A transceiver module thin film circuit type surface mount circulator

Abstract

The utility model provides a kind of for transceiving module thin film circuit type surface mount circulator, it is related to surface mount circulator field, the for transceiving module thin film circuit type surface mount circulator, including grounding bottom plate, the top of grounding bottom plate is provided with gyromagnetic material, the outside of gyromagnetic material is provided with nested medium, the top of nested medium is provided with center conductor, the inside of center conductor integrally formed with T type matching impedance, the inside of center conductor integrally formed with protruding matching impedance knot, the outside of center conductor integrally formed with first rectangular impedance knot, the outside of rectangular impedance knot integrally formed with second rectangular impedance knot, this for transceiving module thin film circuit type surface mount circulator integration molding and compact layout design, while guaranteeing performance, volume is simplified, application requirement of 5G, radar and so on field transceiving module miniaturization, modularization is met.

Description

Technical Field

[0001] This utility model relates to a surface-mount circulator for a transceiver module with thin-film circuitry, specifically a surface-mount circulator for a transceiver module with thin-film circuitry, and belongs to the technical field of surface-mount circulators. Background Technology

[0002] As a core component in modern communication systems, circulators play an irreplaceable role in base stations, power amplifiers, and radar equipment. They are non-reversible multi-port devices that can transmit incident waves entering any of their ports to the next port in a sequential direction determined by a static deflection magnetic field, thus realizing unidirectional transmission of high-frequency signal energy.

[0003] Existing thin-film circuit surface mount circulators use metal cavity structures and manual assembly methods, which have problems such as large size, heavy weight, complex assembly process, and poor consistency. They are difficult to meet the requirements of modern communication equipment for high performance and mass production. Therefore, we propose a thin-film circuit surface mount circulator for transceiver modules. Utility Model Content

[0004] The purpose of this invention is to provide a thin-film circuit type surface mount circulator for transceiver modules to solve the above-mentioned problems. This addresses the issues of large size, heavy weight, complex assembly process, and poor consistency in existing technologies that use metal cavity structures and manual assembly methods, making it difficult to meet the demands of modern communication equipment for high performance and mass production.

[0005] This utility model is achieved through the following technical solution: a thin-film circuit type surface mount circulator for transceiver modules.

[0006] The device includes a grounding base plate, on the top of which is a gyromagnetic material, and on the outside of which is a nested medium. On the top of which is a center conductor, a T-type matching impedance is integrally formed on the inside of the center conductor, and a raised matching impedance junction is integrally formed on the inside of the center conductor. The integral forming of the T-type and raised matching impedance junction reduces connection loss, improves impedance matching accuracy, and enhances signal transmission stability.

[0007] Preferably, a first rectangular impedance junction is integrally formed on the outer side of the central conductor, and a second rectangular impedance junction is integrally formed on the outer side of the rectangular impedance junction. The multi-level rectangular impedance junctions work together to optimize the impedance gradient, adapt to different frequency band signals, and broaden the transmission bandwidth.

[0008] An inverted L-shaped inductor is integrally formed on the outer side of the center conductor, and an input port rectangular matching structure is integrally formed on the outer side of the inverted L-shaped inductor. The inverted L-shaped inductor and the port matching structure are designed as an integral unit, which reduces parasitic parameters, improves input signal matching efficiency, and reduces reflection loss.

[0009] A dielectric body is disposed on the top of the central conductor, and a permanent magnet is disposed on the top of the dielectric body. The dielectric body isolates the central conductor from the permanent magnet to avoid electrical interference. The permanent magnet provides a stable static bias magnetic field to excite the irreversible properties of the gyromagnetic material.

[0010] The permanent magnet is provided with a shielding cover on its top, and the grounding base plate is provided with a first contact body on its bottom. The top of the first contact body penetrates through the nested medium and the central conductor. The shielding cover isolates external magnetic field interference and ensures magnetic field stability. The through-hole design of the contact body enables direct signal transmission and reduces transmission path loss.

[0011] The bottom of the grounding base plate is provided with a second contact, the top of the second contact penetrates the nested medium and the second rectangular impedance junction. The bottom of the grounding base plate is provided with a third contact, the top of the third contact penetrates the nested medium and matches the rectangular impedance junction of the input port. The contact and the corresponding impedance matching structure are precisely connected to ensure that the signals of each port are transmitted independently and improve the isolation between ports.

[0012] The top ends of the first contact body, the second contact body, and the third contact body are provided with contact body through-hole guide surfaces. The guide surfaces ensure that the contact body and the positioning hole of the nested medium are accurately aligned, thereby improving assembly consistency and welding reliability.

