A simplified data acquisition terminal for factory OEE and energy consumption management

Abstract

The utility model belongs to industrial automation data acquisition technical field discloses a kind of for factory OEE and energy consumption management's simplified data acquisition terminal, including pedestal module, computing core module, heat conduction element, heat dissipation module and positioning chassis, the computing core module, heat conduction element and heat dissipation module are carried and positioned by positioning chassis, the physical position of the heat dissipation module is separated from the physical position of pedestal module, when using, pedestal module is installed on the guide rail of industrial cabinet, and the heat generated by computing core module is efficiently conducted to the open area far from installation position, air circulation is good, and is dissipated by heat dissipation module.The utility model fundamentally solves the fundamental defect that integrated terminal in prior art is overheated and fails in closed environment due to structural limitation.

Description

Technical Field

[0001] This utility model belongs to the field of industrial automation data acquisition technology, and in particular relates to the physical structure of a data acquisition terminal for factory OEE and energy management that can operate stably for a long time in harsh industrial environments. Background Technology

[0002] With the deepening of intelligent manufacturing, factory OEE and energy management systems have become standard configurations in modern factories. The data acquisition terminals at the front end, acting as a bridge connecting physical equipment and information systems, are crucial to the stability of their operation. To facilitate standardized installation within the limited space of industrial control cabinets, existing data acquisition terminals almost invariably employ a high-density integrated, one-piece, fanless, passively cooled, enclosed structure. This structure is typically a compact metal or plastic box with clips at the bottom that can be directly attached to 35mm DIN rails.

[0003] However, this structure, which has been widely adopted in the industry for a long time, has a fundamental physical defect that has not been perfectly resolved. This defect directly violates the requirements for the reliability of industrial equipment in specific environments as stipulated in national standards such as GB / T 26802.2-2017 General Specification for Industrial Control Computer Systems.

[0004] The inherent weakness of existing technology products lies in their complete reliance on a single, passive, and inefficient natural convection heat dissipation path—from the chip to the casing to the air. In the most typical application scenario of data acquisition terminals—the enclosed industrial control cabinet filled with cables, inverters, and PLC modules with poor air circulation—this sole heat dissipation path can drastically reduce its effectiveness or even fail completely due to the harsh external environment. In this situation, the Joule heat generated by high-performance components such as the CPU inside the terminal cannot be effectively dissipated, leading to a rapid accumulation of heat. This ultimately causes electronic components to overheat, resulting in performance degradation, data transmission interruptions, random crashes, or even permanent burnout. This reveals an inherent and inevitable failure risk in the existing technology structure in typical applications.

[0005] In summary, a long-standing technical bias and physical conflict exists in this field: for ease of wiring, the installation reference of equipment must be fixed in a congested area with the worst heat dissipation conditions. This fundamentally contradicts the requirement of its internal high-performance chips to have a good heat dissipation environment to ensure reliable operation. Those skilled in the art have been constrained by the design mindset of integrated systems and have failed to provide an effective technical solution that can completely solve this fatal heat dissipation problem under the unique installation constraints of this field. Utility Model Content

[0006] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a simplified data acquisition terminal for factory OEE and energy consumption management, so as to fundamentally solve the technical problem that the integrated terminal in the prior art will inevitably have the risk of overheating failure in typical industrial application scenarios due to its inherent structural defects.

[0007] To achieve the above objectives, this utility model provides the following technical solution: A simplified data acquisition terminal for factory OEE and energy management includes: a base module suitable for mounting on an industrial rail; a computing core module with a built-in core heating element; a heat conduction element whose heated end is thermally connected to the computing core module; a heat dissipation module connected to the heat dissipation end of the heat conduction element; and a positioning chassis for supporting and positioning the heat conduction element and the heat dissipation module. The positioning chassis separates the physical location of the heat dissipation module from the physical location of the base module, so that the heat dissipation module is arranged in a preset heat dissipation area with good air circulation, away from the base module.

[0008] Preferably, the positioning chassis is a rigid cantilever structure, with the proximal end of the cantilever structure fixedly connected to the base module, and the distal end used to install the heat dissipation module. The heat conduction element is arranged along the cantilever structure.

