Millimeter wave digital isolator using on-chip antenna

Abstract

The utility model provides millimeter wave digital isolator of using on -chip antenna, including respectively located transmitting end chip module and receiving end chip module of isolation band both sides, the transmitting end chip module is integrated including first on -chip antenna, first matching network and transmitting unit who connects in proper order, the receiving end chip module is integrated including second on -chip antenna, second matching network and receiving unit who connects in proper order, first on -chip antenna with second on -chip antenna between based on millimeter wave communication connection. The utility model integrates antenna in the chip inside, not only be advantageous to antenna structure and the miniaturization design of isolator overall structure, moreover can realize high integration, eliminate RF loss and impedance matching problem while reducing cost, simultaneously, on -chip antenna supports diversification radiation field form, also help to widen application scene.

Description

Technical Field

[0001] This utility model relates to the field of digital isolator technology, and more specifically to a millimeter-wave digital isolator using an on-chip antenna. Background Technology

[0002] Existing technologies utilize antennas to implement electromagnetic coupling millimeter-wave digital isolators, such as... Figure 1 As shown, the antenna structure typically uses an antenna-in-package (AiP) antenna. This method results in a large antenna area and high cost. To save costs as much as possible, AiP antennas mostly use wire bonding to connect with other components, i.e., wires are bonded from the TX output of the isolator to the antenna, and from the RX input of the isolator to the antenna. This wire bonding method has high RF loss, and if the height is inconsistent, it will also cause impedance mismatch between the antenna and the circuit. Even if a flip-chip packaging method is used to overcome the impedance mismatch problem caused by wire bonding and reduce RF loss to some extent, the problems of high cost and RF loss still exist, especially when used in the millimeter-wave band, where the problems are more prominent and cannot be ignored. Furthermore, AiP antennas typically use dipole antennas or patch antennas, and their symmetrical structure and specific impedance range limit their application. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a millimeter-wave digital isolator using an on-chip antenna, which can not only greatly reduce the area occupied by the antenna and make the overall structure more compact; but also eliminate RF loss and impedance matching problems while reducing costs; and at the same time broaden the application.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0005] A millimeter-wave digital isolator using an on-chip antenna includes a transmitter chip module and a receiver chip module located on opposite sides of an isolator strip. The transmitter chip module integrates a first on-chip antenna, a first matching network, and a transmitter unit connected in sequence. The receiver chip module integrates a second on-chip antenna, a second matching network, and a receiver unit connected in sequence. The first on-chip antenna and the second on-chip antenna are connected via millimeter-wave communication.

[0006] Optionally, the first on-chip antenna is a slot on-chip antenna, a loop on-chip antenna, a slot-loop on-chip antenna, or a dipole on-chip antenna; the second on-chip antenna is a slot on-chip antenna, a loop on-chip antenna, a slot-loop on-chip antenna, or a dipole on-chip antenna.

[0007] Optionally, the transmitting unit is a power amplifier, a buffer, or a voltage-controlled oscillator.

[0008] Optionally, the receiving unit is an envelope detector or a low-noise amplifier.

[0009] Optionally, the first matching network is a network transformer, a matching microstrip line, or a matching coupler; the second matching network is a network transformer, a matching microstrip line, or a matching coupler.

[0010] Optionally, the transmitter chip module and the receiver chip module are integrated on the same semiconductor substrate to form a millimeter-wave digital isolation chip.

[0011] Optionally, the first on-chip antenna and the second on-chip antenna on the millimeter-wave digital isolation chip are an integrated on-chip antenna structure.

[0012] Optionally, the integrated on-chip antenna structure consists of two slot on-chip antennas, or two loop on-chip antennas, or two slot-loop on-chip antennas, or two dipole on-chip antennas.

[0013] Optionally, the integrated on-chip antenna structure operates in the millimeter-wave band from 30Hz to 300GHz.

[0014] Optionally, the antenna impedance of the integrated on-chip antenna structure is 50 ohms or 100 ohms.

