A heat dissipation structure and a heater

Abstract

The utility model discloses a kind of heat dissipation structure and heater, it is related to heat dissipation technical field, to solve how to effectively cool power module, prolong the service life of power module Problem.The heat dissipation structure is applied to heater, and heater includes water tank body and power module;Water tank body includes multiple flow channels, and multiple flow channels are spaced apart along the first direction;Interval is equipped between adjacent two flow channels to form passage, and flow channel is used for circulating medium.The heat dissipation structure includes: heat-conducting part and heat sink.The heat-conducting part has opposite first end face and second end face;Power module is set to the first end face of heat-conducting part.Heat sink is inserted in passage, and at least part of area of heat sink and flow channel abut;The second end face of heat-conducting part is connected with the end of heat sink away from water tank body.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation structure and a heater. Background Technology

[0002] A PTC (Positive Temperature Coefficient) heater is a device that utilizes the properties of a positive temperature coefficient thermistor (PTC thermistor) to achieve a heating function. PTC material has a unique property: its resistance increases sharply when its temperature rises to a specific Curie temperature. This characteristic allows PTC heaters to achieve automatic temperature control without the need for external temperature control devices. When current flows through the PTC element, the element begins to heat up. As the temperature rises to the Curie point, the resistance increases, the current decreases, and thermal equilibrium is reached, preventing overheating. PTC heaters are widely used in air conditioning, electric vehicle heating, household appliances, and drying equipment due to their high safety, fast response speed, energy efficiency, flameless operation, and long lifespan.

[0003] PTC heaters include power modules, which can be IGBTs (Insulated Gate Bipolar Transistors). An IGBT is a composite, fully controllable, voltage-driven power electronic device whose core function is to achieve efficient power conversion and control in high-voltage, high-current scenarios. This device regulates circuit operation by rapidly switching on and off states, but it generates a significant amount of heat during operation. Sustained high temperatures can not only cause IGBT shutdown failures but also severely shorten the device's lifespan.

[0004] Therefore, how to effectively cool down power modules and extend their service life remains a pressing technical problem for the industry. Utility Model Content

[0005] The purpose of this invention is to provide a heat dissipation structure and a heater for cooling power modules and extending their service life.

[0006] To achieve the above objectives, in a first aspect, this utility model provides a heat dissipation structure. This heat dissipation structure is applied to a heater, which includes a water tank body and a power module. The water tank body includes multiple flow channels spaced apart along a first direction. A gap is provided between adjacent flow channels to form a passage for the flow of a medium. The heat dissipation structure includes a heat-conducting element and a heat-dissipating element. The heat-conducting element has opposing first and second end faces. The power module is disposed on the first end face of the heat-conducting element. The heat-dissipating element is inserted into the passage, and at least a portion of the heat-dissipating element abuts against the flow channel. The end of the heat-dissipating element away from the water tank body is connected to the second end face of the heat-conducting element.

[0007] In the heat dissipation structure provided by this utility model, the heat generated by the power module is conducted to the heat-conducting component, which then conducts the heat to the heat sink. Since the heat sink is inserted into the channel, at least a portion of the heat sink is in contact with the flow channel, which is used for the flow of the medium. Therefore, the heat at the heat sink can exchange heat with the medium flowing through the water tank body. The continuous flow of the medium can quickly remove locally accumulated heat (i.e., the heat at the heat sink is carried away by the medium flowing within the water tank body), thereby cooling the power module. Based on this, the temperature of the power module can be kept within a relatively low range, improving its operational stability and extending its service life.

[0008] In one implementation, the heat sink includes a first sub-heat sink and a second sub-heat sink; The first sub-heat sink includes a first surface and a second surface facing each other; the first surface of the first sub-heat sink is connected to the second end surface of the heat-conducting component; Multiple second sub-heat sinks are spaced apart along the first direction, and multiple second sub-heat sinks are connected to the second surface of the first sub-heat sink; multiple second sub-heat sinks are correspondingly inserted into multiple channels of the water tank body.

