Mainboard structure and electronic device

Abstract

The application discloses a mainboard structure and electronic equipment. The mainboard structure comprises a mainboard body, a first electronic component and a second electronic component. The mainboard body comprises a first connecting point and a second connecting point. The first electronic component is electrically connected to the first connecting point, and the second electronic component is electrically connected to the second connecting point. The working current of the second electronic component is greater than that of the first electronic component. The mainboard body is provided with a gap. The gap penetrates the mainboard body along the thickness direction of the mainboard structure and is arranged between the first connecting point and the second connecting point. The gap is used for cutting off the back-to-earth current generated by the second electronic component. The design of the mainboard structure can cut off the large-current loop generated by the second electronic component, thereby avoiding the magnetic coupling interference of the large current on the first electronic component and ensuring the working stability of the sensitive component.

Description

Technical Field

[0001] This application relates to the field of antennas, and more particularly to a motherboard structure and electronic device. Background Technology

[0002] With the continuous development of smartphones, in addition to the basic function of making calls, users' demands for the appearance design and entertainment functions of mobile phones are also increasing. Based on this, the entertainment attributes of electronic devices, such as games, movies, sound effects, and pixels, are becoming more and more selling points for manufacturers. Excellent sound and photography effects require speakers and cameras to have sufficient space, which requires the motherboard to reserve more space for the sound cavity and camera.

[0003] However, with the increasing number of components in electronic devices, the installation space on the motherboard has been further compressed, resulting in some high-current devices being placed too close to the speakers and cameras. This can lead to magnetic coupling during operation, causing problems such as speaker noise and decreased camera image quality. Utility Model Content

[0004] This application provides a motherboard structure and an electronic device to address some or all of the shortcomings in the related technologies.

[0005] The motherboard structure of this application includes: The motherboard body includes a first connection point and a second connection point; A first electronic component, wherein the first electronic component is electrically connected to the first connection point; A second electronic component is electrically connected to the second connection point; the operating current of the second electronic component is greater than the operating current of the first electronic component. The motherboard body has a slit that extends through the motherboard body along the thickness direction of the motherboard structure and is located between the first connection point and the second connection point; the slit is used to cut off the ground return current generated by the second electronic component.

[0006] Optionally, it also includes an antenna structure and a tuning element, wherein the antenna structure is electrically connected to the motherboard near the first connection point, and the tuning element is connected across both sides of the gap to conduct the current path of the antenna structure.

[0007] Optionally, the tuning element includes at least one capacitor, with its two ends electrically connected to both sides of the gap.

[0008] Optionally, the first connection point and the second connection point are arranged at intervals along a first direction, and the seam extends along a second direction, wherein the first direction and the second direction intersect but are not parallel.

[0009] Optionally, the fracture includes at least two first fractures and at least one second fracture, the first fractures extending along the second direction; a second fracture is disposed between two adjacent first fractures, the second fracture being in communication with both adjacent first fractures; at least a portion of the second fracture protrudes relative to the first fractures along the first direction.

[0010] Optionally, the second fracture includes a main segment, a first bending segment, and a second bending segment; the two ends of the main segment are respectively connected to two adjacent first fractures through the first bending segment and the second bending segment; wherein the main segment extends along the second direction, and the first bending segment and the second bending segment extend along the first direction.

[0011] Optionally, the fracture is arranged in a stepped manner and surrounds the periphery of the first connection point.

[0012] Optionally, the fracture is arc-shaped and surrounds the periphery of the first connection point.

[0013] Optionally, the motherboard structure further includes a wire, one end of which is electrically connected to the motherboard body, and the other end of which crosses the gap and is electrically connected to the first electronic component or the second electronic component.

[0014] The electronic device of this application includes the motherboard structure as described above.

[0015] The technical solutions provided by the embodiments of this application may include the following beneficial effects: As can be seen from the above embodiments, the design of the motherboard structure of this application can cut off the large current loop generated by the second electronic component, thereby avoiding magnetic coupling interference caused by the large current to the first electronic component and ensuring the working stability of the sensitive component.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this application. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram illustrating a motherboard structure according to an exemplary embodiment; Figure 2 This is a schematic diagram illustrating a straight fracture according to an exemplary embodiment; Figure 3 This is a schematic diagram illustrating a stepped fracture according to an exemplary embodiment; Figure 4 This is a schematic diagram illustrating an arc-shaped fracture according to an exemplary embodiment; Figure 5 This is a comparison graph of efficiency curves for the B41 band according to an exemplary embodiment. Detailed Implementation

[0019] The technical solutions in the embodiments (or "implementations") of this application will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0020] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movement of the components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.

[0021] like Figure 1 As shown, the motherboard structure 1 of this application includes a motherboard body 11, a first electronic component 12, and a second electronic component 13. The motherboard body 11 includes a first connection point 111 and a second connection point 112. The first electronic component 12 is electrically connected to the first connection point 111, and the second electronic component 13 is electrically connected to the second connection point 112. The operating current of the second electronic component 13 is greater than the operating current of the first electronic component 12. The motherboard body 11 has a slit 14 that extends through the motherboard body 11 along its thickness and is located between the first connection point 111 and the second connection point 112. The slit 14 is used to cut off the return current to ground generated by the second electronic component 13.