[0013] The first, second, and third contact bodies are provided with knurled desoldering pumps on their outer sides, and with flow-limiting solder buffers on their outer sides. A supporting annular platform is provided at the top of each of the first, second, and third contact bodies. The knurled desoldering pumps improve immersion efficiency and solder joint strength; the flow-limiting solder buffers prevent excessive solder from causing short circuits, ensuring electrical safety; and the supporting platform bears the weight of the medium, enhancing the connection strength between the contact body and the nested medium, and improving overall tensile strength and structural stability.

[0014] This utility model provides a surface-mount circulator of thin-film circuit type for transceiver modules, which has the following beneficial effects: 1. This utility model discloses a thin-film circuit type surface mount circulator for transceiver modules. It abandons the large Y-shaped disk with straight leads for input and output of other embedded devices, which increases the space required. Instead, it uses a large Y-shaped junction combined with a small Y-shaped junction with an S-shaped distribution to set up multiple levels of inductors and capacitors, which is conducive to the miniaturization of surface mount products, reduces product losses, and increases product bandwidth.

[0015] 2. This utility model provides a thin-film circuit type surface mount circulator for transceiver modules, which eliminates the traditional rectangular transmission lines and RF connectors used in embedded products for signal transmission, thus achieving a more modular and miniaturized design.

[0016] 3. This utility model provides a surface-mount circulator for a transceiver module with a thin-film circuit type. The supporting annular platform is set at the connection between the first contact body and the nested medium, which can bear the weight of the medium. At the same time, it ensures stable signal transmission and performs the tasks of signal reception and transmission. It is beneficial to strengthen the locking degree of the connection and ensure the reliability and tensile strength of the thin-film circuit type circulator.

[0017] 4. This utility model provides a thin-film circuit type surface mount circulator for transceiver modules, which supports the nested medium and the magnetic material and shielding cover, reducing material stacking. It adopts a novel surface mount mounting setting, so that the signal and ground planes are on the same plane and connected within the module or component, which is conducive to the miniaturization design of S-band and C-band transceiver components.

[0018] 5. This utility model discloses a surface-mount circulator for a transceiver module with thin-film circuits. The nested medium is arranged with signal transmission channels in three directions, scattering 120 degrees from the center of the intersection of the X and Y axes. The channel diameter is 0.8-1.0 mm. This perforated channel design facilitates the surface-mount form of the thin-film circuit. At the same time, the stable parameters and physical characteristics of the nested medium can improve the performance and reliability of the product.

[0019] 6. This utility model provides a thin-film circuit type surface-mount circulator for transceiver modules. The shielding device adopts an integrated design and is coated with nickel to effectively shield the cutting of external and internal magnetic induction lines, reduce the leakage of magnetic induction in the product, effectively ensure the magnetic stability of the product, and enhance the product reliability and performance.

[0020] 7. This utility model provides a thin-film circuit type surface mount circulator for transceiver modules, which eliminates the previous multi-layer stacking assembly method of circulators and the setting of external RF connectors and rectangular lead input and output, saving space on the X and Y axes and reducing the horizontal space of the product. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is an exploded view of the overall structure of this utility model; Figure 3 This is a schematic diagram of the central conductor structure of this utility model; Figure 4 This is a schematic diagram of the contact body structure of this utility model; [Explanation of Key Component Symbols] 1. Grounding base plate; 2. Gyromagnetic materials; 3. Nested media; 4. Center conductor; 4-1. T-type matching impedance; 4-2. Raised matching impedance junction; 4-3. First rectangular impedance junction; 4-4. Second rectangular impedance junction; 4-5. Inverted L-shaped inductor; 4-6. Rectangular matching at the input port; 5. Medium body; 6. Permanent magnet; 7. Shielding cover; 8-1, First contact body; 8-2, Second contact body; 8-3, Third contact body; 9-1. Contact body through-hole guide surface; 9-2. Knurled desoldering pump; 9-3. Current-limiting solder buffer strip; 9-4. Supporting annular platform. Detailed Implementation

[0022] This utility model provides a thin-film circuit type surface mount circulator for transceiver modules.

[0023] Example 1, please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 It includes a grounding base plate 1, a gyromagnetic material 2 on the top of the grounding base plate 1, a nested medium 3 on the outside of the gyromagnetic material 2, a center conductor 4 on the top of the nested medium 3, a T-type matching impedance 4-1 integrally formed on the inside of the center conductor 4, and a raised matching impedance junction 4-2 integrally formed on the inside of the center conductor 4.