[0009] In one implementation, along the first direction, the two sides of the second sub-heat sink respectively abut against the flow channels located on both sides of the second sub-heat sink; and / or, the exposed second surface of the first sub-heat sink abuts against the flow channels of the water tank body.

[0010] In one implementation, along the height direction of the heat sink, the height of the first sub-heat sink is less than or equal to the maximum height of the second sub-heat sink; and / or, the first sub-heat sink and the second sub-heat sink are integrally formed.

[0011] In one implementation, along the height direction of the heat sink, the cross-sectional shape of the second sub-heat sink is a closed shape, a rectangle, or a triangle formed by a line segment and an arc, and the cross-section of the second sub-heat sink is perpendicular to the extension direction of the flow channel. And / or, the second sub-heat sink has a cuboid structure or an L-shaped structure.

[0012] In one implementation, the heat sink is bonded to the water tank body using thermally conductive adhesive; or, the heat sink is welded to the water tank body.

[0013] In one implementation, the heat sink is inserted into the middle of the water tank body in a direction perpendicular to the first direction; or, the heat sink is inserted into the end of the water tank body in a direction perpendicular to the first direction.

[0014] In one implementation, the heat sink is vertically connected to the water tank body.

[0015] In one implementation, the thermally conductive component is an insulating thermally conductive component, which includes a thermal pad or thermal grease.

[0016] Secondly, this utility model also provides a heater. The heater includes a water tank body, a power module, and the heat dissipation structure described in the above technical solution. The water tank body includes multiple flow channels, which are spaced apart along a first direction, with a gap between adjacent flow channels to form a passage; the flow channels are used for the flow of a medium; the heat dissipation structure is inserted into the passages included in the water tank body, and at least a portion of the heat dissipation structure abuts against the flow channels; the power module is disposed on the end face of the heat dissipation structure away from the water tank body.

[0017] The beneficial effects of the heater provided by this utility model are the same as those of the heat dissipation structure described in the above technical solution, and will not be repeated here. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the combined structure of the water tank body, power module, and heat dissipation structure in an embodiment of this utility model; Figure 2 This is a top view of the structure after the water tank body, power module, and heat dissipation structure are combined in this embodiment of the utility model; Figure 3 As an embodiment of this utility model Figure 1 Explosion-proof diagram of the structure; Figure 4 This is a schematic diagram of a heat sink component in one embodiment of the present utility model; Figure 5 This is a schematic diagram of the cross-sectional shape of the second sub-heat sink in an embodiment of this utility model.

[0019] Figure label: 1-Water tank body, 10-Flow channel, 11-Channel; 2-Power module, 3-Heat dissipation structure, 30-Heat conduction component, 31-Heat dissipation component, 310-First sub-heat dissipation component, 311-Second sub-heat dissipation component. Detailed Implementation

[0020] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0021] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified. "Several" means one or more, unless otherwise explicitly specified.

[0023] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0025] To solve the aforementioned technical problems, firstly, see [reference needed] Figures 1 to 4This utility model provides a heat dissipation structure. The heat dissipation structure 3 is applied to a heater, which includes a water tank body 1 and a power module 2. The water tank body 1 includes multiple flow channels 10, which are spaced apart along a first direction A. A gap is provided between adjacent flow channels 10 to form a channel 11, which is used for the flow of a medium. The heat dissipation structure 3 includes a heat-conducting element 30 and a heat dissipation element 31. The heat-conducting element 30 has a first end face and a second end face facing each other. The power module 2 is disposed on the first end face of the heat-conducting element 30. The heat dissipation element 31 is inserted into the channel 11, and at least a portion of the heat dissipation element 31 abuts against the flow channel 10. One end of the heat dissipation element 31 away from the water tank body 1 is connected to the second end face of the heat-conducting element 30. It should be noted that other specific structures of the water tank body 1 and the detailed structure of the power module 2 are not specifically limited here; reference can be made to the prior art.