[0009] Preferably, the cantilever structure is an integrally extruded aluminum alloy profile, with an internal cavity for housing the connecting cable between the computing core module and the base module.

[0010] Preferably, the heat conduction element is a vacuum phase change heat pipe with a capillary wick structure on its inner wall.

[0011] Preferably, the surface of the heat dissipation fins of the heat dissipation module has a ceramicized porous layer formed by a micro-arc oxidation process. Preferably, the base module is provided with a wedge-shaped self-locking structure for locking it onto an industrial guide rail; it also includes a temperature sensor, which is disposed on the heat dissipation module for monitoring the temperature of the heat dissipation module.

[0012] Compared with the prior art, this utility model has the following advantages: 1. This utility model, through its unique split-type, cross-zone heat dissipation structure, fundamentally decouples the heat source from the heat dissipation area, completely overcoming the physical conflict between installation location dependence and heat dissipation environment requirements. Under the same harsh operating conditions as described in the background technology, this solution can effectively control the steady-state operating temperature of the core processor within a safe range, while products using existing technologies will fail due to overheating caused by heat accumulation. This design achieves a fundamental difference in equipment usability, yielding unexpected technical results and greatly improving the long-term operational reliability of the equipment in harsh industrial environments.

[0013] 2. The structure of this utility model effectively isolates the computing core module containing the high-frequency digital circuit from the base module containing the easily interfered analog signals or high-voltage electricity, and connects them through a shielded flexible flat cable. This greatly improves the electromagnetic environment inside the device, reduces signal interference, and thus improves the accuracy and stability of data acquisition. This is an additional advantage that is difficult to match by existing integrated structures.

[0014] 3. This utility model features a highly modular structure. Users can flexibly select computing core modules with different performance characteristics and match them with heat dissipation modules of corresponding specifications according to their actual computing power needs, realizing product customization and flexible configuration. Furthermore, in the event of a failure, on-site maintenance personnel can independently replace the faulty module without disassembling and rewiring the entire terminal, significantly reducing the mean time to repair and total cost of ownership. Attached Figure Description

[0015] Figure 1 This is an exploded perspective view of one embodiment of the present invention; Figure 2 This is a schematic diagram of the overall structure of one embodiment of the present utility model; Figure 3 This is a cross-sectional schematic diagram of the heat pipe and the computing core module being press-fitted together in this utility model; Figure 4 This is a schematic diagram of another embodiment of the present invention; Figure 5 This is a schematic diagram of another embodiment of the present utility model.

[0016] In the diagram: 1. Base module; 11. Snap-fit; 12. I / O interface terminal; 2. Computing core module; 3. Heat conduction element; 31. Phase change heat conduction sheet; 32. Preload screw; 4. Heat dissipation module; 41. Heat dissipation fins; 5. Positioning chassis; 51. Cantilever structure; 6. Flexible flat cable; 7. Temperature sensor; 61. Metal panel; 62. PoE motherboard; 63. Flat heat pipe; 64. Decorative heat sink. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0018] Example 1 Please see Figures 1 to 3 This illustrates a specific structure of the present invention. This embodiment includes a base module 1, a computing core module 2, a heat conduction element 3, a heat dissipation module 4, and a positioning chassis 5.

[0019] The base module 1 serves as the foundation for the installation and wiring of the entire terminal. Its main body is injection-molded from insulating engineering plastic, and its bottom features an integrally molded buckle 11. This buckle 11 preferably employs a wedge-shaped self-locking structure with an inclination angle of 30°±2° to securely lock the entire terminal onto a 35mm standard DIN rail within the industrial control cabinet, ensuring installation reliability under strong vibration conditions. The front and sides of the base module 1 are equipped with I / O interface terminals 12 for connecting external sensors, actuators, power supplies, and Ethernet, including RS485, DI, AI, and LAN interfaces.

