Electronic device

Abstract

The application provides an electronic device. The electronic device comprises a shell, a circuit board, a support and a conductive piece. The electronic device further comprises an electrical component. The conductive piece comprises a base, a first force arm and a second force arm, the first force arm and the second force arm are fixedly connected to the periphery of the base at intervals, the first force arm can elastically deform in a first direction relative to the base, the second force arm can elastically deform in a second direction relative to the base, and the first direction and the second direction are arranged at an included angle. The base and the support are fixedly connected, and the support and the circuit board are fixedly connected. The first force arm abuts against the frame of the shell and is electrically connected to the electrical component, and the second force arm abuts against the circuit board and is electrically connected to the circuit board. One conductive piece can conduct multiple electronic devices to realize the power supply function, which is beneficial to optimizing the EMC and electrostatic transmission path, reducing the electrostatic accumulation problem, the electrical signal transmission between two electronic devices (the electrical component and the circuit board) is relatively rapid, and the electronic device has a relatively fast response speed.

Description

Technical Field

[0001] This application relates to the field of conductive structure technology, and in particular to an electronic device. Background Technology

[0002] Mobile phone products have increasingly higher requirements for the speed and quality of signal transmission, making the overall electromagnetic compatibility (EMC) and anti-static performance of the device crucial. Currently, the focus of research is on how to enable conductive components to simultaneously conduct power to multiple structural devices in different locations, achieving power supply functions, while effectively optimizing EMC and electrostatic transmission paths and reducing electrostatic accumulation. Utility Model Content

[0003] This application provides an electronic device with less static electricity buildup.

[0004] In a first aspect, embodiments of this application provide an electronic device. The electronic device includes a housing, a circuit board, a bracket, and a conductive component. The circuit board, bracket, and conductive component are all located inside the housing. The electronic device also includes an electrical component. The electrical component is formed by at least a portion of the frame of the housing, or the electrical component is fixedly connected to the frame of the housing. The conductive component includes a base, a first lever arm, and a second lever arm. The first lever arm and the second lever arm are fixedly connected to the periphery of the base at a distance from each other. The first lever arm is capable of elastic deformation relative to the base along a first direction, and the second lever arm is capable of elastic deformation relative to the base along a second direction. The first and second directions are arranged at an angle. The base and the bracket are fixedly connected, and the bracket and the circuit board are fixedly connected. The first lever arm abuts against the frame of the housing and is electrically connected to the electrical component, while the second lever arm abuts against the circuit board and is electrically connected to the circuit board.

[0005] Understandably, brackets can be used to fix structures on circuit boards, preventing interference between these structures and other electronic components within the electronic device's internal space, thus facilitating assembly. Conductive components can be used to achieve electrical connections between electrical components on the frame and the circuit board. These electrical components on the frame can be of many types, not limited to one specific type; for example, they can be antenna radiators, button modules, SIM cards, or other structures requiring electrical conductivity. The circuit board can be a motherboard circuit board, a sub-board circuit board, or a circuit board within other functional components.

[0006] In traditional technical solutions, two electronic devices in different locations need to be electrically connected through multiple spring contacts. These spring contacts require multiple soldering operations, resulting in high raw material costs and poor assembly efficiency. Furthermore, the electrical signal transmission between the two electronic devices requires passing through multiple soldering points and multiple spring contacts, leading to a complex electrical signal transmission path, high resistance between connection points, and serious EMC and electrostatic accumulation problems, which hinders the speed of electrical signal transmission between the two electronic devices.

[0007] This application provides a conductive component, which includes a base, a first lever arm, and a second lever arm. The first lever arm is capable of elastic deformation relative to the base along a first direction, and the second lever arm is capable of elastic deformation relative to the base along a second direction. The first and second directions are set at an angle. The base and the support are fixedly connected. The first lever arm abuts against the frame of the housing and is electrically connected to the electrical component. The second lever arm abuts against the circuit board and is electrically connected to the circuit board. In this way, the conductive component can simultaneously realize the electrical connection between the electrical component and the circuit board. The conductive component provided by this application can simultaneously realize the electrical connection between multiple electronic devices in multiple directions, which is beneficial to simplify the connection structure between two electronic devices. It has fewer parts, improves space utilization, and reduces the number of welding points between the support and the conductive component, significantly reducing the raw material cost and mold cost of welding the conductive component. Secondly, the assembly of the conductive component is simpler, without the problem of multiple welding of multiple spring contacts, which is beneficial to improve assembly efficiency. In addition, one conductive component can conduct multiple electronic devices to realize the power supply function, which is beneficial to optimize EMC and electrostatic transmission path, reduce electrostatic accumulation problems, and the electrical signal transmission between two electronic devices (electrical component and circuit board) is faster, resulting in a faster response speed of electronic devices.

[0008] Furthermore, the contact force between the first lever arm and the frame ensures a stable connection between them, which is beneficial for a stable electrical connection between the first lever arm and the electrical components. Similarly, the contact force between the second lever arm and the circuit board ensures a stable connection between them, which is also beneficial for a stable electrical connection between them.

[0009] In some possible implementations, in the first direction, the first lever arm is located between the frame and the bracket. And / or, the circuit board and the bracket are arranged sequentially along the second direction, with the second lever arm located between the circuit board and the bracket.

[0010] It is understood that, in the first direction, the first lever arm is located between the frame and the bracket. In other words, the first direction is perpendicular to the thickness direction of the electronic device. Compared to a scheme where the first direction and the thickness direction of the electronic device are set at an acute angle, in this embodiment, the first lever arm can realize electrical connections in any direction within the XY plane (the thickness direction of the electronic device is perpendicular to the XY plane), resulting in a shorter electrical signal transmission path and effectively reducing EMC and electrostatic accumulation issues.

[0011] The circuit board and the bracket are arranged sequentially along the second direction, with the second lever arm located between the circuit board and the bracket. The second lever arm enables electrical connection with the circuit board stack in the second direction, resulting in a short electrical signal transmission path and effectively reducing EMC and electrostatic accumulation issues.

[0012] In some possible implementations, the circuit board is part of the motherboard of the electronic device. The housing also includes a middle plate. The housing's frame surrounds and connects to the middle plate of the housing. The circuit board is mounted on the middle plate of the housing. A bracket is mounted on the surface of the circuit board on the middle plate of the housing, away from the circuit board. A second lever arm is located between the circuit board and the bracket.

[0013] Understandably, conductive components enable electrical connections between the motherboard's circuit board and the electrical components of the bezel. The middle plate serves to support the circuit board.

[0014] In some possible implementations, the length direction of the first lever arm is set at an angle to the plane in which the support is located.

[0015] It is understood that the length direction of the first lever arm refers to the direction from the end of the first lever arm connected to the base to the end of the first lever arm in contact with the frame. During the bracket installation process, the conductive component and the bracket are assembled first, and then the bracket is assembled onto the circuit board. The bracket is typically assembled onto the circuit board using an angled insertion method (e.g., 360° angled insertion). When the frame has some protruding structures, the first lever arm is prone to rubbing against the protruding structures, leading to plastic deformation and affecting the conductivity of the conductive component. In this embodiment, the first lever arm is set in an inclined state. During the angled insertion process, the first lever arm is less likely to rub against the protruding structures, avoiding irreversible deformation of the first lever arm after rubbing, which would affect the conductivity stability of the conductive component. For example, the end of the first lever arm in contact with the frame faces the side where the motherboard is located.

[0016] In some possible implementations, the angle between the length direction of the first lever arm and the plane in which the support is located is in the range of ° to °.

