Curing mechanism, curing device, and circuit board processing apparatus

Abstract

The application relates to the technical field of circuit board processing, and discloses a solidification mechanism, a solidification device and a circuit board processing equipment. The solidification mechanism comprises a solidification assembly and a carrying assembly. The carrying assembly is configured to drive the solidification assembly to move relative to a circuit board, so that the solidification assembly has a first movement area and a second movement area. When the solidification assembly is in the first movement area, the solidification assembly is adapted to be arranged above the space of the circuit board. When the solidification assembly is in the second movement area, the solidification assembly is adapted to avoid the space above the circuit board. The carrying assembly drives the solidification assembly to flexibly switch between the first movement area and the second movement area to avoid the space above the circuit board, so as to provide an operation space for a subsequent processing procedure of the circuit board and improve the efficiency of processing the circuit board.

Description

Technical Field

[0001] This application relates to the field of circuit board processing technology, and in particular to a curing mechanism, curing device and circuit board processing equipment. Background Technology

[0002] In the circuit board processing, after the circuit board has undergone inkjet printing, the cured surface of the circuit board needs to be cured to ensure the stability of ink adhesion.

[0003] In related technologies, a curing component is fixedly installed in the curing device. The circuit board to be cured is transported to the processing position below the curing component by a conveying device. The curing component emits a curing beam from above the processing position to cure the circuit board.

[0004] Due to the structural layout of the curing components within the curing apparatus, after the circuit board curing process is completed, a conveyor device is needed to remove the circuit board from the processing position. The board must then be moved back into the processing position after another circuit board is installed or the curing surface is flipped, allowing the curing components to continue processing. Therefore, the current structure of the curing components restricts the working space for subsequent circuit board processing, resulting in low efficiency. Utility Model Content

[0005] In order to overcome the problems existing in the above-mentioned related technologies, the main purpose of this application is to provide a curing mechanism, a curing device and a circuit board processing equipment.

[0006] To achieve the above objectives, this application specifically adopts the following technical solution: According to a first aspect of the present application, a curing mechanism is provided, comprising: a curing component configured to perform curing processing on a circuit board; and a transport component connected to the curing component, the transport component being configured to drive the curing component to move relative to the circuit board, such that the curing component has a first movement region and a second movement region, wherein when the curing component is in the first movement region, the curing component is adapted to be disposed in the space above the circuit board to perform curing processing on the circuit board; and when the curing component is in the second movement region, the curing component is adapted to avoid the space above the circuit board.

[0007] Optionally, the carrier assembly includes a moving component configured to drive the curing assembly to move relative to the circuit board along a first direction, so that the curing assembly moves and switches between a first movement region and a second movement region; the first direction intersects the vertical direction.

[0008] Furthermore, the curing component has a first moving area, and the second moving area is arranged along the first direction on one or both sides of the first moving area; Alternatively, the curing component has at least two first motion regions arranged along the first direction, and the second motion region is arranged between adjacent first motion regions; Alternatively, the curing component has at least two first motion regions arranged along the first direction, and the second motion region is arranged on at least one of the two disjoint sides of the adjacent first motion regions; Alternatively, the curing component has at least two first motion regions arranged along the first direction, the second motion region being arranged between adjacent first motion regions, and the second motion region also being arranged on at least one of the two disjoint sides of the adjacent first motion regions.

[0009] Optionally, the carrier assembly includes a rotating component and a moving component, wherein the rotating component is configured to drive the curing assembly to rotate about a vertical direction, so that the curing assembly rotates and switches between a first movement region and a second movement region; the moving component is configured to drive the curing assembly to move relative to the circuit board along a first direction, so that the curing assembly moves within the first movement region; the first direction intersects the vertical direction.

[0010] Optionally, the curing mechanism further includes a lifting assembly connected to the curing assembly, the lifting assembly being configured to drive the curing assembly to move vertically toward or away from the circuit board.

[0011] Optionally, the lifting assembly includes a lifting slide rail, a lifting slider, a first transmission component, and a first motor. The lifting slide rail extends along the vertical direction. The lifting slider is connected to the curing assembly, and the lifting slider and the lifting slide rail are slidably connected along the vertical direction. The first transmission component is connected to the lifting slider. The first motor is driven by the transmission component, and the first motor is configured to drive the first transmission component to move the lifting slider along the lifting slide rail, thereby driving the curing assembly to move along the vertical direction.

[0012] Optionally, the moving component includes a moving slide rail, a moving slider, a second transmission component, and a second motor. The moving slide rail extends along the first direction. The moving slider is connected to the curing component and is slidably connected to the moving slide rail along the first direction. The second transmission component is connected to the moving slider. The second motor is driven by the second transmission component and is configured to drive the second transmission component to move the moving slider along the moving slide rail, thereby driving the curing component to move along the first direction.

[0013] Optionally, the curing component includes a connector and a curing element. The connector is connected to the carrier component and includes multiple connecting portions, each of which is connected to the curing element. The curing element is configured to emit a curing beam. Specifically, the curing elements with the multiple connecting portions are configured to be regionally openable and / or regionally adjustable in light intensity of the curing beam. Alternatively, at least two connecting portions are connected to curing elements with different powers.

[0014] According to a second aspect of the embodiments of this application, a curing apparatus is provided, comprising: a frame; a processing table disposed on the frame and configured to carry a circuit board; and a curing mechanism according to any embodiment of the first aspect, wherein a transport component of the curing mechanism is connected to the frame, wherein when the curing component is in a first movement area, the curing component is located in the space above the processing table, and the curing component is configured to perform curing processing on the circuit board placed on the processing table; and when the curing component is in a second movement area, the curing component avoids the space above the processing table.

[0015] Furthermore, the processing table includes a fixing component and a support component, the fixing component being configured to support the circuit board, the support component being supported below the fixing component, and the support component being connected to the frame; Alternatively, the processing table may further include a flipping assembly connected between the support assembly and the fixing assembly, the flipping assembly being configured to drive the fixing assembly to flip, thereby changing the curing surface of the circuit board.

[0016] Optionally, the curing apparatus includes at least two processing tables with a gap between adjacent processing tables; wherein: the second moving area is arranged in the space above the gap; and / or, the second moving area is arranged in the space above the side of the processing table, and the space above the side of the processing table does not include the space above the gap.

[0017] According to a third aspect of the present application, a circuit board processing apparatus is provided, including a conveying device and a curing device according to any of the embodiments of the second aspect described above. The conveying device is configured to transfer a circuit board to a processing table of the curing device and / or remove the circuit board placed on the processing table.

[0018] The curing mechanism according to the embodiments of this application has at least the following beneficial effects: by setting a carrier component to drive the curing component to switch between a first movement area and a second movement area, and in the second movement area, the curing component is adapted to avoid the space above the circuit board. Therefore, in application, the carrier component enables the curing component to flexibly switch between the first movement area and the second movement area, thereby allowing the curing component to avoid the space above the circuit board, providing working space for subsequent processing steps of the circuit board, and improving the efficiency of circuit board processing.

[0019] The curing apparatus and circuit board processing equipment of this application embodiment also have the above-mentioned advantages by adopting the curing mechanism described above.

[0020] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a curing device in one embodiment of this application; Figure 2 for Figure 1 A schematic diagram of part of the structure of the curing device; Figure 3 This is a schematic diagram of a curing mechanism in one embodiment of this application; Figure 4 This is a first schematic diagram of the movement area of ​​the curing component in an embodiment of this application; Figure 5 This is a second schematic diagram of the movement area of ​​the curing component in an embodiment of this application; Figure 6 This is a third schematic diagram of the movement area of ​​the curing component in the embodiments of this application; Figure 7 This is a fourth schematic diagram of the movement area of ​​the curing component in the embodiments of this application; Figure 8 This is a schematic diagram of a structure of the curing component and the lifting component in an embodiment of this application; Figure 9 for Figure 2 A schematic diagram of one structure of the processing table in the embodiment is shown; Figure 10 for Figure 2 A top view of an embodiment is shown.

