LCD display module structure with high-efficiency heat dissipation structure

Abstract

The utility model is suitable for display equipment technical field provides a LCD display module structure with high -efficient heat dissipation structure, including module frame, install in the display panel of module frame, set up the back light module of display panel's back, it contains light source and light guide plate, set up the back heat dissipation substrate of back light module, its one end near light guide plate is equipped with heat pipe heat spreader, and heat pipe heat spreader forms thermal contact with light source through the hollow area on light guide plate, the side of heat pipe heat spreader away from light source is arranged with first radiating fin group, still a plurality of heat transfer column are installed in array shape on heat pipe heat spreader, and the one end of heat transfer column away from heat pipe heat spreader is installed with radiating plate, and radiating plate is fixedly installed in the installation slot in module frame bottom, and is equipped with a plurality of heat dissipation holes on the installation slot, and, a plurality of second radiating fin groups are set up in array shape on radiating plate.

Description

Technical Field

[0001] This utility model relates to the field of display device technology, specifically to an LCD display module structure with a high-efficiency heat dissipation structure. Background Technology

[0002] As LCD display modules develop towards higher brightness and higher resolution, the heat generated by their internal LED backlights increases dramatically. Traditional heat dissipation structures use a single metal heat sink, which suffers from low heat conduction efficiency, leading to decreased display brightness, color shift, and shortened device lifespan. Especially when operating for extended periods in high-temperature environments, insufficient heat dissipation can cause degradation of the liquid crystal material's performance, severely impacting display quality and reliability. To address this technical problem, a new LCD display module structure with a highly efficient heat dissipation mechanism is proposed. Utility Model Content

[0003] The purpose of this invention is to provide an LCD display module structure with a high-efficiency heat dissipation structure to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] An LCD display module structure with a high-efficiency heat dissipation structure includes a module frame;

[0006] Display panel installed within the module frame;

[0007] The backlight module, located on the back of the display panel, includes a light source and a light guide plate;

[0008] A heat dissipation substrate is set on the back of the backlight module. A heat pipe heat dissipation plate is provided at one end of the substrate near the light guide plate. The heat pipe heat dissipation plate forms thermal contact with the light source through the hollow area on the light guide plate.

[0009] The first heat dissipation fin group is arranged on the side of the heat pipe heat pipe heat pipe plate away from the light source.

[0010] Several heat transfer columns are also installed in an array on the heat pipe heat pipe vapor chamber.

[0011] A heat dissipation plate is installed at the end of the heat transfer column away from the heat pipe heat spreader. The heat dissipation plate is fixedly installed in the mounting groove at the bottom of the module frame, and the mounting groove is provided with several heat dissipation holes.

[0012] And, a number of second heat dissipation fin groups arranged in an array on the heat dissipation plate.

[0013] As a further improvement of this utility model: the heat spreader is a flat copper heat spreader with a microchannel structure inside.

[0014] As a further improvement of this utility model: the first heat dissipation fin assembly is made of aluminum and has an anodized layer on its surface.

[0015] As a further improvement of this utility model, the phase change heat storage layer is disposed between the light guide plate and the heat dissipation substrate.

[0016] As a further improvement of this utility model: a miniature fan is installed on the first through hole on the side wall of the module frame, and an air inlet is provided on the other side wall of the module frame, with the air inlet and the miniature fan being positioned opposite each other.

[0017] As a further improvement of this utility model: a temperature sensor is also provided inside the module frame, the temperature sensor is located close to the heat sink, and the temperature sensor is linked to the micro fan for control.

[0018] As a further improvement of this invention, the temperature sensor adopts a high-precision NTC thermistor.

[0019] As a further improvement of this invention, a graphene thermal pad is provided between the phase change heat storage layer and the heat dissipation substrate.

[0020] As a further improvement of this utility model, the module frame is integrally die-cast from magnesium-aluminum alloy.

[0021] Compared with the prior art, the beneficial effects of this utility model are: by attaching the heat spreader to the light source, the heat on the light source can be effectively transferred, and then the heat is dissipated through the first heat dissipation fin group. At the same time, the heat transfer column, heat dissipation plate and second heat dissipation fin group are provided to achieve multi-stage heat dissipation, which can effectively ensure the heat dissipation effect. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the internal structure of an LCD display module with a high-efficiency heat dissipation structure according to an embodiment of the present invention.

[0023] Figure 2 This is a schematic diagram of the external structure of an LCD display module with a high-efficiency heat dissipation structure according to an embodiment of the present invention.