[0022] The motherboard structure 1 of this application, through the design of the gap 14, cuts off the high-current loop generated by the second electronic component 13, thereby avoiding magnetic coupling interference caused by the high current to the first electronic component 12. In the embodiments provided in this application, the first electronic component 12 may include at least one of a speaker and a camera, while the second electronic component 13 may be a high-current component such as a power supply or a power amplifier. Therefore, the design of the motherboard structure 1 of this application can eliminate magnetic coupling interference around the speaker and camera, thereby avoiding problems such as speaker noise and camera image quality degradation, and ensuring the operational stability of sensitive components.

[0023] In an optional embodiment, the motherboard structure 1 further includes an antenna structure and a tuning element 15. The antenna structure is electrically connected to the motherboard near the first connection point 111, and the tuning element 15 is connected across both sides of the gap 14 to conduct the current path of the antenna structure.

[0024] In practical applications, the metal decorative parts of cameras are often used as radiating branches of antenna structures. Therefore, the antenna structure may also be connected at the first connection point 111. The design of the gap 14 would cut off the antenna's current return path, leading to noise or reduced radiation performance. This application addresses this by bridging the gap 14 with a tuning element 15, thereby ensuring that the antenna's signal strength and radiation performance are unaffected by the gap 14 and allowing the current return path to be maintained through the tuning element 15.

[0025] In an optional embodiment, the tuning element 15 includes at least one capacitor, with its two ends electrically connected to both sides of the gap 14.

[0026] This application utilizes a capacitor design to precisely conduct the antenna's current path while blocking high-current loops. This not only optimizes the antenna's signal strength but also further isolates magnetic coupling interference. Such a solution is low-cost, easy to integrate, and effectively improves the reliability and usability of the tuning element 15.

[0027] Of course, it should be noted that in practical applications, the number of capacitors, their values, and their placement can be adjusted according to the corresponding antenna frequency band and the location of the gap 14, thereby enabling targeted tuning of antenna signals for different frequency bands. Furthermore, the specific structure of the tuning element 15 can be designed according to different application scenarios and user requirements. For example, inductors, resistors, LC resonant circuits, RC circuits, etc., can also be used as the tuning element 15. Therefore, this application does not impose any limitations on this.

[0028] In an optional embodiment, the first connection point 111 and the second connection point 112 are arranged at intervals along the first direction X, and the slit 14 extends along the second direction Y. The first direction X and the second direction Y intersect but are not parallel.

[0029] The design of the motherboard structure 1 in this application allows the gap 14 to be precisely positioned across the propagation path of the high-current loop, thereby significantly reducing magnetic coupling interference generated by the high-current loop and ensuring the stability and anti-interference capabilities of sensitive components such as speakers and cameras. This design also makes the layout of the motherboard structure 1 clearer, facilitating the design and production of the motherboard body 11.

[0030] In an optional embodiment, the fracture 14 includes at least two first fractures 141 and at least one second fracture 142, with the first fractures 141 extending along a second direction Y. A second fracture 142 is disposed between two adjacent first fractures 141, and the second fracture 142 communicates with both adjacent first fractures 141. At least a portion of the second fracture 142 protrudes relative to the first fracture 141 along a first direction X.

[0031] In practical application scenarios, such as Figure 2 As shown, the slit 14 can be simply designed as a straight line, which is simpler, more efficient in production, and easier to place the tuning element 15. However, the motherboard structure 1 of this application also incorporates a second slit 142 protruding along the first direction X on the slit 14, giving the slit 14 a laterally protruding structure. This design reduces the possibility of localized breakage of the motherboard body 11 due to an excessively long slit 14, effectively improving the reliability, practicality, and safety of the motherboard structure 1. Furthermore, the multi-segment structure of the slit 14 is more adaptable to complex motherboard layouts, enabling efficient isolation within limited space and effectively avoiding the installation space of other components.

[0032] Of course, the specific structure of the second fracture 142 can also be designed according to the actual working scenario and layout, for example, it can be designed as a triangular protrusion, a circular arch protrusion, a sawtooth protrusion, etc. This application does not impose any restrictions on this.

[0033] In such Figure 1 In the embodiment shown, the second fracture 142 includes a main segment 1421, a first bending segment 1422, and a second bending segment 1423; the two ends of the main segment 1421 are connected to two adjacent first fractures 141 through the first bending segment 1422 and the second bending segment 1423, respectively; wherein, the main segment 1421 extends along the second direction Y, and the first bending segment 1422 and the second bending segment 1423 extend along the first direction X.

[0034] As can be seen, in this embodiment, the second slit 142 is designed as a rectangular protrusion. This design ensures the overall continuity of the slit 14, thereby guaranteeing the blocking effect of the slit 14 on high-current circuits. Furthermore, this design also creates a tortuous shape, further reducing the risk of localized breakage of the motherboard. In addition, the rectangular space formed between the first bending segment 1422 and the second bending segment 1423 can better accommodate the mounting positions of other components, avoiding conflicts between the slit 14 and other components, and improving the layout flexibility and safety of the motherboard body 11.

