inverter bricks

Abstract

The utility model discloses an inverter brick, including capacitor component and the PCB board and busbar of surface on capacitor component's stacking in proper order, is provided with direct current positive terminal, direct current negative pole terminal and power module on the PCB board, direct current positive terminal and direct current negative pole terminal are along first direction and set gradually, and the first contact area and second contact area are along first direction and set gradually on the busbar, and capacitor positive pole terminal and capacitor negative pole terminal are fixedly installed on capacitor component, and capacitor positive pole terminal and direct current positive terminal electric property contact, and capacitor negative pole terminal and busbar's first contact area electric property contact, and direct current negative pole terminal and busbar's second contact area electric property contact, the utility model discloses an inverter brick, through each terminal on the PCB board, capacitor positive / negative pole terminal and the structural design of busbar, has reduced system parasitic inductance, has promoted system reliability, makes inverter brick whole volume reduction while power density promotion.

Description

Technical Field

[0001] This utility model belongs to the field of new energy vehicle technology, specifically relating to an inverter brick. Background Technology

[0002] Faced with cost and size constraints in electronic control components, current new energy vehicles typically use all-in-one controllers. These controllers consist of a single enclosure that integrates numerous components. However, current designs generally have many components and are relatively complex. To reduce the controller's size, these internal components are tightly interconnected mechanically. Removing one component requires disassembling all its associated structural parts, making fault diagnosis and repair difficult and increasing after-sales service costs. Furthermore, the numerous and scattered parts increase assembly difficulty during manufacturing, reducing the reliability and stability of the controller assembly. Alternatively, inverter bricks using encapsulated power modules are relatively large, have high parasitic stray inductance, and their system power density and reliability advantages are not yet significant. Therefore, simplifying the system manufacturing process and improving the product's power density, system reliability, and cost-effectiveness are crucial aspects of all-in-one controller development.

[0003] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0004] The purpose of this invention is to provide an inverter brick that can improve overall power density and reduce parasitic inductance.

[0005] To achieve the above objectives, the technical solution provided by a specific embodiment of this utility model is as follows:

[0006] An inverter brick includes a capacitor assembly and a PCB board and a busbar stacked sequentially on the surface of the capacitor assembly. The PCB board is provided with a DC positive terminal, a DC negative terminal and a power module. The DC positive terminal and the DC negative terminal are arranged sequentially along a first direction. The busbar is provided with a first contact area and a second contact area sequentially along the first direction. The capacitor assembly is fixedly mounted with a capacitor positive terminal and a capacitor negative terminal. The capacitor positive terminal is in electrical contact with the DC positive terminal, the capacitor negative terminal is in electrical contact with the first contact area of ​​the busbar, and the DC negative terminal is in electrical contact with the second contact area of ​​the busbar.

[0007] In one or more embodiments of this utility model, the capacitor assembly includes a capacitor body and a cover plate. The capacitor body is provided with cooling water channels, and the cover plate covers the surface of the cooling water channels. The PCB board and the busbar are stacked on the cover plate in sequence.

[0008] In one or more embodiments of this utility model, the cover plate is provided with a heat dissipation structure extending into the cooling water channel; and / or a sealing ring is provided between the cover plate and the capacitor body.

[0009] In one or more embodiments of this utility model, the PCB board is divided into multiple pieces and arranged sequentially along a second direction perpendicular to the first direction; and / or the power module is embedded inside the PCB board.

[0010] In one or more embodiments of this utility model, the PCB board is further provided with AC output terminals and signal connectors.

[0011] In one or more embodiments of this utility model, the inverter brick further includes an AC output copper busbar, a first through hole is provided on the busbar corresponding to the AC output terminal, the AC output copper busbar passes through the first through hole and makes electrical contact with the AC output terminal; and / or a second through hole is provided on the busbar corresponding to the signal connector; and / or the AC output terminal is disposed between the DC positive terminal and the DC negative terminal, and the signal connector is disposed between the AC output terminal and the DC positive terminal and / or the DC negative terminal.

[0012] In one or more embodiments of this utility model, the positive terminal of the capacitor is laser welded to the DC positive terminal; and / or the negative terminal of the capacitor is laser welded to the first contact area of ​​the busbar; and / or the DC negative terminal is laser welded to the second contact area of ​​the busbar.

