A chip trademark structure

Abstract

The utility model discloses a kind of chip trademark structure, it is related to trademark technical field, including bottom layer, shielding layer, buffer layer, chip containing layer and trademark surface layer from bottom to top sequentially laminated. Chip containing layer contains hard substrate, its surface is provided with reserved groove, passive RFID chip is fixed in groove, and chip signal transceiver surface faces trademark surface layer. Trademark surface layer is the film layer of PET film material, and the middle part is provided with the inductive identification area corresponding to chip, and the film layer and surface trademark are all covered with wear-resistant protective coating. The structure breaks through the limitation of traditional trademark, realizes high-grade anti-fake and commodity full life cycle information tracking by RFID chip, shielding layer, buffer layer guarantees chip stability, wear-resistant coating prolongs trademark life, satisfies market anti-fake traceability demand and high-end commodity management appeal.

Description

Technical Field

[0001] This utility model relates to the field of trademark technology, and in particular to a chip trademark structure. Background Technology

[0002] Currently, as the core carrier of product identification and brand protection, trademarks have an increasingly urgent market demand for anti-counterfeiting traceability and information storage, in addition to their basic identification functions. Traditional trademarks mostly adopt single forms such as printed patterns and laser marking, which are easy to be counterfeited and cannot achieve information tracking throughout the entire product life cycle, making it difficult to meet the anti-counterfeiting and management needs of high-end products. Utility Model Content

[0003] To address the technical problems existing in the background art, this utility model proposes a chip trademark structure.

[0004] This utility model proposes a chip trademark structure, comprising a bottom layer, a chip housing layer, and a trademark surface layer stacked sequentially from bottom to top. The chip housing layer includes a rigid substrate, and a reserved groove is formed on the upper surface of the rigid substrate. A passive RFID chip is fixed inside the reserved groove. The signal transceiver surface of the passive RFID chip is arranged facing the trademark surface layer. The trademark surface layer includes a PET film layer, and a sensing and identification area corresponding to the passive RFID chip is set in the middle of the film layer. The trademark is set on the surface of the film layer. Both the surface of the film layer and the trademark are coated with a wear-resistant protective coating.

[0005] Furthermore, a shielding layer and a buffer layer are stacked sequentially from bottom to top between the bottom layer and the chip accommodating layer. The shielding layer is made of copper foil, and the upper surface of the shielding layer is bonded to the lower surface of the buffer layer with conductive adhesive.

[0006] Furthermore, the bottom layer includes a base layer and an adhesive layer. The base layer is made of polyimide film material, and the adhesive layer is coated on the upper surface of the base layer. The adhesive layer is made of insulating adhesive to bond with the lower surface of the shielding layer.

[0007] Furthermore, the buffer layer includes a foam layer and a pressure-sensitive adhesive layer. The foam layer is made of porous polyurethane foam and is bonded to the lower surface of the rigid substrate through the pressure-sensitive adhesive layer.

[0008] Furthermore, a stepped groove is formed around the opening of the reserved groove, and a sealing cap is bonded to the inside of the stepped groove by a set hot melt adhesive layer. The sealing cap completely covers the opening of the reserved groove. The rigid substrate is made of epoxy glass cloth laminate material, and the sealing cap is made of PET film material.

[0009] Furthermore, a thermally conductive insulating filler layer is provided between the passive RFID chip and the reserved slot. The thermally conductive insulating filler layer is made of thermally conductive silicone and completely covers the sides and bottom of the passive RFID chip. The thermal conductivity of the thermally conductive insulating filler layer is not less than 1.5 W / (m·K), and the volume resistivity is not less than 10¹. 4 Ω・cm.

[0010] Furthermore, the wear-resistant protective coating is made of ultraviolet-cured polyurethane resin with a thickness of 0.02-0.05 mm. The surface of the sensing and identification area is printed with an anti-counterfeiting pattern layer that does not affect the penetration of radio frequency signals. The anti-counterfeiting pattern layer is made of ultraviolet fluorescent ink.

