A printed wiring board assembly

Abstract

The utility model discloses a kind of printed wiring board assemblies, it is related to printed wiring technical field, printed wiring board assembly includes additive printed wiring board, electronic component and protective film.Additive printed wiring board includes carrier plate and the conductive circuit on the surface of the carrier plate;Electronic component is located on the surface of the carrier plate, and is electrically connected with the conductive circuit;Protective film is adhered with the additive printed wiring board, and covers part or all of the electronic component, the protective film exerts the compacting force of the electronic component towards the side where the additive printed wiring board is located.Protective film can play the role of auxiliary fixation electronic component, make electronic component and additive printed wiring board tightly combined, to improve the firmness of electronic component and additive printed wiring board connection and the reliability of printed wiring board assembly use.Meanwhile, when covering electronic component, protective film also covers conductive circuit, to protect conductive circuit and electronic component.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit technology, and in particular to a printed circuit board assembly. Background Technology

[0002] A printed circuit board assembly (PCBA) includes a printed circuit board (PCB) and electronic components mounted on the PCB. The electronic components can be soldered to the additive printed circuit board using SMT processes or bonded to it using conductive adhesive.

[0003] Some printed circuit boards (PCBs) have conductive lines on their surface manufactured using additive manufacturing processes, and can be called additive printed circuit boards (PCBs). The conductive lines on their surface are formed through additive processes such as printing, inkjet printing, 3D printing, laser deposition, chemical plating, or electroplating. They do not require traditional etching processes and have the advantages of high material utilization, environmentally friendly processes, and suitability for complex structures and flexible designs.

[0004] However, the bonding strength between the conductive lines on the additive printed circuit board and the carrier board (or substrate) is lower than that of FPCs and PCBs produced by ordinary etching. The bonding strength between electronic components and conductive lines is also weaker, which can easily lead to poor bonding between electronic components and printed circuit boards. Therefore, it is necessary to apply adhesive to connect electronic components and additive printed circuit boards to improve the connection strength between the two.

[0005] While adhesive dispensing can increase the bond strength between electronic components and additive printed circuit boards (PCBs) to some extent, the adhesion still needs further improvement, especially when the PCB is a flexible circuit board. Bending can cause the connection between the electronic components and the printed circuitry to crack, affecting the reliability of the PCB assembly. Furthermore, due to the thinness of the conductive lines, internal microcracks are prone to occur, causing defects, particularly on flexible circuit boards, which are more susceptible to internal microcracks after bending, further impacting the reliable use of the PCB assembly.

[0006] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects.

[0007] The above content is only used to help understand the technical solution of this application and does not constitute an admission that the above is prior art. Utility Model Content

[0008] The purpose of this invention is to provide a printed circuit board assembly to increase the robustness of the connection between electronic components and printed circuit boards.

[0009] To achieve the above-mentioned objectives, this utility model proposes a printed circuit board assembly, comprising:

[0010] An additively printed circuit board, comprising a carrier board and conductive lines located on the surface of the carrier board;

[0011] Electronic components are disposed on the surface of the carrier board and electrically connected to the conductive lines; and,

[0012] A protective film is adhered to the additive printed circuit board and covers part or all of the electronic components. The protective film applies a pressing force to the electronic components toward the side where the additive printed circuit board is located.

[0013] Furthermore, the protective film is adhered to the carrier plate; or, the surface of the carrier plate is provided with a protective layer covering the conductive lines, the protective layer is provided with clearance holes for the electronic components to be exposed, and the protective film is adhered to the protective layer.

[0014] Furthermore, the protective film tightly wraps around the outside of the electronic components.

[0015] Furthermore, an adhesive layer is provided on the side of the protective film facing the additive printed circuit board, and the adhesive layer is a thermosetting adhesive or a pressure-sensitive adhesive.

[0016] Furthermore, the protective film and / or the additive printed circuit board have a through-venting passage at a position corresponding to the blank area of ​​the additive printed circuit board.

[0017] Furthermore, the exhaust passage is slit-shaped or perforated.

[0018] Furthermore, at least one of the electronic components is provided with at least one exhaust passage at a distance not exceeding 20 mm from it; or, each of the electronic components is provided with at least one exhaust passage at a distance not exceeding 20 mm from it.

