Micro rough laminate interface circuit board

Abstract

The utility model discloses a micro rough laminated interface circuit board, including top layer, the bottom of top layer is equipped with first prepreg board, the bottom of first prepreg board is equipped with circuit board core, the bottom of circuit board core is equipped with second prepreg board, the bottom of second prepreg board is equipped with ground layer, and both sides of top layer top are equipped with rough layer, and two connecting assemblies all include connecting column and length shell, and the one side of connecting column inner wall is fixedly connected with one end of length shell, and the other end of length shell is slidably connected with length rod, and one end of length rod is fixedly installed with the sliding block of sliding connection with connecting column, and one end of sliding block is fixedly installed with silica gel block, the utility model discloses micro rough laminated interface circuit board, and the wire connected with circuit board is orderly arranged in first row groove or second row groove through the setting micro rough board, avoids appearing the partial temperature exceeding the bearing range of insulating material, leads to appearing accelerated aging even causes the fire phenomenon, prolongs the service life of circuit board.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a micro-roughened laminated interface circuit board. Background Technology

[0002] The independent ground plane of a laminated interface circuit board can effectively control the signal return path, reduce the loop area to reduce electromagnetic interference (EMI), and the capacitive effect formed by the power plane and ground plane can also filter out power supply noise. For example, after a certain industrial control PLC adopted a four-layer board, the EMI value of the signal dropped from 30dB to 25dB, which meets the industrial EMC standard. Compared with a two-layer board, a four-layer board can increase the wiring density by more than 60% through three-dimensional wiring. For example, after a certain microcontroller development board was changed to a four-layer board, no jumpers were needed, the component layout was more compact, the board area was significantly reduced, the independent ground plane reduced signal transmission loss, and the stable power supply of the power plane avoided signal distortion caused by voltage drops.

[0003] However, traditional circuit boards have the following drawbacks:

[0004] In traditional circuit board use, the wires connected to it are stacked haphazardly on one side. The stacked wires have poor heat dissipation, which may cause the local temperature to exceed the insulation material's tolerance range, accelerate aging, or even cause a fire. Utility Model Content

[0005] The purpose of this invention is to provide a micro-rough laminated interface circuit board to solve the problem mentioned in the background art, where the wires connected to the traditional circuit board are messily stacked on one side, resulting in poor heat dissipation of the stacked wires, which may cause the local temperature to exceed the tolerance range of the insulating material, accelerate aging, or even cause a fire.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a micro-roughened laminated interface circuit board, comprising a top layer, a first prepreg plate at the bottom of the top layer, a circuit board core at the bottom of the first prepreg plate, a second prepreg plate at the bottom of the circuit board core, a grounding layer at the bottom of the second prepreg plate, and roughened layers on both sides of the top of the top layer. The roughened layers include a micro-roughened plate and two connecting components. The two sides of the bottom of the micro-roughened plate are respectively fixedly connected to the top of the two connecting components. Each of the two connecting components includes a connecting post and a length shell. One side of the inner wall of the connecting post is fixedly connected to one end of the length shell. A length rod is slidably connected to the other end of the length shell. A sliding block that is slidably connected to the connecting post is fixedly installed at one end of the length rod. A silicone block is fixedly installed at one end of the sliding block.

[0007] Preferably, a micro spring is fixedly installed on the surface of the sliding block. One end of the micro spring is fixedly connected to the side of the connecting post opposite to it. The connecting post is inserted into the connecting groove. The silicone block squeezes the sliding block to slide, so that the length rod slides relative to the length shell. The sliding block squeezes the micro spring, and the micro spring undergoes elastic deformation to buffer the squeezing force, so that the silicone block is tightly attached to the connecting groove to complete the assembly.

[0008] Preferably, the top of the top layer has four connecting grooves at its four corners, and the four connecting grooves are respectively set to correspond to four connecting posts. The rough layer is installed in the connecting grooves through the connecting posts.

