Hot plate mechanism and hot press device

Abstract

The application relates to the technical field of hot pressing, and discloses a hot plate mechanism and a hot pressing device, the hot plate mechanism is applied to the hot pressing device, the hot pressing device comprises a casing and an inner cavity formed in the casing, the casing comprises a frame plate, the hot plate mechanism comprises a hot plate assembly and a stress absorption assembly, the hot plate assembly comprises a top layer pressing plate arranged on the side of the frame plate facing the inner cavity; the stress absorption assembly is arranged on at least one side of the top layer pressing plate along the extension direction of the top layer pressing plate, the stress absorption assembly is connected to the frame plate and the hot plate assembly, and at least part of the structure of the stress absorption assembly can move relative to the other one along the thermal deformation of any one of the two in the extension direction of the other one. Through the above arrangement, the displacement difference caused by the inconsistent thermal deformation of the hot plate assembly and the frame plate is compensated by the movement of at least part of the structure of the stress absorption assembly, and the problem that the connecting structure of the frame plate and the hot plate assembly is cut off due to the inconsistent thermal deformation of the two is effectively avoided.

Description

Technical Field

[0001] This application relates to the field of circuit board manufacturing technology, and in particular to a hot plate mechanism and a hot pressing device. Background Technology

[0002] In a hot press, some of the hot plates are connected to the frame plate of the housing. Because the hot plates are used for pressing, the pressing surfaces must meet certain flatness and surface finish requirements; therefore, holes are typically not drilled on the pressing surfaces. Currently, hot presses mainly use an outside-to-inside connection structure, such as bolt assemblies, to connect and fix the hot plates to the frame plate of the housing. However, there is a heat difference between the frame plate and the hot plates, resulting in inconsistent thermal deformation. This causes the mounting holes on each plate to misalign during deformation, making it easy to sever the connection structure. Utility Model Content

[0003] In order to overcome the problems existing in the prior art, the main objective of this application is to provide a hot plate mechanism and a hot pressing device.

[0004] According to a first aspect of the embodiments of this application, a hot plate mechanism is provided for use in a hot pressing device, the hot pressing device including a housing and an inner cavity formed within the housing, the housing including a frame plate, and the hot plate mechanism including: The hot plate assembly includes a top pressure plate disposed on the side of the frame plate facing the inner cavity; A stress-absorbing component is disposed on at least one side of the top platen along its extension direction. The stress-absorbing component is used to connect the frame plate and the top platen, and at least a portion of the structure of the stress-absorbing component is movable relative to the other in response to thermal deformation of either of them along its extension direction.

[0005] According to some embodiments of this application, The stress-absorbing assembly includes a first fastener and a mounting base. The mounting base is connected to the frame plate via the first fastener. The mounting base has a strip-shaped hole extending along the thickness direction of the hot plate assembly. The first fastener passes through the strip-shaped hole. The mounting base is capable of slight movement relative to the first fastener through the strip-shaped hole, thereby making the mounting base movable relative to the frame plate. Alternatively, the stress-absorbing component includes a mounting base, one of the frame plate and the mounting base is provided with a groove, and the other is provided with a sliding part. The sliding part and the groove are slidably engaged along the extension direction of the top pressure plate, and the mounting base is movable relative to the frame plate through the groove and the sliding part.

[0006] According to some embodiments of this application, the mounting base and the frame plate are spaced apart along the thickness direction of the hot plate assembly.

[0007] According to some embodiments of this application, the hot plate assembly further includes an insulation plate, and the stress-absorbing assembly is used to connect the frame plate and the top pressure plate, and to sandwich the insulation plate between the frame plate and the top pressure plate.

[0008] According to some embodiments of this application, a heat insulation portion is provided between the stress-absorbing component and the top pressure plate.

[0009] According to some embodiments of this application, the stress-absorbing component includes a mounting base, one side of which abuts against the top plate, and the side of the mounting base abutting against the top plate is further provided with a groove, and the heat insulation part is a heat insulation space formed between the groove wall and the side wall of the top plate.