[0017] Understandably, setting the angle between the length direction of the first lever arm and the plane where the bracket is located to be greater than or equal to ° results in a larger tilt of the first lever arm, making it less susceptible to scratches. Electronic devices have limited space in the thickness direction, necessitating a longer first lever arm. Setting the angle between the length direction of the first lever arm and the plane where the bracket is located to be less than or equal to ° allows the space between the bracket and the frame to better accommodate the length of the first lever arm, ensuring it has sufficient length to support deformation.

[0018] In some possible implementations, the end of the first lever arm that contacts the frame of the housing faces the side where the circuit board is located.

[0019] Understandably, during the assembly of electronic devices, the bracket is first tilted downwards at an angle of about 30 degrees and then inserted into the middle frame. When simulating the assembly path, the bracket clips are required to engage with the circuit board first. Then, the bracket is assembled to a normal horizontal position so that the spring point of the first force bracket finally contacts the frame to achieve the spring-loaded function. This avoids premature contact with the frame during tilted assembly, which could cause excessive pressure and result in non-rebound deformation.

[0020] In some possible implementations, the electrical component is the radiator of the antenna.

[0021] It is understandable that the radiator of the antenna on the frame can be electrically connected to the circuit board through conductive components. When conductive components are used to transmit electrical signals between the radiator of the antenna and the circuit board, it helps to reduce the complexity of the electrical connection structure between the radiator of the antenna and the circuit board, optimize the EMC and electrostatic transmission path between the two, reduce electrostatic accumulation problems, and improve the communication speed of electronic devices.

[0022] In some possible implementations, the conductive element further includes a first connecting arm. The first connecting arm is fixedly connected between the base and the first lever arm in a direction perpendicular to the thickness direction of the electronic device. And / or,

[0023] The conductive component also includes a second connecting arm. The second connecting arm is connected between the base and the second lever arm, and in the thickness direction of the electronic device, the second connecting arm is located between the bracket and the second lever arm.

[0024] Understandably, by providing the first connecting arm, the strength of the conductive component can be enhanced, and support can be provided for the first lever arm when it deforms. Similarly, by providing the second connecting arm, the strength of the conductive component can be enhanced, and support can be provided for the second lever arm when it deforms.

[0025] In some possible implementations, the second connecting arm is provided with a limiting groove. The conductive element also includes a first component, the first end of which is fixedly connected to the second lever arm, and the second end of the first component is engaged within the limiting groove. When the second lever arm elastically deforms against the base in a second direction, the second end of the first component slides within the limiting groove.

[0026] Understandably, by setting a limiting groove, when the second lever arm elastically deforms against the base along the second direction, the second end of the first component slides within the limiting groove. The limiting groove can limit the second lever arm, preventing it from wobbling and interfering with surrounding components. Furthermore, the design of the limiting groove can effectively prevent the second lever arm from damaging electronic components or other surrounding device units on the circuit board during bracket assembly.

[0027] In some possible implementations, the second connecting arm includes a base plate, a first sidewall, and a second sidewall. The first and second sidewalls are fixedly connected to both sides of the base plate, and the first sidewall, the second sidewall, and the base plate form a limiting groove. The second end of the first component is at least partially located between the first and second sidewalls.

[0028] Understandably, the first and second sidewalls can limit the second lever arm, reducing the risk of the second lever arm swaying in the XY plane and causing interference to surrounding devices.

[0029] In some possible implementations, the second connecting arm further includes a first protrusion, which is fixedly connected to the end of the first sidewall away from the bottom plate and spaced apart from the bottom plate, with a portion of the first component located between the first protrusion and the bottom plate. And / or, the second connecting arm further includes a second protrusion, which is fixedly connected to the end of the second sidewall away from the bottom plate and spaced apart from the bottom plate, with a portion of the first component located between the second protrusion and the bottom plate.

[0030] It is understandable that by setting a first protrusion, and the first protrusion, first sidewall, second sidewall, and base plate forming a limiting groove, the first component can be limited in the direction of the base plate towards the first protrusion. When the conductive component is mounted on the bracket, and the bracket is mounted on the circuit board of the motherboard, the first protrusion is located on the side of the base plate closest to the circuit board, that is, the direction of the base plate towards the first protrusion is the thickness direction of the electronic device. The first protrusion can limit the first component in the thickness direction of the electronic device, preventing the first component from interfering with the electronic components on the motherboard.

[0031] In some possible implementations, during the elastic deformation of the first lever arm relative to the base along a first direction, the non-rebound displacement of the first lever arm is less than or equal to %. and / or, during the elastic deformation of the second lever arm relative to the base along a second direction, the non-rebound displacement of the second lever arm is less than or equal to %.

[0032] As can be understood, non-rebound displacement refers to the displacement of an object after being subjected to an external force, but which cannot automatically return to its original position or state. Non-rebound displacement usually occurs after a material or structure reaches its elastic limit, that is, when the external force exceeds a certain limit, the molecular structure inside the material undergoes irreversible changes, causing the object to be unable to completely return to its original shape.

[0033] The non-rebound displacement of the first lever arm is less than or equal to %, the first lever arm has good resilience and is not prone to plastic deformation, and the first lever arm can better spring against the frame.

[0034] The non-rebound displacement of the second lever arm is less than or equal to %, the second lever arm has good resilience and is not prone to plastic deformation, and the second lever arm can better spring against the frame.

[0035] In some possible implementations, the base and the first lever arm are integrally formed structural components. And / or, the base and the second lever arm are integrally formed structural components.

[0036] It is understandable that a structural component with two parts molded as a single piece refers to a component formed through a one-piece molding process. During the formation of one of the two parts, that part is already connected to the other, without requiring further processing (such as bonding, welding, snap-fit ​​connections, or screw connections). For example, the base and the first lever arm can be formed by shearing and stamping from a single sheet of steel. As a one-piece structural component, the base and the first lever arm do not require additional assembly steps, simplifying the process and improving production efficiency. Furthermore, the connection strength between the base and the first lever arm is relatively good. Similarly, if the base and the second lever arm are also one-piece structural components, they do not require additional assembly steps, simplifying the process and improving production efficiency. Furthermore, the connection strength between the base and the second lever arm is relatively good.

[0037] In some possible implementations, the conductive element further includes a third lever arm, which is fixedly connected to the periphery of the base and spaced apart from the first and second lever arms. The third lever arm is capable of elastic deformation relative to the base along a third direction, which is different from both the first and second directions.

[0038] Understandably, conductive components may also include a third lever arm, and more lever arms, thereby enabling electrical connections in three or more directions.

[0039] In some possible implementations, the bracket is provided with a first groove, the opening of the first groove facing the circuit board, and the base is located in the first groove.

[0040] Understandably, during the assembly of the conductive components to the bracket, the first groove can serve as a positioning structure for the conductive components, accelerating assembly efficiency. Furthermore, the first groove can reduce displacement deviation of the conductive components, preventing them from shifting laterally during assembly and causing misalignment, which could prevent precise contact with the electrical connection points on the frame and circuit board, resulting in poor electrical connection reliability.

[0041] In some possible implementations, the bracket includes a metal part, a base and a welded layer are provided between the base and the metal part, and the base and the metal part are fixedly connected by the welded layer.