[0035] In addition, the shape of the gap 14 can be adjusted according to the actual layout of the motherboard structure 1 and user needs, for example: Figure 3 As shown, the fracture 14 is arranged in a stepped shape and surrounds the first connection point 111. This design allows the fracture 14 to form a multi-stage tortuous shape, further improving the structural strength of the motherboard body 11, and also providing surrounding protection for sensitive components, blocking interference from multiple directions, making the protection of the fracture 14 more comprehensive. Alternatively, it can be as follows... Figure 4 As shown, the seam 14 is designed as an arc and surrounds the first connection point 111. This design makes the path of the seam 14 smoother, thus providing more accurate protection for the first electronic component 12, reducing local current concentration, and lowering the possibility of local magnetic coupling interference. Furthermore, the arc design avoids sharp corners, making the motherboard structure 1 easier to process and reducing stress, thereby improving the stability of the motherboard structure 1. Therefore, this application does not limit the specific structure of the seam 14.

[0036] In an optional embodiment, the motherboard structure 1 further includes a wire, one end of which is electrically connected to the motherboard body 11, and the other end of which crosses the gap 14 and is electrically connected to the first electronic component 12 or the second electronic component 13.

[0037] The design of the wires can prevent the gap 14 from completely blocking the power supply lines of each component. While ensuring the normal operation of sensitive components and high-current components, it also ensures the blocking effect of the gap 14 on magnetic coupling interference, thus ensuring the overall functional integrity of the motherboard structure 1.

[0038] The electronic device of this application includes the motherboard structure 1 as described above.

[0039] The electronic device of this application, through the design of motherboard structure 1, can cut off the grounding current generated by high-current components, thereby eliminating magnetic coupling interference around the speaker and camera, avoiding problems such as speaker noise and camera image quality degradation, and ensuring the operational stability of sensitive components. This design effectively improves the stability of the core functions of the electronic device, enhances the user experience, and strengthens its market competitiveness.

[0040] like Figure 5 As shown in the figure, taking the B41 band as an example, as indicated by the purple dotted line, when the motherboard structure 1 only has the gap 14 and no tuning element 15 is designed, the antenna signal of the B41 band will have an efficiency dip (as shown by label 3 in the figure), which will affect the radiation efficiency of the antenna. However, as shown by the light blue and green lines in the figure, when a 2pF capacitor and a 3pF capacitor are added at the gap 14 position respectively, the antenna signal efficiency dip of the B41 band can be tuned to the out-of-band of the B41 band (as shown by label 1 in the figure), thereby adjusting the radiation efficiency of the antenna signal to be comparable to the case without the gap (as shown by the red line in the figure), thus ensuring the signal strength and radiation efficiency of the antenna structure.

[0041] It should be noted that the technical solutions or features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A motherboard structure, characterized in that, include: The motherboard body includes a first connection point and a second connection point; A first electronic component, wherein the first electronic component is electrically connected to the first connection point; A second electronic component is electrically connected to the second connection point; the operating current of the second electronic component is greater than the operating current of the first electronic component. The motherboard body has a slit that extends through the motherboard body along the thickness direction of the motherboard structure and is located between the first connection point and the second connection point; the slit is used to cut off the ground return current generated by the second electronic component.

2. The motherboard structure according to claim 1, characterized in that, It also includes an antenna structure and a tuning element. The antenna structure is electrically connected to the motherboard near the first connection point, and the tuning element is connected across both sides of the gap to conduct the current path of the antenna structure.

3. The motherboard structure according to claim 2, characterized in that, The tuning element includes at least one capacitor, with its two ends electrically connected to both sides of the fracture.

4. The motherboard structure according to claim 1, characterized in that, The first connection point and the second connection point are arranged at intervals along the first direction, and the seam extends along the second direction. The first direction and the second direction intersect but are not parallel.

5. The motherboard structure according to claim 4, characterized in that, The fracture includes at least two first fractures and at least one second fracture, the first fractures extending along the second direction; a second fracture is disposed between two adjacent first fractures, the second fracture being connected to both adjacent first fractures; at least a portion of the second fracture protrudes relative to the first fracture along the first direction.

6. The motherboard structure according to claim 5, characterized in that, The second fracture includes a main segment, a first bending segment, and a second bending segment; the two ends of the main segment are connected to two adjacent first fractures through the first bending segment and the second bending segment, respectively; wherein the main segment extends along the second direction, and the first bending segment and the second bending segment extend along the first direction.

7. The motherboard structure according to claim 1, characterized in that, The fractures are arranged in a stepped pattern and surround the periphery of the first connection point.

8. The motherboard structure according to claim 1, characterized in that, The fracture is arc-shaped and surrounds the periphery of the first connection point.

9. The motherboard structure according to claim 1, characterized in that, The motherboard structure also includes a wire, one end of which is electrically connected to the motherboard body, and the other end of which crosses the gap and is electrically connected to the first electronic component or the second electronic component.

10. An electronic device, characterized in that, Includes the motherboard structure as described in any one of claims 1 to 9.

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