[0015] The beneficial effects of this invention are as follows: The millimeter-wave digital isolator of this invention uses an on-chip antenna (AoC) that integrates the antenna directly inside the chip to achieve its antenna function. Compared with millimeter-wave digital isolators that use traditional packaged antennas (AiP), it has at least the following advantages:

[0016] (1) Miniaturization of antenna structure: On-chip antennas operating in the millimeter wave band have a significantly reduced size due to their short wavelength characteristics, which greatly reduces the area occupied by the antenna structure.

[0017] (2) High integration: The antenna structure and the RF chip are integrated on the same semiconductor substrate, which can not only eliminate the RF signal loss and impedance matching problems caused by wire bonding or flip packaging, but also make the overall structure of the isolator more compact and more conducive to the miniaturization design of the isolator.

[0018] (3) Wider application: The conductor structure of the on-chip antenna (such as slot, loop, dipole, etc.) can realize the efficient radiation of electromagnetic field, and at the same time have good impedance matching, which can maximize the energy transmission efficiency, thus having a wider application prospect. Attached Figure Description

[0019] Figure 1This is a schematic diagram of a millimeter-wave digital isolator structure implemented using a patch antenna in the prior art;

[0020] Figure 2 A simplified structural diagram of a millimeter-wave digital isolator using an on-chip antenna is provided for an embodiment of this utility model;

[0021] Figure 3 A schematic diagram of the structure of a millimeter-wave digital isolator with an overall single-chip design provided for embodiments of this utility model;

[0022] Figures 4a-4c A schematic diagram of the transmitter chip module in a millimeter-wave digital isolator using an on-chip antenna, provided for a specific embodiment of this utility model;

[0023] Figures 5a-5b This is a schematic diagram of the receiver chip module in a millimeter-wave digital isolator using an on-chip antenna, provided for a specific embodiment of this utility model. Detailed Implementation

[0024] To illustrate in detail the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this utility model, the following detailed description is provided in conjunction with the listed specific embodiments and accompanying drawings. The embodiments described herein are merely illustrative of the technical solutions of this utility model and are therefore intended to limit the scope of protection of this utility model.

[0025] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0026] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0027] In the description of this utility model, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " generally indicates that the preceding and following objects have an "or" logical relationship.

[0028] In this invention, terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy, or order relationship between these entities or operations.

[0029] Without further limitations, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this invention is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a series of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0030] Similar to the understanding in the Examination Guidelines, in this utility model, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this utility model, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.

[0031] In the description of the embodiments of this utility model, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the convenience of describing the specific embodiments of this utility model or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0032] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this utility model, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this utility model pertains, the specific meaning of the above terms in the embodiments of this utility model can be understood according to the specific circumstances.

[0033] Explanation of technical terms involved in this utility model:

[0034] Antenna-in-package (AiP) is a packaging process that integrates antennas and radio frequency circuits together, achieving a single package that integrates antennas and radio frequency components.

[0035] On-chip antenna (AoC) is a technology that integrates an antenna directly inside a chip using semiconductor processes (such as CMOS). This means that the antenna and radio frequency (RF) circuitry are designed and fabricated together, unlike the typical design process where the RF circuitry and antenna are designed first and then combined.

[0036] Antenna in package (AiP) and antenna on chip (AoC) are two different integrated antenna technologies. The former is a package-level integration method, implemented using packaging technology; the latter is a chip-level integration method, implemented using semiconductor technology.

[0037] Example 1

[0038] This embodiment provides a millimeter-wave digital isolator using an on-chip antenna, such as... Figure 2 As shown, it includes a transmitter chip module and a receiver chip module located on both sides of the isolation zone; the transmitter chip module integrates a first on-chip antenna, a first matching network and a transmitter unit TX connected in sequence; the receiver chip module integrates a second on-chip antenna, a second matching network and a receiver unit RX connected in sequence; the first on-chip antenna and the second on-chip antenna are connected based on millimeter-wave communication.