[0019] The distance between the exhaust passage and the electronic components and the conductive lines shall not exceed 10 mm.

[0020] Furthermore, the printed circuit board assembly includes a sealant that seals the venting passage.

[0021] Furthermore, a filler material is disposed between the outer periphery of the electronic component and the surface of the additive printed circuit board, the filler material surrounding the outer periphery of the electronic component, and the protective film simultaneously covering the filler material.

[0022] Furthermore, the carrier plate is a rigid plate or a flexible membrane material with a thickness of not less than 15 micrometers.

[0023] Furthermore, at least one of the electronic components is a light-emitting device;

[0024] The protective film is doped with light-diffusing powder at least at the position corresponding to the light-emitting device; and / or;

[0025] The protective film is provided with an optical lens at least at a position corresponding to the light-emitting device; and / or,

[0026] The protective film has a phosphor layer at least at the position corresponding to the light-emitting device.

[0027] Compared with the prior art, the present invention has the following beneficial effects: According to some embodiments of the present invention, the printed circuit board assembly includes an additive printed circuit board, electronic components, and a protective film. The additive printed circuit board includes a carrier board and conductive lines located on the surface of the carrier board; electronic components are disposed on the surface of the carrier board and electrically connected to the conductive lines; the protective film is adhered to the additive printed circuit board and covers part or all of the electronic components, and the protective film applies a pressing force to the electronic components toward the side where the additive printed circuit board is located. Since the protective film covers the outside of the electronic components and presses the electronic components firmly onto the surface of the additive printed circuit board, it can play a role in assisting in fixing the electronic components, making the electronic components and the additive printed circuit board tightly bonded, thereby improving the firmness of the connection between the electronic components and the additive printed circuit board and the reliability of the printed circuit board assembly. At the same time, when the protective film covers the electronic components, it also covers the conductive lines, thereby making the bond between the conductive lines and the carrier board more firm. In addition, the protective film can also protect the conductive lines and electronic components on the surface of the additive printed circuit board. Attached Figure Description

[0028] Figure 1 This is a cross-sectional schematic diagram of a printed circuit board assembly according to some embodiments of the present invention.

[0029] Figure 2 This is a cross-sectional schematic diagram of a printed circuit board assembly according to some embodiments of the present invention. In the figure, the additive printed circuit board is provided with a protective layer.

[0030] Figure 3 This is a cross-sectional schematic diagram of a printed circuit board assembly according to some embodiments of the present invention. In the figure, the additive printed circuit board is provided with an exhaust passage.

[0031] Figure 4 This is a cross-sectional schematic diagram of a printed circuit board assembly according to some embodiments of the present invention. In the figure, the protective film is provided with an exhaust passage.

[0032] Figure 5 This is a schematic diagram showing the positions of the exhaust passage, electronic components, and conductive lines in some embodiments of this utility model.

[0033] Figure 6This is a schematic diagram showing the positions of the exhaust passage, electronic components, and conductive lines in some embodiments of this utility model.

[0034] Figure 7 yes Figure 4 The diagram shown illustrates the structure where the exhaust passage is filled with sealant.

[0035] Figure 8 This is a cross-sectional schematic diagram of a printed circuit board assembly according to some embodiments of the present invention. In the figure, the electronic components are surrounded by a filling material.

[0036] Figure 9 This is a cross-sectional schematic diagram of a printed circuit board assembly according to some embodiments of the present invention. In the figure, the protective film is provided with an optical lens.

[0037] Figure 10 This is a cross-sectional schematic diagram of a printed circuit board assembly according to some embodiments of the present invention. In the figure, the protective film is provided with a phosphor layer.

[0038] Figure 11 This is a schematic diagram of an additive printed circuit board with electronic components on its surface, according to some embodiments of this utility model.

[0039] Figure 12 This is a schematic diagram of the pressure head pressing the protective film onto the additive printed circuit board in some embodiments of this utility model.

[0040] Figure 13 yes Figure 12 The diagram shows the pressure head after it has been pressed against the additively printed circuit board.

[0041] Figure 14 yes Figure 8 The diagram shown is a schematic of the exhaust passage after it has been filled with sealant in the embodiment shown. Detailed Implementation

[0042] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0043] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0044] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0045] like Figure 1 As shown, some embodiments of this utility model propose a printed circuit board assembly, which includes an additive printed circuit board 1, electronic components 3, and a protective film 2.