[0013] In one or more embodiments of this utility model, the positive terminal of the capacitor includes a connected contact portion and a mounting portion. The contact portion is fixedly mounted to the capacitor assembly via the mounting portion. The contact portion is inserted between the PCB board and the busbar and makes electrical contact with the DC positive terminal. And / or the busbar extends in the opposite direction of the first direction to the outside of the capacitor assembly. The first contact area is located on the outside of the capacitor assembly. One end of the negative terminal of the capacitor makes electrical contact with the first contact area of ​​the busbar, and the other end is fixedly mounted to the capacitor assembly.

[0014] In one or more embodiments of this utility model, a first insulating plate is provided between the busbar and the PCB board; and / or a second insulating plate is provided on the surface of the busbar opposite to the PCB board.

[0015] In one or more embodiments of this utility model, the capacitor assembly includes an aluminum-cased potted capacitor.

[0016] Compared with existing technologies, the inverter brick of this invention reduces parasitic inductance and improves system reliability through the structural design of the terminals, capacitor positive / negative terminals, and busbars on the PCB board, resulting in a smaller overall size and increased power density. The design of cooling channels and other heat dissipation structures reduces system thermal resistance and improves heat dissipation. Compared with the traditional complex structure of dispersed electronic control components, this inverter brick reduces assembly difficulty, simplifies subsequent fault diagnosis and repair, and lowers after-sales costs. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is an overall structural diagram of the inverter brick in one embodiment of the present invention.

[0019] Figure 2 This is an exploded view of the inverter brick in one embodiment of the present invention.

[0020] Figure 3 This is a bottom view of the first insulating plate and busbar in one embodiment of the present invention. Detailed Implementation

[0021] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0022] The terms "coupled," "connected," or "linked" in this specification include both direct and indirect connections. Indirect connections are those made through an intermediate medium, such as those made through an electrically conductive medium, which may have parasitic inductance or capacitance. Indirect connections may also include connections made through other active or passive devices to achieve the same or similar functional purpose, such as connections through switches, follower circuits, or other circuits or components. Furthermore, in this specification, terms such as "first" and "second" are primarily used to distinguish one technical feature from another, and do not necessarily require or imply any actual relationship, quantity, or order between these technical features.

[0023] In the detailed description of this specification, reference is made to the accompanying drawings, which form a part thereof, wherein like reference numerals always denote like parts, and wherein exemplary embodiments are shown by way of example that may be implemented. It should be understood that other embodiments may be utilized, and structural or logical changes may be made, without departing from the scope of this application. Therefore, the following detailed description should not be considered limiting.

[0024] The various operations in the specification may be described sequentially as multiple discrete actions or operations in a manner most conducive to understanding the claimed subject matter. However, the order of description should not be construed as implying that these operations must be sequentially related. Specifically, these operations may not be performed in the order presented. The described operations may be performed in a different order than in the described embodiments. Various additional operations may be performed in additional embodiments and / or the described operations may be omitted.

[0025] For the purposes of this application, the phrase "A and / or B" means (A), (B), or (A and B). For the purposes of this application, the phrase "A, B and / or C" means (A), (B), (C), (A and B), (A and C), (B and C), or (A, B and C).

[0026] Various components and devices may be mentioned or shown in the singular form herein, but only for the convenience of discussion, and any element mentioned in the singular form may include multiple such elements as taught herein.

[0027] The description uses the phrases "in one embodiment," "in other embodiments," or "in some embodiments," each of which can refer to one or more of the same or different embodiments. Furthermore, the terms "comprising," "including," "having," etc., used in relation to embodiments of this application are synonymous.

[0028] Combination Figures 1-3 As shown, in one embodiment of the present invention, the inverter brick includes a capacitor assembly 10 and a PCB board 20 and a busbar 30 stacked sequentially on the surface of the capacitor assembly 10.

[0029] In one embodiment, the PCB board 20 and the busbar 30 are stacked sequentially on the upper surface of the capacitor assembly 10 along the Z-axis direction shown in the figure.

[0030] The PCB board 20 includes a DC positive terminal 21, a DC negative terminal 22, a power module, an AC output terminal 23, and a signal connector 24. The DC positive terminal 21 and the DC negative terminal 22 are arranged sequentially along a first direction, which, for example, is the positive X-axis as shown in the figure. The AC output terminal 23 is located between the DC positive terminal 21 and the DC negative terminal 22. For example, the DC positive terminal 21 and the DC negative terminal 22 are located at opposite ends of the PCB board 20, and the AC output terminal 23 is located in the middle of the PCB board 20.