[0026] See Figures 1 to 4 In the heat dissipation structure 3 provided in this embodiment of the present invention, the heat generated by the power module 2 is conducted to the heat-conducting component 30, and the heat-conducting component 30 conducts the heat to the heat sink 31. Since the heat sink 31 is inserted into the channel 11, at least a portion of the heat sink 31 abuts against the flow channel 10, which is used for the flow of medium. Therefore, the heat at the heat sink 31 can exchange heat with the medium flowing through the water tank body 1. The continuous flow of the medium can quickly remove the locally accumulated heat (i.e., the heat at the heat sink 31 is carried away by the medium flowing in the water tank body 1), thereby achieving the cooling of the power module 2. Based on this, the temperature of the power module 2 can be kept in a relatively low range to improve its operational stability and extend its service life.

[0027] The medium mentioned above can be understood as a heat exchange medium, which can be water or other substances. The heater can be a PTC heater.

[0028] The aforementioned power modules include IGBT modules or silicon carbide modules.

[0029] As one possible implementation, see Figures 1 to 4 The heat sink 31 includes a first sub-heat sink 310 and a second sub-heat sink 311. The first sub-heat sink 310 includes a first surface and a second surface facing each other. The first surface of the first sub-heat sink 310 is connected to the second end surface of the heat conductor 30. A plurality of second sub-heat sinks 311 are spaced apart along a first direction A and are connected to the second surface of the first sub-heat sink 310. The plurality of second sub-heat sinks 311 are correspondingly inserted into a plurality of channels 11 of the water tank body 1.

[0030] In some embodiments, the shape of the first sub-heat sink 310 can be a cuboid or a cube; the first surface of the first sub-heat sink 310 is bonded to the second end surface of the heat conductor 30; the area of ​​the first surface of the first sub-heat sink 310 is less than or equal to the area of ​​the second end surface of the heat conductor 30.

[0031] In one alternative approach, see Figures 1 to 4 Along the height direction H of the heat sink 31, the height of the first sub-heat sink 310 is less than or equal to the maximum height of the second sub-heat sink 311.

[0032] In one alternative approach, see Figures 1 to 4 The first sub-heat sink 310 and the second sub-heat sink 311 are integrally formed. Alternatively, the first sub-heat sink 310 and the second sub-heat sink 311 are bonded together. For example, the above bonding can be achieved using a high thermal conductivity adhesive bonding process.

[0033] In one alternative approach, see Figures 1 to 4 Along the first direction, the two sides of the second sub-heat sink 311 abut against the flow channels 10 located on both sides of the second sub-heat sink 311; and / or, the exposed second surface of the first sub-heat sink 310 abuts against the flow channels 10 of the water tank body 1. It should be noted that the "exposed second surface of the first sub-heat sink 310" here refers to an area on the second surface of the first sub-heat sink 310 where no second sub-heat sink 311 is provided (defined as a "blank area" for ease of description) because multiple second sub-heat sinks 311 are spaced apart along the first direction. This "blank area" is the "exposed second surface of the first sub-heat sink 310".

[0034] At this time, the contact area between the heat sink 31 and the flow channel 10 included in the water tank body 1 is large, which can accelerate the heat exchange between the heat sink 31 and the medium flowing through the water tank body 1, improve the cooling speed of the power module 2, and improve the cooling efficiency.

[0035] In one alternative approach, see Figures 1 to 5 Along the height direction of the heat sink 31, the cross-sectional shape of the second sub-heat sink 311 is a closed shape formed by a line segment and an arc (e.g., Figure 5 The cross-section of the second sub-heat sink 311 is perpendicular to the extension direction of the flow channel 10, and can be either rectangular or triangular.

[0036] In one alternative approach, see Figures 1 to 4 The second sub-heat sink 311 has a cuboid or L-shaped structure. Combined with... Figure 4 In this application, the second sub-heat sink 311 has an L-shaped structure.