[0046] The additive printed circuit board 1 includes a carrier board 10 and conductive lines 11 located on the surface of the carrier board 10. Electronic components 3 are disposed on the surface of the carrier board 10 and are electrically connected to the conductive lines 11. The two can be connected, for example, by soldering. It is understood that the additive printed circuit board 1 can be manufactured using existing processes, and the connection between the electronic components 3 and the additive printed circuit board 1 is also a mature process of existing technology, such as the connection through SMT process.

[0047] The protective film 2 is adhered to the additive printed circuit board 1 and covers at least a portion of the electronic components 3. The protective film 2 exerts a pressing force on the electronic components 3 toward the side where the additive printed circuit board 1 is located. The electronic components 3 may be, for example, resistors, capacitors, inductors, potentiometers, electron tubes, processor chips, LED chips, etc.

[0048] Since the protective film 2 covers the outside of the electronic component 3 and presses the electronic component 3 firmly onto the surface of the additive printed circuit board 1, it can help fix the electronic component 3, making the electronic component and the additive printed circuit board 1 tightly bonded, thereby improving the strength of the connection between the electronic component 3 and the additive printed circuit board 1 and the reliability of the printed circuit board assembly. At the same time, when covering the electronic component 3, the protective film 2 also covers the conductive lines 11, making the bond between the conductive lines 11 and the carrier board 10 more secure. In addition, the protective film can also protect the conductive lines 11 and the electronic component 3 on the surface of the additive printed circuit board 1.

[0049] Understandably, when the printed circuit board assembly is bent, the carrier board 10 and the protective film 2 are subjected to force simultaneously, and the conductive lines 11 are pressed on the carrier board 10, and the electronic components 3 are pressed on the conductive lines 11. Therefore, the risk of microcracks in the conductive lines 11 and the risk of cracks at the connection between the electronic components 3 and the conductive lines 11 can be reduced. In addition, even if microcracks occur in the conductive lines 11, the printed circuit board assembly can usually still work normally because the electronic components 3 and the conductive lines 11 can maintain contact more reliably, thus improving the reliability of use.

[0050] It is understandable that the protective film 2 can cover only a portion of the electronic components 3, or cover all of the electronic components 3, as needed. Additionally, the protective film 2 can cover only a portion of the conductive lines 11, or cover all of the conductive lines 11, as needed.

[0051] In some embodiments, such as Figure 1 As shown, the protective film 2 is directly bonded to the carrier plate 10. In other embodiments, the surface of the carrier plate 10 is further provided with other layers, and the protective film 2 is in contact with these other layers. Figure 2 As shown, the additive printed circuit board 1 also includes a protective layer 12 disposed on the surface of the carrier board 10 and covering the conductive lines 11. The protective layer 12 protects the conductive lines 11 and has clearance holes 120 for exposing electronic components 3. The protective film 2 is adhered to the protective layer 12 and covers the electronic components 3. This provides better protection.

[0052] In some embodiments, the protective film 2 tightly wraps around the electronic component 3, with no residual air between them. When residual air is present, air bubbles form. The air trapped in these bubbles reduces the adhesion between the protective film 2 and the additive printed circuit board 1, causing oxidation of the printed circuit. If moisture remains in the air bubbles, it can also lead to malfunctions of the circuit board. Ensuring the protective film 2 tightly wraps around the electronic component 3 improves the adhesion between the protective film 2 and the additive printed circuit board 1, and extends the lifespan of the printed circuit board assembly.

[0053] It is understandable that the pressing force exerted by the protective film 2 on the electronic components 3 and the conductive lines 11 comes from the elastic force generated by its own deformation, and from the adhesive force between the protective film 2 and the additive printed circuit board 1.

[0054] like Figure 1As shown, an adhesive layer 20 is provided on the side of the protective film 2 facing the additive printed circuit board 1, and the adhesive layer 20 adheres to the additive printed circuit board 1. In some embodiments, the adhesive layer 20 is a thermosetting adhesive, which can be reliably bonded to the additive printed circuit board 1 by pressing the protective film 2 firmly onto the surface of the additive printed circuit board 1 and heating it. In other embodiments, the adhesive layer 20 is a pressure-sensitive adhesive, which allows the protective film 2 to adhere to the additive printed circuit board 1 under pressure.