[0031] In one embodiment, the power module is a three-phase inverter circuit, with the DC positive terminal 21 and the DC negative terminal 22 connected to the DC positive and DC negative terminals of the inverter circuit, respectively, and the AC output terminal 23 connected to the AC output terminal of the inverter circuit.

[0032] Signal connectors 24 are disposed between the AC output terminal 23 and the DC positive terminal 21 and the DC negative terminal 22. In one embodiment, the signal connectors 24 are connected to the signal control terminal of the inverter circuit. The signal connectors 24 are used to connect external control devices to control the inverter circuit. For example, six signal connectors 24 are provided, corresponding to the six power devices in the three-phase inverter circuit. Three signal connectors 24 are disposed between the AC output terminal 23 and the DC positive terminal 21, and the other three signal connectors 24 are disposed between the AC output terminal 23 and the DC negative terminal 22. In other embodiments, the number of signal connectors 24 may also be different, and they may be disposed between the AC output terminal 23 and the DC positive terminal 21, or between the AC output terminal 23 and the DC negative terminal 22.

[0033] In one embodiment, the PCB board 20 is divided into multiple pieces and arranged sequentially along a second direction perpendicular to the first direction. For example, the second direction is the Y-axis direction shown in the figure.

[0034] Preferably, the PCB board 20 is divided into 3 pieces, and each PCB board 20 is provided with one half-bridge of the three-phase inverter circuit and two corresponding signal connectors 24. Three DC positive terminals 21, three DC negative terminals 22 and three AC output terminals 23 are also provided and distributed on the three PCB boards 20 respectively.

[0035] By dividing the PCB board 20, PCB warpage can be effectively reduced.

[0036] Preferably, the power module is embedded inside the PCB board 20. Embedding power semiconductor chips into the PCB is an emerging process that integrates the power device with the PCB board 20 through special manufacturing processes, achieving higher integration and power density. This not only reduces the space occupied by the package and lowers the packaging cost, but also improves electrical performance and heat dissipation to a certain extent.

[0037] Combination Figures 1-3 As shown, a first contact area 31 and a second contact area 32 are sequentially arranged on the busbar 30 along the first direction. A capacitor positive terminal 41 and a capacitor negative terminal 42 are fixedly installed on the capacitor assembly 10. The capacitor positive terminal 41 is electrically in contact with the DC positive terminal 21, the capacitor negative terminal 42 is electrically in contact with the first contact area 31 of the busbar 30, and the DC negative terminal 22 is electrically in contact with the second contact area 32 of the busbar 30.

[0038] As can be seen, the current enters the PCB board 20 from the DC positive terminal 21, then flows along the first direction, from the DC negative terminal 22 to the busbar 30, and then flows in the reverse direction of the first direction to the capacitor negative terminal 42. Through the above design, the current direction can be well controlled, the overall parasitic inductance of the system can be reduced, and the overall layout is compact and the size is small.

[0039] In one embodiment, a first insulating plate 51 may be provided between the busbar 30 and the PCB board 20 to prevent accidental contact and electrical conduction. A second insulating plate 52 may be provided on the surfaces of the busbar 30 opposite to the PCB board 20 to prevent accidental contact and electrical conduction with the outside.

[0040] Specifically, a clearance hole is provided on the first insulating plate 51 at the position corresponding to the DC negative terminal 22, and the DC negative terminal 22 can pass through the clearance hole to make electrical contact with the second contact area 32 of the busbar 30.

[0041] In other embodiments, the first insulating plate 51 and / or the second insulating plate 52 may not be provided, and insulation isolation may be achieved by means of interval installation or other methods.

[0042] In one embodiment, the inverter brick also includes an AC output copper busbar 25. A first through hole is provided on the busbar 30 corresponding to the AC output terminal 23. A clearance hole is also provided on the first insulating plate 51 and the second insulating plate 52 corresponding to the AC output terminal 23. The AC output copper busbar 25 can pass through the first through hole and the corresponding clearance hole on the first insulating plate 51 and the second insulating plate 52 to make electrical contact with the AC output terminal 23.