[0037] In some embodiments, the three-dimensional shape of the second sub-heat sink 311 matches the shape of the channel 11 included in the water tank body 1. The three-dimensional shape of the second sub-heat sink 311 is not specifically limited here, as long as the second sub-heat sink 311 can be inserted into the channel 11.

[0038] For example, the second sub-heater 311 in the heat sink 31 is in the shape of a comb and is inserted into the flow channel 10 of the water tank body 1.

[0039] As one possible implementation, see Figures 1 to 4 The heat sink 31 is bonded to the water tank body 1 with thermally conductive adhesive; or, the heat sink 31 is welded to the water tank body 1.

[0040] For example, the welding described above includes brazing, brazing-free welding, vacuum brazing, and other welding processes. The bonding described above can be achieved using a high thermal conductivity adhesive bonding process.

[0041] In some embodiments, the second sub-heat sink 311 is bonded to the flow channel 10 included in the water tank body 1 by thermally conductive adhesive. In this case, not only can the connection between the heat sink 31 and the water tank body 1 be strengthened and the heat sink 31 be fixed, but the contact area between the heat sink 31 and the water tank body 1 can also be increased, thereby enhancing the heat transfer effect and improving the cooling efficiency of the power module 2.

[0042] As one possible implementation, see Figures 1 to 4 The heat sink 31 is inserted into the middle of the water tank body 1 along direction B, which is perpendicular to the first direction; or, the heat sink 31 is inserted into the end of the water tank body 1 along direction B, which is perpendicular to the first direction. The specific position of the heat sink 31 relative to the water tank body 1 can be adjusted according to the actual situation to avoid the heat sink 31 affecting the setting of other components in the heater.

[0043] Preferably, the heat sink 31 is inserted into the middle position of the water tank body 1 along a direction perpendicular to the first direction.

[0044] As one possible implementation, see Figures 1 to 4 The heat sink 31 is vertically connected to the water tank body 1. At this time, the contact area between the heat sink 31 and the water tank body 1 is at its maximum, which can improve the cooling efficiency of the power module 2.

[0045] As one possible implementation, see Figures 1 to 4 The heat-conducting component is an insulated heat-conducting component.

[0046] As one possible implementation, see Figures 1 to 4 The thermal conductive component 30 includes a thermal pad or thermal grease.

[0047] In some embodiments, the end of the heat sink 31 away from the water tank body 1 is bonded to the second end face of the heat conductor 30 by adhesive bonding, for example, a high thermal conductivity adhesive can be used for bonding.

[0048] In summary, see Figures 1 to 4 This application constructs a novel heat dissipation system by inserting a heat dissipation structure 3 into the channel 11 of the water tank body 1, placing the power module 2 on the heat dissipation structure 3, and utilizing the circulating medium in the water tank body 1 as a cold source. Compared to directly attaching the power module 2 to the surface of the water tank body 1 for cooling, this application not only improves heat dissipation efficiency but also avoids affecting the internal structure and electrical control layout of the heater, ensuring normal operation of the heater. Furthermore, compared to the method where the power module 2 relies on the cast aluminum shell of the heater for heat dissipation, this application uses liquid cooling to replace the natural air cooling solution of the cast aluminum shell, significantly improving cooling efficiency and effectively controlling the operating temperature of the power module 2. That is, compared to the natural air cooling method of the cast aluminum shell, this application enhances the heat dissipation efficiency of the power module 2 through medium circulation. In addition, the heat generated by the power module 2 can be transferred to the medium in the water tank body 1 for heating the medium, rather than being completely discharged into the air, achieving heat recovery and utilization, improving the overall thermal efficiency of the PTC heater, and forming a dual optimization effect. That is, the heat dissipation structure 3 provided by this application can recover the heat generated by the power module 2 during operation, improving the thermal efficiency of the PTC heater.

