Intermediate support seat for motor drive module

Abstract

The utility model provides a kind of intermediate support seat for motor drive module, including substrate, the substrate top installation support seat structure, the support seat structure top is connected with PCB board, support seat structure both sides are respectively symmetrically installed several DBC ceramic sheet, install one SIC power device on each DBC ceramic sheet, the pin of the SIC power device is worn to support seat structure one side.The utility model has beneficial effect: mechanical support and structural integrity: the weight of device is borne, share the pressure of PCB board, prevent long-time deformation.Anti-vibration and displacement: provide additional support for power device, reduce the fatigue of device displacement or soldering point caused by vibration, thereby improve the reliability and life of module.Improve overall stability, reduce the risk of pin breakage in vibration or impact environment, improve the reliability of circuit board.

Description

Technical Field

[0001] This utility model belongs to the field of motor drive technology, and in particular relates to an intermediate support base for a motor drive module. Background Technology

[0002] In motor drive modules, high-frequency transformers and various power devices are typically mounted on a PCB board. Since high-frequency transformers usually have a certain weight, prolonged exposure can cause PCB board deformation. Furthermore, vibrations and shocks in motor drive scenarios can also threaten the reliability of components, easily leading to component displacement, solder joint fatigue, or even pin breakage.

[0003] Traditional solutions typically involve simply soldering components onto a PCB or using basic mounting methods. However, these methods are inadequate in terms of bearing weight, resisting vibration, and distributing stress. Especially in modules using DBC ceramic substrates, the difference in thermal expansion coefficients between the components and the substrate leads to greater stress concentration, making solder joints more prone to failure.

[0004] Therefore, there is an urgent need for an intermediate support that can effectively support high-frequency transformers and other power devices, improve vibration resistance, disperse structural stress, and simplify the manufacturing and assembly process, so as to improve the overall reliability and lifespan of the motor drive module. Utility Model Content

[0005] In view of this, the present invention aims to provide an intermediate support for a motor drive module, so as to solve the problem of reduced reliability of high-frequency transformers and power devices due to weight, vibration and stress in the prior art.

[0006] To achieve the above objectives, the technical solution of this utility model is implemented as follows: An intermediate support base for a motor drive module includes a base plate, a support base structure is mounted on the top of the base plate, the top of the support base structure is connected to a PCB board, and several DBC ceramic sheets are symmetrically mounted on both sides of the support base structure. Each DBC ceramic sheet is equipped with a SiC power device, and the pins of the SiC power device pass through to one side of the support base structure. The support structure includes a support body, the top of which is connected to a PCB board. The support body has an integrally formed protrusion around its perimeter, with a limit strip installed inside the protrusion. Several fixing holes are opened in the middle of the support body, and the height of the fixing holes is higher than the top surface of the support body.

[0007] Furthermore, the substrate is an aluminum plate structure.

[0008] Furthermore, a mounting hole is provided at each of the four corners of the substrate, and one of the mounting holes on one side of the substrate is a through hole structure.

[0009] Furthermore, a clearance groove is also provided on one side of the substrate.

[0010] Furthermore, several pin limiting platforms are provided on both sides of the support body, and the pin limiting platforms are used to shape the pins of the SiC power device.

[0011] Furthermore, multiple limiting strips form a non-closed ring structure.

[0012] Furthermore, a groove for accommodating overflowing adhesive is formed between the limiting strip and the protrusion.

[0013] Furthermore, the support structure is made of high-strength engineering plastic.

[0014] Furthermore, the main body of the support base has a cuboid structure.

[0015] Furthermore, the number of both the DBC ceramic chip and the SiC power device is six.

[0016] Compared with the prior art, the intermediate support base for the motor drive module described in this utility model has the following advantages: (1) The intermediate support for the motor drive module described in this utility model provides mechanical support and structural integrity: it bears the weight of the device, shares the pressure of the PCB board, and prevents deformation over a long period of time.

