Sensor harness assembly structure

Abstract

A sensor wire harness assembly structure relates to the technical field of eddy current sensor wire harness assembly, and is used for solving the problems of arranging the eddy current sensor in a narrow space in the thickness direction and the problems caused by hot-pressing wire harness assembly. The sensor wire harness assembly structure comprises a shell, a PCB board, wire harnesses and a resin layer; the shell has a containing cavity; the PCB board is arranged in the containing cavity of the shell; the wire harnesses are arranged in multiple, the multiple wire harnesses are distributed at intervals, and one end of the wire harnesses is electrically connected to the PCB board; the resin layer is arranged in the shell, the resin layer is cast in the containing cavity, and the resin layer can wrap the PCB board after solidification; a plurality of interval-distributed wiring holes are formed in the side wall of the shell, the wiring holes penetrate through the side wall of the shell, the plurality of wiring holes correspond to the plurality of wire harnesses one by one, the wire harnesses are arranged in the corresponding wiring holes, along the opening direction of the containing cavity, the wiring holes are located on the upper side of the PCB board, along the direction of the inner wall of the shell pointing to the outer wall, and the wiring holes comprise a taper counterbore section, a glue overflow section and a straight hole section connected in sequence.

Description

Technical Field

[0001] This application relates to the field of eddy current sensor harness assembly technology, and in particular to a sensor harness assembly structure. Background Technology

[0002] The wiring harness assembly of the eddy current sensor is a structure in which the wiring harness is fixedly mounted on the PCB board. The wiring harness installation of the eddy current sensor includes both rigid terminals and wiring harnesses. When communicating and supplying power through the wiring harness, the wiring harness and the housing of the eddy current sensor need to be fixedly connected to ensure the stability of the wiring harness position and the connection effect.

[0003] In existing eddy current sensors, when the customer's installation environment has limited space, in order to reduce the overall thickness of the sensor, a wire harness through-hole method and thermocompression welding are used for assembly. However, the through-hole wire harness is a multi-strand wire, which is easy to come apart during thermocompression welding, causing short circuits with the connected wire harnesses.

[0004] For example, an eddy current sensor has 6 wires, which need to be drilled 6 times and each wire needs to be positioned and adjusted for easy welding, resulting in very low assembly efficiency. In addition, in order to ensure the natural transition of the wires and the strength of the drilled structure, the thickness of traditional eddy current sensors is generally 12mm-15mm, which is not very suitable for the layout environment of the OEM where the thickness of the sensor is strictly required. Utility Model Content

[0005] This application provides a sensor harness assembly structure to solve the problems of eddy current sensor placement in a narrow space in the thickness direction and the problems caused by thermocompression welding of the harness assembly.

[0006] This application provides a sensor wiring harness assembly structure, including a housing, a PCB board, wiring harnesses, and a resin layer. The housing has a receiving cavity. The PCB board is disposed within the receiving cavity of the housing. The wiring harness consists of multiple wires spaced apart, with one end of each wire harness electrically connected to the PCB board. The resin layer is disposed within the housing and poured into the receiving cavity. After solidification, the resin layer can encapsulate the PCB board. Multiple spaced wiring holes are provided on one side wall of the housing, penetrating one side wall of the housing. Each wiring hole corresponds to one of the multiple wiring harnesses, and the wiring harnesses pass through the corresponding wiring holes. Along the opening direction of the receiving cavity, the wiring holes are located on the upper side of the PCB board. Along the direction from the inner wall of the housing to the outer wall, the wiring holes include a conical countersunk section, an overflow section, and a straight section connected in sequence. Along this direction, the cross-section of the conical countersunk section gradually decreases, the diameter of the conical countersunk section is larger than the diameter of the straight section, and the diameter of the overflow section is larger than the diameter of the conical countersunk section, so that the poured resin layer can enter the overflow section through the conical countersunk section. After solidification, the wiring harness and the housing are relatively fixed.

