A heating circuit for heating a headset

Abstract

The utility model relates to a kind of heating circuit for heating sleep earphone, including integrated module, switch module and heating module.Switch module is controlled to the control signal output by integrated module, according to the temperature change in earphone control the conduction and disconnection between heating module and battery, to realize the intermittent heating of earphone.Heating module is constituted by heating resistance and thermistor, and heat is effectively transmitted to earphone shell by heat-conducting silica gel, and ear is hot-compressed, blood circulation is promoted, nerve regulation is improved, to assist sleep.The utility model has simple structure, high control precision, with good sleep promotion effect, suitable for the design and application of TWS sleep aid earphone.

Description

Technical Field

[0001] This application relates to the field of electrothermal control technology, and more particularly to a heating circuit for heating headphones. Background Technology

[0002] With the fast pace of life and increasing stress, sleep problems are becoming increasingly common, especially in urban areas. Many users rely on TWS (True Wireless Stereo) earbuds to play soothing music to help them fall asleep. However, most TWS sleep earbuds on the market currently only have audio playback functionality and lack additional physiological soothing designs, resulting in limited sleep-aiding effects.

[0003] Studies have shown that the ear has abundant nerve endings and capillaries, and appropriate warm compresses can promote local blood circulation in the ear, thus relaxing the nerves and improving sleep. However, current technology lacks a highly integrated, low-power heating solution that integrates temperature control and heating functions into TWS earphones.

[0004] Some attempts to apply heating elements to wearable devices generally suffer from the following problems: the control method is singular and cannot intelligently adjust the heating according to the wearing status or temperature changes; the heating element is separated from the headphone body structure, resulting in low heat conduction efficiency; it cannot achieve automatic intermittent heating, posing a risk of overheating or energy waste; and it lacks a feedback closed-loop control mechanism for temperature sensors, resulting in lag in adjustment or unstable response.

[0005] Therefore, there is an urgent need to provide a heating circuit that is compact, intelligently controlled, responsive, and can be effectively integrated with the structure of TWS earphones to realize the heat therapy function of the earphones, thereby improving the sleep aid effect and user wearing comfort. Summary of the Invention

[0006] This application provides a heating circuit for heated headphones to solve the problem that existing TWS sleep headphones lack intelligent temperature control heating function and cannot achieve efficient and safe heat therapy to assist sleep.

[0007] In a first aspect, this application provides a heating circuit for heating headphones, the heating circuit including a switching module, a heating module and an integrated module; The input terminal of the switch module is connected to the output terminal of the integrated module; The output terminal of the switch module is connected to the input terminal of the heating module; The heating module is connected to the output terminal of the battery via the switch module; The first output terminal of the heating module is connected to the headphone device, and the headphone device is heated by the heating module. The switching module is turned on or off in response to the control signal output by the integrated module, so that the output terminal of the battery is connected or disconnected from the heating module, so that the battery intermittently heats the heating module.

[0008] Optionally, the first input terminal of the switch module is connected to the output terminal of the integrated module, and the output terminal of the integrated module is a signal output terminal; The second input terminal of the switch module is connected to the output terminal of the battery; The output terminal of the switch module is connected to the input terminal of the heating module; The second output terminal of the heating module is connected to the input terminal of the integrated module, and the input terminal of the integrated module is a temperature detection terminal.

[0009] Optionally, the control signal includes a first control signal; The integrated module outputs a first control signal at its signal output terminal. The switching module is turned on in response to the first control signal, so that the output terminal of the battery is connected to the heating module, so that the battery heats the heating module.

[0010] Optionally, the control signal may further include a second control signal; The temperature detection terminal of the integrated module collects the temperature of the heating module. When the temperature of the heating module exceeds a preset temperature threshold, the signal output terminal of the integrated module outputs a second control signal. The switching module disconnects in response to the second control signal, thereby disconnecting the output terminal of the battery from the heating module and stopping the battery from heating the heating module.