[0009] Preferably, the top of the micro-roughened plate has a plurality of first wiring slots, and the wires connected to the circuit board can be arranged in an orderly manner in the first wiring slots. The installation of the first wiring slots increases the unevenness of the circuit board surface, making it easier for users to pick up the circuit board.

[0010] Preferably, the side of the micro-roughened plate has a plurality of second wire slots, and the wires connected to the circuit board can be arranged in an orderly manner in the second wire slots.

[0011] Preferably, slots are provided at the four corners of the top of the first prepreg plate, the four corners of the bottom of the first prepreg plate, the four corners of the top of the second prepreg plate, and the four corners of the bottom of the second prepreg plate.

[0012] Preferably, four corners at the bottom of the top layer, four corners at the top of the circuit board core, four corners at the bottom of the circuit board core, and four corners at the top of the ground layer are all fixedly installed with card blocks. The sixteen card slots are respectively set with sixteen card blocks, and the boards are assembled together by the card blocks and card slots.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] By setting a micro-roughened plate, the wires connected to the circuit board are arranged in an orderly manner in the first or second row of wire slots, which avoids local temperature exceeding the insulation material's tolerance range, thus preventing accelerated aging or even fires and extending the lifespan of the circuit board. Attached Figure Description

[0015] Figure 1 This is a perspective view of the present utility model;

[0016] Figure 2 This is a side view of the rough layer of this utility model;

[0017] Figure 3 This is a side view of the micro-roughened plate of this utility model;

[0018] Figure 4 This is a cross-sectional view of the connecting component of this utility model;

[0019] Figure 5 This is a side view of the connecting component of this utility model.

[0020] In the diagram: 1. Top layer; 2. First prepreg board; 3. Circuit board core; 4. Second prepreg board; 5. Grounding layer; 6. Connecting groove; 7. Rough layer; 71. Micro-roughened plate; 72. Connecting assembly; 721. Connecting post; 722. Length shell; 723. Miniature spring; 724. Length rod; 725. Sliding block; 726. Silicone block; 73. First ribbon cable groove; 74. Second ribbon cable groove; 8. Card slot; 9. Card block. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0022] Please see Figure 1-5 This utility model provides a micro-roughened laminated interface circuit board, including a top layer 1, a first prepreg plate 2 at the bottom of the top layer 1, a circuit board core 3 at the bottom of the first prepreg plate 2, a second prepreg plate 4 at the bottom of the circuit board core 3, a grounding layer 5 at the bottom of the second prepreg plate 4, and roughening layers 7 on both sides of the top of the top layer 1. The roughening layer 7 includes a micro-roughened plate 71 and two connecting components 72. The two sides of the bottom of the micro-roughened plate 71 are fixedly connected to the top of the two connecting components 72 respectively. Each connecting component 72 includes a connecting post 721 and a length shell 722. One side of the inner wall of the connecting post 721 is fixedly connected to one end of the length shell 722. The other end of the length shell 722 is slidably connected to a length rod 724. One end of the length rod 724 is fixedly installed with a sliding block 725 that is slidably connected to the connecting post 721. One end of the sliding block 725 is fixedly installed with a silicone block 726.

[0023] A miniature spring 723 is fixedly installed on the surface of the sliding block 725. One end of the miniature spring 723 is fixedly connected to the side of the connecting post 721 opposite to it. The connecting post 721 is inserted into the connecting groove 6. The silicone block 726 squeezes the sliding block 725 to slide, so that the length rod 724 slides relative to the length shell 722. The sliding block 725 squeezes the miniature spring 723, and the miniature spring 723 undergoes elastic deformation to buffer the squeezing force, so that the silicone block 726 is tightly attached to the connecting groove 6 to complete the assembly.

[0024] The top layer 1 has four connecting grooves 6 at its four corners. The four connecting grooves 6 are respectively set with four connecting posts 721. The rough layer 7 is installed in the connecting grooves 6 through the connecting posts 721.

[0025] The top of the micro-roughened board 71 has several first wiring slots 73. The wires connected to the circuit board can be arranged in an orderly manner in the first wiring slots 73. The installation of the first wiring slots 73 increases the unevenness of the circuit board surface, making it easier for users to pick up the circuit board.