[0042] Understandably, the metal components enhance the strength of the support structure, allowing it to better withstand the resistance from the conductive parts. Compared to adhesive bonding or other methods, welding the base and metal components provides a more stable connection. Furthermore, welding offers higher assembly precision than adhesive bonding or injection molding when assembling the conductive parts and the support structure, thus improving the reliability of the electrical connection. Attached Figure Description

[0043] To illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0044] Figure 1 This is a schematic diagram of the structure of the electronic device provided in some embodiments of this application;

[0045] Figure 2 yes Figure 1 A schematic diagram of the electronic device shown from another angle;

[0046] Figure 3 yes Figure 1 A partial cross-sectional view of one embodiment of the electronic device shown at AA;

[0047] Figure 4 yes Figure 2 An assembly schematic diagram of one embodiment of the conductive components and support shown;

[0048] Figure 5 yes Figure 4 An exploded view of one embodiment of the structure shown;

[0049] Figure 6 yes Figure 5 A schematic diagram of the conductive component shown from another angle;

[0050] Figure 7 yes Figure 6 The schematic diagram of the conductive component shown is displayed at another angle;

[0051] Figure 8 yes Figure 3 A partial structural diagram of the structure shown in the image from another angle;

[0052] Figure 9 It is the pressure-displacement curve of the first lever arm;

[0053] Figure 10 This is the force diagram of the first lever arm under maximum stress;

[0054] Figure 11 It is the pressure-displacement curve of the second lever arm;

[0055] Figure 12 This is the force diagram of the second lever arm under maximum stress;

[0056] Figure 13 This is a schematic diagram of another embodiment of the conductive element provided in this application. Detailed Implementation

[0057] For ease of understanding, the English abbreviations and related technical terms used in the embodiments of this application will be explained and described below.

[0058] Electromagnetic compatibility (EMC).

[0059] Static Electricity Accumulation (SEA) refers to the accumulation of static charge caused by an object's static charge generation rate exceeding its dissipation rate.

[0060] The embodiments of this application are described below with reference to the accompanying drawings. The embodiments described herein with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0061] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after connection. "Rotary connection" refers to a connection where the components can rotate relative to each other after connection. "Sliding connection" refers to a connection where the components can slide relative to each other after connection. The directional terms mentioned in the embodiments of this application, such as "up," "down," "left," "right," "inner," and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0062] It should be understood that in this application, "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as the form in which different components in a circuit structure are connected through physical lines that can transmit electrical signals, such as copper foil on a printed circuit board (PCB) or wires. "Connection" and "connected" can both refer to a mechanical connection or a physical connection. For example, A and B being connected or A and B being connected can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or that A and B are in contact with each other and are difficult to separate.

[0063] Furthermore, the term "fixed" in this article should be interpreted broadly. For example, "fixed" can mean directly fixed or indirectly fixed through an intermediate medium. Specifically, "fixed" refers to connections where the relative positions of the connected parts remain unchanged.

[0064] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0065] In the description of the embodiments of this application, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of this application, "multiple" means two or more.

[0066] References to "one embodiment" or "some embodiments" as used in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0067] Connection / linking: can refer to a mechanical or physical connection, that is, A and B are connected or linked. It can mean that there are fastened components (such as screws, bolts, rivets, etc.) between A and B, or that A and B are in contact with each other and are difficult to separate.

[0068] Relative / Relative Setting: A relative setting with B can refer to A and B being face-to-face. For example, when two structures are set relative to each other, at least a portion of the two structures overlap along a certain direction.

[0069] A radiator, or antenna stub, is a device in an antenna used to receive / transmit electromagnetic wave radiation. In some cases, the term "antenna" is narrowly defined as a radiator, which converts guided wave energy from the transmitter into radio waves, or converts radio waves into guided wave energy, for radiating and receiving radio waves. The modulated high-frequency current energy (or guided wave energy) generated by the transmitter is transmitted to the transmitting radiator via a feed line, where it is converted into electromagnetic wave energy of a specific polarization and radiated in the desired direction. The receiving radiator converts electromagnetic wave energy of a specific polarization from a specific direction in space back into modulated high-frequency current energy, which is then transmitted to the receiver input via a feed line.

[0070] The radiator (or antenna stub) may include a conductor with a specific shape and size, such as a wire or a sheet, and this application does not limit the specific shape. In one embodiment, the wire radiator may be simply referred to as a wire antenna. In one embodiment, the wire radiator may be implemented by a conductive frame, and may also be referred to as a frame antenna. In one embodiment, the wire radiator may be implemented by a support conductor, and may also be referred to as a support antenna.

[0071] It is understood that the specific embodiments described herein are merely for explaining the relevant application and not for limiting the application. It should also be noted that, for ease of description, only the parts relevant to the application are shown in the accompanying drawings.

[0072] Figure 1 This is a schematic diagram of the structure of the electronic device 1000 provided in some embodiments of this application. Figure 2 yes Figure 1 The diagram shows the structure of the electronic device 1000 from another angle.

[0073] like Figure 1 and Figure 2 As shown, the electronic device 1000 provided in this application can be a mobile phone, tablet computer, laptop computer, personal digital assistant (PDA), camera, personal computer, laptop computer, in-vehicle equipment, wearable device, augmented reality (AR) glasses, AR headset, virtual reality (VR) glasses, or VR headset, etc. The electronic device 1000 can also be a handheld device with wireless communication capabilities, a computing device, or other processing devices connected to a wireless modem, or other forms of devices capable of receiving and radiating electromagnetic wave signals. Figure 1 The electronic device 1000 of the embodiment shown will be described using a mobile phone as an example.

[0074] For ease of description, the width direction of the electronic device 1000 is defined as the X-axis. The length direction of the electronic device 1000 is defined as the Y-axis. The thickness direction of the electronic device 1000 is defined as the Z-axis. It is understood that the coordinate system of the electronic device 1000 can be set according to actual needs, and this application does not limit it in this regard.

[0075] In some embodiments, the electronic device 1000 may include a housing 100 and a screen 200. It is understood that... Figure 1 and Figure 2 The electronic device 1000 is shown only schematically, and the actual shape, size, and construction of these components are not subject to change. Figure 1 and Figure 2 Limited. The screen 200 can be mounted on the housing 100. (Attached) Figure 1 The diagram illustrates the roughly rectangular structure formed by the screen 200 and the housing 100.

[0076] Screen 200 can be used to display images, videos, etc. In some embodiments, screen 200 may also have a touch sensing function, which is used to sense the user's touch actions to achieve human-computer interaction. For example, screen 200 can be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, a flexible light-emitting diode (FLED) display, a Mini-LED display, a Micro-LED display, a Micro-OLED display, a quantum dot light-emitting diode (QLED) display, etc.

[0077] In some implementations, when the electronic device 1000 is a device of some other form, the electronic device 1000 may not include the screen 200.

[0078] In some embodiments, the housing 100 can be used to support the screen 200 and related components of the electronic device 1000. Exemplarily, the housing 100 may include a housing 10 and a rear cover 20. The rear cover 20 and the screen 200 can be respectively mounted on opposite sides of the housing 10. The arrangement direction of the rear cover 20 and the screen 200 can be parallel to the Z-axis direction. The rear cover 20 can be fixedly connected to the housing 10 by means of adhesive bonding, welding, or other methods. In this case, the screen 200, the housing 10, and the rear cover 20 can together enclose the internal space of the electronic device 1000. The internal space of the electronic device 1000 can be used to house internal components of the electronic device 1000, such as a battery, processor, communication module, camera, audio module, speaker, microphone, and subscriber identification module (SIM) card, etc.

[0079] In some embodiments, the back cover 20 and the middle frame 10 can be connected by methods such as bonding, welding, snap-fit ​​connection, and screw connection. In some embodiments, the back cover 20 can also be integrally formed with the middle frame 10, that is, the back cover 20 and the middle frame 10 are a single integral structure.

[0080] In some implementations, the middle frame 10 can be made of metal, glass, plastic, or ceramic.

[0081] For example, the middle frame 10 may include a border 1 and a middle plate 2. The border 1 may surround and connect to the middle plate 2. The border 1 connects between the back cover 20 and the screen 200, and together with the screen 200 and the back cover 20, it encloses the internal space of the electronic device 1000. The middle plate 2 may be located within the internal space of the electronic device 1000. In some other embodiments, the middle frame 10 may consist only of the border 1.