[0007] This application addresses the problems of easy breakage and short circuits, low pull-out force, and easy poor soldering of perforated wire harnesses in the prior art. It guides the resin through a three-section structure: the tapered countersunk section with a gradually decreasing cross-section guides the resin flow from the receiving cavity to the overflow section. The overflow section serves as a resin storage cavity. After curing, it forms a resin block. Together with the limiting function of the straight hole section, it firmly locks the wire harness to the housing, avoiding the problems of wire harnesses being easy to loosen and pull off in the traditional structure.

[0008] After the resin layer solidifies, it completely encapsulates the PCB board, achieving a sealed protection against vibration, corrosion, and dust. At the same time, multiple wire harnesses are spaced apart to avoid the risk of short circuits between wire harnesses. The wiring holes are located on the upper side of the PCB, which not only facilitates the wire harnesses to be led out from the upper side of the housing, but also provides a reasonable flow direction for resin pouring, taking into account both assembly convenience and functional reliability.

[0009] In some embodiments of this application, the wiring hole extends through the upper side wall of the housing along the opening direction of the receiving cavity. When the opening of the receiving cavity faces upward, the wiring hole extends through the upper side wall, allowing the wire harness to be led out vertically and obliquely upward, avoiding interference with the fixed bracket or other equipment outside the sensor, improving scene adaptability and installation convenience. At the same time, the wiring hole on the upper side wall is aligned with the opening direction of the receiving cavity, allowing the resin to naturally cover the inside of the wiring hole during resin pouring, ensuring that the resin flows smoothly into the overflow section.

[0010] In some embodiments of this application, the central angle of the straight hole segment along the axial direction of the wiring hole is greater than 180°. This portion allows the wire harness to be inserted and initially fixed from the upper opening, facilitating assembly and casting. Furthermore, compared to a complete circular hole, the C-shaped straight hole segment is easier to mold and less costly to manufacture.

[0011] In some embodiments of this application, an extension is formed on the housing, and the extension is located in the housing area where the wiring hole is located. The wiring hole penetrates through the side wall of the housing, which weakens the structural rigidity of the area. The extension can reinforce the weakened housing thickness, preventing cracking or deformation of the housing during vibration or impact. At the same time, the extension only locally strengthens the wiring hole area, without the need to thicken the housing as a whole, thus avoiding an increase in the size of the sensor.

[0012] In some embodiments of this application, the inner arc surface of the conical countersunk section is conical. The conical arc surface is smooth and has a uniform angle, so that the resin flows in from the receiving cavity without dead corners or obstructions, and can be evenly filled to the overflow section, avoiding resin accumulation or poor flow due to irregular arc surface; the conical shape can be processed by standard conical cutters, the mold design is simple and the precision is easy to control; the smooth conical arc surface fits the resin more tightly, and after curing, it can reduce the gap between the resin and the hole wall, prevent external dust and liquid from seeping into the receiving cavity from the gap, and improve the overall sealing performance.

[0013] In some embodiments of this application, the taper of the conical surface gradually decreases in the direction from the inner wall to the outer wall. The steep inner taper can quickly guide a large amount of resin from the receiving cavity into the conical counterbore section, while the gentle outer taper slows down the resin flow rate, allowing the resin to smoothly transition to the overflow section and avoiding resin splashing or eddy currents in the overflow section due to excessive flow rate. The outer conical surface of the gentle taper has a higher degree of fit with the wire harness, allowing the resin to more evenly coat the surface of the wire harness, resulting in a stronger bond between the wire harness and the resin after curing.

[0014] In some embodiments of this application, the cross-sectional shape of the overflow section is square in the direction from the inner wall of the housing to the outer wall. After the overflow section with square cross-section cures, it forms a square resin block. The block is completely fitted with the square hole wall, and the hole wall can restrict the circumferential rotation of the resin block, thereby locking the wire harness and preventing poor contact or short circuit caused by the rotation of the wire harness. Compared with a circular cross-section, the resin block with square cross-section has stronger shear resistance.

[0015] In some embodiments of this application, the length of the overflow section is greater than the length of the conical counterbore section and less than the length of the straight hole section in the direction from the inner wall of the housing to the outer wall.