[0011] Optionally, the switching module includes a first MOSFET and a second MOSFET; The source of the first MOS transistor is connected to ground, the gate is connected to the signal output terminal of the integrated module, and the drain is connected to the gate of the second MOS transistor. The source of the second MOS transistor is connected to the output terminal of the battery, and the drain is connected to the heating module.

[0012] Optionally, in response to the first control signal output from the signal output terminal of the integrated module, the source and drain of the first MOS transistor are turned on, so that the gate of the second MOS transistor is short-circuited to the ground line. The gate of the second MOSFET responds to a short-circuit voltage, and the source of the second MOSFET responds to a battery voltage, so that the source and drain of the second MOSFET are turned on, thereby connecting the battery to the heating module.

[0013] Optionally, the heating module includes a heating resistor and a thermistor, wherein the input terminal of the heating resistor is connected to the drain of the second MOS transistor, and the output terminal is connected to the input terminal of the thermistor. The output terminal of the thermistor is connected to the temperature detection terminal of the integrated module.

[0014] Optionally, the input terminal of the heating resistor is heated in response to the battery voltage, so that the headphone device is heated through the heating resistor; The temperature detection terminal of the integrated module acquires the temperature of the thermistor and feeds back the acquired temperature to the integrated module; in response to the acquired temperature, when the acquired temperature exceeds the preset temperature threshold, the integrated module controls the signal output terminal of the integrated module to output a second control signal.

[0015] Optionally, the first control signal is high level and the second control signal is low level.

[0016] Optionally, a highly thermally conductive silicone rubber is disposed between the heating resistor and the headphone device, so that the headphone device can be rapidly heated through the heating resistor.

[0017] Compared with the prior art, the technical solution provided in this application has the following advantages: By integrating a control signal output by a module and combining it with a thermistor to collect temperature in real time and compare it with a preset threshold, the heating circuit can be automatically turned on or off, avoiding overheating and ensuring safe use. The heating circuit uses a switching module composed of a first MOSFET and a second MOSFET, with simple control logic, fast turn-on speed, and rapid response to control signals, ensuring the real-time performance and stability of heating control. A closed-loop system of "temperature acquisition—signal output—heating control" is formed, achieving intermittent heating based on changes in the internal temperature of the earphone, effectively reducing battery consumption and extending usage time. The earphone heating module can provide gentle heat to the ears, promoting local blood circulation, relieving nervous tension, and, when used with sleep-aiding music, significantly improving the user's speed of falling asleep and sleep quality. High thermal conductivity silicone is filled between the heating resistor and the earphone shell, effectively improving heat transfer efficiency, making earphone heating more uniform and rapid, and enhancing the overall wearing experience. This heating circuit is suitable for various TWS earphone structures, easily integrated with existing Bluetooth control chips, and has a compact circuit, facilitating mass production and miniaturization design. In summary, this invention solves the problem of existing TWS earphones lacking effective heating functions, and has significant improvements in intelligent control, safe use, and sleep-aiding experience, showing promising application prospects. Attached Figure Description The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without creative effort.

[0019] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0020] Figure 1 A schematic diagram of a module structure for a heating circuit used in heating headphones, provided as an embodiment of this application; Figure 2 This is a circuit diagram of a heating circuit for heating headphones, provided as an embodiment of this application. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0023] like Figure 1 As shown, Figure 1 This is a schematic diagram of a heating circuit for heating headphones, provided as an embodiment of this application.

[0024] The heating circuit includes a switching module, a heating module, and an integrated module; The input terminal of the switch module is connected to the output terminal of the integrated module; The output terminal of the switch module is connected to the input terminal of the heating module; The heating module is connected to the output terminal of the battery via the switch module; The first output terminal of the heating module is connected to the headphone device, and the headphone device is heated by the heating module. The switching module is turned on or off in response to the control signal output by the integrated module, so that the output terminal of the battery is connected or disconnected from the heating module, so that the battery intermittently heats the heating module.