[0024] Please refer to it again. Figure 1 , Figure 2 and Figure 3 A first rectangular impedance junction 4-3 is integrally formed on the outer side of the center conductor 4. A second rectangular impedance junction 4-4 is integrally formed on the outer side of the rectangular impedance junction 4-3. An inverted L-shaped inductor 4-5 is integrally formed on the outer side of the center conductor 4. An input port rectangular matching 4-6 is integrally formed on the outer side of the inverted L-shaped inductor 4-5. A dielectric body 5 is provided on the top of the center conductor 4. A permanent magnet 6 is provided on the top of the dielectric body 5. A shielding cover 7 is provided on the top of the permanent magnet 6. A first contact 8-1 is provided on the bottom of the grounding base plate 1. The top of the first contact 8-1 penetrates the nested dielectric 3 and the center conductor 4.

[0025] Wideband impedance matching is achieved by sputtering the central conductor 4 onto a coplanar substrate using thin-film lithography to form a dual-Y circuit. The large Y-shaped junction has a disk structure (with square slots in the middle), while the small Y-shaped junction has a multi-stage impedance matching LC circuit. The two are distributed in a 120-degree rotation around the disk. The signal input and output terminals are equipped with circular interfaces. The T-shaped matching impedance 4-1 and the raised matching impedance 4-2 integrally formed by the small Y-junction constitute the initial impedance calibration unit. The impedance adjustment accuracy is refined by the distribution of S-shaped arc lines, reducing signal loss in the core area caused by impedance abrupt changes. The first rectangular impedance 4-3 and the second rectangular impedance 4-4 extending from the outer side of the large Y-junction form a multi-stage toothed ladder-like impedance distribution. The integrated design of the inverted L-shaped inductor 4-5 and the rectangular matching inductor 4-6 at the input port extends the 1 / 4 wavelength matching path while reducing parasitic parameters. In this structure, the size of the large Y-disk junction matches the arc length of the small YS-shaped stripline, allowing the multi-stage impedance structure to cover different frequency bands from S-band to C-band. This solves the problem of insufficient broadband coverage of a single impedance structure, significantly reduces signal reflection loss, and achieves broadband and efficient matching. Compared to the traditional large Y-disk straight lead design, this dual Y integrated structure reduces the space occupied by the leads, directly contributing to the miniaturization of surface-mount products. The permanent magnet 6 is isolated from the central conductor 4 through the dielectric body 5, and the gyromagnetic material 2 below it is nested and connected to the nested dielectric 3. The nested medium 3 is a cut-and-formed structure of "cubic prism + 8mm diameter cylinder (0.8mm Z-axis extension)" to provide stable support for the gyromagnetic material 2. The static bias magnetic field provided by the permanent magnet 6 is shielded by the cylindrical shielding cover 7 (0.2-0.5mm high) to form a stable magnetic field environment. The shielding cover 7 adopts an integrated nickel-plated design, which can effectively block external magnetic induction line interference, reduce internal magnetic field leakage, and ensure the stable excitation of the irreversible gyromagnetic characteristics of the gyromagnetic material 2, so that the signal is transmitted unidirectionally along a preset path distributed at 120 degrees. The nested medium 3 has signal transmission channels with diameters of 0.8-1.0mm in three directions at 120 degrees, centered on the intersection of the X and Y axes, and is connected to the 0mm diameter... The 0.4mm cylindrical first contact 8-1, second contact 8-2, and third contact 8-3 are precisely fitted and extend along the positive Z-axis through the channel, respectively connecting to the center conductor 4, the second rectangular impedance junction 4-4, and the input port rectangular matching 4-6, thus constructing a direct conduction path of "contact - impedance matching structure - center conductor". This path reduces signal attenuation by utilizing the stable physical parameters of the nested medium 3. Combined with the size matching between the contact and the channel (0.4mm conductor fits 0.8-1.0mm channel), it avoids the redundant losses of traditional rectangular transmission lines and RF connectors, achieving efficient signal conduction while meeting the requirements of modular miniaturization design.