[0043] In one embodiment, a second through hole is provided on the busbar 30 corresponding to the signal connector 24. A clearance hole is also provided on the first insulating plate 51 and the second insulating plate 52 corresponding to the signal connector 24. The signal connector 24 can pass through the second through hole and the corresponding clearance hole on the first insulating plate 51 and the second insulating plate 52, facilitating external wiring.

[0044] Preferably, the positive terminal 41 of the capacitor is fixed to the DC positive terminal 21, the negative terminal 42 of the capacitor is fixed to the first contact area 31 of the busbar 30, and the negative terminal 22 of the DC negative terminal is fixed to the second contact area 32 of the busbar 30 by laser welding. This reduces the contact resistance and parasitic inductance of the power circuit of the system, and further improves the reliability of the system.

[0045] Combination Figures 1-3 As shown, the positive terminal 41 of the capacitor includes a contact portion 411 and a mounting portion 412 connected together. The contact portion 411 is fixedly mounted to the capacitor assembly 10 through the mounting portion 412. The contact portion 411 is inserted between the PCB board 20 and the busbar 30 and makes electrical contact with the DC positive terminal 21.

[0046] Specifically, the mounting part 412 is mounted on the side of the capacitor assembly 10 near the DC positive terminal 21. The mounting part 412 and the contact part 411 form a certain angle, so that the mounting part 412 can be inserted between the PCB board 20 and the busbar 30, or more specifically, between the PCB board 20 and the first insulating plate 51, thereby enabling electrical contact with the DC positive terminal 21.

[0047] The busbar 30 extends in the opposite direction of the first direction to the outside of the capacitor assembly 10. The first contact area 31 is located outside the capacitor assembly 10, that is, in the negative X-axis direction of the figure, the orthogonal projection of the busbar 30 (projection along the Z-axis) exceeds the orthogonal projection of the capacitor assembly 10, and the first contact area 31 is located in the excess portion. One end of the capacitor negative terminal 42 is electrically in contact with the first contact area 31 of the busbar 30, and the other end is fixedly installed with the capacitor assembly 10.

[0048] Specifically, the negative terminal 42 of the capacitor is located outside the positive terminal 41 of the capacitor to avoid short circuit. The bottom end of the negative terminal 42 of the capacitor is fixedly installed on the side of the capacitor assembly 10. The top end of the negative terminal 42 of the capacitor is bent away from the capacitor assembly 10 and makes electrical contact with the first contact area 31 of the busbar 30.

[0049] As can be seen, the first contact area 31 and the second contact area 32 are both located on the bottom surface of the busbar 30. The above design facilitates the installation and welding of the busbar 30.

[0050] like Figure 2As shown, the capacitor assembly 10 includes a capacitor body 11 and a cover plate 12. Cooling channels 13 are provided on the capacitor body 11, and the cover plate 12 covers the surface of the cooling channels 13. The PCB board 20 and the busbar 30 are stacked on the cover plate 12 in sequence.

[0051] Specifically, the PCB board 20 is reflow soldered onto the cover plate 12, and the cover plate 12 is fixedly installed to the capacitor body 11 with fastening screws. Cooling channels 13 are formed on the top of the capacitor body 11, and inlets 14 and outlets 15 are also formed on both sides of the capacitor body 11. The positive terminal 41 and the negative terminal 42 of the capacitor are both fixedly installed on the capacitor body 11 and electrically connected to it.

[0052] In one embodiment, the cover plate 12 is provided with a heat dissipation structure 121 extending into the cooling water channel 13. For example, the heat dissipation structure 121 is a heat dissipation pin. By providing the heat dissipation structure 121, the heat dissipation capacity of the cover plate 12 and the PCB board 20 can be improved. The cover plate 12 can be made of a metal material with high thermal conductivity.

[0053] In one embodiment, a sealing ring 16 is provided between the cover plate 12 and the capacitor body 11. Specifically, a sealing groove 17 surrounding the cooling water channel 13 is provided on the top of the capacitor body 11, and the sealing ring 16 is disposed in the sealing groove 17. The cover plate 12 achieves sealing with the capacitor body 11 through the sealing ring 16.

[0054] Preferably, the capacitor assembly 10 includes an aluminum-cased encapsulated capacitor, which improves strength and reliability compared to traditional plastic-cased encapsulation. Specifically, the capacitor body 11 has an aluminum casing and is internally encapsulated with epoxy resin potting compound.