[0039] In some specific implementations, the transmitter chip module and receiver chip module in the millimeter-wave digital isolator are two independently fabricated chips, meaning the millimeter-wave digital isolator as a whole is a dual-chip design. Specifically, the first on-chip antenna, the first matching network, and the transmitter unit are integrated onto the same semiconductor substrate using semiconductor technology to form the transmitter chip module. Similarly, the second on-chip antenna, the second matching network, and the receiver unit are also integrated onto the same semiconductor substrate using semiconductor technology to form the receiver chip module.

[0040] Here, the dual-chip millimeter-wave digital isolator, due to the physical separation between its transmitter and receiver, effectively reduces the risk of electromagnetic crosstalk, improves signal purity and transmission stability, thus exhibiting stronger functional isolation. Simultaneously, the transmitter's high power consumption necessitates independent design for better heat dissipation, resulting in superior thermal management. Furthermore, the dual-chip module design better supports modular upgrades, such as allowing for separate optimization of the transmitter or receiver chip modules, thus offering greater flexibility and scalability. Additionally, a failure in one of the dual-chip modules will not affect the other, demonstrating high fault isolation.

[0041] In other specific embodiments, the millimeter-wave digital isolator is designed as a single chip, also known as a millimeter-wave digital isolation chip. The transmitter chip module and receiver chip module can be considered as two functionally divided regions on a single chip. Specifically, the first on-chip antenna, the first matching network, and the transmitting unit are integrated using semiconductor technology on the same side of the same semiconductor substrate. This side constitutes the transmitter chip module, used to convert the input signal into millimeter-wave form for transmission. The second on-chip antenna, the second matching network, and the receiving unit are integrated using semiconductor technology on the opposite side of the same semiconductor substrate, corresponding to the transmitter chip module. This side constitutes the receiver chip module, used to restore the received millimeter-wave signal back to the input signal.

[0042] Here, the millimeter-wave digital isolator with a single-chip design can significantly reduce the footprint and achieve higher integration by integrating the transmitter and receiver circuits on a single chip, which is more conducive to micro-miniaturization design. In addition, the integrated chip packaging helps to reduce overall power consumption and production costs.

[0043] In some specific implementations, such as Figure 3 As shown, the millimeter-wave digital isolator with a single-chip design has an integrated on-chip antenna structure for both the first and second on-chip antennas. In other words, the first and second on-chip antennas are physically integrated into a single unit, using the same materials and manufactured uniformly.

[0044] In some specific embodiments, the first on-chip antenna can be a slot on-chip antenna, a loop on-chip antenna, or a combination of both (i.e., a slot-loop on-chip antenna), or a dipole on-chip antenna, etc. Similarly, the second on-chip antenna can also be a slot on-chip antenna, a loop on-chip antenna, a slot-loop on-chip antenna, or a combination of both (i.e., a slot-loop on-chip antenna), or a dipole on-chip antenna, etc.

[0045] Among them, the slot on-chip antenna, such as Figure 4a As shown, the on-chip antenna of the slot loop is as follows: Figure 4b As shown, the on-chip antenna of the dipole is as follows: Figure 4c As shown. Here, the first and second on-chip antennas can be implemented using various antenna structures, resulting in diverse antenna radiation patterns.

[0046] Similarly, in some specific implementations of the "millimeter-wave digital isolator with overall single-chip design" mentioned above, the integrated on-chip antenna structure can be composed of two slot on-chip antennas, two loop on-chip antennas, two slot-loop on-chip antennas, or two dipole on-chip antennas.

[0047] In some other embodiments, the first on-chip antenna and the second on-chip antenna, or the integrated on-chip antenna structure, operate in the millimeter-wave frequency band from 30Hz to 300GHz. This enables isolated communication transmission between the transmitting chip module and the receiving chip module based on millimeter-wave technology.