[0026] The side of the micro-roughened board 71 has several second wiring slots 74, and the wires connected to the circuit board can be arranged in an orderly manner in the second wiring slots 74.

[0027] The four corners at the top and bottom of the first prepreg plate 2, the four corners at the top and bottom of the second prepreg plate 4, and the four corners at the bottom of the second prepreg plate 4 are all provided with slots 8.

[0028] Card blocks 9 are fixedly installed at the four corners of the bottom of the top layer 1, the four corners of the top of the circuit board core 3, the four corners of the bottom of the circuit board core 3, and the four corners of the top of the grounding layer 5. Sixteen card slots 8 are respectively set with sixteen card blocks 9. The boards are assembled together by card blocks 9 and card slots 8.

[0029] In this embodiment of the application, when in use: the connecting post 721 is inserted into the connecting groove 6, the silicone block 726 presses the sliding block 725 to slide, so that the length rod 724 slides relative to the length shell 722, the sliding block 725 presses the micro spring 723, the micro spring 723 undergoes elastic deformation to buffer the pressing force, so that the silicone block 726 is tightly attached to the connecting groove 6 to complete the assembly. The installation of the first wire slot 73 increases the unevenness of the circuit board surface, making it easier for the user to pick up the circuit board. The wires connected to the circuit board can be arranged in an orderly manner in the second wire slot 74, or the wires connected to the circuit board can be arranged in an orderly manner in the first wire slot 73.

[0030] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A micro-roughened laminated interface circuit board, comprising a top layer (1), characterized in that: The bottom end of the top layer (1) is provided with a first prepreg plate (2), the bottom end of the first prepreg plate (2) is provided with a circuit board core (3), the bottom end of the circuit board core (3) is provided with a second prepreg plate (4), the bottom end of the second prepreg plate (4) is provided with a grounding layer (5), and both sides of the top end of the top layer (1) are provided with roughening layers (7), the roughening layer (7) includes a micro-roughening plate (71) and two connecting components (72), the bottom ends of the micro-roughening plate (71) are respectively connected to the two connecting components (72). 2) The top end is fixedly connected. Both of the connecting components (72) include a connecting post (721) and a length shell (722). One side of the inner wall of the connecting post (721) is fixedly connected to one end of the length shell (722). The other end of the length shell (722) is slidably connected to a length rod (724). One end of the length rod (724) is fixedly installed with a sliding block (725) that is slidably connected to the connecting post (721). One end of the sliding block (725) is fixedly installed with a silicone block (726).

2. The micro-roughened laminated interface circuit board according to claim 1, characterized in that: A miniature spring (723) is fixedly installed on the surface of the sliding block (725), and one end of the miniature spring (723) is fixedly connected to the side of the connecting post (721) opposite to it.

3. The micro-roughened laminated interface circuit board according to claim 1, characterized in that: The top layer (1) has four connecting grooves (6) at its four corners, and the four connecting grooves (6) are respectively set to correspond to the four connecting posts (721).

4. The micro-roughened laminated interface circuit board according to claim 1, characterized in that: The top of the micro-roughened plate (71) has several first wiring grooves (73).

5. The micro-roughened laminated interface circuit board according to claim 1, characterized in that: The side of the micro-roughened plate (71) is provided with several second row grooves (74).

6. The micro-roughened laminated interface circuit board according to claim 1, characterized in that: The four corners at the top of the first prepreg plate (2), the four corners at the bottom of the first prepreg plate (2), the four corners at the top of the second prepreg plate (4), and the four corners at the bottom of the second prepreg plate (4) are all provided with slots (8).

7. The micro-roughened laminated interface circuit board according to claim 6, characterized in that: The four corners at the bottom of the top layer (1), the four corners at the top of the circuit board core (3), the four corners at the bottom of the circuit board core (3), and the four corners at the top of the ground layer (5) are all fixedly installed with card blocks (9), and the sixteen card slots (8) are respectively set with the sixteen card blocks (9).

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