A mezzanine bus of a cross-floor layout

CN224817585UActive Publication Date: 2026-09-29HUA TIANXIN INTELLIGENT IOT CO LTD
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Patent Information

Application Number
CN202522411689.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-13
Publication Date
2026-09-29
Estimated Expiration
2035-11-13

AI Technical Summary

Technical Problem

[0004]本实用新型的目的在于提供一种错层布局的层叠母排,解决现有层叠母排存在热气流交叉导致散热效率变差,产生高频共模干扰的可能性,以及均流效果差导致局部过热的问题

Benefits of technology

[0017]第一连接端用于集成输入端子组并连接整流电路,第二连接端用于齿痕输出端子组并连接逆变电路,让第一连接端的长度大于第二连接端的长度,第一连接端的高度大于第二连接端的高度,由此让连接整流电路和连接逆变电路的位置形成错层布置,同时通过缺口实现隔离,以此可以实现以下技术效果:

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a kind of staggered layout's layering busbar, including busbar matrix, the busbar matrix middle part is equipped with gap, the bottom of busbar matrix is respectively bent to form first connecting end and second connecting end with gap as boundary, the length of first connecting end is greater than the length of second connecting end, the height of first connecting end is greater than the height of second connecting end;The first connecting end is used to connect rectifier circuit, second connecting end is used to connect inverter circuit, and the first connecting end is equipped with input terminal group, and input terminal group is connected with rectifier circuit;Second connecting end is equipped with output terminal group, and output terminal group is connected with inverter circuit;The top of busbar matrix is equipped with third connecting end and fourth connecting end, and the third connecting end and fourth connecting end are used to connect capacitor;Solve the present layering busbar exists hot airflow intersection and lead to poor heat dissipation efficiency, the possibility of generating high-frequency common-mode interference, and the current effect poor lead to local overheating status.
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Description

Technical Field

[0001] This utility model relates to the field of stacked busbar technology, and in particular to a stacked busbar with a staggered layout. Background Technology

[0002] In the main circuit structure of high-power power electronic devices (such as frequency converters, SVG, UPS, wind power converters, etc.), the rectifier circuit and the inverter circuit usually share a single laminated busbar as the core channel for energy transmission and buffering. In traditional designs, the terminals of the rectifier and inverter circuits are often arranged on the same horizontal plane for ease of fabrication and installation. However, in applications with high power density and high switching frequency, this approach exposes risks that affect normal operation, such as reduced heat dissipation efficiency due to hot airflow crosstalk, the possibility of high-frequency common-mode interference, and localized overheating due to poor current sharing. Utility Model Content

[0003] (a) Technical issues

[0004] The purpose of this invention is to provide a staggered layout of stacked busbars, which solves the problems of poor heat dissipation efficiency caused by cross-flow of hot air in existing stacked busbars, the possibility of generating high-frequency common-mode interference, and local overheating caused by poor flow equalization.

[0005] (II) Technical Solution

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A staggered stacked busbar includes a busbar base with a notch in the middle. The bottom of the busbar base is bent along the notch to form a first connecting end and a second connecting end. The length and height of the first connecting end are greater than the length and height of the second connecting end. The first connecting end is used to connect to a rectifier circuit, and the second connecting end is used to connect to an inverter circuit. The first connecting end has an input terminal group connected to the rectifier circuit. The second connecting end has an output terminal group connected to the inverter circuit. The top of the busbar base has a third connecting end and a fourth connecting end for connecting capacitors.

[0008] Preferably, the busbar substrate includes a first conductor layer and a second conductor layer with insulating layers stacked on both sides. The first conductor layer has a first insulating layer on both sides, and the second conductor layer has a second insulating layer on both sides. The first connection end includes a first interface and a second interface spaced apart. The second connection end includes a third interface and a fourth interface spaced apart. The third connection end includes a fifth interface and a sixth interface spaced apart. The fourth connection end includes a seventh interface and an eighth interface spaced apart. The first interface, the third interface, and the fourth interface are all located on the first conductor layer. The second interface, the fourth interface, and the sixth interface are all located on the second conductor layer.