[0011] The beneficial effects of this utility model are as follows: By fixing a passive RFID chip in the reserved slot of the chip housing layer and ensuring that the chip's signal transceiver surface accurately corresponds to the sensing and identification area on the trademark surface, it breaks through the limitations of traditional trademarks that rely solely on single forms such as printed patterns and laser marking. With the help of the information storage and reading functions of the RFID chip, it can not only effectively avoid the problem of traditional trademarks being easily counterfeited and achieve a higher level of anti-counterfeiting protection, but also record and track information throughout the entire life cycle of goods from production and circulation to consumption. This effectively meets the market's urgent needs for trademark anti-counterfeiting traceability and information storage, and is especially suitable for the core demands of high-end products in terms of brand protection and refined management. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the disassembled structure of this utility model; Figure 2 This is a schematic diagram of the split structure of the bottom layer in this utility model; Figure 3 This is a schematic diagram of the split structure of the chip accommodating layer in this utility model; Figure 4 This is a schematic diagram of the structure of the trademark surface in this utility model; Figure 5 This is a schematic diagram of the split structure of the buffer layer in this utility model; Figure 6 This is a schematic diagram of the assembly structure of this utility model; Figure 7 This is a half-sectional view of the assembled version of this utility model.

[0013] In the diagram: 1. Bottom layer; 11. Base layer; 12. Adhesive layer; 2. Chip housing layer; 21. Rigid substrate; 22. Passive RFID chip; 23. Reserved slot; 24. Stepped slot; 25. Thermally conductive insulating filling layer; 26. Hot melt adhesive layer; 27. Sealing cap; 3. Trademark surface layer; 31. Thin film layer; 32. Sensing and identification area; 33. Trademark; 34. Wear-resistant protective coating; 4. Shielding layer; 5. Buffer layer; 51. Foaming layer; 52. Pressure-sensitive adhesive layer. Detailed Implementation

[0014] Reference Figure 1-7 The present invention proposes a chip trademark structure, which, from bottom to top, consists of a bottom layer 1, a shielding layer 4, a buffer layer 5, a chip housing layer 2, and a trademark surface layer 3. The specific technical solution is as follows: The bottom layer 1 consists of a base layer 11 and an adhesive layer 12. The base layer 11 is made of polyimide film, which has excellent high temperature resistance and aging resistance, and can provide good structural strength and environmental adaptability for the entire structure. The adhesive layer 12 is coated on the upper surface of the base layer 11 and is made of insulating adhesive. Its main function is to achieve tight adhesion with the lower surface of the shielding layer 4 above, and at the same time, it avoids interference with subsequent radio frequency signals through insulation properties, thus ensuring the signal stability of the passive RFID chip 22. The shielding layer 4 is made of copper foil, which has excellent electromagnetic shielding effect and can effectively block electromagnetic interference signals in the external environment, preventing them from interfering with the passive RFID chip 22 in the chip housing layer 2, and ensuring that the chip can send and receive data normally. The upper surface of the shielding layer 4 is bonded to the lower surface of the buffer layer 5 with conductive adhesive. The use of conductive adhesive can not only achieve a stable connection between the two layers, but also further optimize the electromagnetic shielding performance of the shielding layer 4 and reduce shielding gaps. The buffer layer 5 is composed of a foam layer 51 and a pressure-sensitive adhesive layer 52. The foam layer 51 is made of porous polyurethane foam, which is soft and has good cushioning and shock absorption performance. When the structure is subjected to external forces such as compression and collision, it can provide buffer protection for the chip housing layer 2 above, and prevent the passive RFID chip 22 from being damaged by external impact. The pressure-sensitive adhesive layer 52 is set on the upper surface of the foam layer 51 and is used to reliably bond the buffer layer 5 to the lower surface of the rigid substrate 21 of the chip housing layer 2, ensuring the connection stability between the buffer layer 5 and the chip housing layer 2. The chip housing layer 2 includes a rigid substrate 21, a passive RFID chip 22, a thermally conductive and insulating filler layer 25, and a sealing cap 27. The rigid substrate 21 is made of epoxy glass cloth laminate, which has high hardness and good insulation, providing a stable mounting carrier for the passive RFID chip 22. A pre-drilled slot 23 is provided on its front surface, the size of which is adapted to the passive RFID chip 22 for precise housing and fixation. The signal transceiver surface of the passive RFID chip 22 faces the trademark surface layer 3, ensuring a smooth signal transmission path between the chip and the external reading device. A thermally conductive and insulating filler layer 25 is filled between the passive RFID chip 22 and the pre-drilled slot 23. This filler layer is made of thermally conductive silicone and completely covers the sides and bottom of the passive RFID chip 22. Its thermal conductivity is not less than 1.5 W / (m·K), effectively conducting the heat generated during chip operation to the rigid substrate 21 and dissipating it, preventing the chip from overheating and affecting its performance. Simultaneously, its volume resistivity is not less than 10¹. 4 The Ω・cm insulation provides excellent insulation performance to prevent leakage or signal interference between the chip and the rigid substrate 21. In addition, a stepped groove 24 is provided around the opening of the reserved groove 23 on the rigid substrate 21. A sealing cover 27 is bonded inside the stepped groove 24 by a hot melt adhesive layer 26. The sealing cover 27 is made of PET film and completely covers the opening of the reserved groove 23. This not only forms a sealed protection for the passive RFID chip 22 to prevent dust, moisture and other impurities from entering the reserved groove 23 and affecting the chip performance, but also avoids obstructing the chip's signal transmission and reception through the light transmittance and radio frequency signal penetration of the PET film. The topmost trademark layer 3 consists of a thin film layer 31, a trademark 33, a wear-resistant protective coating 34, and an anti-counterfeiting pattern layer. The thin film layer 31 is made of PET film, which has good light transmittance, flexibility, and weather resistance, clearly displaying the trademark 33 on the surface while ensuring normal penetration of radio frequency signals. A sensing and identification area 32 corresponding to the passive RFID chip 22 is located in the middle of the thin film layer 31. This area provides a dedicated channel for signal transmission between the passive RFID chip 22 and external reading devices, ensuring the accuracy and efficiency of signal transmission. The trademark 33 is printed on the surface of the thin film layer 31, serving as a carrier of product identification information and realizing the basic identification function of the trademark. All surfaces are coated with a wear-resistant protective coating 34. This coating is made of UV-cured polyurethane resin with a thickness of 0.02-0.05mm. UV-cured polyurethane resin has excellent wear resistance, scratch resistance, and aging resistance, which can effectively protect the film layer 31 and the trademark 33, preventing wear and fading caused by friction and scratches during daily use, thus extending the service life of the trademark. At the same time, an anti-counterfeiting pattern layer is printed on the surface of the sensing and identification area 32. This pattern layer is made of UV fluorescent ink, which is invisible under normal light and only appears under UV light. It does not affect the penetration of radio frequency signals, further enhancing the anti-counterfeiting level of the trademark and making it easier for staff to quickly identify the authenticity of the trademark through UV light detection.