[0082] In some implementations, the back cover 20 can be made of metal, glass, plastic, or ceramic.

[0083] In some embodiments, the electronic device 1000 may further include a first electronic device, a second electronic device, and a conductive element 300. The conductive element 300 is used for electrical connection between the first electronic device and the second electronic device. The first electronic device may be an antenna, a motherboard 500, a battery, a speaker, a microphone, or a handset, etc., and the second electronic device may be an antenna, a motherboard 500, a battery, a speaker, a microphone, or a handset, etc. The first and second electronic devices may be of the same type or different types. The conductive element 300 can be used for electrical connection between two electronic devices in the electronic device 1000 that need to be electrically connected.

[0084] Understandably, in traditional technical solutions, two electronic devices that need to conduct electricity can be connected using conductive foam. However, conductive foam relies on manual installation, which is costly and prone to missing parts during assembly, making it unsuitable for automated assembly. Alternatively, conductive adhesive can be used for electrical connection, but this is expensive, has limited application scenarios, its conductivity is easily affected by external interference, its adhesion is poor, and the reliability of the electrical connection is low. Another option is to use a hardware bracket for hard contact, but this solution suffers from poor contact and inconsistent contact performance due to manufacturing tolerances. Reassembly also makes it difficult to guarantee effective grounding, and its weak resistance to impact and vibration can easily lead to solder cracking.

[0085] This application specifically describes a conductive element 300 for electrical connection between two electronic devices at different locations, overcoming the shortcomings of traditional electrical connection schemes. The details are described below with reference to the accompanying drawings. In the following embodiments, the first electronic device is an electrical component located on the frame 1, and the second electronic device is a circuit board located inside the housing 100 of the electronic device 1000. The conductive element 300 can be used to conduct electricity between the electrical component on the frame 1 and the circuit board inside the electronic device 1000. It is understood that the electrical component on the frame 1 can be of many types, not limited to one type. For example, the electrical component can be an antenna radiator, a button module, a SIM card, or other structures requiring electrical conduction. The second electronic device can be the circuit board 510 of the main board 500, the circuit board of a sub-board, or a circuit board in other functional components; this application does not impose any limitations. In the following drawings, the electrical component is illustrated as an antenna radiator 400, and the second electronic device is the circuit board 510 of the main board 500. The conductive element 300 is used to realize the electrical connection between the antenna radiator 400 on the frame 1 and the circuit board 510 of the main board 500.

[0086] For example, the circuit board can be a printed circuit board (PCB), a flexible printed circuit (FPC), or a rigid-flex circuit board, etc.

[0087] Figure 3 yes Figure 1 A partial cross-sectional view of one embodiment of the electronic device 1000 shown at AA.

[0088] like Figure 1 and Figure 3As shown, the frame 1 of the middle frame 10 may include conductive portions. The conductive portions of the frame 1 of the middle frame 10 of the electronic device 1000 can serve as the main radiator and / or parasitic stub of an antenna. The antenna can be used to receive or transmit signals for communication bands used for satellite messages and / or satellite phones. For example, the frame 1 can be made of metal, thus providing better strength.

[0089] Exemplarily, the antenna may include at least one radiator 400. A portion of the frame 1 may be used as the radiator 400 of the antenna, and this portion of the frame 1 may also be referred to as a frame antenna. The frame 1 may have multiple antenna slots 1001. The multiple antenna slots 1001 may divide the frame 1 into at least one metal segment in the extending direction of the frame 1 to form the radiator 400 of the antenna. In some embodiments, insulating non-metallic materials may be used to fill the antenna slots, which can avoid affecting the antenna signal and seal the antenna slots to prevent external moisture and dust from interfering with the operation of the internal components of the electronic device 1000.

[0090] In other embodiments, the radiator 400 of the antenna may also be a separate structural component, fixedly connected to the inside of the frame 1, the inside of the frame 1 being the side of the frame 1 facing the internal space of the electronic device 1000.

[0091] In some embodiments, the electronic device 1000 may also include a communication module (not shown). The communication module may integrate one or more electronic components of at least one communication processing module, and the communication module may be used to perform frequency modulation, amplification, filtering, and other processing on the antenna radiated signal. Exemplarily, the communication module may be located on the motherboard 500.

[0092] In some embodiments, the motherboard 500 may be mounted inside the housing 100 of the electronic device 1000. For example, the motherboard 500 may be mounted on the middle plate 2 of the middle frame 10. Exemplarily, the motherboard 500 may include a circuit board 510 and electronic components 520. The electronic components 520 may be fixedly connected to and electrically connected to the circuit board 510. The circuit board 510 may be mounted on the middle plate 2 of the middle frame 10. The circuit board 510 may serve as a carrier structure and an electrical connection structure for the electronic components 520. In some other embodiments, the circuit board 510 may also be fixedly mounted to the rear cover 20 of the housing 100.

[0093] For example, electronic component 520 can be an active device such as a chip, or a passive device such as a capacitor, inductor, or resistor. It is understood that those skilled in the art can form a circuit module with a specific function, such as a communication module electrically connected to an antenna, by selecting the number, type, and arrangement of electronic components 520 on the circuit board 510.

[0094] In some embodiments, the electronic device 1000 may further include a bracket 600. The bracket 600 is located inside the housing 100. Exemplarily, the bracket 600 may be fixedly connected to the circuit board 510. The bracket 600 can be used to fix structures on the circuit board 510, preventing interference between structures on the circuit board 510 and other electronic components in the internal space of the electronic device 1000, thus facilitating the assembly of the electronic device 1000. Exemplarily, the bracket 600 may be fixed to the side of the circuit board 510 facing the screen 200. When the bracket 600 is fixedly connected to the circuit board 510 of the motherboard 500, the bracket 600 may also be referred to as a motherboard bracket.

[0095] Figure 4 yes Figure 2 An assembly diagram of one embodiment of the conductive element 300 and the support 600 shown. Figure 5 yes Figure 4 An exploded view of one embodiment of the structure shown. It is understood that, to highlight structural features, Figure 4 and Figure 5 The image only shows the frame 1 around the conductive component 300, part of the motherboard 500, and part of the bracket 600; other areas are not shown.

[0096] like Figures 3 to 5 As shown, the conductive component 300 can be fixedly connected to the bracket 600 and is electrically connected to the circuit board and the electrical components located on the frame 1. The conductive component 300 can realize the electrical connection between the electrical components on the frame 1 and the circuit board. For example, the conductive component 300 can electrically connect the radiator 400 of the antenna and the motherboard 500, thereby realizing the electrical signal transmission between the communication module on the motherboard 500 and the radiator 400 of the antenna.

[0097] Figure 6 yes Figure 5 The conductive element 300 shown is illustrated from another angle. Figure 7 yes Figure 6 The conductive element 300 shown is illustrated at another angle. Figure 8 yes Figure 3 The diagram shown is a partial view of the structure from another angle.

[0098] like Figures 6 to 8As shown, the conductive component 300 includes a base 310, a first lever arm 320, and a second lever arm 330. Both the first lever arm 320 and the second lever arm 330 are fixedly connected to the base 310. The first lever arm 320 is capable of elastic deformation relative to the base 310 along a first direction, and the second lever arm 330 is capable of elastic deformation relative to the base 310 along a second direction. The first and second directions are arranged at an angle. Exemplarily, the base 310 and the bracket 600 are fixedly connected. The first lever arm 320 abuts against the frame 1 of the housing 100 and is electrically connected to an electrical component. The second lever arm 330 abuts against the circuit board 510 and is electrically connected to the circuit board 510. The conductive component 300 can be used to achieve electrical connection between devices in two different orientations. In this embodiment, the first and second directions are illustrated as perpendicular; in other embodiments, the first and second directions may not be perpendicular. For example, the first direction is perpendicular to the thickness direction (Z-direction) of the electronic device 1000, and the second direction is parallel to the thickness direction (Z-direction) of the electronic device 1000. In other embodiments, the relationship between the first direction, the second direction and the thickness direction (Z direction) of the electronic device 1000 can be adjusted as needed.