[0022] Figure label: Curing mechanism 100; Curing component 110; connector 111; curing component 112; Carrier component 120; Moving component 121; Second motor 1211; Synchronous pulley 1212; Synchronous belt 1213; Moving slide rail 1214; Moving slider 1215; Second transmission component 1216; First motion zone 130°; Second motion zone 140°; Lifting assembly 150; first transmission component 151; first motor 152; lifting slide rail 153; lifting slider 154; 200mm machining table; Fixed component 210; Support component 220; Drive component 230; Drive motor 231; Transmission screw 232; Guide rail 233; Flip component 240; Interval area 250; 300 racks; Circuit board W. Detailed Implementation

[0023] The following will clearly and completely describe the concept and technical effects of this application in conjunction with embodiments, so as to fully understand the purpose, features and effects of this application. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are all within the scope of protection of this application.

[0024] In the description of the embodiments of this application, if directional descriptions are involved, such as "up", "down", "front", "back", "left", "right" etc., indicating the directional or positional relationship based on the directional or positional relationship shown in the drawings, it is only for the convenience of describing this application and simplifying the description, and is not intended to indicate or imply that the device or device referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0025] In the description of the embodiments of this application, if a feature is referred to as "setting," "fixing," "connecting," or "installing" on another feature, it can be directly set, fixed, or connected to the other feature, or it can be indirectly set, fixed, connected, or installed on the other feature. In the description of the embodiments of this application, if "several" is involved, it means one or more; if "multiple" is involved, it means two or more; if "greater than," "less than," or "exceeds," it should be understood as excluding the stated number; if "above," "below," or "within," it should be understood as including the stated number. If "first" or "second" is involved, it should be understood as used to distinguish technical features, and not as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of the indicated technical features.

[0026] refer to Figures 1 to 4 A curing apparatus according to an embodiment of this application includes a frame 300, a processing table 200, and a curing mechanism 100. The processing table 200 is disposed on the frame 300 and configured to carry a circuit board W. The curing mechanism 100 is disposed on the frame 300 and may include a curing component 110 and a transport component 120. The curing component 110 is configured to provide curing energy to cure the circuit board W on the processing table 200. The carrier component 120 is connected to the curing component 110. The carrier component 120 can drive the curing component 110 to move relative to the circuit board W, moving the curing component 110 to the space above the circuit board W to perform curing treatment on the circuit board W. After the curing treatment is completed, the carrier component 120 can also move the curing component 110 to other positions or above another circuit board W to avoid the space above the circuit board W that has been cured. This leaves clearance space for the circuit board W that has been cured to carry out subsequent processing steps, such as unloading the circuit board W that has been cured, flipping the cured surface, or transporting another circuit board that needs to be cured to the loading process of the processing table 200.

[0027] It is understood that in the curing mechanism 100, the transport component 120 is configured to drive the curing component 110 to move relative to the circuit board W, so that the curing component 110 has a first movement region 130 and a second movement region 140 along its movement direction. When the curing component 110 is in the first movement region 130, the curing component 110 is adapted to be located in the space above at least one circuit board W, so that the curing component 110 can perform curing processing on the circuit board W below it. When the curing component 110 is in the second movement region 140, the curing component 110 is adapted to avoid the space above the current circuit board W by avoiding the first movement region 130, and can carry out subsequent processing steps on the current circuit board W without adjusting the position of the circuit board W.

[0028] Therefore, in application, the circuit board W can be carried under the first movement area 130 of the curing component 110, so that the curing component 110 moves to the first movement area 130 to perform curing processing on the circuit board W located under the first movement area 130. When it is necessary to avoid obstacles (for example, after curing is completed, or when it is necessary to adjust the curing processing surface), the curing component 110 can be switched to the second movement area 140 to avoid the space above the circuit board W.

[0029] When processing multiple circuit boards W, the multiple circuit boards W can be respectively positioned below the first movement area 130 or below the second movement area 140. By switching between the first movement area 130 and the second movement area 140, the circuit board W can be cured in one movement area while avoiding the circuit board W above the other movement area. Therefore, when the circuit board W below the curing component 110 needs to avoid a certain distance (for example, after the circuit board W below the curing component 110 has been processed, or when the curing surface of the circuit board W below the curing component 110 needs to be adjusted), the carrying component 120 can switch the curing component 110 to another movement area to provide clearance space.

[0030] In one example, refer to Figure 2 and Figure 5When the circuit board W to be cured needs to be processed below the first motion area 130, the circuit board W can be supported by the processing table 200 below the first motion area 130. During loading, the curing component 110 can be positioned in the second motion area 140 to facilitate the loading of the circuit board W onto the processing table 200 below the first motion area 130. After loading, the curing component 110 can be switched to the first motion area 130 to process the circuit board W. After the circuit board W is processed, the transport component 120 drives the curing component 110 to move to the second motion area 140, avoiding the space above the processed circuit board W on the processing table 200, thereby allowing for unloading, transfer, or changing of the curing surface of the processed circuit board W. Similarly, when another circuit board W needs to be processed below the second motion area 140, the circuit board W can be supported by the processing table 200 below the second motion area 140. The curing component 110 is switched to the first motion area 130 by the transport component 120, avoiding the space above the current processing table 200 and facilitating loading. After loading, the curing component 110 is switched to the second motion area 140 (i.e., the space above the current processing table 200) by the transport component 120 to cure the circuit board W. After the circuit board W is processed, the transport component 120 drives the curing component 110 to move to the first motion area 130, thereby avoiding the space above the processed circuit board W on the processing table 200, so that the processed circuit board W can be unloaded, transferred, or the curing surface can be changed.

[0031] In another example, refer to Figure 2 and Figure 7When circuit boards W need to be processed in both the first motion area 130 and the second motion area 140, the circuit boards W to be processed can be carried by processing tables 200 in the first motion area 130 and the second motion area 140 respectively. During loading, the curing component 110 can be placed in the first motion area 130 to facilitate loading onto the processing table 200 in the second motion area 140. After loading, the curing component 110 can be switched back to the first motion area 130, where it can cure the circuit boards W below the first motion area 130. After curing, the transport component 120 drives the curing component 110 to the second motion area 140, avoiding the space above the circuit boards W already processed in the first motion area 130. At this point, operations such as unloading, transferring, or changing the curing surface of the circuit boards W already processed in the first motion area 130 can be performed. Simultaneously, the curing component 110 located in the second motion area 140 can cure the circuit board W below the second motion area 140, thereby achieving continuous curing of multiple circuit boards W. Similarly, after the circuit board W below the second motion area 140 has completed curing, the transport component 120 can drive the curing component 110 back to the first motion area 130 to avoid the circuit board W that has been processed below the second motion area 140. At this time, the circuit board W that has been processed below the second motion area 140 can be unloaded, transferred, or have its curing surface changed. The curing component 110 located in the first motion area 130 can cure the newly loaded circuit board W to be processed below the first motion area 130 or the curing surface after the previous circuit board W has been replaced, thereby achieving continuous and efficient curing of multiple circuit boards W, shortening the waiting time required for the curing component to continuously cure the curing surface of the same circuit board and / or multiple circuit board curing surfaces, and improving the processing efficiency of the curing component.