[0010] According to some embodiments of this application, a portion of the structure of the mounting base is located on one side of the extension direction of the insulation board, and the heat insulation portion extends along the thickness direction of the top layer pressure plate, such that a portion of the heat insulation portion is located between the insulation board and the mounting base.

[0011] According to some embodiments of this application, the hot plate assembly further includes an insulation plate, which is stacked between the top pressure plate and the frame plate; The stress-absorbing component includes a mounting base, which includes a first mounting portion and a second mounting portion connected to each other. The second mounting portion is located on one side of the extension direction of the top plate, and the first mounting portion is located between the second mounting portion and the frame plate. The first mounting portion is used to connect with the frame plate, and the second mounting portion is connected with the top plate; wherein the first mounting portion abuts against the insulation board.

[0012] According to some embodiments of this application, the stress-absorbing assembly further includes a first fastener, and the first mounting portion is used to connect to the frame plate via the first fastener; The first mounting portion includes a protrusion that extends from at least one side of the second mounting portion along a predetermined direction. The predetermined direction is parallel to the extension direction of the top plate and intersects with the arrangement direction of the mounting base and the top plate. The first fastener passes through the protrusion.

[0013] According to a second aspect of the present application, a hot pressing device is provided, including a housing and a hot plate mechanism as described in any of the above embodiments, wherein the interior of the housing defines an inner cavity, the housing includes a frame plate, and the hot plate mechanism is disposed in the inner cavity and connected to the frame plate.

[0014] The hot plate mechanism according to the embodiments of this application has at least the following beneficial effects: In this embodiment, a stress-absorbing component is provided on at least one side of the top platen along its extension direction. The stress-absorbing component is connected to the hot plate assembly and the hot pressing device. At least a portion of the structure of the stress-absorbing component can move relative to the other as either of them undergoes thermal deformation along its extension direction. In this way, the movement of the stress-absorbing component can be used to compensate for the displacement difference caused by the inconsistent thermal deformation of the top platen and the frame plate, effectively avoiding the problem of the connection structure between the frame plate and the hot plate assembly being cut off due to the inconsistent thermal deformation of the two.

[0015] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0016] Figure 1 This is a partial structural schematic diagram of a hot pressing device according to an embodiment of this application; Figure 2 This is a side view of the connection between the stress-absorbing component and the hot plate component according to an embodiment of this application; Figure 3 for Figure 2 The structure shown is a cross-sectional view along section AA; Figure 4 This is a top view of the connection between the stress-absorbing component and the hot plate component according to an embodiment of this application. Figure 5 This is a partial structural schematic diagram of a hot pressing device according to another embodiment of this application; Figure 6 This is a schematic diagram of the stress-absorbing component according to an embodiment of this application.

[0017] Figure label: 10. Hot pressing device; 100. Housing; 101. Inner cavity; 110. Frame plate; 111. Gap; 200. Hot plate mechanism; 210. Hot plate assembly; 211. Insulation board; 212. Top layer pressure plate; 220. Stress-absorbing component; 221. Mounting base; 221a. Groove; 2211. First mounting part; 2211a. Protrusion; 2211b. Strip hole; 2211c. Movable space; 2212. Second mounting part; 2212a. Connecting hole; 222. First fastener; 223. Second fastener; 230. Insulation section; 231. Insulation space; P. Centerline. Detailed Implementation

[0018] The following will clearly and completely describe the concept and technical effects of this application in conjunction with embodiments, so as to fully understand the purpose, features and effects of this application. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are all within the scope of protection of this application.

[0019] In the description of the embodiments of this application, if directional descriptions are involved, such as "up", "down", "front", "back", "left", "right" etc., indicating the directional or positional relationship based on the directional or positional relationship shown in the drawings, it is only for the convenience of describing this application and simplifying the description, and is not intended to indicate or imply that the device or device referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0020] In the description of the embodiments of this application, if a feature is referred to as "setting," "fixing," "connecting," or "installing" on another feature, it can be directly set, fixed, or connected to the other feature, or it can be indirectly set, fixed, connected, or installed on the other feature. In the description of the embodiments of this application, if "several" is involved, it means one or more; if "multiple" is involved, it means two or more; if "greater than," "less than," or "exceeds," it should be understood as excluding the stated number; if "above," "below," or "within," it should be understood as including the stated number. If "first" or "second" is involved, it should be understood as used to distinguish technical features, and not as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of the indicated technical features.