[0099] Understandably, in traditional technical solutions, two electronic devices in different locations need to be electrically connected through multiple spring contacts. These spring contacts require multiple soldering operations, resulting in high raw material costs and poor assembly efficiency. Furthermore, the electrical signal transmission between the two electronic devices requires passing through multiple soldering points and multiple spring contacts, leading to a complex electrical signal transmission path, high resistance between connection points, and serious EMC and electrostatic accumulation problems, which hinders the speed of electrical signal transmission between the two electronic devices. This application provides a conductive component 300 that can simultaneously realize electrical connections between multiple electronic devices in multiple directions. This simplifies the connection structure between two electronic devices, reduces the number of parts, improves space utilization, and reduces the number of welding points between the bracket 600 and the conductive component 300, significantly reducing the raw material and mold costs of welding the conductive component 300. Secondly, the assembly of the conductive component 300 is simpler, eliminating the problem of multiple welding of multiple spring contacts, which helps improve assembly efficiency. In addition, one conductive component 300 can conduct multiple electronic devices and realize the power supply function, which helps optimize EMC and electrostatic transmission paths, reduces electrostatic accumulation problems, and allows for faster electrical signal transmission between two electronic devices (between the circuit board and the electronic component), resulting in a faster response speed for the electronic device 1000.

[0100] Furthermore, compared to the solution of using conductive foam for electrical connection, the solution in this application uses a conductive component 300 with deformation capability for conduction. The conductive component 300 has a certain ability to adapt to the installation space and can be adapted to automatic assembly. Compared to the solution of using conductive adhesive for electrical connection, the solution in this application uses a conductive component 300 with deformation capability for conduction. The abutment force of the conductive component 300 after deformation can resist certain external interference, help stabilize the position of the conductive component 300, and the electrical connection reliability is better. Compared to the solution of using hard contact of hardware bracket for electrical connection, the solution in this application uses a conductive component 300 with deformation capability for conduction. The conductive component 300 has deformation capability, can accommodate certain manufacturing and assembly tolerances, has better contact consistency, and the conductive component 300 abuts against the frame 1 and the circuit board. The abutment force generated after deformation can effectively resist impact, and the conductive component 300 has better vibration resistance and is not easy to break.

[0101] For example, when the first lever arm 320 of the conductive element 300 abuts against the frame 1, the first lever arm 320 deforms in a first direction. This abutting force between the first lever arm 320 and the frame 1 ensures a stable connection between them, which is beneficial for a stable electrical connection between the first lever arm 320 and the electrical component. When the second lever arm 330 abuts against the circuit board 510, the second lever arm 330 deforms in a second direction. This abutting force between the second lever arm 330 and the circuit board 510 ensures a stable connection between them, which is beneficial for a stable electrical connection between them.

[0102] In some embodiments, the conductive element 300 may be made of a conductive material, such as steel, aluminum alloy, magnesium alloy, etc.

[0103] In some embodiments, the electrical component is the radiator 400 of the antenna. (In conjunction with...) Figure 3 The first lever arm 320 abuts against the frame 1 of the housing 100 and is electrically connected to the radiator 400 of the antenna. The second lever arm 330 abuts against the circuit board 510 of the motherboard 500 and is electrically connected to the circuit board 510. Thus, the radiator 400 of the antenna on the frame 1 can be electrically connected to the circuit board 510 via the conductive element 300, enabling electrical connection with the communication module on the motherboard 500. It is understood that when the conductive element 300 is used to transmit electrical signals between the radiator 400 of the antenna and the circuit board, it helps to reduce the complexity of the electrical connection structure between the radiator 400 of the antenna and the circuit board 510, optimizes the EMC and electrostatic transmission path between them, reduces electrostatic accumulation problems, and improves the communication speed of the electronic device 1000.

[0104] For example, the electronic device 1000 may further include a pad 700, which is fixedly connected to the frame 1 and electrically connected to the radiator 400 of the antenna on the frame 1. A conductive element 300 may be electrically connected to the pad 700. The radiator 400 of the antenna on the frame 1 may be electrically connected to the circuit board 510 in sequence via the pad 700 and the conductive element 300. The circuit board 510 may have signal transmission traces. The conductive element 300 transmits the antenna signal from the frame 1 to the circuit board 510. The antenna signal is transmitted along the signal transmission traces on the circuit board 510 to the communication module on the motherboard 500, thus realizing the electrical connection between the communication module and the antenna.

[0105] For example, the first lever arm 320 of the conductive element 300 can be electrically connected to the antenna, and the second lever arm 330 of the conductive element 300 can be electrically connected to the circuit board 510. The electrical signal transmission path between the radiator 400 of the antenna and the circuit board 510 can include: radiator 400 of the antenna - first lever arm 320 - base 310 - second lever arm 330 - circuit board 510. The electrical signal transmission between the antenna and the circuit board 510 can be bidirectional.

[0106] In some embodiments, the first lever arm 320 can be directly electrically connected to the radiator 400 of the antenna, or it can be indirectly electrically connected through a conductive structure. For example, the first lever arm 320 can abut against the pad 700 and be electrically connected to the pad 700, and indirectly electrically connected to the radiator 400 of the antenna through the pad 700.

[0107] In some embodiments, when the conductive element 300 and the bracket 600 are fixedly connected, the base 310 is fixedly connected to the bracket 600, and the bracket 600 is fixedly connected to the mainboard 500. For example, the base 310 can be fixedly connected to the bracket 600 by welding or adhesive bonding. The bracket 600 can be fixedly connected to the circuit board 510 by processes such as snap-fit, screw locking, and / or welding.

[0108] It is understood that the conductive component 300 and the bracket 600 can be assembled together in one process to form a whole, namely the bracket assembly (including the conductive component 300 and the bracket 600). In the assembly process of the electronic device 1000, the bracket assembly is installed to the housing 100 of the electronic device 1000 in one process; or, the conductive component 300 and the bracket 600 are installed to the housing 100 of the electronic device 1000 in two assembly processes. This application does not impose any limitations on this.

[0109] In some embodiments, the first lever arm 320 and the second lever arm 330 of the conductive element 300 are fixedly connected to the periphery of the base 310 and are spaced apart. It is understood that, compared to solutions where the first lever arm 320 is connected between the second lever arm 330 and the base 310, or the second lever arm 330 is connected between the first lever arm 320 and the base 310, in this embodiment, the base 310 is connected between the first lever arm 320 and the second lever arm 330. When the base 310 is fixed to the bracket 600, the forces on the first lever arm 320 and the second lever arm 330 are distributed along the periphery of the base 310, the reaction force on the base 310 is more uniform, and the base 310 is less likely to detach from the bracket 600.

[0110] In some embodiments, the first direction is perpendicular to the thickness direction of the electronic device 1000. In this first direction, the first lever arm 320 is located between the frame 1 and the bracket 600. It is understood that, compared to a scheme where the first direction is set at an acute angle to the thickness direction of the electronic device 1000, in this embodiment, the first lever arm 320 can achieve electrical connection in any direction within the XY plane, resulting in a shorter electrical signal transmission path and effectively reducing EMC and electrostatic accumulation problems.