[0032] Therefore, by switching between the first motion area 130 and the second motion area 140, the curing component 110 avoids the circuit board W that has been cured, which facilitates the loading and unloading of the circuit board W or the adjustment of the curing surface, thereby facilitating the continuous processing of multiple circuit boards W and improving processing efficiency.

[0033] It is understood that the carrier component 120 drives the curing component 110 to move, thereby changing the position of the curing component 110. Depending on the different motion forms or motion paths, different layouts of the first motion area 130 and the second motion area 140 can be formed. In specific implementations, the carrier component 120 can be implemented in various structural forms, such as linear guide modules, robotic arms, or rotating platforms. The specific selection can be reasonably configured according to the overall layout of the curing device and / or the circuit board processing equipment equipped with the curing device, as well as space constraints and circuit board W processing requirements.

[0034] refer to Figure 3 and Figure 4 One possible implementation is that the carrier assembly 120 may include a moving member 121 configured to drive the curing assembly 110 to move relative to the circuit board W along a first direction, thereby switching the curing assembly 110 between a first movement region 130 and a second movement region 140, whereby the curing assembly 110 has a first movement region 130 and a second movement region 140 arranged along the first direction. The first direction intersects the vertical direction. Preferably, the first direction is perpendicular to the vertical direction, i.e., the moving member 121 moves in a straight line in the horizontal plane.

[0035] The curing component 110 can move along a straight path and back and forth between two motion areas in the space above the circuit board W under the drive of the carrier component 120, thereby realizing the processing and avoidance operation of a single circuit board W, or the sequential processing and avoidance operation of different circuit boards W.

[0036] The function of the moving part 121 can be achieved using existing structures, which are simple and easy to maintain. For example, the moving part 121 can adopt a linear module or synchronous belt mechanism to achieve linear motion. The moving part 121 can be directly or indirectly connected to the solidification component 110 and can communicate with the controller. Appropriate movement control timing can be configured according to actual needs. This is a commonly used movement structure in industrial equipment design that can be understood by those skilled in the art. Of course, in specific applications, the moving part 121 can also be implemented using other mechanical structures, as long as the corresponding movement function can be achieved.

[0037] It is understandable that in the curing process, in some cases, it is necessary to move the circuit board W relative to the curing assembly 110 during the processing so that the curing assembly 110 can perform curing processing on different areas of the same circuit board W surface.

[0038] In related technologies, a conveyor device is typically used to move the circuit board W and the curing component to achieve relative movement. This method not only requires sufficient space for the conveyor device, resulting in a large overall footprint for the curing device, but also necessitates coordinating the movement between the conveyor mechanism and the curing component 110 to ensure that the circuit board W is moved out of the processing position via a short path after processing, increasing the complexity of the curing device's structural layout. Furthermore, repeated changes in the position of the circuit board W can easily affect its positional accuracy due to vibration or offset of the conveyor device, thus impacting the curing quality and efficiency.

[0039] In contrast, in some embodiments of this application, during the curing process of the circuit board W, the curing component 110 can remain at a set position in the corresponding motion area (e.g., the first motion area 130 or the second motion area 140) above the circuit board W, or it can move within the corresponding motion area (e.g., the first motion area 130 or the second motion area 140) above the circuit board W under the drive of the carrier component 120, so as to perform curing processing on different positions of the circuit board W. There is no need to drive the circuit board W to move to achieve relative movement between the circuit board W and the curing component 110; the relative movement between the curing component 110 and the circuit board W can be achieved using the space above the circuit board W, thereby processing different areas of the circuit board W. There is no need to reserve additional movement space for the movement of the circuit board W. After processing, the curing component 110 can still be quickly moved to an area that avoids the circuit board W by the carrier component 120, thereby achieving rapid unloading of the circuit board W. Therefore, the curing mechanism 100 of this application embodiment not only effectively simplifies operation and motion control, which is conducive to improving processing efficiency and ease of operation, but also effectively reduces space occupation, improves the spatial compactness of the structure, and is conducive to the miniaturization design of the curing device.

[0040] refer to Figure 5 In one example, the curing component 110 may have a first motion region 130, and a second motion region 140 arranged along a first direction on one side of the first motion region 130. In another example, the second motion region 140 is arranged along the first direction on both sides of the first motion region 130. The processing table 200 may include a fixing component 210 and a support component 220. The fixing component 210 is configured to carry the circuit board W, and the support component 220 is supported below the fixing component 210. The support component 220 may be connected to the frame 300 to realize the installation of the processing table 200. Thus, the circuit board W can be placed below the first movement area 130. For example, the fixing component 210 for supporting the circuit board W can be located below the first movement area 130, so that the curing component 110 is located in the second movement area 140 to avoid the space above the fixing component 210, so that the circuit board W can be loaded onto the fixing component 210 for fixing. The curing component 110 is driven by the moving component 121 to move to the first movement area 130 to cure the circuit board W on the fixing component 210. After the curing process is completed, the curing component 110 can be switched back to the second movement area 140 by the moving component 121 to unload the cured circuit board W and load the next circuit board W. When it is necessary to change the curing surface of the circuit board W, the position or orientation of the circuit board W can also be adjusted (e.g., flipping the circuit board W) when the curing component 110 is in the second movement area 140 to change the curing surface of the circuit board W.

[0041] refer to Figure 4In another example, the curing component 110 may have at least two first motion regions 130 arranged along a first direction, and a second motion region 140 arranged between two adjacent first motion regions 130; or, refer to Figure 6 A second motion region 140 is arranged on at least one of the two disjoint sides of an adjacent first motion region 130; or, a second motion region 140 is arranged between adjacent first motion regions 130, and a second motion region 140 is arranged on at least one of the two disjoint sides of an adjacent first motion region 130. Therefore, the number of second motion regions 140 is not less than the number of first motion regions 130, forming a second motion region 140 and a first motion region 130 arranged at intervals along a first direction, so that the switching of the curing component 110 between different regions is more efficient. Thus, the circuit board W can be placed under any first motion region 130, or a circuit board W can be placed under each first motion region 130. When the curing component 110 is performing a curing operation in any first motion region 130, other circuit boards W can be prepared for loading or unloading in the remaining first motion regions 130, thereby realizing continuous processing and efficient flow of multiple circuit boards W. After the current circuit board W has completed the curing process, the moving component 121 can transfer it to the second movement area 140 or another first movement area 130 for further curing. Simultaneously, this allows for the unloading of the cured circuit board W and the loading of the next circuit board W. When it is necessary to change the curing surface of a completed circuit board W, the position or orientation of the circuit board W can be adjusted (e.g., flipping the circuit board W) while the curing component 110 is in the second movement area 140 or another first movement area 130 to change the curing surface of the circuit board W.

[0042] refer to Figure 7In another example, the curing component 110 may have a first motion area 130 and a second motion area 140, which are arranged sequentially along a first direction, so that the circuit board W can be placed below the first motion area 130 and the second motion area 140. For example, the fixing components 210 of the two sets of processing tables 200 can be respectively set below the first motion area 130 and the second motion area 140. During loading, the curing component 110 is positioned above the first motion area 130 to make room for the second motion area 140, thereby facilitating the loading of the circuit board W to the fixing component 210 below the second motion area 140 for fixing. The moving component 121 drives the curing component 110 to move to the second motion area 140 to perform curing treatment on the circuit board W on the fixing component 210 below it. At this time, another circuit board W can be loaded onto the curing component 110 below the first motion area 130. After the circuit board W in the second motion area 140 has completed curing, the curing component 110 can be switched back to the first motion area 130 via the moving component 121 to unload the cured circuit board W below the second motion area 140 and load the next circuit board W. Simultaneously, the circuit board W below the first motion area 130 can be cured. When it is necessary to change the curing surface of the circuit board W, the position or orientation of the circuit board W below the second motion area 140 can be adjusted (e.g., flipping the circuit board W) while the curing component 110 is in the first motion area 130 to change the curing surface of the circuit board W.