[0024] In the figure: 1-Module frame, 2-Display panel, 3-Backlight module, 4-Heat dissipation substrate, 5-Heat vapor chamber, 6-First heat dissipation fin group, 7-Heat transfer column, 8-Heat dissipation plate, 9-Second heat dissipation fin group, 10-Temperature sensor, 11-Miniature fan, 12-Phase change heat storage layer, 31-Light source, 32-Light guide plate. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Example 1

[0027] Please see Figure 1 This utility model embodiment 1 provides a structural diagram of an LCD display module structure with a high-efficiency heat dissipation structure. The LCD display module structure with a high-efficiency heat dissipation structure includes: a module frame 1, a display panel 2, a backlight module 3, and a heat dissipation substrate 4. The display panel 2 is installed in the module frame 1. The backlight module 3 is disposed on the back side of the display panel 2. The backlight module 3 includes a light source 31 and a light guide plate 32. The heat dissipation substrate 4 is disposed on the back side of the backlight module 3. A heat dissipation plate 5 is disposed at one end of the heat dissipation substrate 4 near the light guide plate 32. The heat dissipation plate 5 is in thermal contact with the light source 31 through a hollow area on the light guide plate 32. A first heat dissipation fin group 6 is arranged on the side of the heat dissipation plate 5 away from the light source 31. A plurality of heat transfer columns 7 are also arrayed on the heat dissipation plate 5. The end of the heat transfer column 7 away from the heat dissipation plate 5 is mounted on a heat dissipation plate 8. A plurality of second heat dissipation fin groups 9 are arrayed on the heat dissipation plate 8. The heat dissipation plate 8 is fixedly installed in a mounting groove at the bottom of the module frame 1, and a plurality of heat dissipation holes are provided on the mounting groove. The heat sink 8 is fixedly installed in the mounting slot to ensure its stability and effectively protect the backlight module 3 and the heat dissipation substrate 4. The 9 is made of high thermal conductivity aluminum alloy, and its surface is anodized to enhance heat dissipation efficiency. A 0.5mm gap is left between each 9 to form an air convection channel. A micro-guide groove is also provided at the bottom of 8, forming a vertical airflow channel with the heat dissipation holes of the mounting slot. When the heat generated by 32 is conducted to 7 through 5, 6 will activate forced convection cooling, forming a three-stage heat dissipation system in conjunction with the radiative cooling of 9.

[0028] This invention effectively transfers heat from the light source 31 by attaching a heat spreader 5 to the light source 31. The heat is then dissipated through the first heat dissipation fin group 6. Simultaneously, the inclusion of a heat transfer column 7, a heat dissipation plate 8, and a second heat dissipation fin group 9 achieves multi-stage heat dissipation, effectively ensuring heat dissipation performance. Under prolonged high-load operation, the internal temperature of the module can be controlled below 45℃, approximately 12℃ lower than traditional structures, significantly extending the lifespan of the display module.

[0029] In some embodiments, the heat spreader 5 is a flat copper heat spreader with a microchannel structure inside for rapid heat spread.

[0030] In some embodiments, the first heat dissipation fin group 6 is made of aluminum, with an anodized layer on the surface, and the fin spacing is 1.5mm-2.5mm.

[0031] Example 2

[0032] Please see Figures 1-2 Embodiment 2 of this utility model provides an improved LCD display module structure, which adds a phase change heat storage layer 12 based on Embodiment 1. The phase change heat storage layer 12 is disposed between the light guide plate 32 and the heat dissipation substrate 4. The phase change heat storage layer 12 is used to absorb instantaneous heat, suppress temperature rise, prolong the temperature equalization time, buffer thermal shock, and protect the optical film and LED.

[0033] Please see Figure 2 In some embodiments, a miniature fan 11 is installed on the first through hole on the side wall of the module frame 1, and an air inlet is provided on the other side wall of the module frame 1. The air inlet (not shown in the figure) is positioned opposite to the miniature fan 11, which facilitates the miniature fan 11 to dissipate heat when powered on, while simultaneously forming a through-flow airflow circulation. The miniature fan 11 uses a dual ball bearing fan, achieving an airflow of 3.2 CFM at a speed of 2000 rpm, with noise levels controlled below 25 dB.