[0025] like Figure 2 As shown, Figure 2 This application provides a circuit diagram of a heating circuit for heating headphones, as illustrated in an embodiment of the present application. The headphone heating circuit in this embodiment includes a switching module, a heating module, and an integrated module. Wherein: The integrated module can be a Bluetooth master control chip or an MCU with control logic and temperature acquisition function. SW is used to output control signals, and NTC is used to acquire temperature information of the heating module. The switching module includes two MOSFETs, namely a first MOSFET Q1 and a second MOSFET Q2. The gate of the first MOSFET is connected to the control pin of the integrated module to receive control signals; its source is grounded and its drain is connected to the gate of the second MOSFET; the source of the second MOSFET is connected to the battery output terminal, and its drain is connected to the input terminal of the heating module.

[0026] When the integrated module outputs a high-level control signal, the first MOSFET Q1 is turned on, the gate of the second MOSFET Q2 is pulled low, and Q2 is turned on, connecting the battery and the heating module to start heating. When the control signal is low, Q1 is turned off, there is no trigger voltage on the gate of Q2, Q2 is turned off, the heating module is disconnected from the battery, and heating is stopped.

[0027] The heating module includes a heating resistor R3 and a thermistor R4 connected in series. The input terminal of the heating resistor R3 is connected to the drain of the second MOSFET Q2, and the output terminal is connected to the headphone body. The thermistor R4 is used to monitor the internal temperature of the headphone in real time. One end of the thermistor is connected to the output terminal of the heating resistor, and the other end is connected to the temperature detection terminal of the integrated module. The space between the heating resistor and the headphone shell is filled with thermally conductive silicone to improve heat transfer efficiency and enable the headphone device to heat up quickly.

[0028] In practical use, when a user wears the headphones, the Bluetooth chip detects the activation conditions (such as playing sleep-aid audio or being worn) and outputs a high-level control signal to start the heating module. During the heating process, the integrated module continuously collects the temperature signal fed back by the thermistor. When the temperature exceeds the set threshold, the control signal turns low, and heating is turned off; when the temperature drops below the set range, it is turned on again, forming a closed-loop control of automatic intermittent heating, which achieves constant temperature maintenance inside the headphones, effectively improving wearing comfort and sleep-aiding effect.

[0029] Furthermore, the first input terminal of the switch module is connected to the output terminal of the integrated module, and the output terminal of the integrated module is a signal output terminal; The second input terminal of the switch module is connected to the output terminal of the battery; The output terminal of the switch module is connected to the input terminal of the heating module; The second output terminal of the heating module is connected to the input terminal of the integrated module, and the input terminal of the integrated module is a temperature detection terminal.

[0030] In this embodiment, the heating circuit of the earphone includes an integrated module, a switching module, and a heating module, which are used to realize the intelligent temperature control heating function inside the earphone to help the wearer fall asleep and soothe the ears.

[0031] Specifically, the switch module has two input terminals and one output terminal: Its first input terminal is connected to the output terminal of the integrated module, which is a signal output terminal used to send control signals; The second input terminal is connected to the output terminal of the battery to obtain power. The output terminal is connected to the input terminal of the heating module and is used to control whether to supply power to the heating module.

[0032] When the integrated module outputs a high-level signal, the switch module is turned on, and the battery's output voltage is transmitted to the heating module through the switch module, causing the heating resistor to start working and supplying heat to the headphone device; when it outputs a low-level signal, the switch module is turned off, cutting off the heating circuit, thereby achieving intermittent heating.

[0033] Furthermore, the heating module is provided with two output terminals: The first output terminal is connected to the headphone device and is used to transfer the heat released by the heating resistor to the headphone structure; The second output terminal is connected to the input terminal of the integrated module, which is a temperature detection terminal used to receive temperature signals from the thermistor.

[0034] In this embodiment, the thermistor is part of the heating module and is connected in series with the heating resistor. Its output signal is transmitted back to the integrated module, which includes a temperature detection function to collect and judge the temperature of the headphone heating area in real time. When the temperature reaches the preset upper threshold, the control signal turns low, turns off the switch module, and stops heating; when the temperature is lower than the lower threshold, it outputs a high level again to start heating.