[0021] This application provides a hot plate mechanism and a hot pressing device.

[0022] The hot pressing apparatus provided in this application is suitable for pressing electronic components that require bonding, such as circuit boards like PCBs. Please refer to... Figure 1 , Figure 1 This is a partial structural schematic diagram of the hot pressing device 10 according to an embodiment of this application. The hot pressing device 10 includes a housing 100, the interior of which defines an inner cavity 101, and a hot plate mechanism 200 disposed within the inner cavity 101. The housing 100 includes a frame plate 110 surrounding the inner cavity 101, and the hot plate mechanism 200 is connected to the frame plate 110.

[0023] The hot plate mechanism 200 includes a hot plate assembly 210, which includes a top pressure plate 212 disposed on the side of the frame plate 110 facing the inner cavity 101. For some embodiments of this application, please refer to... Figure 1The hot plate assembly 210 also includes an insulation plate 211, which contacts the frame plate 110 and is stacked between the top pressure plate 212 and the frame plate 110. The insulation plate 211 is made of heat-insulating material and can prevent heat transfer from the top pressure plate 212 to the frame plate 110, thus avoiding heat loss. The top pressure plate 212 has a pressing surface for contacting the device to be pressed.

[0024] In this embodiment, the hot plate mechanism 200 further includes a stress-absorbing component 220. The stress-absorbing component 220 is disposed on at least one side of the top platen 212 along its extension direction. The stress-absorbing component 220 is connected to the frame plate 110 and the top platen 212, and at least a portion of the structure of the stress-absorbing component 220 is capable of moving relative to the other due to thermal deformation of either of them along its extension direction. That is, in this embodiment, the top platen 212 is connected to the frame plate 110 via the stress-absorbing component 220.

[0025] In this application, the stress-absorbing component 220 can be disposed on one side of the extension direction of the top pressure plate 212, or it can be disposed on multiple sides of the extension direction of the top pressure plate 212. The number and distribution of the stress-absorbing components 220 can be adapted to the shape of the top pressure plate 212, and this application embodiment does not limit this. In some embodiments, combined with Figure 1 As shown, the top plate 212 is designed with a square outline, and the stress absorption components 220 can be disposed on opposite sides of the top plate 212 along its extension direction.

[0026] Understandably, during the use of the hot pressing device 10, when the top platen 212 is heated, its material will undergo displacement along its extension direction (i.e., thermal deformation of the top platen 212 along its extension direction). Similarly, when the side of the frame plate 110 facing the inner cavity 101 is heated, the material of the frame plate 110 will also undergo displacement along its extension direction (i.e., thermal deformation of the frame plate 110 along its extension direction). The displacement of the top platen 212 and the frame plate 110 will drive the stress absorbing component 220 to move accordingly. However, due to the thermal difference between the top platen 212 and the frame plate 110, the displacement amounts generated by their thermal deformation are inconsistent. In this embodiment, by setting at least a portion of the structure of the stress absorbing component 220 to be movable relative to at least one of the two, the movement of the stress absorbing component 220 can compensate for the inconsistent displacement amounts of the top platen 212 and the frame plate 110, effectively avoiding the problem of bolts being cut off due to the different displacement amounts of their thermal deformation.

[0027] Understandably, in order to enable at least a portion of the structure of the stress-absorbing assembly 220 to move relative to the frame plate 110 or the top plate 212, the stress-absorbing assembly 220 may be configured to be movably connected to at least one of the frame plate 110 or the top plate 212.

[0028] In one embodiment of this application, the stress-absorbing component 220 is movably connected to the frame plate 110, and at least a portion of the structure of the stress-absorbing component 220 is movable relative to the frame plate 110 as the hot plate assembly 210 undergoes thermal deformation along its extension direction. That is, in this embodiment, the stress-absorbing component 220 and the frame plate 110 are not rigidly connected, and at least a portion of the structure of the stress-absorbing component 220 is movable relative to the frame plate 110 under external force.