[0015] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A structure having a chip trademark, characterized in that, The system comprises, from bottom to top, a bottom layer (1), a shielding layer (4), a buffer layer (5), a chip housing layer (2), and a trademark surface layer (3). The chip housing layer (2) includes a rigid substrate (21). A reserved slot (23) is formed on the upper surface of the rigid substrate (21). A passive RFID chip (22) is fixed inside the reserved slot (23). The signal transceiver surface of the passive RFID chip (22) is set on the side facing the trademark surface layer (3). The trademark surface layer (3) includes a thin film layer (31) made of PET film. A sensing and identification area (32) corresponding to the passive RFID chip (22) is set in the middle of the thin film layer (31). A trademark (33) is set on the surface of the thin film layer (31). A wear-resistant protective coating (34) is set on the surface of both the thin film layer (31) and the trademark (33).

2. The chip trademark structure according to claim 1, characterized in that, The bottom layer (1) includes a base layer (11) and an adhesive layer (12). The base layer (11) is made of polyimide film material. The adhesive layer (12) is coated on the upper surface of the base layer (11) and is made of insulating adhesive to bond to the lower surface of the shielding layer (4).

3. The chip trademark structure according to claim 1, characterized in that, The buffer layer (5) includes a foam layer (51) and a pressure-sensitive adhesive layer (52). The foam layer (51) is made of porous polyurethane foam and is bonded to the lower surface of the rigid substrate (21) through the pressure-sensitive adhesive layer (52).

4. The chip trademark structure according to claim 1, characterized in that, A stepped groove (24) is formed around the opening of the reserved groove (23). The interior of the stepped groove (24) is bonded to the sealing cover (27) by a hot melt adhesive layer (26). The sealing cover (27) completely covers the opening of the reserved groove (23). The rigid substrate (21) is made of epoxy glass cloth laminate material, and the sealing cover (27) is made of PET film material.

5. The chip trademark structure according to claim 1, characterized in that, A thermally conductive insulating filler layer (25) is provided between the passive RFID chip (22) and the reserved slot (23). The thermally conductive insulating filler layer (25) is made of thermally conductive silicone and completely covers the sides and bottom of the passive RFID chip (22). The thermal conductivity of the thermally conductive insulating filler layer (25) is not less than 1.5 W / (m·K) and the volume resistivity is not less than 10¹. 4 Ω・cm.

6. The chip trademark structure according to claim 1, characterized in that, The wear-resistant protective coating (34) is made of ultraviolet-cured polyurethane resin with a thickness of 0.02-0.05 mm. The surface of the sensing and identification area (32) is printed with an anti-counterfeiting pattern layer that does not affect the penetration of radio frequency signals. The anti-counterfeiting pattern layer is made of ultraviolet fluorescent ink.

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