[0055] In some embodiments, the protective film 2 and / or the additive printed circuit board 1 are provided with a through exhaust passage 100 at a position corresponding to the blank area of ​​the additive printed circuit board 1. The surface of the blank area of ​​the additive printed circuit board 1 is not provided with conductive lines 11 and electronic components 3. Therefore, opening the exhaust passage 100 will not affect the conductive lines 11 and electronic components 3. Figure 3 A schematic diagram is shown of an additive printed circuit board 1 with an exhaust passage 100. Figure 4 A schematic diagram is shown when the protective film 2 has an exhaust passage. Figure 5 and Figure 6 A schematic diagram showing the positions of the exhaust passage 100, electronic components 3, and conductive lines 11 is provided.

[0056] When the protective film 2 is pressed against the surface of the additive printed circuit board 1, gas can be discharged from the exhaust passage 100, which helps to expel the air between the protective film 2 and the additive printed circuit board 1, so that the protective film 2 tightly covers the electronic components 3 and the surface of the additive printed circuit board 1. Obviously, the exhaust passage 100 penetrates both surfaces of the protective film 2 (including the adhesive layer 20).

[0057] The shape of the exhaust passage 100 is not limited; for example, it can be a hole, such as a round hole, a square hole, or other shapes.

[0058] Optionally, the exhaust passage 100 is disposed on the protective film 2 to reduce the decrease in structural strength of the additive printed circuit board 1 caused by opening holes in the additive printed circuit board 1, thereby affecting its service life. At the same time, since the protective film 2 is elastic, the cross-sectional area of ​​the exhaust passage 100 will become smaller when it is squeezed, thereby further enhancing the protective effect of the protective film 2 and improving the service life of the additive printed circuit board 1.

[0059] When the exhaust passage 100 is disposed on the protective film 2, optionally, such as Figure 6As shown, the exhaust passage 100 is configured as a slit, that is, the exhaust passage 100 is a narrow strip with a small width. Because the protective film 2 is elastic, after the protective film 2 is adhered to the additive printed circuit board 1, the exhaust passage 100 can be significantly reduced or even closed, thereby preventing external air from contacting the additive printed circuit board 1 through the exhaust passage 100, further enhancing the protective effect of the protective film 2 and improving the service life of the additive printed circuit board 1. Optionally, by controlling the shape and size of the exhaust passage 100, it can be made to close after the protective film 2 is connected to the additive printed circuit board 1. Parameters such as shape and size can be adjusted according to parameters such as the thickness and extensibility of the protective film 2.

[0060] Optional, see reference Figure 7 The printed circuit board assembly also includes a sealant 101 that seals the vent passage 100 to improve the sealing performance of the protective film 2. This reduces the adverse effects of the external environment on the conductive line 11, even if the vent passage 100 is located on or close to the conductive line 11. It is understood that if the vent passage 100 can close automatically, the sealant may not be necessary, thus reducing processing steps and costs.

[0061] In some embodiments, at least one electronic component 3 is provided with at least one exhaust passage 100 at a distance not exceeding 20 mm, so that air near the electronic component 3 can be reliably discharged from the exhaust passage 100. It is understood that since the electronic component 3 protrudes from the surface of the additive printed circuit board 1, air is more likely to accumulate near the electronic component 3, forming a bubble area. Providing an exhaust passage 100 within 20 mm helps reduce the risk of a bubble area existing between the protective film 2 and the additive printed circuit board 1 near the electronic component 3. Optionally, all electronic components 3 are provided with at least one exhaust passage 100 at a distance not exceeding 20 mm.

[0062] Optionally, the distance between the exhaust passage 100 and the electronic components 3 and the conductive lines 11 is not less than 10mm, so as to prevent oxidation and material failure caused by air leakage during subsequent use due to the close proximity of the exhaust passage 100 to the electronic components 3 and the conductive lines 11, thereby improving the service life and reliability of the printed circuit board assembly.

[0063] The distance between electronic component 3 and conductive line 11 and exhaust passage 100 refers to the shortest distance D between them.