[0048] In some specific embodiments, the first on-chip antenna and the second on-chip antenna, or the integrated on-chip antenna structure, preferably have a standardized impedance of 50 ohms or 100 ohms. The 50Ω impedance matches the port impedance of the on-chip antenna (especially a dipole antenna), minimizing reflection loss and ensuring efficient energy transmission. The 100Ω impedance, as a standard specification for differential signal transmission, effectively suppresses common-mode noise using a two-wire transmission structure, reducing compatibility risks between different devices and ensuring stable signal transmission. Here, the on-chip antennas on both the transmitting and receiving chip modules adopt a standardized impedance design, facilitating direct matching with the corresponding RF circuits and enabling efficient transmission of millimeter-wave signals between isolated ends.

[0049] Example 2

[0050] This embodiment is a further extension of Embodiment 1, with a more detailed breakdown of its structure.

[0051] This embodiment provides a millimeter-wave digital isolator using an on-chip antenna, such as... Figures 4a to 4cAs shown, its transmitting unit can be a power amplifier (PA), a buffer, or a voltage-controlled oscillator (VCO); one end of the power amplifier (PA), buffer, or voltage-controlled oscillator (VCO) is connected to the first matching network, and the other end is connected to other circuits.

[0052] Here, the power amplifier (PA) enhances the driving capability of the signal to be transmitted, providing sufficient output power to maintain transmission quality. The buffer receives the signal to be transmitted with high input impedance and drives subsequent circuits with low output impedance, serving to achieve impedance matching and isolation, as well as maintain signal integrity. The voltage-controlled oscillator (VCO) converts the signal to be transmitted into a high-frequency carrier signal, achieving signal modulation for isolated transmission. It also adjusts the output frequency to adapt to different transmission rates, achieving frequency adaptability.

[0053] like Figure 5a and Figure 5b As shown, this embodiment provides a millimeter-wave digital isolator using an on-chip antenna, whose receiver unit can be an envelope detector (ED) or a low-noise amplifier (LNA); one end of the envelope detector (ED) or low-noise amplifier (LNA) is connected to the second matching network, and the other end is connected to other circuits.

[0054] Here, the envelope detector (ED) is used to detect changes in the amplitude envelope of the received signal to reconstruct the original digital signal waveform, completing the conversion from carrier to baseband signal and realizing carrier demodulation and signal restoration. It also filters out carrier frequency components and isolates high-frequency interference introduced during transmission, retaining effective low-frequency digital signals, improving the signal-to-noise ratio, and suppressing high-frequency noise. The low-noise amplifier (LNA), as the first-stage amplifier circuit at the receiver, amplifies the signal with an extremely low noise figure, thus amplifying the signal. It also improves receiver sensitivity, ensuring accurate signal identification, and thus suppresses noise and enhances sensitivity.

[0055] like Figures 4a to 4c ,as well as Figure 5a and Figure 5b As shown, the first or second matching network can be a network transformer, a transmission line matching, or a matching coupler.

[0056] Here, the first matching network and the second matching network are used to adjust the impedance consistency between the transmitting end and the receiving end, maximize power transmission and suppress signal distortion, thus playing the role of impedance matching; they are also used to accurately match and reduce the influence of grounding loops and electromagnetic interference, improve the system signal-to-noise ratio and anti-interference capability, thus playing the role of noise suppression.

[0057] In some specific implementations, such as Figure 4a As shown, the transmitter chip module integrates a slot antenna, a transmission line matching microstrip line, and a power amplifier (PA) / buffer, which are connected in sequence.

[0058] In other specific implementations, such as Figure 4b As shown, the transmitter chip module integrates a slot loop antenna, a transmission line matching microstrip line, and a power amplifier (PA) / buffer, which are connected in sequence.

[0059] In some specific implementations, such as Figure 4c As shown, the transmitter chip module integrates a dipole on-chip antenna, a network transformer, and a voltage-controlled oscillator (VCO) connected in sequence.

[0060] In some specific implementations, such as Figure 5a As shown, the receiver chip module integrates a dipole on-chip antenna, a matching coupler, and an envelope detector (ED) connected in sequence.