[0029] In the above embodiments, by movably connecting the stress-absorbing component 220 to the frame plate 110, when the material of the top pressure plate 212 is deformed by heat, causing the stress-absorbing component 220 to move, at least a part of the structure of the stress-absorbing component 220 moves relative to the frame plate 110. The movement of the stress-absorbing component 220 relative to the frame plate 110 compensates for the displacement difference between the frame plate 110 and the top pressure plate 212 caused by inconsistent thermal deformation, effectively avoiding deformation or breakage of the connection structure between the stress-absorbing component 220 and the frame plate 110.

[0030] In another embodiment of this application, the stress-absorbing component 220 is movably connected to the top pressure plate 212, and at least a portion of the structure of the stress-absorbing component 220 can move relative to the top pressure plate 212 as the frame plate 110 undergoes thermal deformation along its extension direction. That is, in this embodiment, the stress-absorbing component 220 and the top pressure plate 212 are non-rigidly connected. By movably connecting the stress-absorbing component 220 to the top pressure plate 212, when the material of the frame plate 110 undergoes thermal deformation, causing the stress-absorbing component 220 to displace, at least a portion of the structure of the stress-absorbing component 220 moves relative to the top pressure plate 212. This movement of the stress-absorbing component 220 relative to the top pressure plate 212 compensates for the displacement difference between the frame plate 110 and the top pressure plate 212 caused by inconsistent thermal deformation, effectively preventing deformation or breakage of the connection structure between the stress-absorbing component 220 and the top pressure plate 212.

[0031] In another embodiment of this application, the stress-absorbing component 220 is movably connected to both the top pressure plate 212 and the frame plate 110, and the stress-absorbing component 220 can move relative to the top pressure plate 212 and the frame plate 110. It is understood that this embodiment is based on the same principle as the above embodiments "stress-absorbing component 220 movably connected to frame plate 110" and "stress-absorbing component 220 movably connected to top pressure plate 212," and will not be repeated here. Please refer to the description of the above embodiments for details.

[0032] In some embodiments of this application, please refer to the references. Figure 2 and Figure 3 Through the connection of the stress-absorbing component 220, the insulation board 211 is sandwiched between the frame plate 110 and the top pressure plate 212. The stress-absorbing component 220 can be connected to the top pressure plate 212 and the frame plate 110 respectively using bolts. In this embodiment, by connecting the stress-absorbing component 220 to the frame plate 110 and the top pressure plate 212 respectively, the insulation board 211 is clamped between the frame plate 110 and the top pressure plate 212 by the clamping force between them. This eliminates the need for an additional connection structure to fix the insulation board 211 and the top pressure plate 212, simplifying the assembly of the heat plate assembly 210. Furthermore, by eliminating the connection structure between the insulation board 211 and the top pressure plate 212, the problem of deformation or breakage of the connection structure due to inconsistent thermal expansion between the insulation board 211 and the top pressure plate 212 is completely avoided.

[0033] Understandably, the stress-absorbing component 220 is positioned on one side of the extension direction of the top pressure plate 212. This can mean the entire stress-absorbing component 220 is located on one side of the extension direction of the top pressure plate 212, or a portion of the stress-absorbing component 220 is located on one side of the extension direction of the top pressure plate 212, while the remaining portion is located elsewhere. Figure 3 As shown, for example, the remaining structure of the stress-absorbing component 220 may be located on one side of the extension direction of the insulation plate 211.

[0034] In some embodiments, the stress-absorbing component 220 is movably connected to the frame plate 110. The connection structure of the stress-absorbing component 220 to the frame plate 110 is described in detail below.

[0035] In one embodiment of this application, please refer to Figure 3 The stress-absorbing component 220 includes a first fastener 222 and a mounting base 221. The mounting base 221 is used to connect to the frame plate 110 via the first fastener 222. The mounting base 221 has a strip-shaped hole 2211b extending along the thickness direction of the hot plate assembly 210, and the first fastener 222 passes through the strip-shaped hole 2211b. The first fastener 222 can be a bolt.