[0016] The straight hole section is the main positioning section of the wire harness. A longer straight hole section can increase the contact area between the wire harness and the hole wall, improving the stability of temporary fixation (before resin curing). The overflow section needs to be long enough to store sufficient resin to ensure that the size of the formed resin clip meets the standard. The tapered countersunk hole section only needs to achieve the flow guiding effect. This design distribution can minimize the housing size while ensuring the reliability of wire harness fixation. The sensor thickness can be reduced to 8.5mm, which is beneficial for placement in confined spaces. The structure is reliable and the process is simple.

[0017] In some embodiments of this application, the wire harness is clearance-fitted with the conical countersunk section of the corresponding wiring hole and interference-fitted with the straight hole section of the corresponding wiring hole. The clearance fit allows for resin flow channels, preventing the wire harness from clogging the hole section, while the interference fit temporarily fixes the wire harness inside the wiring hole and traps resin, preventing it from overflowing. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the technical solution of this utility model and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solution of this utility model and do not constitute a limitation on the technical solution of this utility model.

[0019] Figure 1 This is a schematic diagram of a sensor harness assembly structure provided in an embodiment of this application after the resin layer has been removed.

[0020] Figure 2 This is a front view of a sensor harness assembly structure provided in an embodiment of this application after the resin layer has been removed.

[0021] Figure 3 This is a cross-sectional view of a sensor harness assembly structure provided in an embodiment of this application after the resin layer has been removed.

[0022] Figure 4 A sensor harness assembly structure provided in this application embodiment Figure 3 A magnified view of a portion of point A in the middle.

[0023] Figure 5 This is a schematic diagram of a sensor harness assembly structure provided in an embodiment of this application.

[0024] Reference numerals: 1-Housing; 11-Receiving cavity; 12-Positioning boss; 13-Extension part; 2-PCB board; 3-Wire harness; 4-Connection hole; 41-Conical countersunk hole section; 42-Overflowing glue section; 43-Straight hole section; 5-Resin layer. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0027] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0028] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, when describing pipelines, the terms "connected" and "linked" as used in this application have the meaning of establishing electrical connection. The specific meaning needs to be understood in conjunction with the context.

[0029] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0030] The wiring harness assembly of the eddy current sensor is a structure in which the wiring harness is fixedly mounted on the PCB board. The wiring harness installation of the eddy current sensor includes both rigid terminals and wiring harnesses. When communicating and supplying power through the wiring harness, the wiring harness and the housing of the eddy current sensor need to be fixedly connected to ensure the stability of the wiring harness position and the connection effect.

[0031] When space is limited in the customer's installation environment, some eddy current sensors are assembled using wire harness perforation and thermocompression welding to reduce the overall thickness of the sensor. However, the perforated wire harness is made of multi-strand wire, which has low splicing efficiency and is prone to coming apart during thermocompression welding, causing short circuits with the connected wire harnesses. In addition, the pull-out force of thermocompression welding is small, and the welding is prone to incomplete soldering.

[0032] Furthermore, existing technologies have low PCB board utilization rates, leaving significant blank space at the rear. With the same electronic components, this design results in a longer rectangular sensor area, wasting space and increasing the overall size.

[0033] To address the aforementioned problems, this application provides an assembly structure for the sensor harness 3, please refer to... Figure 1 It includes a housing 1, a PCB board 2, a wire harness 3, and a resin layer 5.

[0034] Please refer to Figure 1 The housing 1 has a receiving cavity 11. As the overall supporting frame of the sensor, the housing 1 can be made of temperature-resistant and impact-resistant engineering plastics, such as PPS-GF40 or PA66-GF30 (eddy current sensors need to be immersed in motor cooling oil, so the plastic material needs to have good oil resistance; therefore, PPS-GF40 or PA66-GF30 is commonly used. Other sensors can use materials such as PBT-GF30 and ABS. GF40 and GF30 refer to the percentage of glass fiber content, which can be increased or decreased as needed). The shape of the housing 1 can be designed as rectangular, circular, or irregular depending on the application scenario.

[0035] Please refer to Figure 2 The housing 1 encloses a cavity 11, the shape of which is adapted to the outline of the housing 1 and the size is slightly larger than the PCB board 2. The cavity 11 is located inside the housing 1, with one end open and the other end closed or integrally formed with the side wall of the housing 1. Its core function is to provide installation space for the PCB board 2 and wire harness 3, and to provide a casting carrier for the resin layer 5, while protecting the internal components from external vibration, dust and corrosion.