[0043] Another possible implementation is that the carrier assembly 120 includes a rotating component and a moving component 121. The rotating component is configured to drive the curing assembly 110 to rotate about a vertical direction, so that the curing assembly 110 can switch between a first movement region 130 and a second movement region 140. The moving component 121 is configured to drive the curing assembly 110 to move relative to the circuit board W along a first direction, so that the curing assembly 110 can move within the first movement region 130. Thus, the second movement region 140 of the fixing assembly 210 is located beside the first movement region 130 along a second direction. The first and second directions intersect, and the plane containing both the first and second directions intersects the vertical direction. Therefore, by driving the curing assembly 110 to switch between the first and second movement regions 130 by the rotating component, the space occupied by the curing assembly 110 in the first direction can be reduced, resulting in a compact structure and high processing efficiency for the curing mechanism 100. Preferably, the plane containing both the first and second directions is perpendicular to the vertical direction.

[0044] The functions of the rotating and moving parts 121 can be achieved using existing structures, resulting in a simple structure that is easy to maintain. For example, the rotating part can be a rotary cylinder, motor, or other structure that achieves rotational motion, while the moving part 121 can be a linear module or synchronous belt mechanism that achieves linear motion. The rotating part can be directly or indirectly connected to the curing component 110 via a rotating component, and the moving part 121 can be directly or indirectly connected to the rotating seat of the rotating part via a moving component. Thus, the moving part 121 can drive the rotating part to move, thereby moving the curing component 110, and the rotating part can drive the curing component 110 to rotate. The rotating and moving parts 121 can communicate with a controller, and appropriate rotation and / or movement control timing can be configured according to actual needs. This is a commonly used rotation and movement structure in industrial equipment design that can be understood by those skilled in the art. Of course, in specific applications, the rotating and moving parts 121 can also be implemented using other mechanical structures, as long as the corresponding rotation and movement functions can be achieved.

[0045] refer to Figure 2 , Figure 7 as well as Figure 9 As an example, the circuit board W can be positioned below the first movement area 130 via the fixing component 210 of the processing table 200. When loading, the curing component 110 can be positioned in the second movement area 140 to avoid the space above the fixing component 210. The circuit board W can then be loaded onto the fixing component 210. After loading, the curing component 110 can be rotated to the first movement area 130 via the rotating component to cure the circuit board W below the first movement area 130. Simultaneously, according to processing needs, the curing component 110 can be moved along the first direction within the first movement area 130 via the moving component 121 to process different positions of the circuit board W, thereby improving curing efficiency. After processing, the curing component 110 can be rotated to the second movement area 140 via the rotating component, so that the curing component 110 is positioned above the fixing component 210 on one side along the second direction, avoiding the space above the fixing component 210. This facilitates the replacement or adjustment of the circuit board W below the first movement area 130.

[0046] It is understood that the time the curing component 110 stays in each moving area or the speed of movement can be adjusted according to the specific curing requirements of the circuit board W. For example, when processing a larger circuit board W (such as a PCB), the curing component 110 can move along a first direction in the corresponding moving area (e.g., the first moving area 130) above the circuit board W under the drive of the moving component 121, thereby curing different areas of the circuit board W.

[0047] When it is necessary to increase the curing strength of a local area of ​​the circuit board W, or when the volume of material to be cured in a local area of ​​the circuit board W is large, the curing component 110 can move back and forth in the local area to perform multiple curing processes on the local area. The curing component 110 can move to stay above the local area for a set time to increase the curing time and achieve full curing of the area.

[0048] refer to Figure 3 and Figure 8 One possible implementation is that the curing mechanism 100 may further include a lifting assembly 150, which is directly or indirectly connected to the curing assembly 110. The lifting assembly 150 is configured to drive the curing assembly 110 to move vertically, thereby moving closer to or further away from the surface of the circuit board W. This adjusts the vertical processing distance between the curing assembly 110 and the circuit board W, adapting to different processing distance requirements of different circuit boards W. For example, for circuit boards W with different thicknesses or uneven shapes, a suitable processing distance can be achieved by adjusting the lifting assembly 150, ensuring the efficiency of the curing process and the consistency of the curing effect. For instance, when there are protrusions or depressions on the surface of the circuit board W, adjusting the distance between the curing assembly 110 and the circuit board W ensures that the curing assembly 110 always maintains an appropriate distance from the surface of the circuit board W, thereby avoiding insufficient curing due to excessive distance or localized overheating due to excessive distance. When the processing distance requirements of different areas of the same circuit board W are different, they can also be adjusted by the lifting component 150, thereby realizing the switching of multiple processing distances to meet the processing needs of complex circuit boards W.

[0049] It is understandable that the function of the lifting component 150 can be achieved using existing lifting structures. The structure is simple and easy to maintain. For example, the lifting component 150 can adopt a linear module or synchronous belt mechanism to achieve linear motion, with its movement direction set vertically. The moving parts of the lifting component 150 are connected to the curing component 110, thereby driving the curing component 110 to move vertically. The lifting component 150 can be mounted on the transport component 120, which drives the lifting component 150 to move the curing component 110. Furthermore, the lifting component 150 can be connected to a controller, and a suitable control timing can be configured according to actual needs. This is a commonly used lifting structure in industrial equipment design that is understandable to those skilled in the art. Of course, in specific applications, the lifting component 150 can also be implemented using other mechanical structures, as long as the corresponding lifting function can be achieved.

[0050] The lifting assembly 150 can be directly or indirectly connected to the curing assembly 110 in the following ways: the lifting assembly 150 is directly connected to the curing assembly 110, thereby driving 110 to move vertically; the transport assembly 120 is connected to the lifting assembly 150, thereby driving the lifting assembly 150 and the curing assembly 110 to move as a whole, thereby switching the movement area of ​​the curing assembly 110; or, the transport assembly 120 is connected to the curing assembly 110, and the lifting assembly 150 is connected to the transport assembly 120, thus the lifting assembly 150 can move vertically. The lifting assembly 150 is indirectly connected to the curing assembly 110 via the transport assembly 120, thereby driving the transport assembly 120 and the curing assembly 110 to move vertically as a whole; or, in the case where the lifting assembly 150 is indirectly connected to the curing assembly 110, when the transport assembly 120 includes multiple moving parts, such as the transport assembly 120 including a moving part 121 and a rotating part, the lifting assembly 150 can be connected between the moving part 121 and the rotating part, thereby being indirectly connected to the curing assembly 110 via the moving part 121 or via the rotating part.

[0051] refer to Figure 3 and Figure 8 In one example, the transport component 120 includes a moving part 121, and the lifting component 150 can be connected between the moving part 121 and the curing component 110.

[0052] The moving component 121 may employ a synchronous belt mechanism and may include a second motor 1211, a second transmission member 1216, a moving slide rail 1214, and a moving slider 1215. The moving slide rail 1214 extends along a first direction. The second transmission member 1216 is connected to the moving slider 1215. The second motor 1211 is driven by the second transmission member 1216. The moving slider 1215 is connected to the curing assembly 110 and is slidably connected to the moving slide rail 1214 along the first direction. The second motor 1211 is driven by the second transmission member 1216 and is configured to drive the second transmission member 1216 to move the moving slider along the moving slide rail 1214, thereby causing the curing assembly 110 to move along the first direction and achieving position adjustment of the curing assembly 110 along the first direction.