[0064] In some embodiments, such as Figure 2 and Figure 8As shown, a filler material 4 is disposed between the outer periphery of the electronic component 3 and the surface of the additive printed circuit board 1. The filler material 4 surrounds the outside of the electronic component 3, making the transition between the electronic component 3 and the additive printed circuit board 1 smoother and reducing the steepness of the electronic component 3. This further reduces the risk of residual air bubbles near the electronic component 3 between the protective film 2 and the additive printed circuit board 1. In addition, the filler material 4 can also improve the adhesion between the electronic component 3 and the additive printed circuit board 1. Optionally, the filler material 4 is a reinforcing adhesive.

[0065] The additively printed circuit board 1 can be a rigid circuit board or a flexible circuit board. The higher the rigidity and the thicker the additively printed circuit board 1, the less deformation occurs during the bonding and curing process of the protective film 2. This results in a flatter additively printed circuit board 1 and lower deformation of the conductive lines 11, thus improving the overall functional reliability of the circuit. Optionally, when the additively printed circuit board 1 is a flexible circuit board, its thickness is not less than 15 micrometers; further optionally, the thickness is not less than 35 micrometers.

[0066] Optionally, the carrier plate 10 may be made of PET (polyethylene terephthalate), PI (polyimide), CPI (transparent polyimide), or PEN (polyethylene naphthalate).

[0067] In some embodiments, at least one electronic component 3 is a light-emitting device 30, such as an LED chip. The protective film 2 may be made of a transparent material so that the light emitted by the light-emitting device 30 can be emitted.

[0068] The protective film 2 can be processed to alter or improve the optical characteristics of the light-emitting device 30. In some embodiments, the protective film 2 is doped with light-diffusing powder at least at the position corresponding to the light-emitting device 30 to expand the light-emitting surface. In other embodiments, secondary optical design is performed on the protective film 2 at least at the position corresponding to the light-emitting device 30 using methods such as nanoimprinting to change the light emission pattern of the optical device, for example, as... Figure 9 As shown, an optical lens 21 is disposed on the protective film 2 at least at a position corresponding to the light-emitting device 30. In some other embodiments, such as Figure 10 As shown, the protective film 2 has a phosphor layer 22 at least at the position corresponding to the light-emitting device 30, so as to change the color of the light emitted by the light-emitting device 30. For example, the light-emitting device 30 is a blue LED chip, and the phosphor layer 22 includes yellow phosphor, so that the light emitted by the light-emitting device 30 is changed to white.

[0069] It is understandable that the above-mentioned optical feature modification schemes can be used in combination, for example, by simultaneously setting two or three of the light diffusing powder, optical lens 21 and phosphor layer 22.

[0070] It is understood that the above-mentioned optical feature modification scheme can be set only at the position corresponding to the protective film 2 and the light-emitting device 30, or it can be set on the entire protective film 2. For example, the entire protective film 2 is doped with light-diffusing powder, or the entire protective film 2 is provided with optical lenses, or the entire protective film 2 is provided with phosphor layers.

[0071] Understandably, although Figure 9 and Figure 10 In the protective film 2, the optical lens 21 and the phosphor layer 22 are located on the outside of the protective film 2, but they can also be located on the inside of the optical lens 21 to protect the optical lens 21 and the phosphor layer 22.

[0072] The protective film 2 is elastic, and its material can be insulating film materials such as PET or PI. The protective film 2 will shrink to a certain extent after being heated, which is beneficial for better and tighter wrapping of the device and generating pre-pressure on the device. Further optionally, the protective film 2 is a heat shrink film, such as PE shrink film, PVC shrink film, POF shrink film, OPS shrink film, or PET shrink film, which has high puncture resistance, good shrinkage and certain shrinkage stress, thereby providing pre-pressure for electronic components 3 and conductive lines 11 more reliably.

[0073] It is understood that the protective film 2 can be provided only on one side of the additive printed circuit board 1, or it can be provided on both sides of the additive printed circuit board 1. In some embodiments, the additive printed circuit board 1 has electronic components 3 on both sides, and providing the protective film 2 on both sides can protect the electronic components 3 on both sides. In other embodiments, the additive printed circuit board 1 has electronic components 3 on only one side. In this case, providing the protective film 2 on both sides can also increase the overall service life.