[0009] Preferably, it further includes a first protective layer and a second protective layer, wherein the first protective layer is fixed on the first insulating layer located on the outside, and the second protective layer is fixed on the second insulating layer located on the outside.

[0010] Preferably, the input terminal group includes two third insulating layers spaced apart, and three first terminal pieces spaced apart between the two third insulating layers, with the top height of the three first terminal pieces gradually increasing toward the notch side.

[0011] Preferably, the output terminal group includes two fourth insulating layers spaced apart, and three second terminal pieces spaced apart between the two fourth insulating layers, with the top height of the three second terminal pieces gradually increasing toward the notch side.

[0012] Preferably, both ends of the first terminal piece and both ends of the second terminal piece are provided with terminal connectors.

[0013] Preferably, the first conductor layer and the second conductor layer are both made of E-Cu copper with a thickness of 1.5 mm; the first terminal piece and the second terminal piece are both made of E-Cu copper with a thickness of 1 mm.

[0014] Preferably, the first conductor layer, the second conductor layer, the first terminal piece, and the second terminal piece are all provided with a tin plating layer, and the thickness of the tin plating layer is at least 5 μm.

[0015] Preferably, the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer are all made of ISOL insulating paper.

[0016] (III) Beneficial Effects

[0017] The first connection terminal is used to integrate the input terminal group and connect to the rectifier circuit, and the second connection terminal is used to connect the toothed output terminal group and connect to the inverter circuit. The length of the first connection terminal is greater than the length of the second connection terminal, and the height of the first connection terminal is greater than the height of the second connection terminal. This allows the positions connecting the rectifier circuit and the inverter circuit to be staggered, while the notch provides isolation. This achieves the following technical effects:

[0018] 1. Effectively reduces parasitic inductance asymmetry, improves current sharing performance, and avoids local overheating;

[0019] 2. The staggered design is equivalent to introducing a natural impedance isolation band in the physical structure, which increases the inductive and capacitive reactance of the high-frequency interference propagation path, weakens the common-mode voltage transmission efficiency, and helps to meet EMC standards.

[0020] 3. With the staggered layout, vertical layered wiring can be combined to achieve a clear airflow design of "top in, bottom out" or "front rectification, rear inversion", thereby improving the overall heat dissipation efficiency.

[0021] 4. The staggered design at different levels naturally increases the spatial isolation in the Z-axis direction. Even if there is some proximity in the XY plane, it can still meet the minimum gap requirements of the standard under pollution level conditions, and improve the operational reliability of the system in harsh environments.

[0022] 5. During maintenance and replacement, one side can be disconnected without affecting the fixed structure on the other side, improving service convenience; suitable for platform-based design, supporting independent upgrades and iterations of rectifier circuit units and inverter circuit units. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of this utility model;

[0024] Figure 2 This is a schematic diagram of the exploded structure of this utility model;

[0025] exist Figures 1 to 2 In the diagram, the correspondence between component names or lines and the drawing numbers is as follows:

[0026] Busbar base 1, notch 101, first conductor layer 102, second conductor layer 103, first insulating layer 104, second insulating layer 105, first protective layer 106, second protective layer 107, first connecting end 2, first interface 201, second interface 202, second connecting end 3, third interface 301, fourth interface 302, input terminal group 4, third insulating layer 401, first terminal piece 402, third protective layer 403, output terminal group 5, fourth insulating layer 501, second terminal piece 502, fourth protective layer 503, third connecting end 6, fifth interface 601, sixth interface 602, fourth connecting end 7, seventh interface 701, eighth interface 702, terminal connector 8. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0028] See Figures 1-2 As shown in the figure, an embodiment of this utility model proposes a staggered layout of stacked busbars, including a busbar base 1. The busbar base 1 has a notch 101 in the middle. The bottom of the busbar base 1 is bent with the notch 101 as the boundary to form a first connecting end 2 and a second connecting end 3. The length of the first connecting end 2 is greater than the length of the second connecting end 3, and the height of the first connecting end 2 is greater than the height of the second connecting end 3, so that the first connecting end 2 and the second connecting end 3 form a staggered structure. The first connecting end 2 is used to connect to the rectifier circuit, and the second connecting end 3 is used to connect to the inverter circuit. The first connecting end 2 is provided with an input terminal group 4, which is connected to the rectifier circuit. The second connecting end 3 is provided with an output terminal group 5, which is connected to the inverter circuit, so that the positions connected to the rectifier circuit and the positions connected to the inverter circuit are arranged in a staggered manner.

[0029] When the rectifier circuit and inverter circuit are connected to the two ends of the busbar base 1 respectively, if they are on the same plane and close to each other, inconsistent local circulating current paths can easily form, leading to increased differences in parasitic inductance between the parallel IGBT or diode branches. By setting the first connection terminal 2 and the second connection terminal 3 at different heights to form a staggered layer, three-dimensional spatial wiring optimization can be achieved, making the current path more symmetrical and reducing dynamic current sharing deviation. Especially in multi-module parallel systems, this design helps to improve dynamic voltage / current sharing effects and reduce the risk of local overheating.

[0030] The rectifier-side input voltage is relatively stable with a small di / dt; however, the inverter-side generates extremely high-frequency switching currents (reaching several kHz to tens of kHz) due to PWM modulation, which is the main source of EMI in the system. If the first connection terminal 2 and the second connection terminal 3 are arranged adjacent to each other on the same layer, high-frequency noise can be directly coupled to the front end through the busbar, affecting the electromagnetic compatibility performance of the rectifier bridge, filter capacitors, and even the power grid. Therefore, the staggered layer design is equivalent to introducing a natural impedance isolation band in the physical structure, increasing the inductive and capacitive reactance of the high-frequency interference propagation path, weakening the common-mode voltage transfer efficiency, and helping to meet EMC standards.

[0031] Rectifier and inverter circuits are typically mounted on the same heatsink, both generating significant heat during operation. When densely packed on the same layer, additional cables or copper busbars are often required to route them, potentially obstructing the main airflow direction generated by the fan and causing localized eddies or dead zones. Adopting a staggered layout, combined with vertically layered cabling, allows for a clear airflow design with "top-in, bottom-out" or "front rectifier, rear inverter," improving overall heat dissipation efficiency.

[0032] The staggered design at different levels naturally increases spatial isolation in the Z-axis direction. Even if there is some proximity in the XY plane, it can still meet the minimum gap requirements of the standard under pollution level conditions, thereby improving the operational reliability of the system in harsh environments.

[0033] During the assembly process, the staggered terminals allow for "step-by-step connection," first connecting the primary power line on the rectifier side, and then installing the output line on the inverter side, avoiding misconnections or stress caused by cross-operations. During maintenance and replacement, one side can be disconnected independently without affecting the fixed structure on the other side, improving service convenience. It is particularly suitable for platform-based designs, supporting independent upgrades and iterations of the rectifier and inverter circuits.

[0034] Specifically, a third connection terminal 6 and a fourth connection terminal 7 are provided on the top of the busbar base 1. The third connection terminal 6 and the fourth connection terminal 7 are used to connect capacitors in parallel, but they can also be used to connect other devices. This is to reserve connection points for parallel devices other than rectifier and inverter circuits.