[0026] Example 2, please refer to again. Figure 1 , Figure 2 , Figure 3 and Figure 4The bottom of the grounding base plate 1 is provided with a second contact 8-2. The top of the second contact 8-2 passes through the nested medium 3 and the second rectangular impedance junction 4-4. The bottom of the grounding base plate 1 is provided with a third contact 8-3. The top of the third contact 8-3 passes through the nested medium 3 and the input port rectangular matching 4-6. The tops of the first contact 8-1, the second contact 8-2 and the third contact 8-3 are provided with contact through-hole guide surfaces 9-1. The outer sides of the first contact 8-1, the second contact 8-2 and the third contact 8-3 are provided with knurled desoldering pumps 9-2. The outer sides of the first contact 8-1, the second contact 8-2 and the third contact 8-3 are provided with flow-limiting solder buffer strips 9-3. The tops of the first contact 8-1, the second contact 8-2 and the third contact 8-3 are provided with supporting annular platforms 9-4.

[0027] Precise assembly and structural stability are ensured by a flat contact through-hole guide surface 9-1 at the top of the 0.4mm diameter cylindrical contact body, which precisely matches the size of the positioning hole of the nested medium 3. This guides the contact body to penetrate vertically through the nested medium 3 and press firmly for soldering, improving assembly consistency from a dimensional fit perspective and avoiding conduction failures caused by assembly misalignment. A knurled desoldering pump 9-2 extending along the negative Z-axis on the outer side of the contact body consists of 32 protrusions evenly distributed 360 degrees around the contact through-hole guide surface. Each protrusion has a 60-degree slope on both sides—this slope design allows for efficient solder dipping and drainage along the slope, ensuring proper contact with the square grounding base plate 1 (signal). The soldering of the nested medium 3 is ensured by a 4*4mm rectangular groove at the opening. The annular current-limiting solder buffer strip 9-3 below the knurled desoldering pump 9-2, through its annular size and position design, precisely blocks excess solder from flowing downwards, completely solving the problem of short circuits and arcing caused by excessive solder, thus ensuring electrical safety. A supporting annular platform 9-4 is provided at the connection point between the contact top and the nested medium 3. Its annular size is adapted to the bottom dimensions of the medium body 5 and the permanent magnet 6, allowing it to directly support the weight of the upper components without affecting signal transmission. This platform increases the contact area between the contact body and the nested medium 3, enhancing the connection's locking strength and significantly improving the overall structural tensile strength, preventing long-term damage. The performance degradation caused by structural loosening during use is addressed by employing a special reflow soldering process to connect the grounding base plate 1, the gyromagnetic material 2, and the nested dielectric 3 in a coplanar manner. This eliminates the traditional stacked installation method, compresses the Z-axis positive space, and the 4*4mm rectangular groove design perfectly supports the nested dielectric 3 and the gyromagnetic material 2, reducing material stacking and ensuring that the signal and ground planes are on the same horizontal plane, further improving structural stability. The integrated design of the structural dimensions is the core of miniaturization. The dual Y circuit of the center conductor 4 and all impedance matching structures are integrally sputtered, eliminating the need for discrete component installation and reducing radial space occupation. The three contacts are compactly distributed in a square... The layout of signal one and two on the same side and signal three on the same side (parallel distribution on both sides) at the bottom of the grounding base plate 1 optimizes the X-axis and Y-axis space. Combined with a conductor diameter of 0.4mm, the lateral space is greatly reduced. The integrated structure of the nested medium 3, which is a "cubic prism plus cut cylinder" (extending only 0.8mm on the Z-axis), wraps the gyromagnetic material 2, avoiding the space waste of traditional separate wrapping. The ultra-thin design of the cylindrical shielding cover 7 (0.2-0.5mm height) further compresses the axial dimension. The above-mentioned size optimization and layout design enable the device to be directly adapted to the modular installation of S-band and C-band transceiver components, meeting the stringent requirements for component miniaturization in fields such as 5G communication and radar.