[0036] Since the connection position between the first fastener 222 and the frame plate 110 is fixed, the first fastener 222 and the frame plate 110 always remain relatively stationary. To achieve a movable connection between the stress-absorbing component 220 and the frame plate 110, this embodiment provides a strip-shaped hole 2211b in the mounting base 221 for the first fastener 222 to pass through. Please refer to... Figure 3 And refer to Figure 4This design creates a movable space 2211c between the first fastener 222 and at least a portion of the hole wall of the strip hole 2211b, allowing the mounting base 221 to move relative to the frame plate 110. In other words, this embodiment sets the strip hole 2211b to be larger than the first fastener 222, providing space for the mounting base 221 to move relative to the first fastener 222, thus enabling the mounting base 221 to move relative to the frame plate 110. It is understood that the specific size and distribution area of ​​the movable space 2211c are designed based on the relative displacement between the hot plate assembly 210 and the frame plate 110.

[0037] With the above settings, during the use of the hot pressing device 10, when the material of the top platen 212 is deformed by heat and the mounting base 221 is displaced together, the mounting base 221 moves relative to the frame plate 110 and the first fastener 222 through the strip hole 2211b. The first fastener 222 is avoided by utilizing the movable space 2211c. The mounting base 221 will not shear the first fastener 222 during the movement, thereby avoiding cutting off the first fastener 222.

[0038] It should be noted that the deformation of the top layer pressure plate 212 / frame plate 110 along its own extension direction is not unidirectional. Taking the top layer pressure plate 212 as a square as an example, combined with... Figure 4 As shown, a two-dimensional plane coordinate system is established with the extension direction parallel to the top plate 212, including the X and Y directions in the figure. When the top plate 212 is heated and expands, it will deform along the X and Y directions at the same time. Therefore, the design of the strip hole 2211b must simultaneously meet the movement margin in the above two directions so that the mounting base 221 will not exert a shearing effect on the first fastener 222 in either direction when it moves.

[0039] It is understandable that the degree of thermal deformation of the top plate 212 varies at different positions on one side of its extension direction, and the size of the strip hole 2211b can be set to different sizes according to the different arrangement positions of the mounting base 221 on one side of the top plate 212.

[0040] In one embodiment of this application, in conjunction with reference to... Figure 5As shown, when the mounting base 221 is positioned on the centerline P of the extension direction of the hot plate assembly 210, that is, when the mounting base 221 is positioned at the center of one side of the extension direction of the hot plate assembly 210, the thermal deformation of the top platen 212 at this position mainly occurs along the direction of the centerline P, while the thermal deformation of the top platen 212 at this position along the direction intersecting the centerline P is very small. Therefore, only the movement of the mounting base 221 along the centerline P needs to be considered, and the strip hole 2211b can be set to be relatively slender. It can be understood that in this embodiment, a stress-absorbing component 220 can be provided at the center of each side of the hot plate assembly 210 in its extension direction.

[0041] In some embodiments of this application, please refer again to Figure 3 When the mounting base 221 is connected to the frame plate 110 by the first fastener 222, a gap 111 is formed between the mounting base 221 and the frame plate 110 along the thickness direction of the top plate 212.

[0042] Understandably, by creating a gap 111 between the mounting base 221 and the frame plate 110, the mounting base 221 and the frame plate 110 are not initially in contact. This means that the top platen 212, the insulation plate 211, and the frame plate 110 are not completely rigidly constrained, allowing them to undergo relative displacement along the arrangement direction when they expand and deform due to heat. During the operation of the hot pressing device 10, when the top platen 212 and the frame plate 110 expand due to heat, the gap 111 provides a buffer space for the expansion and deformation of the top platen 212 and the frame plate 110, causing relative displacement between them, while the first fastener 222 is not subjected to additional force. Thus, this embodiment, by creating a gap 111 between the mounting base 221 and the frame plate 110, reserves space for the thermal expansion and deformation of the top platen 212 and the frame plate 110.