[0035] To ensure good insulation performance of the conductive structures connected in parallel within the busbar substrate 1 and to meet insulation requirements in an ultra-thin structure, the busbar substrate 1 specifically includes a first conductor layer 102 and a second conductor layer 103 with insulating layers. The first conductor layer 102 has a first insulating layer 104 on both sides, and the second conductor layer 103 has a second insulating layer 105 on both sides. The first insulating layer 104 ensures double-sided insulation of the first conductor layer 102, while the second insulating layer 105 ensures double-sided insulation of the second conductor layer 103. Therefore, they can be directly stacked, satisfying insulation performance while reducing the thickness of the structure.

[0036] The first connection terminal 2 includes a first interface 201 and a second interface 202 spaced apart; the second connection terminal 3 includes a third interface 301 and a fourth interface 302 spaced apart; the third connection terminal 6 includes a fifth interface 601 and a sixth interface 602 spaced apart; and the fourth connection terminal 7 includes a seventh interface 701 and an eighth interface 702 spaced apart. Each connection terminal is used to connect electronic devices in parallel between the first conductor layer 102 and the second conductor layer 103. Therefore, the first interface 201, the third interface 301, and the fourth interface 302 are all located on the first conductor layer 102; the second interface 202, the fourth interface 302, and the sixth interface 602 are all located on the second conductor layer 103. In addition, insulation is formed at the interface of each corresponding connection terminal to prevent possible conduction after connecting the devices.

[0037] To protect the first conductor layer 102 and the second conductor layer 103 and increase the strength of the connection structure, a first protective layer 106 and a second protective layer 107 are also included. The first protective layer 106 is fixed to the first insulating layer 104 located on the outside, and the second protective layer 107 is fixed to the second insulating layer 105 located on the outside. The first protective layer 106 and the second protective layer 107 can be made of rigid plastic parts with insulating material or metal plates with insulating coating, so as to prevent the first conductor layer 102 and the second conductor layer 103 from deformation, and at the same time facilitate the installation of electrical components onto the first protective layer 106 and the second protective layer 107.

[0038] The input terminal group 4 can be directly installed on the second protective layer 107. The input terminal group 4 is used to connect to the rectifier circuit to connect to external cables. The input terminal group 4 is also in the form of a sheet structure. Specifically, the input terminal group 4 includes two layers of third insulating layer 401 spaced apart. Three first terminal pieces 402 are spaced apart between the two layers of third insulating layer 401. The top height of the three first terminal pieces 402 gradually increases towards the notch 101. The three first terminal pieces 402 are used for three-phase connection, such as connecting the T terminal, S terminal and R terminal. The connection position forms a height difference to facilitate wiring and leave space for heat dissipation.

[0039] The output terminals can also be installed on the second protective layer 107 for connection to the inverter circuit and for connecting external cables. They also have a sheet-like structure. Specifically, the output terminal group 5 includes two layers of fourth insulating layer 501 spaced apart, with three second terminal pieces 502 spaced apart between the two layers of fourth insulating layer 501. The top height of the three second terminal pieces 502 gradually increases towards the notch 101. They are used to connect the U terminal, V terminal and W terminal. Similarly, the cable is staggered by the height difference, which facilitates wiring and leaves space for heat dissipation.

[0040] Since both the first terminal piece 402 and the second terminal piece 502 are relatively thin, terminal connectors 8 are provided at both ends of the first terminal piece 402 and both ends of the second terminal piece 502 to facilitate connection. Threaded holes can be provided on the terminal connectors 8 for connection, or nuts can be considered to facilitate connection of devices or cables.

[0041] In order to maintain conductivity and achieve a thin sheet structure for the overall structure, the first conductor layer 102 and the second conductor layer 103 are both made of E-Cu copper with a thickness of 1.5mm; the first terminal piece 402 and the second terminal piece 502 are both made of E-Cu copper with a thickness of 1mm.

[0042] Meanwhile, in order to improve conductivity, a tin plating layer is provided on the first conductor layer 102, the second conductor layer 103, the first terminal piece 402 and the second terminal piece 502, and the thickness of the tin plating layer is at least 5μm.