[0111] In some embodiments, the base 310 and the first lever arm 320 are integrally formed structural components. This means that the two components are formed through a single molding process, where the component is connected to the other component during the formation of one of the components, without requiring further processing (such as bonding, welding, snap-fit ​​connections, or screw connections). For example, the base 310 and the first lever arm 320 can be formed by shearing and stamping from a single piece of steel. It is understood that since the base 310 and the first lever arm 320 are integrally formed structural components, no additional assembly process is required, which simplifies the process and improves production efficiency. Furthermore, the connection strength between the base 310 and the first lever arm 320 is superior.

[0112] In some embodiments, the conductive element 300 further includes a first connecting arm 340, which is fixedly connected between the base 310 and the first lever arm 320 in a direction perpendicular to the thickness direction of the electronic device 1000. It is understood that by providing the first connecting arm 340, the strength of the conductive element 300 can be enhanced, and support can be provided for the first lever arm 320 when it deforms. For example, the first connecting arm 340, the base 310, and the first connecting arm 340 can be integrally formed structural components.

[0113] In some embodiments, during the elastic deformation of the first lever arm 320 relative to the base 310 along a first direction, the non-rebound displacement of the first lever arm 320 is less than or equal to 5%. Non-rebound displacement refers to the displacement of an object after being subjected to an external force, but which cannot automatically return to its original position or state. Non-rebound displacement typically occurs after a material or structure reaches its elastic limit; that is, when the external force exceeds a certain limit, the molecular structure inside the material undergoes irreversible changes, causing the object to be unable to completely return to its original shape. It is understood that when the non-rebound displacement of the first lever arm 320 is less than or equal to 5%, the first lever arm 320 has good resilience and is not prone to plastic deformation, allowing it to better spring back against the frame 1.

[0114] It is understandable that the height of the first lever arm 320 in the first direction can be adjusted according to the working environment. Table 1 shows the simulated working height parameters of one embodiment of the first lever arm 320. The free height H1 of the first lever arm 320 refers to the height of the contact point of the first lever arm 320 from the first connecting arm 340 in the first direction. In this embodiment, the first direction is illustrated as being parallel to the width direction (X-axis) of the electronic device 1000. Figure 9 This is the pressure-displacement curve for the first lever arm of 320, where, Figure 9 The horizontal axis represents displacement in mm, which refers to the displacement of the force-bearing position of the first lever arm 320 in the first direction during the force application process. The vertical axis represents force in N. Figure 10 This is the force diagram of the first lever arm 320 under maximum stress.

[0115] Table 1. Simulation parameters for the first lever arm with a height of 320 mm.

[0116]

[0117] Combining Table 1 and Figure 9 , Figure 10 It can be seen that the free height H1 of the first lever arm 320 is 0.88mm, and the recommended working height is 0.58mm. Under the condition of setting the load amount to 0.3mm, the simulation shows that the working height elastic force (maximum pressing force of the spring piece) is 0.61N. At this time, the non-rebound height of the first lever arm 320 is 0mm, which meets the design requirements.

[0118] In some embodiments, the base 310 and the second lever arm 330 are integrally formed structural components. It is understood that since the base 310 and the second lever arm 330 are integrally formed structural components, no additional assembly process is required, which simplifies the process and improves production efficiency. Furthermore, the connection strength between the base 310 and the second lever arm 330 is superior.

[0119] In some embodiments, the circuit board 510 and the bracket 600 are arranged along a second direction. In this second direction, a second lever arm 330 is located between the bracket 600 and the circuit board 510. Exemplarily, the second direction is parallel to the thickness direction of the electronic device 1000. It is understood that the second lever arm 330 enables electrical connections to the circuit board 510 stacked in the second direction (Z-direction), resulting in a short electrical signal transmission path and effectively reducing EMC and electrostatic discharge problems.

[0120] For example, the circuit board is part of the motherboard 500. The circuit board 510 can be mounted on the middle plate 2 of the housing 100, and the bracket 600 is mounted on the surface of the middle plate 2 of the circuit board 510 away from the housing 100. The second lever arm 330 can be located between the circuit board 510 and the bracket 600. In this way, the conductive element 300 can realize the electrical connection between the circuit board 510 of the motherboard 500 and the electrical components of the frame 1. The middle plate 2 can be used to support the circuit board 510.

[0121] In some embodiments, the conductive element 300 may further include a second connecting arm 350. The second connecting arm 350 is connected between the base 310 and the second lever arm 330. In the thickness direction of the electronic device 1000, the second connecting arm 350 is located between the support 600 and the second lever arm 330. It is understood that by providing the second connecting arm 350, the strength of the conductive element 300 can be enhanced, and support can be provided for the second lever arm 330 when it deforms. Exemplarily, the second lever arm 330, the second connecting arm 350, and the base 310 may be integrally formed structural components.

[0122] In some embodiments, during the elastic deformation of the second lever arm 330 relative to the base 310 along the second direction, the non-rebound displacement of the second lever arm 330 is less than or equal to 5%. It is understood that when the non-rebound displacement of the second lever arm 330 is less than or equal to 5%, the second lever arm 330 has good resilience and is not prone to plastic deformation, and the second lever arm 330 can better spring back the frame 1.

[0123] It is understandable that the height of the second lever arm 330 in the second direction can be adjusted according to the working environment. Table 2 shows the parameters of the work height simulation in one embodiment of the second lever arm 330. The free height H2 of the second lever arm 330 refers to the height of the contact point of the second lever arm 330 from the second connecting arm 350 in the second direction. In this embodiment, the first direction is parallel to the thickness direction (Z-axis) of the electronic device 1000 as an example for illustration. Figure 11 This is the pressure-displacement curve for the second lever arm 330, where, Figure 11 The horizontal axis represents displacement in mm, which refers to the displacement of the second lever arm 330 in the second direction during the force application process. The vertical axis represents force in N. Figure 12 This is the force diagram of the second lever arm 330 under maximum stress.

[0124] Table 2. Parameters for the simulation of the second lever arm with a height of 330 mm.

[0125]

[0126] Combining Table 1 and Figure 11 , Figure 12 It can be seen that the design free height H2 of the second lever arm 330 is 1.34mm, the recommended working height is 0.99mm, and under the condition of setting the load amount to 0.35mm, the simulation shows that the working height elastic force (maximum pressing force of the spring piece) is 0.52N. At this time, the non-rebound height of the second lever arm 330 is 0mm, which meets the design conditions.

[0127] In some embodiments, the bracket 600 may have a first groove 610, the opening of which faces the motherboard 500. The base 310 is located within the first groove 610. It is understood that during the assembly of the conductive component 300 to the bracket 600, the first groove 610 can serve as a positioning structure for the conductive component 300, accelerating assembly efficiency. Furthermore, the first groove 610 can reduce displacement deviation of the conductive component 300, preventing lateral movement during assembly that could lead to inaccurate contact with the electrical connection points on the frame 1 and the circuit board 510, resulting in poor electrical connection reliability of the conductive component 300.

[0128] In some embodiments, the bracket 600 includes a metal portion 620, and a weld layer is provided between the base 310 and the metal portion 620, with the base 310 and the metal portion 620 fixedly connected by the weld layer. Exemplarily, when the bracket 600 has a first groove 610, the metal portion 620 is exposed at the bottom of the first groove 610. The weld layer is located within the first groove 610. It is understood that the metal portion 620 can enhance the strength of the bracket 600, thereby allowing the bracket 600 to better withstand the contact force of the conductive component 300. Compared to processes such as adhesive bonding, the welded connection between the base 310 and the metal portion 620 has a more stable strength, and when assembling the conductive component 300 and the bracket 600, the welding process offers higher assembly precision than adhesive bonding or injection molding, which is beneficial to the electrical connection reliability of the conductive component 300.