[0053] The second transmission component 1216 can adopt a commonly used linear transmission structure, such as a synchronous belt drive, a lead screw drive, or a rack and pinion drive. Taking a synchronous belt drive structure as an example, the second transmission component 1216 may include a synchronous pulley 1212 and a synchronous belt 1213. The two synchronous pulleys 1212 are spaced apart along a first direction. A second motor 1211 drives and connects to one of the synchronous pulleys 1212. The movable slide rail 1214, the synchronous pulley 1212, and the second motor 1211 are relatively fixed (for example, they can be mounted on the frame 300). The synchronous belt 1213 is wound around the synchronous pulley 1212. The movable slider 1215 is connected to the synchronous belt 1213, and the movable slider 1215 is slidably connected to the movable slide rail 1214 along the first direction. The second motor 1211 is configured to drive the synchronous pulley 1212 to rotate, thereby driving the synchronous belt 1213 to move along the first direction. The synchronous belt 1213 drives the movable slider 1215 to move along the first direction. By controlling the start, stop and speed of the second motor 1211, the moving slider 1215 can be precisely positioned and its speed adjusted in the first direction.

[0054] The lifting assembly 150 may include a first transmission member 151, a first motor 152, a lifting slide rail 153, and a lifting slider 154. The lifting slide rail 153 extends vertically, and the lifting slider 154 is connected to the curing assembly 110. The lifting slider 154 and the lifting slide rail 153 are slidably connected in the vertical direction. The first transmission member 151 is connected to the lifting slider 154, and the first motor 152 is driven by the first transmission member 151. The first motor 152 is configured to drive the first transmission member 151 to move the lifting slider 154 along the lifting slide rail 153, thereby driving the curing assembly 110 to move vertically and achieve lifting and lowering adjustment of the curing assembly 110.

[0055] The first transmission component 151 can adopt a commonly used linear transmission structure, such as a synchronous belt transmission structure, a lead screw transmission structure, or a gear and rack transmission structure. Taking the lead screw transmission structure as an example, the first transmission component 151 may include a lifting lead screw and a lead screw nut. The lifting lead screw and the lifting slide rail 153 extend vertically. The lead screw nut is sleeved on the lifting lead screw, and the lead screw nut and the lifting lead screw are threaded together, that is, the lead screw nut and the lifting lead screw form a helical pair to convert the rotational motion of the lifting lead screw into the vertical movement of the lead screw nut. The first motor 152 is driven and connected to the lifting lead screw. The first motor 152 is configured to drive the lifting lead screw to rotate. Specifically, the forward and reverse rotation of the first motor 152 can drive the lifting lead screw to rotate. The lifting slider 154 is connected to the lead screw nut, and the moving lead screw nut drives the lifting slider 154 to move. The lifting slider 154 is also connected to the curing component 110. Therefore, the forward and reverse rotation of the first motor 152 can drive the lifting screw to rotate, thereby driving the screw nut to move up and down along the lifting screw axis (i.e., the vertical direction), realizing the lifting slider 154 to move up and down in the vertical direction, thereby driving the curing component 110 to move up and down.

[0056] The moving component 121 can drive the lifting assembly 150 and the curing assembly 110 connected to the lifting assembly to move along a first direction, thereby realizing the lifting and lowering adjustment of the curing assembly 110. For example, the first motor 152 and the lifting slide rail 153 can be connected to the moving slider 1215 of the moving component 121. The moving component 121 can drive the moving slider 1215 to move along the first direction, thereby driving the lifting assembly 150 and the curing assembly 110 to move together along the first direction. The lifting assembly 150 can drive the lifting slider 154 to move up and down, thereby driving the curing assembly 110 to move up and down in the vertical direction. The second motor 1211 and the first motor 152 can be controlled by the controller to realize the movement of the curing assembly 110 in the first direction and the lifting and lowering movement in the vertical direction.

[0057] In another example, the transport assembly includes a moving part, a rotating part, and a lifting part. The moving part and the lifting part can adopt the structure of the previous example. The rotating part can be a rotary cylinder, including a rotary cylinder body and a rotary output shaft. The rotary cylinder body is connected to the lifting slider of the lifting part, and the rotary output shaft extends vertically and is connected to the curing part. Driven by the rotary cylinder, the curing part can rotate around the axis of the rotary output shaft, thereby switching between different movement areas of the curing part.

[0058] Therefore, the moving component can drive the moving slider to move along the first direction, thereby causing the lifting component, rotating component, and curing component to move together along the first direction. The lifting component can drive the lifting slider to move up and down, thereby causing the rotating component and curing component to move up and down vertically. The rotating component can drive the curing component to rotate around a vertical axis via its output shaft, thus allowing the curing component to switch between the first and second movement areas. The movement of the curing component in the first direction, the vertical lifting and lowering movement, and the rotation around the vertical direction can be achieved by controlling the second motor, the rotary cylinder, and the first motor through the controller.

[0059] refer to Figure 8 It is understood that the curing assembly 110 may include a connector 111 and a curing component 112. The connector 111 is connected to the transport assembly 120. For example, the curing component 112 can be connected to the lifting assembly 150 or the rotating component via the connector 111. Figure 8 (Not shown in the image) is connected to achieve the installation of the curing component 112.

[0060] The curing element 112 includes, but is not limited to, UV lamps, mercury lamps, etc. The curing element 112 on the connector 111 can be a single type of curing element 112, for example, all curing elements 112 may be curing lamps. Alternatively, the connector 111 may have multiple connecting parts, each connected to a curing element 112. The curing elements 112 at each connecting part of the connector 111 can be combinations of different types of curing elements 112, such as UV lamps and mercury lamps located at different connecting parts, which can be selected or combined according to the characteristics of the material to be cured. Of course, the curing elements 112 at different connecting parts can also be of the same type; for example, each connecting part may have curing elements 112 that are all UV lamps or all mercury lamps. The curing elements 112 at different connecting parts can work independently, and the start and stop of different curing elements 112 can be controlled by a controller, thereby allowing the switching of curing elements 112 at different connecting parts to adapt to different curing requirements.

[0061] As an example, the curing mechanism 100 of this application embodiment can be applied to the curing process of ink on the printed surface in PCB production. After the PCB board is printed by inkjet printer, the ink on the printed surface of the PCB needs to be cured to ensure that the ink adheres firmly to the PCB surface and has good electrical properties. The curing component 112 can be a UV lamp, which cures the ink by emitting UV light to achieve PCB ink curing process; or, different types of curing components 112 can be combined according to the material to be cured and the process requirements of the actual circuit board W to be processed, so as to achieve a dual curing effect.

[0062] In some embodiments, the circuit board W may be a PCB board. It is understood that in other embodiments, the circuit board W may also be other types of circuit boards W, such as metal parts, plastic parts, or composite material parts. During the curing process, the curing component 112 in the curing assembly 110 can emit curing light (such as UV light) toward the circuit board W to cure the ink on the printed surface of the PCB board. The curing mechanism 100 drives the curing assembly 110 to switch between the first movement area 130 and the second movement area 140 via the transport assembly 120, so that the curing component 112 can act on the designated area of ​​the circuit board W as needed in different processing stages, while avoiding interference with the processing table 200 or other structures.

[0063] In other examples, when multiple curing components 112 are configured, the start-stop sequence of the curing components 112 can be set according to the sequence requirements of the processing technology, thereby achieving more refined curing control. For example, the heating module can be started first for preheating treatment, and then the curing lamp can be started for irradiation and curing, thereby improving the curing effect and material adaptability.