[0074] Some embodiments of this utility model propose a method for preparing a printed circuit board assembly, characterized by comprising the following steps:

[0075] S1. As Figure 11 As shown, an additive printed circuit board 1 with electronic components 3 mounted on its surface is provided. The additive printed circuit board 1 includes a carrier board 10 and conductive lines 11 located on the surface of the carrier board 10.

[0076] S2. For example Figure 12 and Figure 13 As shown, a protective film 2 is attached to the surface of the additive printed circuit board 1, so that the protective film 2 adheres to the additive printed circuit board 1 and covers the electronic components 3. The protective film 2 applies a pressing force to the electronic components 3 toward the side where the additive printed circuit board 1 is located.

[0077] In some embodiments, the protective film 2 is provided with an adhesive layer 20 on the side facing the additive printed circuit board 1, the adhesive layer 20 being, for example, a thermosetting adhesive or a pressure-sensitive adhesive.

[0078] Optionally, in step S2, the step of attaching the protective film 2 to the surface of the additive printed circuit board 1 includes:

[0079] like Figure 12 and Figure 13 As shown, the protective film 2 is pressed onto the additive printed circuit board 1 by the pressure head 5, and the pressure head 5 has a soft layer 50 that contacts the protective film 2.

[0080] Because the pressure head 5 is equipped with a soft layer 50, when the protective film 2 is pressed onto the surface of the additive printed circuit board 1, the soft layer 50 will indent inward, forming a space to cover the electronic components 3, thereby allowing the protective film 2 to tightly cover the outside of the electronic components 3. At the same time, the protective film 2 has a certain degree of elastic deformation. After the external force is removed, the protective film 2 exerts a force on the electronic components 3 towards the additive printed circuit board 1 through its own elasticity, thereby improving the reliability of the bonding between the electronic components 3 and the additive printed circuit board 1.

[0081] It is understandable that when laminating the protective film 2, the reliability of the connection can be improved based on the characteristics of the adhesive layer 20. For example, in some embodiments, the adhesive layer 20 is a thermosetting adhesive. In this case, it can be held at a preset temperature for a preset time to attach the protective film 2 to the surface of the additive printed circuit board 1. The specific values ​​of the preset temperature and preset time can be determined based on the properties of the adhesive layer 20 made of different materials.

[0082] It is understandable that the reliability and sufficiency of air expulsion during the lamination of the protective film 2 can be improved by the methods described above, thereby ensuring the quality of the printed circuit board assembly.

[0083] In some embodiments, step S1 further includes the following step: providing a filler material 4 between the outer periphery of the electronic component 3 and the additive printed circuit board 1. For example, the filler material 4 can be provided by dispensing, and the filler material 4 can be rapidly cured by heating or UV irradiation. It is understood that in step S2, the protective film 2 will simultaneously coat the filler material 4, and the filler material 4 fills the gap between the electronic component 3 and the additive printed circuit board 1, effectively reducing the formation of air bubbles. Optionally, the filler material 4 is a reinforcing adhesive.

[0084] In some embodiments, in order to better cover the electronic components 3 with the protective film 2, the additive printed circuit board 1 is provided with an exhaust channel 100, and the exhaust channel 100 is connected to a negative pressure generating device to exhaust the air between the protective film 2 and the additive printed circuit board 1 by vacuuming.

[0085] In some embodiments, the method for preparing a printed circuit board assembly further includes the following step: S3. Identifying the bubble areas of the printed circuit board assembly, then puncturing the portion of the protective film 2 corresponding to the bubble areas, and pressing the portion of the protective film 2 corresponding to the bubble areas to expel the air in the bubble areas. It is understood that the bubble areas can be punctured with a sharp object to reduce the opening and ensure sealing after pressing. Optionally, after expelling the air from the bubble areas, sealant is applied to seal the punctured portions. By expelling the air from the bubble areas one by one and sealing them, the airtightness between the entire protective film 2 and the additive printed circuit board 1 can be improved.