[0017] (2) The intermediate support base for the motor drive module described in this utility model is resistant to vibration and displacement: it provides additional support for power devices, reduces device displacement or fatigue of solder joints caused by vibration, thereby improving the reliability and lifespan of the module. It improves overall stability, reduces the risk of pin breakage under vibration or impact, and improves the reliability of the circuit board.

[0018] (3) The intermediate support base for the motor drive module described in this utility model offers advantages in manufacturing and assembly: it facilitates the positioning and alignment of auxiliary components, improving assembly efficiency and accuracy. It also provides a unified installation interface, making it convenient to connect and fix the module to other components.

[0019] (4) The intermediate support for the motor drive module described in this utility model has a structure stress dispersion: reducing welding stress concentration. Especially in the case of DBC ceramic sheet, the device and the substrate will generate stress due to the different coefficients of thermal expansion. The intermediate support block can disperse the stress and protect the welding point. Attached Figure Description

[0020] The accompanying drawings, which form part of this utility model, are used to provide a further understanding of the utility model. The illustrative embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute an undue limitation of the utility model. In the drawings: Figure 1 This is a schematic diagram of the overall structure as described in an embodiment of the present utility model; Figure 2 This is a schematic diagram of the support structure described in an embodiment of the present utility model.

[0021] Explanation of reference numerals in the attached figures: 1. Substrate; 11. Mounting hole; 12. Clearance groove; 2. Support structure; 21. Support body; 22. Protrusion; 23. Limiting strip; 24. Fixing hole; 25. Pin limiting stage; 3. DBC ceramic sheet; 4. SiC power device. Detailed Implementation

[0022] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0023] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0024] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0025] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0026] like Figures 1 to 2As shown, the intermediate support base for the motor drive module includes a base plate 1. A support base structure 2 is mounted on the top of the base plate 1. The top of the support base structure 2 is connected to the PCB board. Several DBC ceramic plates 3 are symmetrically mounted on both sides of the support base structure 2. Each DBC ceramic plate 3 is equipped with a SiC power device 4, and the pins of the SiC power device 4 extend to one side of the support base structure 2. In this embodiment, the number of DBC ceramic plates 3 and SiC power devices 4 are both six. The specific number can be stabilized according to actual conditions.

[0027] This support base is designed to provide mechanical support, structural stability, and vibration resistance for high-frequency transformers and other power devices, and to optimize manufacturing and assembly processes, thereby improving the reliability and lifespan of motor drive modules. It can be widely used in electric vehicles, industrial automation, servo drives, and other fields.

[0028] In a preferred embodiment of this utility model, the substrate 1 is an aluminum plate structure. A mounting hole 11 is provided at each of the four corners of the substrate 1. One of the mounting holes 11 on one side of the substrate 1 is a through hole structure. A clearance groove 12 is also provided on one side of the substrate 1. A wiring groove is also provided on the side of the substrate 1 near each DBC ceramic sheet 3. In this embodiment, the through hole structure facilitates adjustment of the mounting position of the substrate 1. Because capacitors are located on the back of the PCB board, the clearance groove 12 can accommodate them.

[0029] In a preferred embodiment of this utility model, the support structure 2 includes a support body 21. Several pin limiting platforms 25 are provided on both sides of the support body 21. The pin limiting platforms 25 are used to shape the pins of the SiC power device 4 so that they can pass through the PCB board more easily during soldering. The top of the support body 21 is connected to the PCB board. The support body 21 is provided with an integrally formed protrusion platform 22 around its perimeter. A limiting strip 23 is installed inside the protrusion platform 22. Several fixing holes 24 are opened in the middle of the support body 21. The height of the fixing holes 24 is higher than the top surface of the support body 21. In this embodiment, there are three fixing holes 24. When the upper surface of the support body 21 is connected to the PCB board, glue needs to be applied to the upper surface of the support body 21. The upper surface of the support body 21 is designed as a plane to provide support. The height of the fixing holes 24 is higher than the top surface of the support body 21 to prevent glue from overflowing into the middle fixing hole 24. Multiple limiting strips 23 form an open annular structure. The limiting strips 23 are used to limit the glue application area, and glue can only be applied inside the open annular structure. A groove is formed between the limiting strips 23 and the protrusion 22. The groove is formed so that when the module and PCB are assembled, the overflowing glue can flow into the groove and not flow to the outside of the support body 21.