[0064] It is understandable that the curing component 112 can be detachably connected to the corresponding connecting part, for example, the curing component 112 can be connected to the connecting part of the connector 111 by a detachable connection method such as threaded connection, snap-fit, or plug-in connection. The curing component 112 can also be fixedly connected to the corresponding connecting part, for example, the curing component 112 can be fixedly installed by welding, riveting, etc.

[0065] In one possible implementation, the connector 111 has multiple connecting parts, each connected to a curing member 112. The curing member 112 of each connecting part is configured to be partially openable and / or to partially adjust the light intensity of the curing beam, which is beneficial to improving the flexibility and applicability of the curing mechanism 100, as well as effectively reducing energy consumption and improving equipment efficiency.

[0066] For example, the curing elements 112 of multiple connections can be individually turned on or off to cure specific areas according to different processing requirements, avoiding damage to non-cured areas of the circuit board W or equipment caused by the curing elements 112. For example, in some cases, a local area on the surface of the circuit board W needs curing. In this case, the curing element 112 opposite to the local area in the curing assembly 110 is turned on, while the other curing elements 112 can be turned off, thereby curing the required area. For the area requiring curing, the intensity of each curing element 112 can also be adjusted independently. Taking a UV lamp as an example, the intensity of the UV light can be controlled by changing the voltage, thereby adjusting the curing intensity.

[0067] In some cases, if the surface of the circuit board W that needs to be cured has areas with different required curing strengths, for areas requiring higher curing strength, the light intensity of the curing component 112 corresponding to that area of ​​the circuit board W can be increased when the curing component 112 is turned on. In areas requiring relatively lower curing strength, the light intensity of the curing component 112 corresponding to that area can be reduced. This can adapt to the different curing energy requirements of different materials or processes on the surface of the circuit board W.

[0068] Alternatively, in the curing assembly 110, at least two connecting parts are connected to curing components 112 with different power ratings. For example, some connecting parts can be fitted with curing components 112 with higher rated power, forming a combination of curing components 112 with different power distributions. Each curing component 112 can be independently started and stopped by a control system or manually operated, allowing for switching between them. When higher-intensity curing is required, the higher-power curing component 112 is activated; when lower-intensity curing is required, the higher-power curing component 112 is deactivated and the lower-power curing component 112 is activated. This adapts to the different processing intensity requirements of different circuit boards W, improving the applicability of the curing mechanism 100.

[0069] In practical applications, the connecting parts on the connector 111 can be flexibly arranged according to actual processing or installation requirements. For example, multiple connecting parts can be arranged in a matrix or adapted to the shape of the circuit board W. The position and number of the curing components 112 connected to each area can also be reasonably arranged according to the shape characteristics and processing requirements of the circuit board W, thereby improving the compatibility of the curing assembly 110 with circuit boards W of different shapes and sizes. In addition, the motion control of the transport assembly 120 enhances the flexibility of the curing mechanism 100 to different processing requirements, further enhancing the versatility and utilization of the curing mechanism 100.

[0070] refer to Figures 1 to 4 It is understood that the curing apparatus of this application embodiment carries the circuit board W to be processed on the processing table 200, and adopts the curing mechanism 100 of any of the foregoing embodiments. The curing component 110 can be driven by the transport component 120 to switch between the first movement area 130 and the second movement area 140, so that the curing component 110 can be driven to avoid the space above the processing table 200 when needed, so as to load materials onto the processing table 200, unload materials from the processing table 200, or adjust the curing surface of the circuit board W placed on the processing table 200.

[0071] refer to Figure 2 , Figure 9 and Figure 10The processing table 200 may include a fixing component 210 and a support component 220. The fixing component 210 is configured to carry the circuit board W, and the support component 220 is supported below the fixing component 210. The support component 220 can be connected to the frame 300 to realize the installation of the processing table 200. The transport component 120 of the curing mechanism 100 can also be connected to the frame 300. Therefore, when the curing component 110 is in the first movement area 130, the curing component 110 is located in the space above at least one fixing component 210, and the curing component 110 is configured to perform curing processing on the circuit board W below. When the curing component 110 is in the second movement area 140, the curing component 110 avoids the space above at least one fixing component 210, thereby freeing up the space above the fixing component 210 for loading or unloading the circuit board W.

[0072] Therefore, when the curing device is used, the curing component 110 can be moved to the second movement area 140 by the transport component 120, so that the curing component 110 avoids the space above at least one fixed component 210. The circuit board W is then loaded onto the fixed component 210, and then the curing component 110 is moved back to the first movement area 130 by the transport component 120 to perform curing treatment on the loaded circuit board W. It is understood that the implementation of the transport component 120 and the fixed component 210 can be referred to the above description, and will not be repeated here.

[0073] One possible implementation is that the curing device may include a processing table 200, one of the moving areas of the curing component 110 (e.g., the first moving area 130) may be located above the fixed component 210 of the processing table 200, and the other moving area (e.g., the second moving area 140) may be located above the fixed component 210. Thus, when loading or unloading is required, the curing component 110 is driven to the moving area (e.g., the second moving area 140) above the fixed component 210 of the processing table 200 by the transport component 120, so as to free up the space above the fixed component 210 on the processing table 200, which is convenient for operators or automated equipment to load or unload the circuit board W or adjust the curing surface.

[0074] Another possible implementation is that the curing device may include multiple processing tables 200, and multiple first motion areas 130 of the curing component 110 may be respectively disposed above the processing tables 200, while the second motion area 140 may be disposed around the first motion area 130 according to any of the aforementioned examples. The curing component 110 may be initially disposed in one of the first motion areas 130, avoiding the area above the other processing tables 200, so that operators or automated equipment can perform operations such as loading or unloading or adjusting the curing surface of the circuit board W. Simultaneously, the circuit board W on the processing table 200 below the curing component 110 is cured. By switching the motion area of ​​the curing component 110 between different processing tables 200, continuous processing of multiple circuit boards W can be achieved, thereby improving the overall processing efficiency.

[0075] It is understood that the processing table 200 may include two opposing fixing components 210, which are used to clamp the circuit board W. For example, the fixing components 210 may include a gripper structure, and the fixing components 210 are configured to clamp and fix the edges of the circuit board W on opposite sides. Alternatively, the fixing components 210 may also include abutment blocks, which support the circuit board W from the bottom or abut against the side of the circuit board W to fix the circuit board W. The processing table 200 may also include two opposing support components 220, each of which is supported below a fixing component 210. This allows the circuit board W, clamped between the two fixing components 210, to be suspended between the two support components 220, preventing the structure of the processing table 200 from damaging the surface of the circuit board W.

[0076] See Figure 2 and Figure 9 The processing table 200 may also include a drive assembly 230. At least one of the two support assemblies 220 may be movably mounted on the frame 300. The drive assembly 230 is connected to at least one movably mounted support assembly 220. The drive assembly 230 is configured to drive at least one support assembly 220 to move, so that the two support assemblies 220 can move relative to each other, so that the two fixed assemblies 210 can move toward or away from each other. This is applicable to the clamping of circuit boards W of different sizes.