[0020] The positioning chassis 5 is a key structural component for realizing the core function of this utility model. It is preferably made of 6063-T5 aluminum alloy through an integral extrusion process and anodized to improve corrosion resistance and surface hardness. The positioning chassis 5 includes a base fixed to the base module 1 by multiple screws, and an "L"-shaped rigid cantilever structure 51 extending upwards and laterally from the base. The cross-sectional dimensions of the cantilever structure 51 are not less than 15mm x 5mm to ensure that its structural deformation is less than 0.5mm after supporting the heat dissipation module 4, thus avoiding vibration. The length and height of the cantilever structure 51 are preset to allow it to cross obstacles such as cable trays with a width of 60-80mm commonly found in industrial control cabinets. Furthermore, the interior of the cantilever structure 51 has a hollow channel for storing and shielding the flexible flat cable 6 (described later).

[0021] The computing core module 2 is an independent metal-encapsulated module with electromagnetic shielding, which highly integrates the main heat-generating components such as CPU, DDR memory, and eMMC flash memory.

[0022] The heat conduction element 3 is preferably one or more high-performance sintered copper vacuum phase change heat pipes with a diameter of 6 mm, and a bending radius of not less than 18 mm to ensure that the internal capillary structure is not damaged. Please refer to [link / reference]. Figure 3The evaporation end of the heat pipe 3 is mechanically flattened into a plane. A phase change heat-conducting sheet 31 with a thermal conductivity of not less than 8.5 W / (m·K) is filled between it and the metal shell of the computing core module 2. A pre-tightening force of not less than 50N is applied by four M3 pre-tightening screws 32, thus achieving a high-efficiency, low-thermal-resistance thermal connection between the two.

[0023] The heat pipe 3 is arranged along the outer side or inner side of the cantilever structure 51. Its condensation end is firmly bonded to a heat dissipation module 4, which consists of multiple aluminum heat dissipation fins 41 with a thickness of 0.4 mm and a spacing of 1.8 mm, through an interference fit using a through-fin process. This heat dissipation module 4 is fixed at the far end of the cantilever structure 51, thus being precisely positioned in an open area with relatively good airflow, away from cable congestion. To achieve excellent heat dissipation even in areas with poor air convection, the surface of the heat dissipation fins 41 is preferably subjected to micro-arc oxidation treatment. This process forms a grayish-white, ceramicized porous layer with extremely high surface emissivity on the aluminum surface, greatly enhancing the radiative heat dissipation capability. This embodiment also includes a temperature sensor 7, which is mounted on the heat dissipation module 4 to monitor its temperature.

[0024] The computing core module 2 and the I / O circuit on the base module 1 are electrically connected by a flexible flat cable 6 with a length of 50 mm and an outer layer of graphene shielding. The cable 6 is properly housed in the internal cavity of the cantilever structure 51 to avoid interference from external electromagnetic fields.

[0025] Example 2 Please see Figure 4 This illustrates the structure of another embodiment of the present invention. The overall structure of this embodiment is basically the same as that of Embodiment 1, with the main difference being: The heat conduction element 3 was replaced with a solid 6061 aluminum alloy heat-conducting rod with a rectangular cross-section of 10mm x 3mm.

[0026] The cantilever structure 51 of the positioning chassis 5 is replaced with a 2mm thick stainless steel SUS304 plate formed by stamping and bending processes.

[0027] The surface of the heat dissipation fins 41 of the heat dissipation module 4 is only subjected to ordinary anodizing and blackening treatment.

[0028] The structure used in this embodiment, when verified under the same harsh operating conditions, still effectively controls the core processor temperature within the safe operating threshold typically required for industrial-grade chips. This result proves that this invention, through different specific implementation methods, can successfully solve the overheating failure problem that inevitably exists in the prior art, possessing significant practical value and inventiveness.

[0029] Example 3 Please see Figure 5 This illustrates the structure of yet another embodiment of the present invention. This embodiment aims to apply the core structural principles of the present invention to another specific scenario, thereby expanding its application scope.

[0030] The application scenario of this embodiment is a high-power PoE Ethernet power supply switch or power supply that needs to be installed in a confined space such as a ceiling or a standard 86-type recessed box in the wall.