[0035] Through the above structure and control logic, the entire heating circuit can intelligently maintain a constant temperature range during wear, avoiding overheating or underheating, improving wearing comfort and safety, and is especially suitable for TWS sleep earphones used to improve sleep quality and user experience.

[0036] Furthermore, the control signal includes a first control signal; The integrated module outputs a first control signal at its signal output terminal. The switching module is turned on in response to the first control signal, so that the output terminal of the battery is connected to the heating module, so that the battery heats the heating module.

[0037] In this embodiment, the control signal includes a first control signal, which is generated by the integrated module and output to the switching module to control the conduction state of the heating circuit.

[0038] Specifically, the integrated module can be a control chip or microcontroller (MCU) with Bluetooth functionality. The signal output terminal of the integrated module is connected to the control terminal of the switch module to output a first control signal to drive the switch module to turn on.

[0039] The switching module includes a first MOSFET Q1 and a second MOSFET Q2. The gate of the first MOSFET is connected to the signal output terminal of the integrated module. When the integrated module outputs a first control signal at a high level, the first MOSFET Q1 is turned on, and its drain and source are connected, thereby pulling the gate of the second MOSFET Q2 to a low level, and Q2 is also turned on.

[0040] When Q2 is turned on, the output terminal of the battery is connected to the heating module through Q2, and the battery supplies power to the heating module to realize the heating function inside the earphone. At this time, the heating resistor in the heating module starts to work and effectively transfers heat to the earphone shell through the thermally conductive silicone, so that the wearer's ear is heated.

[0041] The triggering condition for the first control signal can be determined by the integrated module based on the user's wearing status, the activation signal of sleep-aid music playback, or temperature feedback. For example, when the user starts playing sleep-aid music or when the headphones are worn and the temperature is below a threshold, the system outputs the first control signal to trigger the heating process.

[0042] This implementation method enables intelligent control and on-demand activation of the heating circuit, ensuring that the headphone device heats up when needed, effectively avoiding unnecessary energy consumption, while improving wearing comfort and sleep aid effects.

[0043] Furthermore, the control signal also includes a second control signal; The temperature detection terminal of the integrated module collects the temperature of the heating module. When the temperature of the heating module exceeds a preset temperature threshold, the signal output terminal of the integrated module outputs a second control signal. The switching module disconnects in response to the second control signal, thereby disconnecting the output terminal of the battery from the heating module and stopping the battery from heating the heating module.

[0044] In this embodiment, the control signal further includes a second control signal, which is used to implement overheat protection control of the heating module, thereby ensuring the safety and comfort of the headphone heating process.

[0045] Specifically, the integrated module has an input terminal, which is a temperature detection terminal, connected to a thermistor in the heating module. The thermistor, acting as a temperature sensing element, detects temperature changes inside the heating module or the earphone in real time and feeds the temperature back to the temperature detection terminal of the integrated module.

[0046] When the temperature of the heating module rises to the system's preset temperature threshold (e.g., 40°C), the control logic inside the integrated module determines that the temperature has reached the safe upper limit. At this time, the signal output terminal outputs a second control signal to shut down the heating circuit.

[0047] The second control signal is a low-level signal. When the first MOSFET Q1 in the switching module receives the low-level signal, it is turned off. Its drain and source are not connected, so the gate of the second MOSFET Q2 is not pulled low, and Q2 is also turned off, causing the battery output terminal to be disconnected from the heating module and the heating to stop.

[0048] This control method constitutes a complete temperature feedback closed-loop system, enabling the headphone's heating process to have overheat detection and automatic power-off functions. When the temperature drops to the set lower limit (e.g., 35°C), the integrated module can re-output the first control signal to resume heating, thereby achieving intermittent heating cycle control to maintain the temperature within a comfortable and safe range.

[0049] This embodiment effectively prevents discomfort or safety hazards caused by overheating of the earphones, further improving the wearing experience and product stability, and is especially suitable for long-term wearing scenarios of TWS earphones during sleep.