[0077] The drive assembly 230 may include actuators such as cylinders or hydraulic cylinders. Alternatively, the drive assembly 230 may employ a motor and a lead screw and nut mechanism. The movement of the drive assembly 230 drives the support assembly 220 to move along the guide rail, thereby adjusting the distance between the two fixed assemblies 210 to accommodate circuit boards W of different sizes. For example, the drive assembly 230 may include a drive motor 231, a transmission lead screw 232, and a guide rail 233. The transmission lead screw 232 is connected to the output end of the drive motor 231. The guide rail 233 is mounted on the frame 300. The support assembly 220 engages with the transmission lead screw 232 via a nut. At least one support assembly 220 may be slidably connected to the guide rail 233, or at least one support assembly 220 may be connected to the guide rail 233 via a slider, thereby enabling the support assembly 220 to be movable relative to the guide rail. By controlling the forward and reverse rotation of the drive motor 231, the transmission screw 232 is driven to rotate and move the support assembly 220. The relative position of the two support assemblies 220 can be adjusted, and the distance between the fixed assembly 210 can be fixed to achieve stable clamping of circuit boards W of different sizes.

[0078] In one possible implementation, such as Figure 10 As shown, the curing apparatus may include at least two processing tables 200, which may be two, three, or more. A gap 250 exists between adjacent processing tables 200. The second moving area 140 may be arranged in the space above the gap 250 and / or in the space above the side of the processing table 200. The space above the side of the processing table 200 does not include the space above the gap 250; that is, the space above the side of the processing table 200 is distinct from the space above the gap 250. This allows the curing component 110 to be positioned above the gap 250 and / or the fixing component 210 to be positioned distinct from the space above the side of the gap 250, thereby avoiding interference with the circuit board W on the processing table 200.

[0079] The curing mechanism 100 can be a single unit. The curing component 110 of the curing mechanism 100 can switch between a first movement area 130 and a second movement area 140, allowing the curing component 110 to perform processing or avoidance actions above multiple processing tables 200. When the curing component 110 is processing above one processing table 200, the other processing tables 200 can serve as waiting positions for loading and processing. When the curing component 110 completes the curing process of the circuit board W on one processing table 200, the curing component 110 moves to another processing table 200 for curing. The completed processing table 200 can then be used for unloading and loading of new circuit boards W, or for adjusting the curing surface. After loading or adjusting the curing surface, the system can wait for the next processing operation of the curing component 110. The number of curing mechanisms 100 can also be two or more, and their number can be matched with the number of processing tables 200. Each curing mechanism 100 corresponds to one or more processing tables 200 to realize the switching of the curing component 110 between the spaces above different processing tables 200. Increasing the number of curing mechanisms 100 can effectively reduce the waiting time of multiple processing tables 200, realize the processing of multiple curing components 110 at multiple workstations, and help improve processing efficiency.

[0080] When the curing device includes at least two processing tables 200 and the number of curing mechanisms 100 is multiple, each curing mechanism 100 can be arranged sequentially along the arrangement direction of the processing tables 200. The first movement area 130 of the curing component 110 of each curing mechanism 100 can be located above a corresponding processing table 200, and the second movement area 140 can be located in the interval area 250 between the fixing components 210 of two adjacent processing tables 200. The first movement area 130 and the second movement area 140 can be switched by the movement of the curing component 110 of each curing mechanism 100 along the arrangement direction of the processing tables 200, so as to perform curing treatment on the circuit board W on the corresponding processing table 200 or avoid it. Alternatively, the second motion area 140 may be located above the fixed component 210, which is different from the interval area 250 (i.e., the interval area 250 between the fixed components 210 of two adjacent processing tables 200). The curing component 110 of each curing mechanism 100 can switch between the first motion area 130 and the second motion area 140 by rotating the component, so as to perform curing treatment on the circuit board W on the corresponding processing table 200 or avoid it.

[0081] Understandably, in some technologies, for circuit boards W requiring multi-sided curing, after curing one side, the position and / or orientation of the circuit board W needs to be adjusted so that the other surfaces to be cured are aligned with the curing beam. In some curing technologies, the circuit board W to be cured is typically fed into the processing position (i.e., below the curing assembly) by a conveyor device for curing. After processing, the conveyor device moves the circuit board W out of the processing position below the curing assembly, and then the other curing surfaces of the circuit board W are adjusted before being fed back into the processing position for continued curing. The operation of adjusting the curing surfaces is cumbersome, increasing the complexity of the process. During the conveying process, the curing lamp is idle and waiting, resulting in low utilization and hindering the improvement of processing efficiency. Multiple conveyings of the circuit board W may also cause repeated positioning errors, leading to deviations in the position of the circuit board W and affecting the accuracy of the curing position and the processing quality.

[0082] In comparison, reference Figure 9 In some possible implementations of this application, the processing table 200 may further include a flipping component 240, which is connected between the support component 220 and the fixing component 210. The flipping component 240 is configured to drive the fixing component 210 to flip, thereby changing the curing surface of the circuit board W. Therefore, when it is necessary to adjust the curing surface of the circuit board W, the curing mechanism 100 can drive the curing component 110 to move relative to the circuit board W via the transport component 120, switching to a movement area that avoids the upper area of ​​the circuit board W, thereby allowing the flipping component 240 to flip and adjust the circuit board W. After flipping, the curing component 110 can be switched back to the upper movement area of ​​the circuit board W via the transport component 120 to continue curing operations on other curing surfaces of the circuit board W. Therefore, the circuit board W can complete the adjustment of the curing surface without completely moving out of the processing area, which can effectively reduce the waiting time and repeated positioning error of the circuit board W during the transport process, and further improve the overall processing continuity and efficiency.

[0083] For example, the curing device can be used for ink curing on the printed surface of a PCB. The processing table 200 can fix the edges of opposite sides of the PCB board via the fixing component 210. After ink curing is completed on one surface of the PCB board, the curing component 110 is driven by the transport component 120 to avoid the area above the circuit board W. Then, the PCB board can be flipped over by the flipping component 240 so that the other side faces up. After the flipping is completed, it returns to the upper area to perform curing treatment on the other side. This reduces the number of times the circuit board W is transported and the waiting time of the curing component 110, improves the utilization efficiency of the curing component 110, and helps to improve processing efficiency.

[0084] When the curing device includes multiple processing tables 200, the multiple processing tables 200 can be spaced apart on the frame 300 to support different circuit boards W respectively. After the current processing table 200 completes the curing process, the curing component 110 can be moved to the processing area of ​​the next processing table 200 to achieve continuous curing operation. The circuit board W on the previous processing table 200 can be adjusted or replaced, thereby realizing efficient utilization of each processing area of ​​the curing component 110 and multi-station operation.

[0085] This application also provides a circuit board processing device, including a conveying device and a curing device of any of the above embodiments (see reference). Figures 1 to 10 The conveying device is configured to transfer circuit boards W to the processing table 200 of the curing device for loading operations, and / or to remove circuit boards W placed on the processing table 200 for unloading operations. The curing component 110 is switched between a first movement area 130 and a second movement area 140 by the transport component 120, and in the second movement area 140, the curing component 110 is adapted to avoid the space above at least one circuit board W. The conveying device can transport circuit boards W on the processing table 200 that the curing component 110 has avoided, and can also load new circuit boards W onto the processing table 200.

[0086] For example, when a processing table 200 needs to be loaded, the curing component 110 can be moved to a position away from the processing table 200 (e.g., moved to the second movement area 140). At this time, the transport device can place the circuit board W on the processing table 200 without interfering with the curing component 110. After loading, the curing component 110 can move to the area above the circuit board W (e.g., the first movement area 130) for curing. During the processing, the transport device can simultaneously perform loading or unloading operations on other processing tables 200, thereby realizing parallel operation of curing and loading / unloading operations in a single circuit board processing device. After the circuit board W on the current processing table 200 is completed, the curing component 110 can be switched to an area away from the area above the circuit board W (e.g., the second movement area 140). The transport device can then transport the circuit board W that has been completed by the curing component 110, while simultaneously sending a new circuit board W to be processed into the processing table 200 for curing.