[0043] To achieve good insulation while maintaining a sheet-like structure, each insulating layer is also a sheet structure. Specifically, the first insulating layer 104, the second insulating layer 105, the third insulating layer 401, and the fourth insulating layer 501 are all made of ISOL insulating paper, which can effectively avoid the risk of breakdown and ensure good insulation.

[0044] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0045] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0046] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A staggered layout of stacked busbars, characterized in that: Includes a busbar base (1), the busbar base (1) has a notch (101) in the middle, the bottom of the busbar base (1) is bent with the notch (101) as the boundary to form a first connecting end (2) and a second connecting end (3), the length of the first connecting end (2) is greater than the length of the second connecting end (3), and the height of the first connecting end (2) is greater than the height of the second connecting end (3); The first connection terminal (2) is used to connect to the rectifier circuit, and the second connection terminal (3) is used to connect to the inverter circuit. The first connection terminal (2) is provided with an input terminal group (4), which is connected to the rectifier circuit. The second connection terminal (3) is provided with an output terminal group (5), which is connected to the inverter circuit. The top of the busbar base (1) is provided with a third connection end (6) and a fourth connection end (7), which are used to connect capacitors.

2. The staggered layout of the stacked busbar according to claim 1, characterized in that: The busbar substrate (1) includes a first conductor layer (102) and a second conductor layer (103) with insulating layers. The first conductor layer (102) has a first insulating layer (104) on both sides, and the second conductor layer (103) has a second insulating layer (105) on both sides. The first connection end (2) includes a first interface (201) and a second interface (202) spaced apart, the second connection end (3) includes a third interface (301) and a fourth interface (302) spaced apart, the third connection end (6) includes a fifth interface (601) and a sixth interface (602) spaced apart, and the fourth connection end (7) includes a seventh interface (701) and an eighth interface (702) spaced apart. The first interface (201), the third interface (301), and the fourth interface (302) are all disposed on the first conductor layer (102); The second interface (202), the fourth interface (302) and the sixth interface (602) are all located on the second conductor layer (103).

3. The staggered layout of the stacked busbar according to claim 2, characterized in that: It also includes a first protective layer (106) and a second protective layer (107), the first protective layer (106) being fixed on the first insulating layer (104) located on the outside, and the second protective layer (107) being fixed on the second insulating layer (105) located on the outside.

4. The staggered layout of the stacked busbar according to claim 3, characterized in that: The input terminal group (4) includes two layers of third insulating layer (401) spaced apart, and three first terminal pieces (402) spaced apart between the two layers of third insulating layer (401). The top height of the three first terminal pieces (402) gradually increases toward the notch (101).

5. The staggered layout of the stacked busbar according to claim 4, characterized in that: The output terminal group (5) includes two fourth insulating layers (501) spaced apart, and three second terminal pieces (502) spaced apart between the two fourth insulating layers (501). The top height of the three second terminal pieces (502) gradually increases toward the notch (101).

6. The staggered layout of the stacked busbar according to claim 5, characterized in that: Terminal connectors (8) are provided at both ends of the first terminal piece (402) and both ends of the second terminal piece (502).

7. A staggered layout of stacked busbars according to claim 6, characterized in that: The first conductor layer (102) and the second conductor layer (103) are both made of E-Cu copper with a thickness of 1.5 mm; the first terminal piece (402) and the second terminal piece (502) are both made of E-Cu copper with a thickness of 1 mm.

8. The staggered layout of the stacked busbar according to claim 7, characterized in that: The first conductor layer (102), the second conductor layer (103), the first terminal piece (402) and the second terminal piece (502) are all provided with a tin plating layer, and the thickness of the tin plating layer is at least 5 μm.

9. A staggered layout of stacked busbars according to claim 8, characterized in that: The first insulating layer (104), the second insulating layer (105), the third insulating layer (401) and the fourth insulating layer (501) are all made of ISOL insulating paper.