] Example 1: A liquid cooling heat dissipation system for electronic devices includes: at least one inner liquid cooling plate 1 for thermally contacting a heat-generating element inside the electronic device, and a circulation pump 2 and a water cooling radiator 3 respectively disposed outside the electronic device; one end of a first inner conduit 41 is connected to the liquid outlet of the inner liquid cooling plate 1, and the other end of the first inner conduit 41 is connected to one end of a first outer conduit 61 through an adapter 5; the other end of the first outer conduit 61 is connected to the liquid inlet of the water cooling radiator 3; the other end of a second outer conduit 62, one end of which is connected to the liquid outlet of the water cooling radiator 3, is connected to the adapter 5; the circulation pump 2 is mounted on the second outer conduit 62; and the adapter 5 is connected to the liquid inlet of the inner liquid cooling plate 1 through the second inner conduit 42. The electronic device is internally provided with a first heat dissipation fin group 71 and a second heat dissipation fin group 72 that respectively cooperate with the first inner conduit 41 and the second inner conduit 42. The first inner conduit 41 and the second inner conduit 42, which are configured as flat tubes, each have at least one U-shaped segment 81. The areas of the first segment 82 and the second segment 83 located at both ends of the U-shaped segment 81 are parallel to each other and each has a bent portion 9 that fits against the end face of the corresponding first heat dissipation fin group 71 and the second heat dissipation fin group 72 away from the inner liquid cooling plate 1, so that the same side surface of the first inner conduit 41 and the second inner conduit 42 respectively fits and contacts the two side surfaces of the corresponding first heat dissipation fin group 71 and the second heat dissipation fin group 72.

[0016] The aforementioned adapter 5 is installed on the electronic device; the two aforementioned internal liquid cooling plates 1, which are connected in series via conduits, respectively make thermal contact with the CPU chip and GPU chip inside the electronic device. Two of the above-mentioned internal liquid cooling plates 1 are mounted on a base plate 12. The base plate 12 is provided with a plurality of mounting holes 121 spaced apart. A plurality of bolts 13 for connecting to electronic equipment pass through the corresponding mounting holes 121. A spring 14 is fitted on the outside of each bolt 13 and between the base plate 12 and the cap 131 of the bolt 13. This facilitates the installation of the internal liquid cooling plate and ensures the stability of the surface contact with the heat-generating components inside the electronic device, thereby ensuring the stability of heat conduction and heat dissipation.

[0017] After the external liquid cooling pipes are connected to the internal liquid cooling module of the electronic device (water cooling connectors are plugged in), the water inside the internal liquid cooling plate is heated by the CPU and GPU chips, and then enters the water cooling radiator driven by the circulating micro pump. Under the cooling of the axial fan, the cooled water enters the water tank for storage, and is then pumped into the liquid cooling module of the electronic device by the micro pump to form the final circulation.

[0018] Example 2: A liquid cooling heat dissipation system for electronic devices, comprising: at least one inner liquid cooling plate 1 for thermally contacting a heat-generating element inside the electronic device, and a circulation pump 2 and a water cooling radiator 3 respectively disposed outside the electronic device; one end of a first inner conduit 41 is connected to the liquid outlet of the inner liquid cooling plate 1, and the other end of the first inner conduit 41 is connected to one end of a first outer conduit 61 via an adapter 5; the other end of the first outer conduit 61 is connected to the liquid inlet of the water cooling radiator 3; the other end of a second outer conduit 62, one end of which is connected to the liquid outlet of the water cooling radiator 3, is connected to the adapter 5; the circulation pump 2 is mounted on the second outer conduit 62; and the adapter 5 is connected to the liquid inlet of the inner liquid cooling plate 1 via the second inner conduit 42. The electronic device is internally provided with a first heat dissipation fin group 71 and a second heat dissipation fin group 72 that respectively cooperate with the first inner conduit 41 and the second inner conduit 42. The first inner conduit 41 and the second inner conduit 42, which are configured as flat tubes, each have at least one U-shaped segment 81. The areas of the first segment 82 and the second segment 83 located at both ends of the U-shaped segment 81 are parallel to each other and each has a bent portion 9 that fits against the end face of the corresponding first heat dissipation fin group 71 and the second heat dissipation fin group 72 away from the inner liquid cooling plate 1, so that the same side surface of the first inner conduit 41 and the second inner conduit 42 respectively fits and contacts the two side surfaces of the corresponding first heat dissipation fin group 71 and the second heat dissipation fin group 72.