[0050] Furthermore, the switching module includes a first MOSFET and a second MOSFET; The source of the first MOS transistor is connected to ground, the gate is connected to the signal output terminal of the integrated module, and the drain is connected to the gate of the second MOS transistor. The source of the second MOS transistor is connected to the output terminal of the battery, and the drain is connected to the heating module.

[0051] In this embodiment, the switching module specifically includes a first MOSFET Q1 and a second MOSFET Q2, which work together to control the conduction and disconnection of the heating circuit, thereby controlling whether the battery supplies power to the heating module.

[0052] like Figure 2 As shown, the specific structure is as follows: the source of the first MOS transistor Q1 is connected to ground (GND), and the gate is connected to the signal output terminal of the integrated module, which is used to receive the first control signal or the second control signal output by the integrated module; The drain of the first MOSFET is connected to the gate of the second MOSFET Q2, thereby controlling the conduction state of the second MOSFET.

[0053] The source of the second MOSFET Q2 is connected to the output terminal (VBAT) of the battery, and the drain is connected to the input terminal of the heating module, which is used to control whether current enters the heating module.

[0054] The circuit operates as follows: When the integrated module outputs the first control signal (high level), the first MOSFET Q1 is turned on, forming a path between its source and drain. The gate of the second MOSFET Q2 is pulled to ground, and Q2 enters the on state. At this time, the battery supplies power to the heating module through Q2, activating the heating function. When the integrated module outputs the second control signal (low level), Q1 is turned off, and the gate of Q2 is either floating or held at a high level, causing Q2 to turn off. The battery is disconnected from the heating module, and heating stops.

[0055] This dual-MOSFET series control structure enables low-power, high-response, stable and reliable switching control functions, and has good compatibility with the output level of Bluetooth control chips or MCUs. It is suitable for scenarios with high requirements for heat control precision in small smart wearable devices such as TWS earphones.

[0056] Furthermore, in response to the first control signal output from the signal output terminal of the integrated module, the source and drain of the first MOS transistor are turned on, so that the gate of the second MOS transistor is short-circuited to the ground line. The gate of the second MOSFET responds to a short-circuit voltage, and the source of the second MOSFET responds to a battery voltage, so that the source and drain of the second MOSFET are turned on, thereby connecting the battery to the heating module.

[0057] When the integrated module outputs a first control signal (high level), the first MOSFET Q1 is turned on, meaning its source and drain are connected. At this time, the drain of the first MOSFET is connected to the gate of the second MOSFET Q2; the source of the first MOSFET is grounded, so the gate of Q2 is pulled to ground potential, forming a short-circuit voltage state; the source of the second MOSFET Q2 is connected to the output terminal of the battery, i.e., the positive terminal of the power supply; under the condition that the gate of Q2 is low level and the source is high level (battery voltage), Q2 is turned on, and a current path is formed between its source and drain.

[0058] At this time, the battery output current is supplied to the heating module through the drain of the second MOSFET, activating the heating resistor and enabling the headphone device to perform its heating function. This dual-MOSFET cascaded control structure not only ensures effective control of the power path but also achieves reliable driving of the power MOSFET through the short-circuit and pull-up relationship of the gate voltage. Compared to directly driving a single MOSFET, this structure has better driving capability, EMI stability, and low power consumption characteristics, making it suitable for intelligent temperature control scenarios in miniature wearable devices such as headphones.

[0059] This embodiment is particularly suitable for applications that indirectly control power MOS switches by outputting high and low level signals through Bluetooth chips or integrated MCUs, and has the advantages of simple circuit, low cost and fast response.

[0060] Furthermore, the heating module includes a heating resistor and a thermistor, the input terminal of the heating resistor is connected to the drain of the second MOS transistor, and the output terminal is connected to the input terminal of the thermistor. The output terminal of the thermistor is connected to the temperature detection terminal of the integrated module.

[0061] In this embodiment, the heating module includes a heating resistor R3 and a thermistor R4, which are connected in series to form an integrated structure for heating and temperature feedback, used to realize the heating function and temperature monitoring function inside the earphone.