[0034] In some embodiments, a temperature sensor 10 is also provided inside the module frame 1. The temperature sensor 10 is located near the heat sink 8 and is used to monitor temperature changes inside the module. The temperature sensor 10 uses a high-precision NTC thermistor, and its detection signal is fed back to the control system through a built-in circuit. When the temperature exceeds a preset threshold, the fan speed of the micro fan 11 is automatically adjusted.

[0035] In some embodiments, the temperature sensor 10 is linked to the micro fan 11 for control. When the temperature reaches a preset low temperature, the micro fan 11 automatically starts in low-speed mode; when the temperature reaches a preset high temperature, it switches to high-speed mode. The preset low temperature can be 25°C, and the preset high temperature can be 40°C. The fan speed curve of 11 uses an S-shaped algorithm for smooth transition, avoiding mechanical vibration caused by sudden changes in speed. The sampling frequency of the temperature sensor 10 is set to 10Hz, and instantaneous interference signals are eliminated through a digital filtering algorithm.

[0036] In some embodiments, the phase change material of the phase change thermal storage layer 12 is a paraffin-based composite material with an adjustable melting point within the range of 32-35℃, ensuring precise matching with the module's operating temperature curve. A 0.1mm thick graphene thermal conductive pad is added between the phase change thermal storage layer 12 and the heat dissipation substrate 4 to further optimize the heat conduction path. The sampling frequency of the temperature sensor 10 is increased to 10Hz, and a temperature control accuracy of ±0.5℃ is achieved in conjunction with a PID algorithm. The thickness of the phase change layer 12 is precisely calculated and controlled within the range of 2mm ± 0.1mm to ensure optimal thermal storage performance within a limited space.

[0037] In some embodiments, the module frame 1 is integrally die-cast from magnesium-aluminum alloy, and its coefficient of thermal expansion is highly matched with that of the internal components, thus avoiding deformation problems caused by thermal stress.

[0038] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0039] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0040] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An LCD display module structure with a high-efficiency heat dissipation structure, characterized in that, Includes the module framework (1); Display panel (2) installed within module frame (1); A backlight module (3) is disposed on the back of the display panel (2), which includes a light source (31) and a light guide plate (32); A heat dissipation substrate (4) is provided on the back of the backlight module (3), and a heat pipe heat dissipation plate (5) is provided at one end near the light guide plate (32). The heat pipe heat dissipation plate (5) forms thermal contact with the light source (31) through the hollow area on the light guide plate (32). The heat pipe ... Several heat transfer columns (7) are also installed in an array on the heat pipe heat spreader (5); A heat transfer column (7) is mounted on a heat dissipation plate (8) at one end away from the heat pipe heat spreader (5). The heat dissipation plate (8) is fixedly installed in the mounting groove at the bottom of the module frame (1), and several heat dissipation holes are provided on the mounting groove. And, a number of second heat dissipation fin groups (9) arranged in an array on the heat dissipation plate (8).

2. The LCD display module structure with a high-efficiency heat dissipation structure according to claim 1, characterized in that, The heat spreader (5) is a flat copper heat spreader with a microchannel structure inside.

3. The LCD display module structure with a high-efficiency heat dissipation structure according to claim 1, characterized in that, The first heat dissipation fin group (6) is made of aluminum and has an anodized layer on its surface.

4. The LCD display module structure with a high-efficiency heat dissipation structure according to claim 1, characterized in that, A phase change heat storage layer (12) is provided between the light guide plate (32) and the heat dissipation substrate (4).

5. The LCD display module structure with a high-efficiency heat dissipation structure according to claim 1, characterized in that, A miniature fan (11) is installed on the first through hole on the side wall of the module frame (1), and an air inlet is provided on the other side wall of the module frame (1), with the air inlet being positioned opposite to the miniature fan (11).

6. The LCD display module structure with a high-efficiency heat dissipation structure according to claim 5, characterized in that, The module frame (1) is also equipped with a temperature sensor (10), which is located near the heat sink (8). The temperature sensor (10) is linked to the micro fan (11) for control.

7. The LCD display module structure with a high-efficiency heat dissipation structure according to claim 6, characterized in that, The temperature sensor (10) uses a high-precision NTC thermistor.

8. The LCD display module structure with a high-efficiency heat dissipation structure according to claim 4, characterized in that, A graphene thermal pad is provided between the phase change heat storage layer (12) and the heat dissipation substrate (4).

9. The LCD display module structure with a high-efficiency heat dissipation structure according to claim 1, characterized in that, The module frame (1) is integrally die-cast from magnesium-aluminum alloy.

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