[0129] For example, the bracket 600 may include a non-metallic portion 630 and a metallic portion 620. A first groove 610 may be located on the non-metallic portion 630. The metallic portion 620 may be made of a metal material such as stainless steel or aluminum alloy, while the non-metallic portion 630 may be made of a non-metallic material such as plastic. The metallic portion 620 and the non-metallic portion may be integrally formed using an insert process. The position of the metallic portion 620 on the bracket 600 can also serve as a positioning position for mounting the conductive component 300, thereby improving assembly efficiency.

[0130] In some embodiments, the second connecting arm 350 is provided with a limiting groove 351. The conductive element 300 also includes a first component 360. The first end of the first component 360 is fixedly connected to the second lever arm 330. The second end of the first component 360 is engaged within the limiting groove 351. When the second lever arm 330 elastically deforms against the base 310 in the second direction, the second end of the first component 360 slides within the limiting groove 351. It can be understood that by providing the limiting groove 351, when the second lever arm 330 elastically deforms against the base 310 in the second direction, the second end of the first component 360 slides within the limiting groove 351. The limiting groove 351 can limit the second lever arm 330, preventing the second lever arm 330 from wobbling and causing interference to surrounding devices. In addition, the design of the limiting groove 351 can also effectively prevent the second lever arm 330 from damaging the electronic components 520 or other surrounding device units on the circuit board 510 during the assembly of the bracket 600.

[0131] It is understood that the connection position of the first end of the first component 360 and the second lever arm 330 is not limited to the end shown in the drawings of this application. In other embodiments, the first segment of the first component 360 may also be connected to the middle segment of the second lever arm 330. This application does not impose any restrictions.

[0132] In some embodiments, the angle between the first member 360 and the first lever arm 320 is in the range of 45° to 60°. It is understood that when the angle between the first member 360 and the first lever arm 320 is in the range of 45° to 60°, the blocking force of the first member 360 on the second lever arm 330 is relatively small, so as to avoid the first member 360 preventing the second lever arm 330 from deforming.

[0133] For example, the second connecting arm 350 includes a base plate 3501, a first sidewall 3502, and a second sidewall 3503. The first sidewall 3502 and the second sidewall 3503 are fixedly connected to both sides of the base plate 3501. The first sidewall 3502, the second sidewall 3503, and the base plate 3501 form a limiting groove 351, and the second end of the first member 360 is at least partially located between the first sidewall 3502 and the second sidewall 3503. It is understood that by providing the limiting groove 351, when the second lever arm 330 elastically deforms against the base 310 in the second direction, the second end of the first member 360 slides within the limiting groove 351. The first sidewall 3502 and the second sidewall 3503 can limit the second lever arm 330, reducing the risk of the second lever arm 330 swaying in the XY plane and causing interference to surrounding devices.

[0134] For example, the second connecting arm 350 may further include a first protrusion 3504. The first protrusion 3504 is fixedly connected to the end of the first sidewall 3502 away from the base plate 3501 and is spaced apart from the base plate 3501. A portion of the first component 360 is located between the first protrusion 3504 and the base plate 3501. When the conductive component 300 is mounted on the bracket 600 and the bracket 600 is mounted on the main board 500, the first protrusion 3504 is located on the side of the base plate 3501 closer to the main board 500. It is understood that by providing the first protrusion 3504, the first protrusion 3504, the first sidewall 3502, the second sidewall 3503, and the base plate 3501 form a limiting groove 351, which can limit the first component 360 in the direction of the base plate 3501 toward the first protrusion 3504. When the conductive component 300 is mounted on the bracket 600, and the bracket 600 is mounted on the circuit board 510 of the motherboard 500, the first protrusion 3504 is located on the side of the base plate 3501 closest to the circuit board 510, that is, the direction of the base plate 3501 toward the first protrusion 3504 is the thickness direction of the electronic device 1000. The first protrusion 3504 can limit the first component 360 in the thickness direction of the electronic device 1000, preventing the first component 360 from interfering with the electronic devices on the motherboard 500.

[0135] For example, the second connecting arm 350 further includes a second protrusion 3505, which is fixedly connected to the end of the second sidewall 3503 away from the base plate 3501 and spaced apart from the base plate 3501. A portion of the first component 360 is located between the second protrusion 3505 and the base plate 3501. When the conductive component 300 is mounted on the bracket 600 and the bracket 600 is mounted on the main board 500, the second protrusion 3505 is located on the side of the base plate 3501 closer to the main board 500. It can be understood that by providing the second protrusion 3505, the second protrusion 3505, the first sidewall 3502, the second sidewall 3503, and the base plate 3501 form a limiting groove 351, which can limit the first component 360 in the direction of the base plate 3501 toward the second protrusion 3505. When the conductive component 300 is mounted on the bracket 600, and the bracket 600 is mounted on the motherboard 500, the second protrusion 3505 is located on the side of the base plate 3501 closer to the motherboard 500, that is, the direction of the base plate 3501 toward the second protrusion 3505 is the thickness direction of the electronic device 1000. The second protrusion 3505 can limit the first component 360 in the thickness direction of the electronic device 1000, preventing the first component 360 from interfering with the electronic devices on the motherboard 500.

[0136] For example, the second connecting arm 350 may simultaneously include a first protrusion 3504 and a second protrusion 3505, with the first protrusion 3504 and the second protrusion 3505 spaced apart, and a portion of the first member 360 located between the first protrusion 3504 and the second protrusion 3505. In this way, the first protrusion 3504 and the second protrusion 3505 respectively limit the first member 360 from both sides, resulting in a better limiting effect. For example, the base plate 3501, the first sidewall 3502, the second sidewall 3503, the first protrusion 3504, and the second protrusion 3505 can be formed by shearing and stamping from a single piece of steel.

[0137] In other embodiments, the limiting groove 351 can also be formed by mechanically slotting directly on the base plate 3501, and is not limited to the implementation method in the previous embodiments. This application does not limit the formation method of the limiting groove 351.

[0138] In some embodiments, the conductive element 300 further includes a third lever arm (not shown). The third lever arm is fixedly connected to the periphery of the base 310 and is spaced apart from the first lever arm 320 and the second lever arm 330. The third lever arm is capable of elastic deformation relative to the base 310 along a third direction, which is different from the first and second directions. It is understood that the conductive element 300 may also include a third lever arm and more lever arms, thereby enabling electrical connections in three or more directions.

[0139] In some implementations, the parts that are the same as those in the previous embodiments will not be described again. In the previous embodiments, the length direction of the first lever arm 320 is parallel to the plane where the bracket 600 is located. During the installation of the bracket 600, the conductive component 300 and the bracket 600 are assembled first, and then the bracket 600 is assembled onto the circuit board 510. The bracket 600 is usually assembled onto the circuit board 510 by a slanted insertion (e.g., 45° slanted insertion). When the frame 1 has some protruding structures, the first lever arm 320 is prone to rubbing against the protruding structures, resulting in plastic deformation and affecting the conductivity of the conductive component 300.

[0140] Figure 13 This is a schematic diagram of another embodiment of the conductive element 300 provided in this application.