[0062] The specific structure is as follows: the input terminal of the heating resistor R3 is electrically connected to the drain of the second MOS transistor Q2 to receive the power supply current from the battery terminal; the output terminal of the heating resistor is connected to the input terminal of the thermistor R4 to form a series structure; the output terminal of the thermistor R4 is connected to the temperature detection terminal of the integrated module to transmit temperature change signals in real time.

[0063] In operation: When the integrated module outputs the first control signal, the second MOSFET turns on, and the battery voltage is applied to the heating module through Q2; the heating resistor R3 starts working, generating heat to heat the headphone device; the thermistor R4 is in close contact with the heating resistor, and its resistance changes as the temperature rises (for example, using an NTC thermistor, the resistance decreases as the temperature rises); the integrated module obtains the temperature value at the thermistor in real time by detecting the voltage change at the temperature detection terminal; when the temperature exceeds the set threshold, the integrated module can output the second control signal to turn off the heating circuit and prevent overheating.

[0064] The heating module features a compact design and a clear control path. It provides both earphone heating and closed-loop temperature feedback to ensure the entire heating process operates within a safe temperature range. It is particularly suitable for wearable smart devices such as TWS earphones that are small in size and have limited battery capacity.

[0065] In addition, to improve heat conduction efficiency, the heating resistor can be placed near the inner surface of the earphone shell and filled between the heating module and the shell with thermally conductive silicone to further improve the heating speed and thermal comfort on the ear canal side.

[0066] Furthermore, the input terminal of the heating resistor is heated in response to the battery voltage, so that the headphone device is heated through the heating resistor; The temperature detection terminal of the integrated module acquires the temperature of the thermistor and feeds back the acquired temperature to the integrated module; in response to the acquired temperature, when the acquired temperature exceeds the preset temperature threshold, the integrated module controls the signal output terminal of the integrated module to output a second control signal.

[0067] In this embodiment, the heating circuit provides heat through a heating resistor and combines a thermistor with an integrated module to achieve temperature feedback control, so as to ensure that the temperature of the headphone device is maintained within a safe and comfortable range.

[0068] Specifically, the input terminal of the heating resistor R3 is connected to the drain of the second MOSFET Q2, thus receiving the battery's output voltage when Q2 is turned on. After the power is switched on, R3 begins to operate, generating heat. The heating resistor is close to or directly connected to the earphone structure, with thermally conductive silicone filling the space between the heating resistor and the earphone shell to achieve rapid and uniform heat conduction. This allows the earphone device to be heated through the heating resistor, providing a gentle warm compress to the ears.

[0069] To achieve intelligent temperature control, the output terminal of the heating resistor is connected to the input terminal of the thermistor R4, and the output terminal of R4 is connected to the temperature detection terminal of the integrated module, forming a temperature feedback path. The thermistor can be an NTC (negative temperature coefficient) type, whose resistance decreases as the temperature rises, and can sensitively reflect the temperature change of the current heating area.

[0070] During the heating process, the integrated module acquires the temperature signal from the thermistor in real time through the temperature detection terminal and performs digital processing internally. When the acquired temperature value exceeds the preset temperature threshold (e.g., set to 40°C), the integrated module immediately responds by outputting a second control signal (e.g., a low level) through its signal output terminal, thereby controlling the switching module to disconnect, that is, turning off the first MOSFET and the second MOSFET, cutting off the path between the battery and the heating resistor, and realizing automatic stopping of heating.

[0071] Through this closed-loop temperature control mechanism, this heating circuit can not only achieve intelligent heating, but also dynamically monitor the temperature status to avoid overheating and ensure safety and comfort during use. It is especially suitable for sleep aid headphone products that provide localized heat therapy to sensitive areas of the human body, such as the ears.