[0036] Please refer to Figure 2 The PCB board 2 is disposed within the receiving cavity 11 of the housing 1. The PCB board 2 can be made of conventional FR-4 epoxy glass cloth substrate, and its shape matches the receiving cavity 11. It is usually rectangular, but can also be designed into other shapes as needed. Sensor chips, resistors, capacitors and other electronic components are soldered on the surface of the PCB board 2.

[0037] Please refer to Figure 3 The PCB board 2 is placed in the receiving cavity 11 of the housing 1. The connection between the PCB board 2 and the housing 1 can be initially limited by the positioning boss 12 at the bottom of the receiving cavity 11 of the housing 1, or it can be fixed by bonding the resin to the PCB board 2 after the resin layer 5 is poured and cured.

[0038] Please refer to Figure 3 The combination of these two methods can prevent PCB board 2 from shifting during use. The core function of PCB board 2 is to carry the sensor circuit and realize signal acquisition and processing. Its electrical connection with wire harness 3 can be achieved by dip soldering, that is, after stripping the insulation sheath of one end of wire harness 3, it is soldered to the pads of PCB board 2 to ensure reliable transmission of signals or power.

[0039] Please refer to Figure 3 The wire harness 3 consists of multiple wires, which are spaced apart. One end of each wire harness 3 is electrically connected to the PCB board 2. The wire harness 3 can consist of 4 to 12 wires, preferably 6. Each wire harness 3 can be made of multi-strand copper wires twisted together and covered with a PVC insulation layer. The diameter of a single wire harness 3 is designed according to the current requirements.

[0040] Please refer to Figure 3 Multiple wire harnesses 3 are distributed at intervals along the edge of the PCB board 2, with an interval of 1~2mm, to avoid signal crosstalk or damage to the insulation layer between the wire harnesses 3. One end of each wire harness 3 is soldered to the pad of the PCB board 2 (i.e., electrically connected), and the other end is inserted through the wiring hole 4 on the side wall of the housing 1 and extends outward to connect to external devices.

[0041] The core function of wire harness 3 is to serve as a bridge connecting PCB board 2 and external devices, transmitting sensor detection signals or power supplied by external devices. The design of multiple spaced wires ensures that different signal and power channels are independent, avoiding interference.

[0042] Please refer to Figure 5The resin layer 5 is disposed inside the housing 1 and poured into the receiving cavity 11. After solidification, the resin layer 5 can wrap the PCB board 2. The resin layer 5 can be made of bisphenol A type epoxy resin, which is in a liquid casting state and forms a solid structure after curing. The resin layer 5 is poured into the receiving cavity 11 of the housing 1, and the pouring amount is preferably sufficient to completely wrap the PCB board 2. At the same time, the resin can flow into the overflow section 42 through the tapered countersunk section 41 of the wiring hole 4.

[0043] Please refer to Figure 5 The core functions of the resin layer 5 after curing include sealing and protecting the PCB board 2, isolating it from external dust, liquids and vibrations, and preventing damage to electronic components; and curing it into one with the wire harness 3 and the housing 1, fixing the wire harness 3 through the resin clips in the overflow section 42, and improving the tensile strength of the wire harness 3.

[0044] Please return to the reference. Figure 3 Multiple wiring holes 4 are provided on one side wall of the housing 1 at intervals. The wiring holes 4 penetrate one side wall of the housing 1. The multiple wiring holes 4 correspond one-to-one with multiple wire harnesses 3. The wire harnesses 3 pass through the corresponding wiring holes 4. Along the opening direction of the receiving cavity 11, the wiring holes 4 are located on the upper side of the PCB board 2.

[0045] Please refer to Figure 4 The wiring holes 4 are opened on one side wall of the housing 1, and the number corresponds one-to-one with the wire harness 3. Multiple wiring holes 4 are distributed at intervals along the edge of the side wall and penetrate the side wall of the housing 1. They are in the direction from the inner wall of the housing 1 to the outer wall. The wiring holes 4 are divided into three segments connected in sequence, and all three segments can be integrally formed with the housing 1.