[0055] Compared with existing technologies, the inverter brick in this solution, through the structural design of the terminals on the PCB board 20, the positive terminal 41 and the negative terminal 42 of the capacitors, and the busbar 30, standardizes the current direction, reduces system parasitic inductance, and improves system reliability. The use of an embedded power module structure on the PCB reduces the overall size of the inverter brick while increasing power density. The design of heat dissipation structures such as the cooling water channel 13 reduces system thermal resistance and improves heat dissipation.

[0056] During assembly, it is only necessary to first weld and fix the PCB board 20 to the cover plate 12, then assemble the sealing ring 16 and the cover plate 12, then cover the busbar 30 and the first insulating plate 51 and the second insulating plate 52, complete the welding between the terminals, and finally pot the capacitor. Compared with the traditional structure of dispersed and complex electronic control components, this inverter brick reduces the assembly difficulty, and the subsequent fault diagnosis and repair are also simpler, reducing after-sales costs.

[0057] It will be apparent to those skilled in the art that this disclosure is not limited to the details of the exemplary embodiments described above, and that this disclosure can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of this disclosure is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this disclosure. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0058] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An inverter brick, characterized in that, The device includes a capacitor assembly and a PCB board and a busbar stacked sequentially on the surface of the capacitor assembly. The PCB board is provided with a DC positive terminal, a DC negative terminal, and a power module. The DC positive terminal and the DC negative terminal are arranged sequentially along a first direction. The busbar is provided with a first contact area and a second contact area sequentially along the first direction. The capacitor assembly is fixedly mounted with a capacitor positive terminal and a capacitor negative terminal. The capacitor positive terminal is in electrical contact with the DC positive terminal, the capacitor negative terminal is in electrical contact with the first contact area of ​​the busbar, and the DC negative terminal is in electrical contact with the second contact area of ​​the busbar.

2. The inverter brick according to claim 1, characterized in that, The capacitor assembly includes a capacitor body and a cover plate. The capacitor body is provided with cooling water channels, and the cover plate covers the surface of the cooling water channels. The PCB board and busbar are stacked on the cover plate in sequence.

3. The inverter brick according to claim 2, characterized in that, The cover plate is provided with a heat dissipation structure extending into the cooling water channel; and / or A sealing ring is provided between the cover plate and the capacitor body.

4. The inverter brick according to claim 1, characterized in that, The PCB board is divided into multiple pieces and arranged sequentially along a second direction perpendicular to the first direction; and / or The power module is embedded inside the PCB board.

5. The inverter brick according to claim 1, characterized in that, The PCB board is also equipped with AC output terminals and signal connectors.

6. The inverter brick according to claim 5, characterized in that, The inverter brick also includes an AC output copper busbar, on which a first through hole is provided corresponding to the AC output terminal, and the AC output copper busbar passes through the first through hole to make electrical contact with the AC output terminal; and / or The busbar has a second through hole corresponding to the signal connector; and / or The AC output terminal is disposed between the DC positive terminal and the DC negative terminal, and the signal connector is disposed between the AC output terminal and the DC positive terminal and / or the DC negative terminal.

7. The inverter brick according to claim 1, characterized in that, The capacitor's positive terminal is laser-welded to the DC positive terminal; and / or The capacitor negative terminal is laser welded to the first contact area of ​​the busbar; and / or The DC negative terminal is laser welded to the second contact area of ​​the busbar.

8. The inverter brick according to claim 1, characterized in that, The positive terminal of the capacitor includes a connected contact portion and a mounting portion. The contact portion is fixedly mounted to the capacitor assembly via the mounting portion. The contact portion is inserted between the PCB board and the busbar and makes electrical contact with the DC positive terminal; and / or The busbar extends in the opposite direction of the first direction to the outside of the capacitor assembly. The first contact area is located on the outside of the capacitor assembly. One end of the negative terminal of the capacitor is electrically in contact with the first contact area of ​​the busbar, and the other end is fixedly installed with the capacitor assembly.

9. The inverter brick according to claim 1, characterized in that, A first insulating plate is provided between the busbar and the PCB board; and / or A second insulating plate is provided on the surface of the busbar opposite to that of the PCB board.

10. The inverter brick according to claim 1, characterized in that, The capacitor assembly includes aluminum-cased potted capacitors.

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