[0043] Understandably, the gap 111 between the mounting base 221 and the frame plate 110 is set according to the longitudinal deformation of the top pressure plate 212, the frame plate 110, and the stress-absorbing component 220. The gap 111 can be different when the above components are made of different materials. In one embodiment of this application, the gap 111 between the mounting base 221 and the frame plate 110 is 2 mm.

[0044] In some other embodiments (not shown in the figures), one of the frame plate 110 and the mounting base 221 is provided with a groove, and the other is provided with a sliding part. The sliding part and the groove slide together along the extension direction of the top plate 212, and the mounting base 221 is movable relative to the frame plate 110 through the groove and the sliding part.

[0045] In the above embodiments, the mounting base 221 is slidably connected to the frame plate 110 through the sliding groove and sliding part. The mounting base 221 itself does not need to be connected to the frame plate 110 by bolts. When the top plate 212 is deformed by thermal expansion, the mounting base 221 is displaced. The mounting base 221 slides relative to the frame plate 110 using the sliding part and sliding groove, which effectively avoids the deformation or breakage of the connecting parts due to the inconsistent thermal deformation displacement of the top plate 212 and the frame plate 110.

[0046] Please refer to some embodiments of this application. Figure 3 A heat insulation portion 230 is provided between the mounting base 221 and the top pressure plate 212. It can be understood that by providing the heat insulation portion 230 between the mounting base 221 and the top pressure plate 212, the heat insulation portion 230 can prevent the heat generated by the top pressure plate 212 from being transferred to the stress absorption assembly 220, thereby reducing the heat transfer to the frame plate 110 through the stress absorption assembly 220 and reducing heat loss.

[0047] Understandably, the heat insulation portion 230 can be a solid component disposed between the mounting base 221 and the top platen 212, such as a heat insulation element made of heat-insulating material. For example, in one possible embodiment of this application, the heat insulation portion 230 can be a heat insulation pad sandwiched between the mounting base 221 and the top platen 212. The heat insulation portion 230 can also be a gap / space formed between the mounting base 221 and the top platen 212, which can also provide good heat insulation due to the poor thermal conductivity of air (compared to the solid material of the mounting base 221).

[0048] In some embodiments of this application, please refer to Figure 3 And refer to Figure 6 The mounting base 221 has one side abutting against the top plate 212. The mounting base 221 also has a groove 221a on the side facing the top plate 212. At least part of the opening of the groove 221a is opposite to the top plate 212. The heat insulation part 230 is the heat insulation space 231 formed between the groove wall of the groove 221a and the side wall of the top plate 212.

[0049] In the above embodiment, by providing a groove 221a on the side of the mounting base 221 facing the top platen 212, the contact area between the mounting base 221 and the top platen 212 is reduced, thereby reducing the heat transfer efficiency between them and effectively reducing the heat transfer to the frame plate 110 through the stress absorption component 220, thus effectively avoiding heat loss. On the other hand, the groove wall of the groove 221a and the side wall of the top platen 212 form a heat insulation space 231, which can prevent the heat of the top platen 212 from being transferred to the stress absorption component 220, further reducing the heat transfer to the frame plate 110 through the stress absorption component 220, and significantly reducing heat loss.

[0050] In some embodiments of this application, please refer to the references. Figure 3 and Figure 6 Part of the structure of the mounting base 221 is located on one side of the extension direction of the insulation plate 211, and the heat insulation part 230 extends along the thickness direction of the top plate 212 (i.e., the groove 221a can extend along the thickness direction of the top plate 212), so that part of the heat insulation part 230 is located between the insulation plate 211 and the mounting base 221. In this embodiment, by extending the heat insulation part 230 upward to one side of the insulation plate 211, the arrangement area of ​​the heat insulation part 230 is increased, the thermal resistance effect is enhanced, and heat loss is further reduced.

[0051] Please continue to refer to the reference. Figure 3 and Figure 6 In some embodiments, the mounting base 221 includes a first mounting portion 2211 and a second mounting portion 2212 connected to each other. The second mounting portion 2212 is located on one side of the extension direction of the top layer pressure plate 212, and the first mounting portion 2211 is located between the second mounting portion 2212 and the frame plate 110. The second mounting portion 2212 is connected to the top layer pressure plate 212, and the first mounting portion 2211 is used to connect to the frame plate 110. The first mounting portion 2211 abuts against the insulation plate 211.