[0046] Please refer to Figure 4 Along the direction from the inner wall of the housing 1 to the outer wall, the wiring hole 4 includes a conical countersunk section 41, an overflow section 42, and a straight hole section 43 connected in sequence. The cross-section of the conical countersunk section gradually decreases along this direction. The diameter of the conical countersunk section is larger than the diameter of the straight hole section 43, and the diameter of the overflow section 42 is larger than the diameter of the conical countersunk section 41, so that the poured resin layer 5 can enter the overflow section 42 through the conical countersunk section 41 and be fixed relative to the housing 1 after curing.

[0047] Please refer to Figure 4 The inner arc surface of the conical countersunk section 41 can be conical, and its cross-section gradually decreases along the direction from the inner wall of the housing 1 to the outer wall. The conical countersunk section 41 and the wire harness 3 are fitted with a clearance, and the clearance value can be 0.1~1mm. Its core function is to guide the liquid resin in the receiving cavity 11 to the overflow section 42, while providing space for the bonding of the resin and the wire harness 3.

[0048] Please refer to Figure 4The overflow section 42 extends from the inner wall of the housing 1 to the outer wall, and its cross-sectional shape can be square. The overflow section 42 can fully fill the liquid resin, and after curing, it forms a square resin block. The block cannot be dislodged from the smaller diameter conical countersunk section 41 or straight hole section 43, thereby locking the wire harness 3 and preventing the wire harness 3 from being pulled loose.

[0049] Please refer to Figure 4 The straight hole section 43 runs along the inner wall of the housing 1 towards the outer wall, and its cross-sectional shape is circular or C-shaped with a central angle greater than 180°. This section is interference-fitted with the wire harness 3, and the interference amount can be 0.05~0.1mm. Its core function is to position the wire harness 3, limit the radial movement of the wire harness 3, and reduce the entry of external dust or liquid into the receiving cavity 11 through the wiring hole 4.

[0050] Please refer to Figure 1-5 This application addresses the problems of easy breakage and short circuits, low pull-out force, and easy poor soldering of perforated wire harness 3 in the prior art during hot-press welding. It guides the resin through a three-section structure: the tapered countersunk section 41 with a gradually decreasing cross-section guides the resin from the receiving cavity 11 to the overflow section 42. The overflow section 42 serves as a resin storage cavity. After curing, it forms a resin block. With the limiting of the straight hole section 43, the wire harness 3 is firmly locked to the housing 1, avoiding the problems of easy loosening and pulling off of the wire harness 3 in the traditional structure.

[0051] After the resin layer 5 solidifies, it completely encapsulates the PCB board 2, achieving a sealed protection against vibration, corrosion, and dust. Meanwhile, multiple wire harnesses 3 are spaced apart to avoid the risk of short circuits between the wire harnesses 3. The wiring hole 4 is located on the upper side of the PCB, which not only facilitates the wire harnesses 3 to be led out from the upper side of the housing 1, but also provides a reasonable flow direction for resin pouring, taking into account both assembly convenience and functional reliability.

[0052] For example, please refer to Figure 4 The housing 1 also includes an extension portion 13, which is integrally formed with the housing 1 and is located in the area of ​​the housing 1 where the wiring hole 4 is located. The extension portion 13 can be designed as an outwardly protruding rectangular block or an arc-shaped rib, and its position covers the outer periphery of the wiring hole 4.

[0053] The core function of the extension 13 is to enhance the structural strength of the wiring hole 4 area. Since the wiring hole 4 penetrates the side wall of the housing 1, it will weaken the rigidity of the area. By increasing the local wall thickness, the extension 13 can prevent the wall of the wiring hole 4 from cracking under vibration or impact. At the same time, it protects the resin clip and wire harness 3 inside the wiring hole 4 and reduces the impact of external collisions on the connection structure.