[0086] In some embodiments, the method for preparing a printed circuit board assembly further includes the following step after step S2: filling the venting passage 100 with sealant to isolate external air; sealant 101 can be applied to the surface of the protective film 2 to allow the sealant to penetrate into the venting passage 100; and sealing is achieved after curing. (Refer to...) Figure 14 When applying sealant 101, it can be applied to the entire surface or to specific areas.

[0087] In some embodiments, at least one electronic component 3 is a light-emitting device 30. The method for fabricating the printed circuit board assembly further includes the following steps: depositing an optical lens 21 and / or a phosphor layer 22 on the surface of the protective film 2 corresponding to the position of the light-emitting device 30, to alter the optical characteristics of the light emitted by the light-emitting device 30. In some embodiments, the protective film 2 is doped with light-diffusing powder at least at the position corresponding to the light-emitting device 30.

[0088] It is understood that the above-described method for preparing printed circuit board components can be used to prepare the printed circuit board components described above. For a more detailed description of the printed circuit board components, please refer to the above text, which will not be repeated here.

[0089] It should be noted that, in the absence of conflict, the various embodiments described herein can be combined with each other to obtain more implementation schemes.

[0090] The above are merely specific embodiments of this utility model. Any improvements made based on the concept of this utility model shall be considered within the scope of protection of this utility model.

Claims

1. A printed circuit board assembly, characterized in that, include: The additive printed circuit board (1) includes a carrier board (10) and conductive lines (11) located on the surface of the carrier board (10). Electronic components (3) are disposed on the surface of the carrier plate (10) and electrically connected to the conductive lines (11); and, A protective film (2) is adhered to the additive printed circuit board (1) and covers part or all of the electronic components (3). The protective film (2) applies a pressing force to the electronic components (3) toward the side where the additive printed circuit board (1) is located.

2. The printed circuit board assembly as described in claim 1, characterized in that, The protective film (2) is bonded to the carrier plate (10); or, the surface of the carrier plate (10) is provided with a protective layer (12) covering the conductive line (11), the protective layer (12) is provided with a clearance hole (120) for the electronic component (3) to be exposed, and the protective film (2) is bonded to the protective layer (12).

3. The printed circuit board assembly as described in claim 1, characterized in that, The protective film (2) tightly wraps around the outside of the electronic component (3).

4. The printed circuit board assembly as described in claim 3, characterized in that, The protective film (2) has an adhesive layer (20) on the side facing the additive printed circuit board (1), and the adhesive layer (20) is a thermosetting adhesive or a pressure-sensitive adhesive.

5. The printed circuit board assembly as claimed in claim 1, characterized in that, The protective film (2) and / or the additive printed circuit board (1) are provided with a through exhaust passage (100) at a position corresponding to the blank area of ​​the additive printed circuit board (1).

6. The printed circuit board assembly as described in claim 5, characterized in that, The exhaust passage (100) is slit-shaped or perforated.

7. The printed circuit board assembly as described in claim 5, characterized in that, At least one of the electronic components (3) is provided with at least one exhaust passage (100) at a distance not exceeding 20 mm from it; or, each of the electronic components (3) is provided with at least one exhaust passage (100) at a distance not exceeding 20 mm from it. The distance between the exhaust passage (100) and the electronic components (3) and the conductive lines (11) is not less than 10 mm.

8. The printed circuit board assembly as claimed in claim 5, characterized in that, The printed circuit board assembly includes a sealant (101) that seals the vent passage (100).

9. The printed circuit board assembly according to any one of claims 1 to 8, characterized in that, A filler material (4) is provided between the outer periphery of the electronic component (3) and the surface of the additive printed circuit board (1). The filler material (4) surrounds the outer periphery of the electronic component (3), and the protective film (2) covers the filler material (4).

10. The printed circuit board assembly according to any one of claims 1 to 8, characterized in that, The carrier plate (10) is a rigid plate or a flexible membrane material with a thickness of not less than 15 micrometers.

11. The printed circuit board assembly according to any one of claims 1 to 8, characterized in that, At least one of the electronic components (3) is a light-emitting device (30); The protective film (2) is doped with light-diffusing powder at least at the position corresponding to the light-emitting device (30); and / or; The protective film (2) is provided with an optical lens (21) at least at a position corresponding to the light-emitting device (30); and / or, The protective film (2) has a phosphor layer (22) at least at the position corresponding to the light-emitting device (30).

Images