[0052] In the above embodiments, the second mounting portion 2212 is located on one side of the extension direction of the top layer pressure plate 212, while the first mounting portion 2211 is located between the second mounting portion 2212 and the frame plate 110, that is, at least a portion of the structure of the first mounting portion 2211 is located on one side of the extension direction of the insulation plate 211. It can be understood that the first mounting portion 2211 may be entirely located on one side of the extension direction of the insulation plate 211, or a portion of the structure of the first mounting portion 2211 may be located on one side of the extension direction of the insulation plate 211, with a portion of the structure extending to one side of the extension direction of the top layer pressure plate 212. The accompanying drawings of this application are only for illustrative purposes and should not be construed as limiting this application.

[0053] Understandably, the insulation board 211 is sandwiched between the top pressure plate 212 and the frame plate 110. The insulation board 211 is clamped and limited along its thickness direction by the top pressure plate 212 and the frame plate 110, restricting its longitudinal displacement. In the above embodiment, the mounting base 221 is configured to include a first mounting portion 2211 and a second mounting portion 2212. By positioning the first mounting portion 2211 on one side of the partition's extension direction and abutting against the insulation board 211, the insulation board 211 is also limited along its extension direction by the mounting base 221. The mounting base 221 restricts the insulation board 211's lateral displacement. Thus, the frame plate 110, the top pressure plate 212, and the mounting base 221 jointly restrict the insulation board 211's longitudinal and lateral displacement, ensuring that the insulation board 211 is securely sandwiched between the top pressure plate 212 and the frame plate 110. Moreover, the above embodiment uses the first mounting part 2211 to abut against one side of the extension direction of the insulation board 211 and uses part of the structure of the mounting base 221 for limiting, without the need to add an additional limiting structure to the insulation board 211. This simple method effectively ensures the stability and reliability of the installation of the insulation board 211, simplifies the structure, and facilitates assembly.

[0054] The first mounting part 2211 is connected to the frame plate 110 via the first fastener 222, and a strip hole 2211b is provided in the first mounting part 2211. The second mounting part 2212 is connected to the top platen 212 via the second fastener 223, and the second fastener 223 passes through the second mounting part 2212 along the extension direction of the top platen 212. The second mounting part 2212 is provided with a connecting hole 2212a for the second fastener 223 to pass through. By passing the second fastener 223 through the second mounting part 2212 along the extension direction of the top platen 212, the corresponding hole for the second fastener 223 to be connected on the side of the top platen 212 along the extension direction is provided on the side of the top platen 212, eliminating the need to drill holes on the pressing surface of the top platen 212, and making it easier to ensure the surface finish of the pressing surface of the top platen 212.

[0055] Please refer to the reference. Figure 2 , Figure 3 and Figure 6 In some embodiments, the first mounting portion 2211 includes a protrusion 2211a that extends from at least one side of the second mounting portion 2212 along a predetermined direction. This predetermined direction is parallel to the extension direction of the top layer pressure plate 212 and intersects with the arrangement direction of the mounting base 221 and the top layer pressure plate 212. A first fastener 222 passes through the protrusion 2211a. It is understood that the aforementioned strip-shaped hole 2211b is provided in the protrusion 2211a.

[0056] Since the first fastener 222 is connected to the frame plate 110 along the thickness direction of the top platen 212, and the second fastener 223 is connected to the top platen 212 along the extension direction of the top platen 212, the arrangement of the first fastener 222 and the second fastener 223 is perpendicular to each other. In the above embodiment, by configuring the first mounting portion 2211 to include a protrusion 2211a extending from the second mounting portion 2212 in a predetermined direction, and the first fastener 222 passing through the protrusion 2211a to connect with the frame plate 110, the operating spaces of the first fastener 222 and the second fastener 223 are staggered, preventing mutual interference during the connection and disassembly processes of the first fastener 222 and the second fastener 223, thus facilitating the assembly and disassembly of the hot plate mechanism 200. Simultaneously, by setting the protrusion 2211a to extend beyond the outer periphery of the second mounting portion 2212, the first mounting portion 2211 is made larger than the second mounting portion 2212, which helps ensure the stability of the connection between the mounting base 221 and the frame plate 110.