[0054] Please refer to Figure 1In some examples, the wiring hole 4 extends through the upper wall of the housing 1 along the opening direction of the receiving cavity 11. When the opening of the receiving cavity 11 faces upward, the wiring hole 4 extends through the upper wall, allowing the wire harness 3 to be led out vertically and obliquely upward, avoiding interference with the fixed bracket or other equipment outside the sensor, improving scene adaptability and installation convenience. At the same time, the wiring hole 4 on the upper wall is aligned with the opening direction of the receiving cavity 11, and the resin can naturally cover the inside of the wiring hole 4 during resin pouring, ensuring that the resin flows smoothly into the overflow section 42.

[0055] In some examples, the wiring hole 4 can be parallel to the thickness direction of the housing 1. In this case, the wiring hole 4 can penetrate the top wall of the housing 1 everywhere along the thickness direction of the housing 1, and the upper side wall of the housing 1 can be a plane.

[0056] Please refer to Figure 4 In some examples, the central angle of the straight hole section 43 along the axial direction of the wiring hole 4 is greater than 180°. This part allows the wire harness 3 to be inserted and initially fixed from the opening on the upper side, facilitating assembly and casting. At the same time, the C-shaped straight hole section 43 is simpler to mold and less expensive than a complete round hole.

[0057] In some examples, the central angle of the straight hole segment 43 along the axial direction of the wiring hole 4 can be 200°, 230°, or 220°.

[0058] Please refer to Figure 4 In some examples, an extension 13 is formed on the housing 1, and the extension 13 is located in the area of ​​the housing 1 where the wiring hole 4 is located. The wiring hole 4 penetrates the side wall of the housing 1, which weakens the structural rigidity of the area. The extension 13 can reinforce the weakened thickness of the housing 1, preventing the housing 1 from cracking or deforming when vibrating or impacting. At the same time, the extension 13 only locally reinforces the area of ​​the wiring hole 4, without the need to thicken the housing 1 as a whole, thus avoiding an increase in the size of the sensor.

[0059] In some examples, the extension 13 can be integrally formed with the housing 1, and its shape can be square or disc-shaped.

[0060] Please refer to Figure 4 In some examples, the inner arc surface of the conical countersunk section 41 is conical. The conical arc surface is smooth and has a uniform angle, so that the resin flows into the receiving cavity 11 without dead corners or obstructions, and can be evenly filled to the overflow section 42, avoiding resin accumulation or poor flow due to irregular arc surface; the conical shape can be processed by standard conical cutters, the mold design is simple and the precision is easy to control; the smooth conical arc surface fits the resin more tightly, and after curing, it can reduce the gap between the resin and the hole wall, prevent external dust and liquid from seeping into the receiving cavity 11 from the gap, and improve the overall sealing performance.

[0061] Please refer to Figure 4In some examples, the taper of the conical surface gradually decreases in the direction from the inner wall to the outer wall. The steep inner taper can quickly guide a large amount of resin from the receiving cavity 11 into the conical countersunk section 41, while the gentle outer taper slows down the resin flow rate, allowing the resin to smoothly transition to the overflow section 42, avoiding resin splashing or the formation of eddies in the overflow section 42 due to excessive flow rate; the outer conical surface of the gentle taper has a higher degree of fit with the wire harness 3, and the resin can more evenly coat the surface of the wire harness 3, resulting in a stronger bond between the wire harness 3 and the resin after curing.

[0062] Please refer to Figure 4 In some examples, the cross-sectional shape of the overflow section 42 is square along the direction from the inner wall of the housing 1 to the outer wall. After curing, the square-section overflow section 42 forms a square resin block. The block fits completely against the square hole wall, and the hole wall can restrict the circumferential rotation of the resin block, thereby locking the wire harness 3 and preventing poor contact or short circuit caused by the rotation of the wire harness 3. Compared with the circular shape, the square-section resin block has stronger shear resistance.

[0063] Please refer to Figure 4 In some examples, along the direction from the inner wall of the housing 1 to the outer wall, the length of the overflow section 42 is greater than the length of the conical countersunk section 41, and the length of the overflow section 42 is less than the length of the straight hole section 43.