[0141] like Figure 13As shown, in this embodiment, the length direction of the first lever arm 320 is set at an angle to the plane where the bracket 600 is located. The plane where the bracket 600 is located is approximately parallel to the XY plane of the electronic device 1000. The length direction of the first lever arm 320 refers to the direction from the end of the first lever arm 320 connected to the base 310 to the end of the first lever arm 320 in contact with the frame 1. The length direction of the first lever arm 320 is indicated by line segment L1 in the figure. It can be understood that in this embodiment, the first lever arm 320 is set in an inclined state. During the inclined insertion process, the first lever arm 320 is less likely to rub against the protruding structure, avoiding irreversible deformation of the first lever arm 320 after rubbing, which would affect the conductivity stability of the conductive component 300. For example, the end of the first lever arm 320 in contact with the frame 1 faces the side where the motherboard 500 is located.

[0142] In some embodiments, the angle between the length direction of the first lever arm 320 and the plane containing the bracket 600 is in the range of 20° to 50°. It is understood that setting the angle between the length direction of the first lever arm 320 and the plane containing the bracket 600 to be greater than or equal to 20° results in a greater degree of inclination for the first lever arm 320, making it less susceptible to scratches. Since the electronic device 1000 has limited space in the thickness direction, the first lever arm 320 is relatively long. Setting the angle between the length direction of the first lever arm 320 and the plane containing the bracket 600 to be less than or equal to 50° allows the space between the bracket 600 and the frame 1 to better accommodate the length of the first lever arm 320, ensuring that the first lever arm 320 has sufficient length to support deformation.

[0143] In some implementations, combined Figure 3 The first lever arm 320 is used to spring-load the side of the frame 1 facing the circuit board 510 of the motherboard 500. It can be understood that during the assembly of the electronic device 1000, the bracket 600 is first tilted downward at about 45° and installed into the middle frame. When simulating the assembly path, the bracket 600 is required to first engage with the circuit board 510. Then the bracket 600 is assembled to a normal horizontal state, so that the spring point of the first lever arm 600 finally contacts the frame 1 to achieve the spring-load function. This avoids premature contact with the frame 1 during tilted assembly, which could cause excessive pressure and non-rebound deformation.

[0144] It is understood that, without conflict, the embodiments and features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0145] It is understood that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0146] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device (1000), characterized in that, It includes a housing (100), a circuit board, a bracket (600), and a conductive element (300), wherein the circuit board, the bracket (600), and the conductive element (300) are all located inside the housing (100); The electronic device (1000) further includes an electrical component formed by at least a portion of the frame (1) of the housing (100), or the electrical component is fixedly connected to the frame (1) of the housing (100); The conductive element (300) includes a base (310), a first lever arm (320), and a second lever arm (330). The first lever arm (320) and the second lever arm (330) are fixedly connected to the periphery of the base (310) at intervals. The first lever arm (320) is capable of elastic deformation relative to the base (310) in a first direction, and the second lever arm (330) is capable of elastic deformation relative to the base (310) in a second direction. The first direction and the second direction are set at an angle. The base (310) and the bracket (600) are fixedly connected, the bracket (600) and the circuit board (510) are fixedly connected, the first lever arm (320) abuts against the frame (1) of the housing (100) and is electrically connected to the electrical component, and the second lever arm (330) abuts against the circuit board and is electrically connected to the circuit board.

2. The electronic device (1000) according to claim 1, characterized in that, In the first direction, the first lever arm (320) is located between the frame (1) and the bracket (600); and / or, The circuit board and the bracket (600) are arranged sequentially along the second direction, and the second lever arm (330) is located between the circuit board and the bracket (600).

3. The electronic device (1000) according to claim 2, characterized in that, The circuit board is part of the motherboard (500) of the electronic device (1000); The housing (100) further includes a middle plate (2), the frame (1) of the housing (100) is circumferentially connected to the middle plate (2) of the housing (100), the circuit board is mounted on the middle plate (2) of the housing (100), the bracket (600) is mounted on the surface of the circuit board away from the middle plate (2) of the housing (100), and the second lever arm (330) is located between the circuit board and the bracket (600).

4. The electronic device (1000) according to claim 1, characterized in that, The length direction of the first lever arm (320) is set at an angle to the plane where the bracket (600) is located.

5. The electronic device (1000) according to claim 4, characterized in that, The angle between the length direction of the first lever arm (320) and the plane where the bracket (600) is located is in the range of 20° to 50°.

6. The electronic device (1000) according to claim 4 or 5, characterized in that, The first lever arm (320) is positioned so that the end that contacts the frame (1) of the housing (100) faces the side where the circuit board (510) is located.

7. The electronic device (1000) according to any one of claims 1 to 5, characterized in that, The electrical component is the radiator (400) of the antenna.

8. The electronic device (1000) according to any one of claims 1 to 5, characterized in that, The conductive element (300) further includes a first connecting arm (340), which is fixedly connected between the base (310) and the first lever arm (320) in a direction perpendicular to the thickness direction of the electronic device (1000); and / or, The conductive element (300) further includes a second connecting arm (350), which is connected between the base (310) and the second lever arm (330). In the thickness direction of the electronic device (1000), the second connecting arm (350) is located between the bracket (600) and the second lever arm (330).

9. The electronic device (1000) according to claim 8, characterized in that, The second connecting arm (350) is provided with a limiting groove (351), and the conductive component (300) further includes a first component (360). The first end of the first component (360) is fixedly connected to the second lever arm (330), and the second end of the first component (360) is engaged in the limiting groove (351). When the second lever arm (330) elastically deforms against the base (310) in the second direction, the second end of the first component (360) slides within the limiting groove (351).

10. The electronic device (1000) according to claim 9, characterized in that, The second connecting arm (350) includes a base plate (3501), a first side wall (3502) and a second side wall (3503). The first side wall (3502) and the second side wall (3503) are fixedly connected to both sides of the base plate (3501). The first side wall (3502), the second side wall (3503) and the base plate (3501) enclose the limiting groove (351). The second end of the first member (360) is at least partially located between the first sidewall (3502) and the second sidewall (3503).

11. The electronic device (1000) according to claim 10, characterized in that, The second connecting arm (350) further includes a first protrusion (3504), which is fixedly connected to the end of the first sidewall (3502) away from the base plate (3501) and spaced apart from the base plate (3501). A portion of the first component (360) is located between the first protrusion (3504) and the base plate (3501); and / or, The second connecting arm (350) further includes a second protrusion (3505), which is fixedly connected to the end of the second sidewall (3503) away from the base plate (3501) and is spaced apart from the base plate (3501). A portion of the first component (360) is located between the second protrusion (3505) and the base plate (3501).

12. The electronic device (1000) according to any one of claims 1 to 5, characterized in that, During the elastic deformation of the first lever arm (320) relative to the base (310) along the first direction, the non-rebound displacement of the first lever arm (320) is less than or equal to 5%. And / or, During the elastic deformation of the second lever arm (330) relative to the base (310) along the second direction, the non-rebound displacement of the second lever arm (330) is less than or equal to 5%.

13. The electronic device (1000) according to any one of claims 1 to 5, characterized in that, The base (310) and the first lever arm (320) are integrally formed structural components; and / or, The base (310) and the second lever arm (330) are integrally formed structural components.

14. The electronic device (1000) according to any one of claims 1 to 5, characterized in that, The conductive element (300) further includes a third lever arm, which is fixedly connected to the periphery of the base (310) and is spaced apart from the first lever arm (320) and the second lever arm (330); The third lever arm is capable of elastic deformation relative to the base (310) along a third direction, which is different from both the first and second directions.

15. The electronic device (1000) according to any one of claims 1 to 5, characterized in that, The bracket (600) is provided with a first groove (610), the opening of the first groove (610) faces the circuit board (510), and the base (310) is located in the first groove (610).

16. The electronic device (1000) according to any one of claims 1 to 5, characterized in that, The bracket (600) includes a metal part (620), and a welding layer is provided between the base (310) and the metal part (620), and the base (310) and the metal part (620) are fixedly connected by the welding layer.

Images