[0087] It is understood that the handling device may include a motion mechanism and a pick-and-place mechanism. The pick-and-place mechanism is configured to pick up and place the circuit board W. The motion mechanism is connected to the pick-and-place mechanism and is configured to drive the pick-and-place mechanism to move so as to move the circuit board W, thereby loading or unloading the processing table 200 after the curing assembly 110 avoids the processing table 200.

[0088] The motion mechanism can be connected to the frame 300 or fixedly mounted relative to the frame 300 (e.g., both the frame 300 and the motion mechanism are fixed to the ground or other fixed devices). The motion mechanism can be a robotic arm or a multi-axis moving structure. For example, when the motion mechanism uses a robotic arm, the front end of the robotic arm is connected to a pick-and-place mechanism, and the robotic arm can drive the pick-and-place mechanism to perform pick-and-place operations. When the motion mechanism uses a multi-axis moving structure, multiple linear guides can be combined to achieve horizontal movement, lifting movement, and other multi-degree-of-freedom movements of the pick-and-place mechanism, to adapt to the positional changes of different processing tables 200 and the pick-and-place requirements of circuit boards W. For example, the multi-axis moving structure may include X-axis guides, Y-axis guides, and Z-axis guides, and the precise positioning of the pick-and-place mechanism in space is achieved through the coordinated action of each axis.

[0089] The picking and placing mechanism can take the form of grippers, suction cups, or robotic arms, depending on the shape, weight, and material of the circuit board W. During the handling process, the motion mechanism drives the picking and placing mechanism to the target position, whereby the picking and placing mechanism grabs or releases the circuit board W, thereby completing the loading or unloading operation.

[0090] When the processing equipment includes multiple processing tables 200, a conveying device can be set up for each processing table 200 to improve loading and unloading efficiency. For example, when the processing equipment includes two processing tables 200, two conveying devices can be set up to handle their respective loading and unloading operations. The two conveying devices can be set up on the same side or opposite sides. For example, along the vertical direction of the processing table 200 arrangement, the two conveying devices can be set up on the same side, or on opposite sides. Setting them on the same side allows workers to operate and maintain the equipment on the same side, or to connect to external equipment on the same side, facilitating material supply and finished product transfer; while setting them on opposite sides reduces interference between the conveying devices and improves operational stability. The layout of the conveying devices can be designed according to the overall structure of the processing equipment, production cycle, and space utilization. In other possible implementations, multiple processing tables 200 can also share at least one conveying device. Reducing the number of conveying devices simplifies the structure and reduces costs. By rationally planning the conveying paths, loading and unloading operations of circuit boards W on multiple processing tables 200 can be achieved.

[0091] The curing mechanism 100, curing device, and processing equipment of this application embodiment can be applied to the curing processing needs of various circuit boards W. The position of the curing component 110 can be switched conveniently to avoid the workstation to be loaded or to avoid the circuit board W that has been processed, thereby facilitating loading and unloading operations and helping to improve processing efficiency.

[0092] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A curing mechanism, characterized in that, include: The curing component is configured to cure the circuit board. A carrier assembly connected to the curing assembly is configured to drive the curing assembly to move relative to the circuit board, such that the curing assembly has a first movement region and a second movement region, wherein when the curing assembly is in the first movement region, the curing assembly is adapted to be disposed in the space above the circuit board for curing the circuit board. When the curing component is in the second movement area, the curing component is adapted to avoid the space above the circuit board.

2. The curing mechanism according to claim 1, characterized in that, The carrier assembly includes a moving component configured to drive the curing assembly to move relative to the circuit board along a first direction, thereby switching the curing assembly between a first movement region and a second movement region; the first direction intersects the vertical direction.

3. The curing mechanism according to claim 2, characterized in that, The curing component has a first moving area, and the second moving area is arranged along the first direction on one or both sides of the first moving area; Alternatively, the curing component has at least two first motion regions arranged along the first direction, and the second motion region is arranged between adjacent first motion regions; Alternatively, the curing component has at least two first motion regions arranged along the first direction, and the second motion region is arranged on at least one of the two disjoint sides of the adjacent first motion regions; Alternatively, the curing component has at least two first motion regions arranged along the first direction, the second motion region being arranged between adjacent first motion regions, and the second motion region also being arranged on at least one of the two disjoint sides of the adjacent first motion regions.

4. The curing mechanism according to claim 1, characterized in that, The carrier assembly includes a rotating component and a moving component, wherein, The rotating component is configured to drive the curing assembly to rotate about a vertical direction, so that the curing assembly can rotate and switch between the first motion region and the second motion region; The moving component is configured to drive the curing assembly to move relative to the circuit board along a first direction, so that the curing assembly moves within a first movement area; the first direction intersects the vertical direction.

5. The curing mechanism according to any one of claims 1 to 4, characterized in that, The curing mechanism further includes a lifting component connected to the curing component, the lifting component being configured to drive the curing component to move vertically toward or away from the circuit board.

6. The curing mechanism according to claim 5, characterized in that, The lifting assembly includes: A lifting slide rail, which extends along the vertical direction; A lifting slider is connected to the curing component, and the lifting slider and the lifting slide rail are slidably connected in the vertical direction. A first transmission component is connected to the lifting slider; A first motor is driven and connected to the first transmission component. The first motor is configured to drive the first transmission component to move the lifting slider along the lifting slide rail, thereby driving the curing component to move in the vertical direction.

7. The curing mechanism according to claim 2 or 4, characterized in that, The movable component includes: A movable slide rail, which extends along the first direction; A movable slider is connected to the curing component and is slidably connected to the movable slide rail along the first direction; A second transmission component is connected to the movable slider; The second motor is driven and connected to the second transmission component. The second motor is configured to drive the second transmission component to move the movable slider along the movable slide rail, thereby driving the curing component to move in the first direction.

8. The curing mechanism according to claim 1, characterized in that, The curing component includes a connector and a curing element. The connector is connected to the carrier component and includes multiple connecting portions, each of which is connected to the curing element. The curing element is configured to emit a curing beam. Wherein: The curing element of the plurality of connecting portions is also configured to be partially openable and / or partially adjustable in light intensity of the curing beam; Alternatively, at least two of the connecting parts are connected to the curing elements with different powers.

9. A curing apparatus, characterized in that, include: frame; A processing table, which is mounted on the frame, is configured to carry a circuit board; as well as The curing mechanism according to any one of claims 1 to 8, wherein the carrier component of the curing component is connected to the frame, wherein when the curing component is in the first movement area, the curing component is located in the space above the processing table, and the curing component is configured to perform curing processing on the circuit board placed on the processing table; when the curing component is in the second movement area, the curing component avoids the space above the processing table.

10. The curing apparatus according to claim 9, characterized in that, The processing table includes a fixing component and a support component. The fixing component is configured to support the circuit board, and the support component is supported below the fixing component and connected to the frame. Alternatively, the processing table may further include a flipping assembly connected between the support assembly and the fixing assembly, the flipping assembly being configured to drive the fixing assembly to flip, thereby changing the curing surface of the circuit board.

11. The curing apparatus according to claim 9, characterized in that, The curing apparatus includes at least two processing tables, with a gap between adjacent processing tables; wherein: The second motion area is arranged in the space above the interval area; And / or, the second motion area is arranged in the space above and to the side of the processing table, and the space above and to the side of the processing table does not include the space above the interval area.

12. Circuit board processing equipment, characterized in that, include: The conveying device and the curing apparatus according to any one of claims 9 to 11, wherein the conveying device is configured to transfer a circuit board to the processing table of the curing apparatus, and / or to remove the circuit board placed on the processing table.

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