[0030] In this embodiment, as Figure 1As shown, the intermediate support for the motor drive module in this embodiment includes a support structure 2. The support structure 2 is made of high-strength engineering plastic and is rectangular in shape, providing primary mechanical support. The top of the support structure contacts the bottom of the PCB board, providing stable support for the PCB board. In practical applications, the support is placed below the PCB board and fixed to it with thermally conductive adhesive, effectively distributing the weight of the transformer and improving the module's vibration resistance.

[0031] Advantages of this support base: Mechanical support and structural integrity: Bear the weight of the components, share the pressure on the PCB board, and prevent deformation over a long period of time.

[0032] Vibration and displacement resistance: Provides additional support for power devices, reducing device displacement or solder joint fatigue caused by vibration, thereby improving module reliability and lifespan. Improves overall stability, reduces the risk of pin breakage under vibration or shock environments, and enhances circuit board reliability.

[0033] Ease of manufacturing and assembly: Auxiliary components are positioned and aligned, improving assembly efficiency and accuracy. A unified mounting interface facilitates the connection and fixation of modules to other components.

[0034] Structural stress dispersion: Reduces welding stress concentration, especially in the case of DBC ceramic sheets, where stress will be generated due to the difference in thermal expansion coefficients between the device and the substrate. The middle support block can disperse the stress and protect the welding points.

[0035] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An intermediate support base for a motor drive module, characterized in that: Includes a substrate (1), a support structure (2) is mounted on the top of the substrate (1), the top of the support structure (2) is connected to the PCB board, and several DBC ceramic sheets (3) are symmetrically mounted on both sides of the support structure (2). A SiC power device (4) is mounted on each DBC ceramic sheet (3), and the pins of the SiC power device (4) pass through to one side of the support structure (2). The support structure (2) includes a support body (21), the top of which is connected to the PCB board. The support body (21) has an integrally formed protrusion (22) around its perimeter. A limit strip (23) is installed inside the protrusion (22). Several fixing holes (24) are opened in the middle of the support body (21), and the height of the fixing holes (24) is higher than the top surface of the support body (21).

2. The intermediate support for the motor drive module according to claim 1, characterized in that: The substrate (1) is an aluminum plate structure.

3. The intermediate support for the motor drive module according to claim 1, characterized in that: The substrate (1) has a mounting hole (11) at each of its four corners, and one of the mounting holes (11) on one side of the substrate (1) is a through hole structure.

4. The intermediate support for the motor drive module according to claim 1, characterized in that: A clearance groove (12) is also provided on one side of the substrate (1).

5. The intermediate support for the motor drive module according to claim 1, characterized in that: The main body (21) of the support base is in the shape of a cuboid structure.

6. The intermediate support for the motor drive module according to claim 1, characterized in that: The support body (21) has several pin limiting platforms (25) on both sides, which are used to shape the pins of the SIC power device (4).

7. The intermediate support for the motor drive module according to claim 1, characterized in that: Multiple limiting strips (23) form a non-closed ring structure.

8. The intermediate support for the motor drive module according to claim 1, characterized in that: A groove for accommodating overflowing adhesive is formed between the limiting strip (23) and the protrusion (22).

9. The intermediate support for the motor drive module according to claim 1, characterized in that: The support structure (2) is made of high-strength engineering plastic.

10. The intermediate support for the motor drive module according to claim 1, characterized in that: The number of DBC ceramic sheets (3) and SiC power devices (4) are both six.

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