[0072] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0073] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0074] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed in this application can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0075] In the embodiments provided in this application, it should be understood that the disclosed devices / terminal equipment and methods can be implemented in other ways. For example, the device / terminal equipment embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the displayed or discussed mutual coupling or direct coupling or communication connection may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0076] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0077] If the integrated module / unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying the computer program code, recording media, USB flash drives, portable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the content included in the computer-readable medium can be appropriately added or removed according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electrical carrier signals and telecommunication signals.

[0078] The implementation of all or part of the processes in the methods of the above embodiments can also be accomplished by a computer program product. When the computer program product is run on a terminal device, the terminal device can implement the steps in the various method embodiments described above.

[0079] The embodiments described above are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A heating circuit for heating headphones, characterized in that, The heating circuit includes a switching module, a heating module, and an integrated module; The input terminal of the switch module is connected to the output terminal of the integrated module; The output terminal of the switch module is connected to the input terminal of the heating module; The heating module is connected to the output terminal of the battery via the switch module; The first output terminal of the heating module is connected to the headphone device, and the headphone device is heated by the heating module. The switching module is turned on or off in response to the control signal output by the integrated module, so that the output terminal of the battery is connected or disconnected from the heating module, so that the battery intermittently heats the heating module.

2. The heating circuit according to claim 1, characterized in that, The first input terminal of the switch module is connected to the output terminal of the integrated module, and the output terminal of the integrated module is a signal output terminal; The second input terminal of the switch module is connected to the output terminal of the battery; The output terminal of the switch module is connected to the input terminal of the heating module; The second output terminal of the heating module is connected to the input terminal of the integrated module, and the input terminal of the integrated module is a temperature detection terminal.

3. The heating circuit according to claim 2, characterized in that, The control signal includes a first control signal; The integrated module outputs a first control signal at its signal output terminal. The switching module is turned on in response to the first control signal, so that the output terminal of the battery is connected to the heating module, so that the battery heats the heating module.

4. The heating circuit according to claim 3, characterized in that, The control signal also includes a second control signal; The temperature detection terminal of the integrated module collects the temperature of the heating module. When the temperature of the heating module exceeds a preset temperature threshold, the signal output terminal of the integrated module outputs a second control signal. The switching module disconnects in response to the second control signal, thereby disconnecting the output terminal of the battery from the heating module and stopping the battery from heating the heating module.

5. The heating circuit according to claim 4, characterized in that, The switching module includes a first MOSFET and a second MOSFET; The source of the first MOS transistor is connected to ground, the gate is connected to the signal output terminal of the integrated module, and the drain is connected to the gate of the second MOS transistor. The source of the second MOS transistor is connected to the output terminal of the battery, and the drain is connected to the heating module.

6. The heating circuit according to claim 5, characterized in that, In response to the first control signal output from the signal output terminal of the integrated module, the source and drain of the first MOS transistor are turned on, so that the gate of the second MOS transistor is short-circuited to the ground line. The gate of the second MOSFET responds to a short-circuit voltage, and the source of the second MOSFET responds to a battery voltage, so that the source and drain of the second MOSFET are turned on, thereby connecting the battery to the heating module.

7. The heating circuit according to claim 6, characterized in that, The heating module includes a heating resistor and a thermistor. The input terminal of the heating resistor is connected to the drain of the second MOS transistor, and the output terminal is connected to the input terminal of the thermistor. The output terminal of the thermistor is connected to the temperature detection terminal of the integrated module.

8. The heating circuit according to claim 7, characterized in that, The input terminal of the heating resistor is heated in response to the battery voltage, so that the headphone device is heated through the heating resistor; The temperature detection terminal of the integrated module acquires the temperature of the thermistor and feeds back the acquired temperature to the integrated module; in response to the acquired temperature, when the acquired temperature exceeds the preset temperature threshold, the integrated module controls the signal output terminal of the integrated module to output a second control signal.

9. The heating circuit according to claim 4, characterized in that, The first control signal is high level, and the second control signal is low level.

10. The heating circuit according to claim 8, characterized in that, A highly thermally conductive silicone pad is placed between the heating resistor and the headphone device to allow the headphone device to be rapidly heated by the heating resistor.

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