[0028] Working Principle: The working principle of this thin-film circuit type surface-mount circulator for transceiver modules is as follows: First, a constant static bias magnetic field is provided by a permanent magnet 6 supported and isolated by a dielectric body 5. An integrated nickel-plated shielding cover 7 blocks external interference and reduces internal magnetic field leakage, ensuring the stable excitation of the gyromagnetic properties of the tensor permeability of the gyromagnetic material 2, laying the foundation for unidirectional signal transmission. Then, the external microwave signal is input through the first contact 8-1, the second contact 8-2, or the third contact 8-3. After precise alignment between the contact through-hole guide surface 9-1 at the top of each contact and the positioning hole of the nested dielectric 3, the signal passes through the 0.8-1.0mm diameter transmission channel distributed at 120° on the nested dielectric 3. The knurled desoldering pump 9-2 (32 strips with 60° sloping protrusions) on the outside of the contact efficiently dips and guides the solder flow, while the current-limiting solder buffer strip 9-3 below controls the amount of solder to avoid short circuits, ensuring stable signal transmission. Subsequently, the signal enters the dual Y-circuit structure of the central conductor 4 formed by thin-film photolithography. The large Y-junction (disk junction) achieves frequency doubling by extending the 1 / 4 wavelength matching path through the inverted L-inductor 4-5 and the rectangular matching 4-6 of the input port. The small Y-junction optimizes the impedance by forming an S-shaped distribution through the T-type matching impedance 4-1 and the raised matching impedance junction 4-2. Combined with the multi-stage toothed trapezoidal impedance gradient of the first rectangular impedance junction 4-3 and the second rectangular impedance junction 4-4, it achieves wideband adaptation and low-loss transmission. Under the action of the gyromagnetic properties of the gyromagnetic material 2, the signal is transmitted unidirectionally along the preset direction. At the same time, the grounding base plate 1, the nested medium 3, and the gyromagnetic material 2 are coplanarly reflow welded to make the signal and the grounding plane coplanar to reduce interference. The supporting ring platform 9-4 at the top of the contact body carries the weight of the medium body 5 to enhance structural stability. The integrated molding and compact layout of each impedance matching structure and the central conductor 4 achieves miniaturization. Finally, the processed signal is output to the external transceiver module through the corresponding contact body, completing the closed-loop process of "magnetic field excitation - signal input - impedance matching - unidirectional conduction - output".

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A surface-mount circulator for a transceiver module with a thin-film circuit type, comprising a grounding base plate (1), characterized in that: The top of the grounding base plate (1) is provided with a gyromagnetic material (2), and the outside of the gyromagnetic material (2) is provided with a nested medium (3). The top of the nested medium (3) is provided with a central conductor (4), and a T-type matching impedance (4-1) is integrally formed on the inner side of the central conductor (4), and a raised matching impedance junction (4-2) is integrally formed on the inner side of the central conductor (4).

2. A surface-mount circulator for a transceiver module with thin-film circuitry as described in claim 1, characterized in that: The outer side of the center conductor (4) is integrally formed with a first rectangular impedance junction (4-3), and the outer side of the rectangular impedance junction (4-3) is integrally formed with a second rectangular impedance junction (4-4).

3. A surface-mount circulator for a transceiver module with thin-film circuitry as described in claim 2, characterized in that: An inverted L-shaped inductor (4-5) is integrally formed on the outer side of the center conductor (4), and an input port rectangular matching (4-6) is integrally formed on the outer side of the inverted L-shaped inductor (4-5).

4. A surface-mount circulator for a transceiver module with thin-film circuitry as described in claim 3, characterized in that: The top of the central conductor (4) is provided with a dielectric body (5), and the top of the dielectric body (5) is provided with a permanent magnet (6).

5. A surface-mount circulator for a transceiver module with thin-film circuitry as described in claim 4, characterized in that: The permanent magnet (6) is provided with a shielding cover (7) on its top. The shielding cover (7) is cylindrical and has a height of 0.2-0.5 mm. The grounding base plate (1) is provided with a first contact body (8-1) at its bottom. The top of the first contact body (8-1) penetrates the nested medium (3) and the central conductor (4).

6. A surface-mount circulator for a transceiver module with thin-film circuitry as described in claim 5, characterized in that: The bottom of the grounding base plate (1) is provided with a second contact (8-2), the top of the second contact (8-2) penetrates the nested medium (3) and the second rectangular impedance junction (4-4), and the bottom of the grounding base plate (1) is provided with a third contact (8-3), the top of the third contact (8-3) penetrates the nested medium (3) and matches the rectangular input port (4-6).

7. A surface-mount circulator for a transceiver module with thin-film circuitry as described in claim 6, characterized in that: The first contact body (8-1), the second contact body (8-2), and the third contact body (8-3) have a diameter of 0.4 mm. The top of the first contact body (8-1), the second contact body (8-2), and the third contact body (8-3) are provided with a contact body through-hole guide surface (9-1).

8. A surface-mount circulator for a transceiver module with thin-film circuitry as described in claim 7, characterized in that: A knurled desoldering pump (9-2) is provided on the outer side of the first contact body (8-1), the second contact body (8-2), and the third contact body (8-3). A flow-limiting desoldering buffer strip (9-3) is provided on the outer side of the first contact body (8-1), the second contact body (8-2), and the third contact body (8-3). A supporting annular platform (9-4) is provided at the top of the first contact body (8-1), the second contact body (8-2), and the third contact body (8-3).

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