[0019] A fan 10 is installed on the outside of the aforementioned water-cooling radiator 3; the aforementioned first heat dissipation fin group 71 and second heat dissipation fin group 72 are respectively disposed on both sides of the inner liquid cooling plate 1; A water tank 11 is provided on the second external conduit 62 and located between the water cooling radiator 3 and the circulating pump 2. The water tank 11 is located above the circulating pump 2, which facilitates the initial injection and replenishment of liquid in the pipeline, eliminates the need for the circulating pump to self-prime, and facilitates the venting of gas in the pipeline, thereby improving the stability of various performance aspects during use.

[0020] The liquid cooling plate, circulating pump, and water cooling radiator can all be purchased externally and are within the scope of existing technology, so this application will not elaborate on them.

[0021] When the above-mentioned liquid cooling heat dissipation system for electronic devices is adopted, the liquid cooling pipelines that connect the inside and outside can greatly improve the heat dissipation performance of electronic devices and computers. At the same time, it can save internal space of electronic devices, increase the length of the liquid cooling pipelines and the contact area between them and the heat dissipation fins, thereby further improving the heat dissipation efficiency inside the electronic devices.

[0022] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A liquid cooling heat dissipation system for electronic devices, comprising: At least one internal liquid cooling plate (1) for thermally contacting a heating element inside an electronic device and a circulation pump (2) and a water cooling radiator (3) respectively disposed outside the electronic device, characterized in that: one end of a first internal conduit (41) is connected to the liquid outlet of the internal liquid cooling plate (1), the other end of the first internal conduit (41) is connected to one end of a first external conduit (61) through an adapter (5), the other end of the first external conduit (61) is connected to the liquid inlet of the water cooling radiator (3), the other end of a second external conduit (62) connected to the liquid outlet of the water cooling radiator (3) is connected to the adapter (5), the circulation pump (2) is mounted on the second external conduit (62), and the adapter (5) is connected to the liquid inlet of the internal liquid cooling plate (1) through the second internal conduit (42); The electronic device is provided with a first heat dissipation fin group (71) and a second heat dissipation fin group (72) that cooperate with the first inner conduit (41) and the second inner conduit (42) respectively. The first inner conduit (41) and the second inner conduit (42), which are configured as flat tubes, each have at least one U-shaped segment (81). The areas of the first section (82) and the second section (83) at both ends of the U-shaped segment (81) are parallel to each other and each has a bend (9) that fits against the end face of the corresponding first heat dissipation fin group (71) and the second heat dissipation fin group (72) away from the inner liquid cooling plate (1), so that the same side surface of the first inner conduit (41) and the second inner conduit (42) respectively fits against the two side surfaces of the corresponding first heat dissipation fin group (71) and the second heat dissipation fin group (72).

2. The liquid cooling heat dissipation system for electronic devices according to claim 1, characterized in that: The adapter (5) is installed on the electronic device.

3. The liquid cooling heat dissipation system for electronic devices according to claim 1, characterized in that: The two internal liquid cooling plates (1), which are connected in series via conduits, make thermal contact with the CPU chip and GPU chip inside the electronic device, respectively.

4. The liquid cooling heat dissipation system for electronic devices according to claim 3, characterized in that: Both of the inner liquid cooling plates (1) are mounted on a base plate (12). The base plate (12) has a number of mounting holes (121) spaced apart, and a number of bolts (13) for connecting to electronic equipment pass through the corresponding mounting holes (121).

5. The liquid cooling heat dissipation system for electronic devices according to claim 4, characterized in that: A spring (14) is fitted on the outside of each bolt (13) and between the base plate (12) and the cap (131) of the bolt (13).

6. The liquid cooling heat dissipation system for electronic devices according to claim 1, characterized in that: A fan (10) is installed on the outside of the water cooling radiator (3).

7. The liquid cooling heat dissipation system for electronic devices according to claim 1, characterized in that: The first heat dissipation fin group (71) and the second heat dissipation fin group (72) are respectively disposed on both sides of the inner liquid cooling plate (1).

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