[0049] Secondly, see Figures 1 to 4 This utility model embodiment also provides a heater. The heater includes a water tank body 1, a power module 2, and a heat dissipation structure 3 as described in the above technical solution. The water tank body 1 includes a plurality of flow channels 10, which are spaced apart along a first direction, and a gap is provided between two adjacent flow channels 10 to form a channel 11; the flow channels 10 are used for the flow of medium; the heat dissipation structure 3 is inserted into the channel 11 included in the water tank body 1, and at least a portion of the heat dissipation structure 3 abuts against the flow channels 10; the power module 2 is disposed on the end face of the heat dissipation structure 3 away from the water tank body 1.

[0050] The beneficial effects of the heater provided in this embodiment are the same as those of the heat dissipation structure described in the above technical solution, and will not be repeated here.

[0051] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0052] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A heat dissipation structure, characterized in that, The invention is applied to a heater, which includes a water tank body and a power module; the water tank body includes multiple flow channels, which are spaced apart along a first direction; a gap is provided between two adjacent flow channels to form a channel, and the flow channels are used to flow a medium. The heat dissipation structure includes: A heat-conducting component has a first end face and a second end face facing each other; the power module is disposed on the first end face of the heat-conducting component; A heat sink is inserted into the channel, and at least a portion of the heat sink abuts against the flow channel; one end of the heat sink away from the water tank body is connected to the second end face of the heat-conducting component.

2. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation component includes a first sub-heat dissipation component and a second sub-heat dissipation component; The first sub-heat sink includes a first surface and a second surface facing each other; the first surface of the first sub-heat sink is connected to the second end surface of the heat-conducting component; Multiple second sub-heat sinks are spaced apart along the first direction, and multiple second sub-heat sinks are connected to the second surface of the first sub-heat sink; multiple second sub-heat sinks are correspondingly inserted into multiple channels of the water tank body.

3. The heat dissipation structure according to claim 2, characterized in that, Along the first direction, the two sides of the second sub-heat sink respectively abut against the flow channels located on both sides of the second sub-heat sink; And / or, the exposed second surface of the first sub-heat sink abuts against the flow channel of the water tank body.

4. The heat dissipation structure according to claim 2, characterized in that, Along the height direction of the heat sink, the height of the first sub-heat sink is less than or equal to the maximum height of the second sub-heat sink; And / or, the first sub-heat sink and the second sub-heat sink are integrally formed.

5. The heat dissipation structure according to claim 2, characterized in that, Along the height direction of the heat sink, the cross-sectional shape of the second sub-heat sink is a closed shape formed by a line segment and an arc, or a rectangle or a triangle, and the cross-section of the second sub-heat sink is perpendicular to the extension direction of the flow channel. And / or, the second sub-heat sink has a cuboid structure or an L-shaped structure.

6. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation component is bonded to the water tank body with thermally conductive adhesive; Alternatively, the heat dissipation component may be welded to the water tank body.

7. The heat dissipation structure according to claim 1, characterized in that, Along a direction perpendicular to the first direction, the heat dissipation component is inserted into the middle position of the water tank body; Alternatively, the heat sink is inserted into the end of the water tank body in a direction perpendicular to the first direction.

8. The heat dissipation structure according to claim 1 or 5, characterized in that, The heat dissipation component is vertically connected to the water tank body.

9. The heat dissipation structure according to claim 1, characterized in that, The thermally conductive component is an insulating thermally conductive component; the thermally conductive component includes a thermally conductive pad or thermally conductive silicone grease.

10. A heater, characterized in that, include: The water tank body includes multiple flow channels, which are spaced apart along a first direction, with a gap between adjacent flow channels to form a channel; the flow channels are used for the flow of a medium. The heat dissipation structure according to any one of claims 1 to 9, wherein the heat dissipation structure is inserted into the channel included in the water tank body, and at least a portion of the heat dissipation structure abuts against the flow channel; The power module is located on the end face of the heat dissipation structure away from the water tank body.

Images