[0064] The straight hole section 43 is the main positioning section of the wire harness 3. A longer straight hole section 43 can increase the contact area between the wire harness 3 and the hole wall, improving the stability of temporary fixation (before resin curing). The overflow section 42 needs to be long enough to store sufficient resin to ensure that the size of the formed resin block meets the standard. The tapered countersunk hole section 41 only needs to achieve the flow guiding effect. This design distribution can minimize the size of the housing 1 while ensuring the reliability of the wire harness 3 fixation.

[0065] Please refer to Figure 4 In some examples, the wire harness 3 has a clearance fit with the conical countersunk section 41 of the corresponding wiring hole 4, and an interference fit with the straight hole section 43 of the corresponding wiring hole 4. The clearance fit allows for a channel for resin flow, preventing the wire harness 3 from clogging the hole section, while the interference fit temporarily fixes the wire harness 3 inside the wiring hole 4 and can trap resin, preventing it from overflowing.

[0066] This application provides an embodiment one, please refer to... Figure 1-5 The number of wire harnesses 3 in the sensor wire harness 3 assembly structure is 6.

[0067] The housing 1 is made of PPS-GF40 or PA66-GF30 material and is rectangular in shape. The internal cavity 11 is rectangular and open on the upper side. Six spaced wiring holes 4 are opened on the upper side wall of the housing 1.

[0068] The PCB board is a rectangular epoxy glass cloth substrate 2FR-4. It is initially positioned by the positioning boss 12 at the bottom of the receiving cavity 11. The surface is soldered with a temperature and humidity sensor chip and matching resistors and capacitors. One end of each of the six wire harnesses 3 is soldered to the six pads of the PCB board 2.

[0069] Six wire harnesses, each with a cross-sectional area of ​​0.35 mm². 2 The wiring harness is distributed at 1.5mm intervals along the upper edge of the PCB board 2, and the other end passes through the 6 wiring holes 4 on the upper side wall of the housing 1 and extends outward.

[0070] The resin layer 5 is bisphenol A type epoxy resin, which is poured into the receiving cavity 11. The pouring amount is 1.5mm covering the upper surface of the PCB board 2. After curing, it completely covers the PCB board 2 and flows into the overflow section 42 through the conical countersunk section 41 of the wiring hole 4 to form a square resin block.

[0071] The wiring hole 4 is divided into three sections along the inner wall → outer wall of the housing 1. The conical countersunk section 41 is located on the inner arc surface of the cone, with an inner diameter of 3mm, an outer diameter of 2mm, and a length of 1.2mm, and is clearance-fitted with the wire harness 3. The glue overflow section 42 has a square cross-section and a length of 2.2mm. The straight hole section 43 has a circular cross-section and a length of 3.2mm, and is interference-fitted with the wire harness 3 (the interference amount can be adjusted according to the thickness of the wire harness. The commonly used interference amount is 0.05mm-0.3mm).

[0072] The extension portion 13 is made of PPS-GF40 or PA66-GF30 material. The extension portion 13 is a rectangular protrusion that is distributed around the outer wall of each wiring hole 4. There are 6 extension portions 13 corresponding to 6 wiring holes 4, which enhances the strength of the wiring hole 4 area.

[0073] The assembly process of this embodiment is as follows: solder one end of the 6 wire harnesses 3 to the pads of the PCB board 2 → place the PCB board 2 into the housing 1 cavity 11 → press the wire harnesses 3 into the wiring holes 4 through the tooling → pour epoxy resin into the cavity 11 → after the resin cures, a resin layer 5 is formed that wraps the PCB board 2 and a resin block in the overflow section 42, thus completing the assembly.

[0074] This application provides another embodiment, in which the number of wire harnesses 3 in the sensor wire harness 3 assembly structure is 2-30.

[0075] The housing 1 is made of PPS-GF40 or PA66-GF30 material and is rectangular in shape. The internal cavity 11 is rectangular and open on the upper side. The upper side wall of the housing 1 has 2-30 spaced wiring holes 4 (the number of wiring holes 4 is the same as the number of wires 3).

[0076] PCB board 2 uses a rectangular FR-4 epoxy glass cloth substrate. It is initially limited by two positioning bosses 12 at the bottom of the receiving cavity 11. A pressure sensor chip and signal conditioning circuit are soldered on the surface. One end of the wire harness 3 is soldered to the pads of PCB board 2.