[0031] Its structure has been adapted accordingly as follows: The base module was modified into a metal panel 61 that conforms to the mounting holes of an 86-type junction box. The mainboard 62 of the PoE switch integrates core heat-generating components such as the switching chip and power chip, as well as I / O interfaces such as RJ45, and is fixed inside the metal panel 61, which is located inside the junction box.

[0032] The heat conduction element uses 2-3 flat heat pipes 63, and its evaporation end is attached to the main heat-generating chip on the motherboard 62 by means of thermally conductive adhesive or other methods.

[0033] The heat dissipation module is modified into a decorative metal or ceramic heat dissipation plate 64 fixed to the outside of the metal panel 61, which is exposed to the room air. The heat dissipation plate 64 can be made with artistic textures or integrated with the wall or ceiling material according to the interior design style.

[0034] This embodiment cleverly transfers heat dissipation to the surface of a wall or ceiling, enabling a high-power PoE device with a power consumption of tens of watts to operate stably and continuously in a completely enclosed wall box or ceiling space without a fan or with absolute silence. This perfectly solves the industry pain points of traditional PoE devices, which either require the installation of fans, resulting in noise and additional points of failure, or cannot be installed in enclosed spaces due to insufficient heat dissipation. It provides an unprecedented solution for scenarios such as high-end smart homes and smart offices that have extremely high requirements for quietness and aesthetics.

[0035] In summary, this utility model, through its ingenious design of a split structure and heat dissipation channel, effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A simplified data acquisition terminal for factory OEE and energy consumption management, characterized in that, include: A base module (1) suitable for installation on an industrial guide rail; a computing core module (2) with a built-in core heating element; a heat conduction element (3) whose heated end is thermally connected to the computing core module (2); a heat dissipation module (4) connected to the heat dissipation end of the heat conduction element (3); and a positioning chassis (5) for supporting and positioning the heat conduction element (3) and the heat dissipation module (4); wherein the positioning chassis (5) separates the physical position of the heat dissipation module (4) from the physical position of the base module (1), so that the heat dissipation module (4) is arranged in a preset heat dissipation area away from the base module (1).

2. A simplified data acquisition terminal for factory OEE and energy consumption management according to claim 1, characterized in that: The positioning chassis (5) is a rigid cantilever structure (51). The near end of the cantilever structure (51) is fixedly connected to the base module (1), and the far end is used to install the heat dissipation module (4). The heat conduction element (3) is arranged along the cantilever structure (51).

3. A simplified data acquisition terminal for factory OEE and energy consumption management according to claim 2, characterized in that: The cantilever structure (51) is an integrally extruded aluminum alloy profile, and its interior is provided with a cavity for accommodating the connecting cable between the computing core module (2) and the base module (1).

4. A simplified data acquisition terminal for factory OEE and energy consumption management according to claim 1, characterized in that: The computing core module (2) and the base module (1) are electrically connected by a flexible flat cable (6).

5. A simplified data acquisition terminal for factory OEE and energy consumption management according to claim 1 or 3, characterized in that: The heat conduction element (3) is a vacuum phase change heat pipe with a capillary wick structure on its inner wall.

6. A simplified data acquisition terminal for factory OEE and energy consumption management according to claim 5, characterized in that: The evaporation end of the heat pipe is flattened into a plane and pressed against the outer shell of the computing core module (2) by filling it with a phase change heat-conducting sheet (31) and applying a pre-tightening force by a pre-tightening screw (32).

7. A simplified data acquisition terminal for factory OEE and energy consumption management according to claim 1, characterized in that: The heat dissipation fins (41) of the heat dissipation module (4) have a ceramic porous layer formed by micro-arc oxidation process.

8. A simplified data acquisition terminal for factory OEE and energy consumption management according to claim 1, characterized in that: The base module (1) is provided with a buckle (11) for locking it onto an industrial guide rail.

9. A simplified data acquisition terminal for factory OEE and energy consumption management according to claim 8, characterized in that: It also includes a temperature sensor (7), which is disposed on the heat dissipation module (4) and is used to monitor the temperature of the heat dissipation module (4).

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