[0061] In other specific implementations, such as Figure 5b As shown, the receiver chip module integrates a slot antenna, a transmission line matching microstrip line, and a low-noise amplifier (LNA) connected in sequence.

[0062] As a preferred embodiment, such as Figure 3As shown, a millimeter-wave digital isolator using an on-chip antenna has a transmitter chip module that integrates a slot loop antenna, a transmission line matching microstrip line, and a power amplifier (PA) / buffer connected in sequence. Its receiver chip module integrates a slot loop antenna, a transmission line matching microstrip line, and an envelope detector (ED) connected in sequence.

[0063] Preferably, the millimeter-wave digital isolator using an on-chip antenna provided in the above preferred embodiments is a millimeter-wave digital isolation chip designed as a single chip.

[0064] Preferably, in the millimeter-wave digital isolator using an on-chip antenna provided in the above preferred embodiment, the slot loop on-chip antenna located on the transmitting chip module and the slot loop on-chip antenna located on the receiving chip module are an integrated on-chip antenna structure.

[0065] In summary, the millimeter-wave digital isolator using an on-chip antenna provided by this utility model integrates the antenna inside the chip, which not only facilitates the miniaturization design of the antenna structure and the overall isolator structure, but also enables high integration, reducing costs while eliminating RF loss and impedance matching problems. At the same time, the on-chip antenna supports diverse radiation field patterns, which also helps to broaden application scenarios.

[0066] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent modifications made based on the content of this utility model specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A millimeter-wave digital isolator using an on-chip antenna, characterized in that, It includes a transmitter chip module and a receiver chip module located on both sides of the isolation zone; the transmitter chip module integrates a first on-chip antenna, a first matching network and a transmitter unit connected in sequence; the receiver chip module integrates a second on-chip antenna, a second matching network and a receiver unit connected in sequence; the first on-chip antenna and the second on-chip antenna are connected based on millimeter-wave communication.

2. The millimeter-wave digital isolator using an on-chip antenna as described in claim 1, characterized in that, The first on-chip antenna is a slot on-chip antenna, a loop on-chip antenna, a slot-loop on-chip antenna, or a dipole on-chip antenna; the second on-chip antenna is a slot on-chip antenna, a loop on-chip antenna, a slot-loop on-chip antenna, or a dipole on-chip antenna.

3. The millimeter-wave digital isolator using an on-chip antenna as described in claim 1, characterized in that, The transmitting unit is a power amplifier, a buffer, or a voltage-controlled oscillator.

4. The millimeter-wave digital isolator using an on-chip antenna as described in claim 1, characterized in that, The receiving chip is an envelope detector or a low-noise amplifier.

5. The millimeter-wave digital isolator using an on-chip antenna as described in claim 1, characterized in that, The first matching network is a network transformer, a matching microstrip line, or a matching coupler; the second matching network is a network transformer, a matching microstrip line, or a matching coupler.

6. The millimeter-wave digital isolator using an on-chip antenna as described in claim 1, characterized in that, The transmitter chip module and the receiver chip module are integrated on the same semiconductor substrate to form a millimeter-wave digital isolation chip.

7. The millimeter-wave digital isolator using an on-chip antenna as described in claim 6, characterized in that, The first and second on-chip antennas on the millimeter-wave digital isolation chip are an integrated on-chip antenna structure.

8. The millimeter-wave digital isolator using an on-chip antenna as described in claim 7, characterized in that, The integrated on-chip antenna structure consists of two slot on-chip antennas, or two loop on-chip antennas, or two slot-loop on-chip antennas, or two dipole on-chip antennas.

9. The millimeter-wave digital isolator using an on-chip antenna as described in claim 7, characterized in that, The integrated on-chip antenna structure operates in the millimeter-wave frequency band from 30Hz to 300GHz.

10. The millimeter-wave digital isolator using an on-chip antenna as described in claim 7, characterized in that, The antenna impedance of the integrated on-chip antenna structure is 50 ohms or 100 ohms.

Images