[0077] The wire harness 3 is distributed at intervals along the upper edge of the PCB board 2, and the other end passes through 2-30 wiring holes 4 on the upper side wall of the housing 1 and extends outward.

[0078] The resin layer 5 is bisphenol A type epoxy resin, which is poured into the receiving cavity 11. The pouring amount is 1.2mm covering the upper surface of the PCB board 2. After curing, it completely wraps the PCB board 2 and flows into the overflow section 42 of the wiring hole 4 to form a square resin block.

[0079] The wiring hole 4 is divided into three sections along the inner wall → outer wall of the housing 1: the conical countersunk section 41 has a conical inner arc surface with an inner diameter of 2.8 mm, an outer diameter of 1.9 mm, and a length of 1 mm, which is clearance fit with the wire harness 3 (gap 0.1 mm); the glue overflow section 42 has a square cross section with a length of 2 mm; and the straight hole section 43 has a C-shaped cross section with a length of 3 mm, which is interference fit with the wire harness 3.

[0080] The extension 13 is also made of PPS-GF40 or PA66-GF30 material and has curved ribs that are distributed around the outer wall of each wiring hole 4. The eight wiring holes 4 correspond to eight extensions 13, which improves the impact resistance of the wiring hole 4 area.

[0081] The assembly process in this embodiment is the same as that in Embodiment 1.

[0082] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0083] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A sensor harness assembly structure, characterized in that, include: The shell has a receiving cavity; The PCB board is disposed within the receiving cavity of the housing; The wire harness is configured as multiple wires, which are spaced apart, and one end of each wire harness is electrically connected to the PCB board. A resin layer is disposed inside the housing and cast into the receiving cavity. After solidification, the resin layer can encapsulate the PCB board. The housing has multiple spaced wiring holes on one side wall, each wiring hole penetrating the side wall of the housing. Each wiring hole corresponds to one of the multiple wire harnesses, and the wire harnesses pass through the corresponding wiring holes. Along the opening direction of the receiving cavity, the wiring hole is located on the upper side of the PCB board. Along the direction from the inner wall of the housing to the outer wall, the wiring hole includes a conical countersunk section, an overflow section, and a straight section connected in sequence. The cross-section of the conical countersunk section gradually decreases along this direction. The diameter of the conical countersunk section is larger than the diameter of the straight section, and the diameter of the overflow section is larger than the diameter of the conical countersunk section, so that the cast resin layer can enter the overflow section through the conical countersunk section and, after curing, fix the wire harness and the housing relatively.

2. The sensor harness assembly structure according to claim 1, characterized in that, Along the opening direction of the receiving cavity, the wiring hole penetrates the upper side wall of the housing.

3. The sensor harness assembly structure according to claim 2, characterized in that, Along the axial direction of the wiring hole, the central angle of the straight hole segment is greater than 180°.

4. The sensor harness assembly structure according to any one of claims 1 to 3, characterized in that, An extension portion is formed on the housing, and the extension portion is located in the housing area where the wiring hole is located.

5. The sensor harness assembly structure according to claim 1, characterized in that, The inner arc surface of the conical countersunk hole section is conical.

6. The sensor harness assembly structure according to claim 5, characterized in that, The inner arc surface of the conical countersunk section includes multiple conical surfaces connected in sequence, and the taper of the conical surfaces gradually decreases along the direction from the inner wall of the shell to the outer wall.

7. The sensor harness assembly structure according to claim 1, characterized in that, Along the direction from the inner wall of the shell to the outer wall, the cross-sectional shape of the overflow section is square.

8. The sensor harness assembly structure according to claim 7, characterized in that, Along the direction from the inner wall of the housing to the outer wall, the length of the overflow section is greater than the length of the tapered countersunk hole section, and the length of the overflow section is less than the length of the straight hole section.

9. The sensor harness assembly structure according to claim 1, characterized in that, The wire harness has a clearance fit with the tapered countersunk section corresponding to the wiring hole, and an interference fit with the straight hole section corresponding to the wiring hole.

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