[0057] In one embodiment, two protrusions 2211a are provided, and the two protrusions 2211a extend from opposite sides of the second mounting part 2212 along the aforementioned set direction. Each protrusion 2211a is connected to the frame plate 110 by a first fastener 222.

[0058] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A hot plate mechanism, applied in a hot pressing device, characterized in that, The hot pressing device includes a housing and an inner cavity formed within the housing. The housing includes a frame plate. The hot plate mechanism includes: The hot plate assembly includes a top pressure plate disposed on the side of the frame plate facing the inner cavity; A stress-absorbing component is disposed on at least one side of the top platen along its extension direction. The stress-absorbing component is used to connect the frame plate and the top platen, and at least a portion of the structure of the stress-absorbing component is movable relative to the other in response to thermal deformation of either of them along its extension direction.

2. The hot plate mechanism according to claim 1, characterized in that, The stress-absorbing assembly includes a first fastener and a mounting base. The mounting base is connected to the frame plate via the first fastener. The mounting base has a strip-shaped hole extending along the thickness direction of the hot plate assembly. The first fastener passes through the strip-shaped hole. The mounting base is capable of slight movement relative to the first fastener through the strip-shaped hole, thereby making the mounting base movable relative to the frame plate. Alternatively, the stress-absorbing component includes a mounting base, one of the frame plate and the mounting base is provided with a groove, and the other is provided with a sliding part. The sliding part and the groove are slidably engaged along the extension direction of the top pressure plate, and the mounting base is movable relative to the frame plate through the groove and the sliding part.

3. The hot plate mechanism according to claim 2, characterized in that, Along the thickness direction of the hot plate assembly, the mounting base and the frame plate are spaced apart by a gap.

4. The hot plate mechanism according to any one of claims 1 to 3, characterized in that, The hot plate assembly also includes an insulation plate, and the stress-absorbing assembly is used to connect the frame plate and the top pressure plate, and to sandwich the insulation plate between the frame plate and the top pressure plate.

5. The hot plate mechanism according to claim 4, characterized in that, A heat insulation section is provided between the stress-absorbing component and the top pressure plate.

6. The hot plate mechanism according to claim 5, characterized in that, The stress-absorbing component includes a mounting base, one side of which abuts against the top plate. The side of the mounting base that abuts against the top plate is also provided with a groove. The heat insulation part is a heat insulation space formed between the groove wall and the side wall of the top plate.

7. The hot plate mechanism according to claim 6, characterized in that, A portion of the mounting base is located on one side of the extension direction of the insulation board, and the insulation portion extends along the thickness direction of the top layer pressure plate, such that a portion of the insulation portion is located between the insulation board and the mounting base.

8. The hot plate mechanism according to any one of claims 1 to 3, characterized in that, The hot plate assembly also includes an insulation board, which is stacked between the top pressure plate and the frame plate; The stress-absorbing component includes a mounting base, which includes a first mounting portion and a second mounting portion connected to each other. The second mounting portion is located on one side of the extension direction of the top plate, and the first mounting portion is located between the second mounting portion and the frame plate. The first mounting portion is used to connect with the frame plate, and the second mounting portion is connected with the top plate; wherein the first mounting portion abuts against the insulation board.

9. The hot plate mechanism according to claim 8, characterized in that, The stress-absorbing assembly further includes a first fastener, and the first mounting portion is used to connect to the frame plate via the first fastener; The first mounting portion includes a protrusion that extends from at least one side of the second mounting portion along a predetermined direction. The predetermined direction is parallel to the extension direction of the top plate and intersects with the arrangement direction of the mounting base and the top plate. The first fastener passes through the protrusion.

10. A hot pressing device, characterized in that, The device includes a housing and a hot plate mechanism as described in any one of claims 1 to 9, wherein the interior of the housing defines an inner cavity, the housing includes a frame plate, and the hot plate mechanism is disposed in the inner cavity and connected to the frame plate.

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